Design Rule Verification Report

Date:		2021/2/3
Time:		18:33:43
Elapsed Time:		00:00:07
Filename:		C:\Users\22357\Desktop\FOC_DRIVE\PCB_Project\FOC_DRIVER.PcbDoc

Warnings:		0
Rule Violations:		6631

Summary

Warnings	Count
Total	0

Rule Violations	Count
Clearance Constraint (Gap=5mil) (InPolygon),(All)	0
Clearance Constraint (Gap=5mil) (All),(All)	0
Short-Circuit Constraint (Allowed=No) (All),(All)	0
Un-Routed Net Constraint ( (All) )	0
Modified Polygon (Allow modified: No), (Allow shelved: No)	0
Width Constraint (Min=6mil) (Max=60mil) (Preferred=15mil) (All)	0
Width Constraint (Min=6mil) (Max=60mil) (Preferred=15mil) (InNetClass('POWER'))	0
Power Plane Connect Rule(Direct Connect )(Expansion=20mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (All)	0
Hole Size Constraint (Min=1mil) (Max=100mil) (All)	0
Hole To Hole Clearance (Gap=10mil) (All),(All)	0
Minimum Solder Mask Sliver (Gap=10mil) (All),(All)	4899
Silk To Solder Mask (Clearance=10mil) (IsPad),(All)	1655
Silk to Silk (Clearance=10mil) (All),(All)	77
Net Antennae (Tolerance=0mil) (All)	0
Height Constraint (Min=0mil) (Max=1000mil) (Prefered=500mil) (All)	0
Total	6631

Minimum Solder Mask Sliver (Gap=10mil) (All),(All)
Minimum Solder Mask Sliver Constraint: (5.075mil < 10mil) Between Pad 2-1(4662.7mil,4777.442mil) on Bottom Layer And Via (4587mil,4825.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.075mil]
Minimum Solder Mask Sliver Constraint: (1.52mil < 10mil) Between Pad 2-1(4662.7mil,4777.442mil) on Bottom Layer And Via (4611mil,4825.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.52mil]
Minimum Solder Mask Sliver Constraint: (1.12mil < 10mil) Between Pad 2-1(4662.7mil,4777.442mil) on Bottom Layer And Via (4633mil,4824.9mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.12mil]
Minimum Solder Mask Sliver Constraint: (1.12mil < 10mil) Between Pad 2-1(4662.7mil,4777.442mil) on Bottom Layer And Via (4657mil,4824.9mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.12mil]
Minimum Solder Mask Sliver Constraint: (1.22mil < 10mil) Between Pad 2-1(4662.7mil,4777.442mil) on Bottom Layer And Via (4680.1mil,4825mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.22mil]
Minimum Solder Mask Sliver Constraint: (1.22mil < 10mil) Between Pad 2-1(4662.7mil,4777.442mil) on Bottom Layer And Via (4704.1mil,4825mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.22mil]
Minimum Solder Mask Sliver Constraint: (0.92mil < 10mil) Between Pad 2-1(4662.7mil,4777.442mil) on Bottom Layer And Via (4728.2mil,4824.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [0.92mil]
Minimum Solder Mask Sliver Constraint: (9.406mil < 10mil) Between Pad 2-2(4662.7mil,4543.19mil) on Bottom Layer And Pad Q4-D(4770.078mil,4495.276mil) on Bottom Layer [Bottom Solder] Mask Sliver [9.406mil]
Minimum Solder Mask Sliver Constraint: (1.851mil < 10mil) Between Pad 2-2(4662.7mil,4543.19mil) on Bottom Layer And Via (4640mil,4495mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.851mil]
Minimum Solder Mask Sliver Constraint: (1.851mil < 10mil) Between Pad 2-2(4662.7mil,4543.19mil) on Bottom Layer And Via (4664mil,4495mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.851mil]
Minimum Solder Mask Sliver Constraint: (1.851mil < 10mil) Between Pad 2-2(4662.7mil,4543.19mil) on Bottom Layer And Via (4688mil,4495mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.851mil]
Minimum Solder Mask Sliver Constraint: (1.851mil < 10mil) Between Pad 2-2(4662.7mil,4543.19mil) on Bottom Layer And Via (4712mil,4495mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.851mil]
Minimum Solder Mask Sliver Constraint: (8.158mil < 10mil) Between Pad 2-2(4662.7mil,4543.19mil) on Bottom Layer And Via (4747mil,4503mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.158mil]
Minimum Solder Mask Sliver Constraint: (7.45mil < 10mil) Between Pad 2-2(4662.7mil,4543.19mil) on Bottom Layer And Via (4747mil,4527mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.45mil]
Minimum Solder Mask Sliver Constraint: (7.45mil < 10mil) Between Pad 2-2(4662.7mil,4543.19mil) on Bottom Layer And Via (4747mil,4551mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.45mil]
Minimum Solder Mask Sliver Constraint: (7.45mil < 10mil) Between Pad 2-2(4662.7mil,4543.19mil) on Bottom Layer And Via (4747mil,4575mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.45mil]
Minimum Solder Mask Sliver Constraint: (5.267mil < 10mil) Between Pad C1-1(4578.783mil,5380.2mil) on Bottom Layer And Pad C3-1(4552.768mil,5380.141mil) on Bottom Layer [Bottom Solder] Mask Sliver [5.267mil]
Minimum Solder Mask Sliver Constraint: (8.282mil < 10mil) Between Pad C1-1(4578.783mil,5380.2mil) on Bottom Layer And Via (4557.1mil,5351.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.282mil]
Minimum Solder Mask Sliver Constraint: (3.133mil < 10mil) Between Pad C11-1(5563.2mil,5821.583mil) on Bottom Layer And Via (5540.1mil,5801.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.133mil]
Minimum Solder Mask Sliver Constraint: (6.872mil < 10mil) Between Pad C11-2(5563.197mil,5857.013mil) on Bottom Layer And Via (5593.3mil,5871.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.872mil]
Minimum Solder Mask Sliver Constraint: (4.046mil < 10mil) Between Pad C1-2(4614.213mil,5380.203mil) on Bottom Layer And Via (4633.686mil,5355.431mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.046mil]
Minimum Solder Mask Sliver Constraint: (2.504mil < 10mil) Between Pad C13-1(5559.217mil,5778.4mil) on Bottom Layer And Via (5540.1mil,5801.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.504mil]
Minimum Solder Mask Sliver Constraint: (0.933mil < 10mil) Between Pad C13-2(5523.787mil,5778.397mil) on Bottom Layer And Via (5540.1mil,5801.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [0.933mil]
Minimum Solder Mask Sliver Constraint: (0.45mil < 10mil) Between Pad C14-1(4780.8mil,5739.917mil) on Bottom Layer And Via (4801.5mil,5721.2mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [0.45mil]
Minimum Solder Mask Sliver Constraint: (5.755mil < 10mil) Between Pad C14-2(4780.803mil,5704.487mil) on Bottom Layer And Via (4786.1mil,5677mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.755mil]
Minimum Solder Mask Sliver Constraint: (6.715mil < 10mil) Between Pad C20-1(4580.7mil,5645.883mil) on Top Layer And Pad C21-1(4612.1mil,5646.883mil) on Top Layer [Top Solder] Mask Sliver [6.715mil]
Minimum Solder Mask Sliver Constraint: (6.715mil < 10mil) Between Pad C20-2(4580.703mil,5681.313mil) on Top Layer And Pad C21-2(4612.103mil,5682.313mil) on Top Layer [Top Solder] Mask Sliver [6.715mil]
Minimum Solder Mask Sliver Constraint: (7.919mil < 10mil) Between Pad C2-1(5553.6mil,5478.117mil) on Bottom Layer And Pad C5-1(5553.6mil,5506.783mil) on Bottom Layer [Bottom Solder] Mask Sliver [7.919mil]
Minimum Solder Mask Sliver Constraint: (4.602mil < 10mil) Between Pad C2-2(5553.603mil,5442.687mil) on Bottom Layer And Via (5525.3mil,5442.4mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.602mil]
Minimum Solder Mask Sliver Constraint: (7.654mil < 10mil) Between Pad C2-2(5553.603mil,5442.687mil) on Bottom Layer And Via (5541.542mil,5413.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.654mil]
Minimum Solder Mask Sliver Constraint: (8.618mil < 10mil) Between Pad C22-1(5204.2mil,5112.117mil) on Top Layer And Pad R21-2(5237.503mil,5109.613mil) on Top Layer [Top Solder] Mask Sliver [8.618mil]
Minimum Solder Mask Sliver Constraint: (9.194mil < 10mil) Between Pad C22-1(5204.2mil,5112.117mil) on Top Layer And Via (5201.454mil,5143.043mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.194mil]
Minimum Solder Mask Sliver Constraint: (8.621mil < 10mil) Between Pad C22-2(5204.197mil,5076.687mil) on Top Layer And Pad R21-1(5237.503mil,5076.149mil) on Top Layer [Top Solder] Mask Sliver [8.621mil]
Minimum Solder Mask Sliver Constraint: (3.513mil < 10mil) Between Pad C22-2(5204.197mil,5076.687mil) on Top Layer And Via (5195.172mil,5051.442mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.513mil]
Minimum Solder Mask Sliver Constraint: (8.177mil < 10mil) Between Pad C24-1(5377.297mil,5008.68mil) on Top Layer And Pad R15-2(5346.403mil,5004.513mil) on Top Layer [Top Solder] Mask Sliver [8.177mil]
Minimum Solder Mask Sliver Constraint: (7.204mil < 10mil) Between Pad C24-2(5412.727mil,5008.677mil) on Top Layer And Via (5403.4mil,5039.582mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.204mil]
Minimum Solder Mask Sliver Constraint: (7.934mil < 10mil) Between Pad C25-1(5539.6mil,4986.984mil) on Bottom Layer And Via (5508.948mil,5003.437mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.934mil]
Minimum Solder Mask Sliver Constraint: (8.869mil < 10mil) Between Pad C25-2(5539.597mil,5022.413mil) on Bottom Layer And Via (5508.948mil,5003.437mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.869mil]
Minimum Solder Mask Sliver Constraint: (7.919mil < 10mil) Between Pad C26-1(5674.617mil,5367.7mil) on Bottom Layer And Pad C8-1(5703.283mil,5369mil) on Bottom Layer [Bottom Solder] Mask Sliver [7.919mil]
Minimum Solder Mask Sliver Constraint: (4.503mil < 10mil) Between Pad C26-2(5639.187mil,5367.697mil) on Bottom Layer And Via (5638.3mil,5395.9mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.503mil]
Minimum Solder Mask Sliver Constraint: (4.599mil < 10mil) Between Pad C27-1(5405.516mil,5755.5mil) on Bottom Layer And Via (5404.2mil,5783.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.599mil]
Minimum Solder Mask Sliver Constraint: (9.971mil < 10mil) Between Pad C28-1(4916.383mil,5736.4mil) on Bottom Layer And Pad R37-2(4885.664mil,5736.5mil) on Bottom Layer [Bottom Solder] Mask Sliver [9.971mil]
Minimum Solder Mask Sliver Constraint: (6.11mil < 10mil) Between Pad C30-1(5051.7mil,5191.484mil) on Bottom Layer And Via (5050.3mil,5163.642mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.11mil]
Minimum Solder Mask Sliver Constraint: (4.64mil < 10mil) Between Pad C3-1(4552.768mil,5380.141mil) on Bottom Layer And Via (4557.1mil,5351.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.64mil]
Minimum Solder Mask Sliver Constraint: (8.215mil < 10mil) Between Pad C31-1(4305.684mil,5391.4mil) on Top Layer And Pad C32-1(4305.583mil,5424.3mil) on Top Layer [Top Solder] Mask Sliver [8.215mil]
Minimum Solder Mask Sliver Constraint: (8.215mil < 10mil) Between Pad C31-2(4341.113mil,5391.397mil) on Top Layer And Pad C32-2(4341.013mil,5424.297mil) on Top Layer [Top Solder] Mask Sliver [8.215mil]
Minimum Solder Mask Sliver Constraint: (4.237mil < 10mil) Between Pad C3-2(4517.339mil,5380.137mil) on Bottom Layer And Via (4526.4mil,5352.2mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.237mil]
Minimum Solder Mask Sliver Constraint: (7.287mil < 10mil) Between Pad C35-1(4880.984mil,5591.2mil) on Bottom Layer And Via (4855.9mil,5615mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.287mil]
Minimum Solder Mask Sliver Constraint: (1.698mil < 10mil) Between Pad C35-1(4880.984mil,5591.2mil) on Bottom Layer And Via (4859.286mil,5572.358mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.698mil]
Minimum Solder Mask Sliver Constraint: (8.673mil < 10mil) Between Pad C35-2(4916.413mil,5591.203mil) on Bottom Layer And Pad C62-2(4917.797mil,5559.813mil) on Bottom Layer [Bottom Solder] Mask Sliver [8.673mil]
Minimum Solder Mask Sliver Constraint: (7.698mil < 10mil) Between Pad C35-2(4916.413mil,5591.203mil) on Bottom Layer And Pad U1-12(4971.996mil,5575.198mil) on Bottom Layer [Bottom Solder] Mask Sliver [7.698mil]
Minimum Solder Mask Sliver Constraint: (7.276mil < 10mil) Between Pad C35-2(4916.413mil,5591.203mil) on Bottom Layer And Pad U1-13(4971.996mil,5594.883mil) on Bottom Layer [Bottom Solder] Mask Sliver [7.276mil]
Minimum Solder Mask Sliver Constraint: (5.478mil < 10mil) Between Pad C36-1(5283.3mil,4972.383mil) on Top Layer And Via (5305.201mil,4996.617mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.478mil]
Minimum Solder Mask Sliver Constraint: (7.77mil < 10mil) Between Pad C39-1(5310.484mil,5420.3mil) on Top Layer And Pad R26-2(5332.203mil,5389.813mil) on Top Layer [Top Solder] Mask Sliver [7.77mil]
Minimum Solder Mask Sliver Constraint: (2.751mil < 10mil) Between Pad C39-1(5310.484mil,5420.3mil) on Top Layer And Via (5286mil,5420.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.751mil]
Minimum Solder Mask Sliver Constraint: (3.24mil < 10mil) Between Pad C39-1(5310.484mil,5420.3mil) on Top Layer And Via (5317.84mil,5447.24mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.24mil]
Minimum Solder Mask Sliver Constraint: (5.609mil < 10mil) Between Pad C39-2(5345.913mil,5420.297mil) on Top Layer And Pad R24-2(5360.387mil,5390.003mil) on Top Layer [Top Solder] Mask Sliver [5.609mil]
Minimum Solder Mask Sliver Constraint: (7.767mil < 10mil) Between Pad C39-2(5345.913mil,5420.297mil) on Top Layer And Pad R26-2(5332.203mil,5389.813mil) on Top Layer [Top Solder] Mask Sliver [7.767mil]
Minimum Solder Mask Sliver Constraint: (8.118mil < 10mil) Between Pad C40-1(5425.684mil,5358mil) on Top Layer And Pad R28-2(5425.587mil,5390.803mil) on Top Layer [Top Solder] Mask Sliver [8.118mil]
Minimum Solder Mask Sliver Constraint: (9.247mil < 10mil) Between Pad C40-1(5425.684mil,5358mil) on Top Layer And Via (5454.279mil,5336.038mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.247mil]
Minimum Solder Mask Sliver Constraint: (8.121mil < 10mil) Between Pad C40-2(5461.113mil,5357.997mil) on Top Layer And Pad R28-1(5459.051mil,5390.803mil) on Top Layer [Top Solder] Mask Sliver [8.121mil]
Minimum Solder Mask Sliver Constraint: (4.399mil < 10mil) Between Pad C4-1(5532.316mil,5358.2mil) on Top Layer And Via (5558.448mil,5361.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.399mil]
Minimum Solder Mask Sliver Constraint: (8.012mil < 10mil) Between Pad C41-1(4743.583mil,5874.6mil) on Bottom Layer And Pad R33-1(4743.849mil,5841.903mil) on Bottom Layer [Bottom Solder] Mask Sliver [8.012mil]
Minimum Solder Mask Sliver Constraint: (8.015mil < 10mil) Between Pad C41-2(4779.013mil,5874.603mil) on Bottom Layer And Pad R33-2(4777.313mil,5841.903mil) on Bottom Layer [Bottom Solder] Mask Sliver [8.015mil]
Minimum Solder Mask Sliver Constraint: (9.358mil < 10mil) Between Pad C46-1(5109.046mil,5351.966mil) on Top Layer And Pad R35-1(5109.049mil,5317.923mil) on Top Layer [Top Solder] Mask Sliver [9.358mil]
Minimum Solder Mask Sliver Constraint: (9.352mil < 10mil) Between Pad C46-1(5109.046mil,5351.966mil) on Top Layer And Pad R40-2(5109.049mil,5386.003mil) on Top Layer [Top Solder] Mask Sliver [9.352mil]
Minimum Solder Mask Sliver Constraint: (9.355mil < 10mil) Between Pad C46-2(5144.475mil,5351.963mil) on Top Layer And Pad R35-2(5142.513mil,5317.923mil) on Top Layer [Top Solder] Mask Sliver [9.355mil]
Minimum Solder Mask Sliver Constraint: (9.355mil < 10mil) Between Pad C46-2(5144.475mil,5351.963mil) on Top Layer And Pad R40-1(5142.513mil,5386.003mil) on Top Layer [Top Solder] Mask Sliver [9.355mil]
Minimum Solder Mask Sliver Constraint: (5.915mil < 10mil) Between Pad C48-1(4465.4mil,5106.617mil) on Top Layer And Pad C49-1(4496mil,5106.073mil) on Top Layer [Top Solder] Mask Sliver [5.915mil]
Minimum Solder Mask Sliver Constraint: (5.915mil < 10mil) Between Pad C48-2(4465.397mil,5071.187mil) on Top Layer And Pad C49-2(4495.997mil,5070.643mil) on Top Layer [Top Solder] Mask Sliver [5.915mil]
Minimum Solder Mask Sliver Constraint: (8.467mil < 10mil) Between Pad C49-2(4495.997mil,5070.643mil) on Top Layer And Via (4518.4mil,5098.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.467mil]
Minimum Solder Mask Sliver Constraint: (2.96mil < 10mil) Between Pad C50-1(4542.897mil,4934.03mil) on Bottom Layer And Via (4569.557mil,4941.68mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.96mil]
Minimum Solder Mask Sliver Constraint: (8.098mil < 10mil) Between Pad C50-2(4542.9mil,4898.6mil) on Bottom Layer And Via (4518.7mil,4872.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.098mil]
Minimum Solder Mask Sliver Constraint: (4.068mil < 10mil) Between Pad C50-2(4542.9mil,4898.6mil) on Bottom Layer And Via (4541.7mil,4872.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.068mil]
Minimum Solder Mask Sliver Constraint: (7.278mil < 10mil) Between Pad C50-2(4542.9mil,4898.6mil) on Bottom Layer And Via (4565.7mil,4872.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.278mil]
Minimum Solder Mask Sliver Constraint: (0.158mil < 10mil) Between Pad C51-1(4991.417mil,5157.3mil) on Bottom Layer And Via (5002.386mil,5181.143mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [0.158mil]
Minimum Solder Mask Sliver Constraint: (8.31mil < 10mil) Between Pad C51-2(4955.987mil,5157.297mil) on Bottom Layer And Via (4925.945mil,5161.458mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.31mil]
Minimum Solder Mask Sliver Constraint: (5.192mil < 10mil) Between Pad C52-1(4912.217mil,5052.1mil) on Top Layer And Pad U5-48(4909.068mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [5.192mil]
Minimum Solder Mask Sliver Constraint: (6.523mil < 10mil) Between Pad C52-1(4912.217mil,5052.1mil) on Top Layer And Pad U5-49(4928.753mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [6.523mil]
Minimum Solder Mask Sliver Constraint: (3.147mil < 10mil) Between Pad C52-1(4912.217mil,5052.1mil) on Top Layer And Via (4937.095mil,5050.005mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.147mil]
Minimum Solder Mask Sliver Constraint: (5.189mil < 10mil) Between Pad C52-2(4876.787mil,5052.103mil) on Top Layer And Pad U5-46(4869.698mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [5.189mil]
Minimum Solder Mask Sliver Constraint: (5.369mil < 10mil) Between Pad C52-2(4876.787mil,5052.103mil) on Top Layer And Pad U5-47(4889.383mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [5.369mil]
Minimum Solder Mask Sliver Constraint: (0.054mil < 10mil) Between Pad C52-2(4876.787mil,5052.103mil) on Top Layer And Via (4855mil,5045.434mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.054mil]
Minimum Solder Mask Sliver Constraint: (0.702mil < 10mil) Between Pad C52-2(4876.787mil,5052.103mil) on Top Layer And Via (4869.7mil,5027.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.702mil]
Minimum Solder Mask Sliver Constraint: (5.142mil < 10mil) Between Pad C53-1(4813.018mil,5041.108mil) on Top Layer And Via (4837.938mil,5062.162mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.142mil]
Minimum Solder Mask Sliver Constraint: (8.175mil < 10mil) Between Pad C56-2(4633.097mil,5329.013mil) on Bottom Layer And Via (4602.158mil,5345.365mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.175mil]
Minimum Solder Mask Sliver Constraint: (4.685mil < 10mil) Between Pad C56-2(4633.097mil,5329.013mil) on Bottom Layer And Via (4633.686mil,5355.431mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.685mil]
Minimum Solder Mask Sliver Constraint: (9.051mil < 10mil) Between Pad C57-1(4594.816mil,5031.3mil) on Top Layer And Via (4625.6mil,5031.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.051mil]
Minimum Solder Mask Sliver Constraint: (4.522mil < 10mil) Between Pad C57-2(4559.387mil,5031.303mil) on Top Layer And Pad C63-1(4534.117mil,5031.2mil) on Top Layer [Top Solder] Mask Sliver [4.522mil]
Minimum Solder Mask Sliver Constraint: (2.354mil < 10mil) Between Pad C58-2(4561.213mil,5304.503mil) on Bottom Layer And Via (4585.3mil,5311.442mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.354mil]
Minimum Solder Mask Sliver Constraint: (7.499mil < 10mil) Between Pad C59-1(4502.9mil,4897.783mil) on Bottom Layer And Via (4471.7mil,4896.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.499mil]
Minimum Solder Mask Sliver Constraint: (3.251mil < 10mil) Between Pad C59-1(4502.9mil,4897.783mil) on Bottom Layer And Via (4494.7mil,4872.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.251mil]
Minimum Solder Mask Sliver Constraint: (3.655mil < 10mil) Between Pad C59-1(4502.9mil,4897.783mil) on Bottom Layer And Via (4518.7mil,4872.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.655mil]
Minimum Solder Mask Sliver Constraint: (9.815mil < 10mil) Between Pad C6-1(4744.083mil,5774.6mil) on Bottom Layer And Pad C9-1(4743.984mil,5809.1mil) on Bottom Layer [Bottom Solder] Mask Sliver [9.815mil]
Minimum Solder Mask Sliver Constraint: (2.72mil < 10mil) Between Pad C61-1(4876.8mil,5509.883mil) on Bottom Layer And Via (4899.4mil,5529.9mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.72mil]
Minimum Solder Mask Sliver Constraint: (6.095mil < 10mil) Between Pad C61-2(4876.797mil,5545.313mil) on Bottom Layer And Via (4859.286mil,5572.358mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.095mil]
Minimum Solder Mask Sliver Constraint: (0.073mil < 10mil) Between Pad C61-2(4876.797mil,5545.313mil) on Bottom Layer And Via (4899.4mil,5529.9mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [0.073mil]
Minimum Solder Mask Sliver Constraint: (9.815mil < 10mil) Between Pad C6-2(4779.513mil,5774.603mil) on Bottom Layer And Pad C9-2(4779.413mil,5809.103mil) on Bottom Layer [Bottom Solder] Mask Sliver [9.815mil]
Minimum Solder Mask Sliver Constraint: (8.776mil < 10mil) Between Pad C6-2(4779.513mil,5774.603mil) on Bottom Layer And Via (4804.2mil,5748.1mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.776mil]
Minimum Solder Mask Sliver Constraint: (3.967mil < 10mil) Between Pad C62-1(4917.8mil,5524.383mil) on Bottom Layer And Pad U1-10(4971.996mil,5535.828mil) on Bottom Layer [Bottom Solder] Mask Sliver [3.967mil]
Minimum Solder Mask Sliver Constraint: (3.921mil < 10mil) Between Pad C62-1(4917.8mil,5524.383mil) on Bottom Layer And Pad U1-9(4971.996mil,5516.142mil) on Bottom Layer [Bottom Solder] Mask Sliver [3.921mil]
Minimum Solder Mask Sliver Constraint: (9.96mil < 10mil) Between Pad C62-2(4917.797mil,5559.813mil) on Bottom Layer And Pad U1-10(4971.996mil,5535.828mil) on Bottom Layer [Bottom Solder] Mask Sliver [9.96mil]
Minimum Solder Mask Sliver Constraint: (3.924mil < 10mil) Between Pad C62-2(4917.797mil,5559.813mil) on Bottom Layer And Pad U1-11(4971.996mil,5555.512mil) on Bottom Layer [Bottom Solder] Mask Sliver [3.924mil]
Minimum Solder Mask Sliver Constraint: (4.903mil < 10mil) Between Pad C62-2(4917.797mil,5559.813mil) on Bottom Layer And Pad U1-12(4971.996mil,5575.198mil) on Bottom Layer [Bottom Solder] Mask Sliver [4.903mil]
Minimum Solder Mask Sliver Constraint: (9.098mil < 10mil) Between Pad C62-2(4917.797mil,5559.813mil) on Bottom Layer And Via (4899.4mil,5529.9mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.098mil]
Minimum Solder Mask Sliver Constraint: (6.623mil < 10mil) Between Pad C63-1(4534.117mil,5031.2mil) on Top Layer And Via (4560.543mil,5010.757mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.623mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Pad C67-1(5135.488mil,4795.787mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Pad C74-1(5358.4mil,4795.787mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (2.786mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Via (5180.3mil,4774.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.786mil]
Minimum Solder Mask Sliver Constraint: (2.786mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Via (5180.3mil,4798.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.786mil]
Minimum Solder Mask Sliver Constraint: (2.786mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Via (5180.3mil,4822.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.786mil]
Minimum Solder Mask Sliver Constraint: (7.155mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Via (5204.3mil,4846.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.155mil]
Minimum Solder Mask Sliver Constraint: (7.655mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Via (5226.4mil,4847.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.655mil]
Minimum Solder Mask Sliver Constraint: (7.655mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Via (5250.4mil,4847.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.655mil]
Minimum Solder Mask Sliver Constraint: (8.755mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Via (5273.1mil,4848.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.755mil]
Minimum Solder Mask Sliver Constraint: (8.755mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Via (5297.1mil,4848.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.755mil]
Minimum Solder Mask Sliver Constraint: (8.698mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Via (5319.5mil,4776.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.698mil]
Minimum Solder Mask Sliver Constraint: (8.698mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Via (5319.5mil,4800.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.698mil]
Minimum Solder Mask Sliver Constraint: (8.698mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Via (5319.5mil,4824.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.698mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C64-2(5246.944mil,4681.613mil) on Top Layer And Pad C67-2(5135.488mil,4681.613mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C64-2(5246.944mil,4681.613mil) on Top Layer And Pad C74-2(5358.4mil,4681.613mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (2.918mil < 10mil) Between Pad C64-2(5246.944mil,4681.613mil) on Top Layer And Via (5183.8mil,4639.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.918mil]
Minimum Solder Mask Sliver Constraint: (0.321mil < 10mil) Between Pad C64-2(5246.944mil,4681.613mil) on Top Layer And Via (5308.3mil,4641.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.32mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C65-1(4912.576mil,4795.787mil) on Top Layer And Pad C68-1(5024.032mil,4795.787mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C65-1(4912.576mil,4795.787mil) on Top Layer And Pad C69-1(4801.12mil,4795.787mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C65-2(4912.576mil,4681.613mil) on Top Layer And Pad C68-2(5024.032mil,4681.613mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C65-2(4912.576mil,4681.613mil) on Top Layer And Pad C69-2(4801.12mil,4681.613mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (0.641mil < 10mil) Between Pad C65-2(4912.576mil,4681.613mil) on Top Layer And Via (4969.6mil,4638mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.641mil]
Minimum Solder Mask Sliver Constraint: (7.708mil < 10mil) Between Pad C66-1(4465.5mil,4775.087mil) on Top Layer And Pad C71-1(4578.208mil,4795.787mil) on Top Layer [Top Solder] Mask Sliver [7.708mil]
Minimum Solder Mask Sliver Constraint: (1.156mil < 10mil) Between Pad C66-1(4465.5mil,4775.087mil) on Top Layer And Via (4400.8mil,4739.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.156mil]
Minimum Solder Mask Sliver Constraint: (0.842mil < 10mil) Between Pad C66-1(4465.5mil,4775.087mil) on Top Layer And Via (4400.8mil,4763.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.842mil]
Minimum Solder Mask Sliver Constraint: (0.842mil < 10mil) Between Pad C66-1(4465.5mil,4775.087mil) on Top Layer And Via (4400.8mil,4787.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.842mil]
Minimum Solder Mask Sliver Constraint: (1.549mil < 10mil) Between Pad C66-1(4465.5mil,4775.087mil) on Top Layer And Via (4400.8mil,4811.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.549mil]
Minimum Solder Mask Sliver Constraint: (5.355mil < 10mil) Between Pad C66-1(4465.5mil,4775.087mil) on Top Layer And Via (4447.7mil,4824.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.355mil]
Minimum Solder Mask Sliver Constraint: (5.355mil < 10mil) Between Pad C66-1(4465.5mil,4775.087mil) on Top Layer And Via (4471.7mil,4824.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.355mil]
Minimum Solder Mask Sliver Constraint: (5.855mil < 10mil) Between Pad C66-1(4465.5mil,4775.087mil) on Top Layer And Via (4494.7mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.855mil]
Minimum Solder Mask Sliver Constraint: (5.869mil < 10mil) Between Pad C66-1(4465.5mil,4775.087mil) on Top Layer And Via (4518.7mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.869mil]
Minimum Solder Mask Sliver Constraint: (7.708mil < 10mil) Between Pad C66-2(4465.5mil,4660.913mil) on Top Layer And Pad C71-2(4578.208mil,4681.613mil) on Top Layer [Top Solder] Mask Sliver [7.708mil]
Minimum Solder Mask Sliver Constraint: (7.219mil < 10mil) Between Pad C66-2(4465.5mil,4660.913mil) on Top Layer And Via (4396.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.219mil]
Minimum Solder Mask Sliver Constraint: (8.428mil < 10mil) Between Pad C66-2(4465.5mil,4660.913mil) on Top Layer And Via (4455.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.428mil]
Minimum Solder Mask Sliver Constraint: (8.428mil < 10mil) Between Pad C66-2(4465.5mil,4660.913mil) on Top Layer And Via (4479.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.428mil]
Minimum Solder Mask Sliver Constraint: (8.428mil < 10mil) Between Pad C66-2(4465.5mil,4660.913mil) on Top Layer And Via (4503.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.428mil]
Minimum Solder Mask Sliver Constraint: (1.142mil < 10mil) Between Pad C66-2(4465.5mil,4660.913mil) on Top Layer And Via (4530.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.142mil]
Minimum Solder Mask Sliver Constraint: (3.042mil < 10mil) Between Pad C66-2(4465.5mil,4660.913mil) on Top Layer And Via (4532.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.042mil]
Minimum Solder Mask Sliver Constraint: (4.342mil < 10mil) Between Pad C66-2(4465.5mil,4660.913mil) on Top Layer And Via (4533.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.342mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Pad C68-1(5024.032mil,4795.787mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (6.03mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Via (5065.6mil,4775.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.03mil]
Minimum Solder Mask Sliver Constraint: (6.03mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Via (5065.6mil,4799.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.03mil]
Minimum Solder Mask Sliver Constraint: (6.03mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Via (5065.6mil,4823.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.03mil]
Minimum Solder Mask Sliver Constraint: (6.955mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Via (5088.7mil,4846.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.955mil]
Minimum Solder Mask Sliver Constraint: (6.955mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Via (5112.7mil,4846.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.955mil]
Minimum Solder Mask Sliver Constraint: (6.955mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Via (5134.3mil,4846.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.955mil]
Minimum Solder Mask Sliver Constraint: (6.955mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Via (5158.3mil,4846.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.955mil]
Minimum Solder Mask Sliver Constraint: (7.155mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Via (5180.3mil,4846.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.155mil]
Minimum Solder Mask Sliver Constraint: (4.954mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Via (5204.3mil,4774.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.954mil]
Minimum Solder Mask Sliver Constraint: (4.954mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Via (5204.3mil,4798.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.954mil]
Minimum Solder Mask Sliver Constraint: (4.954mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Via (5204.3mil,4822.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.954mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C67-2(5135.488mil,4681.613mil) on Top Layer And Pad C68-2(5024.032mil,4681.613mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (3.53mil < 10mil) Between Pad C67-2(5135.488mil,4681.613mil) on Top Layer And Via (5068.1mil,4662.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.53mil]
Minimum Solder Mask Sliver Constraint: (3.53mil < 10mil) Between Pad C67-2(5135.488mil,4681.613mil) on Top Layer And Via (5068.1mil,4684.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.53mil]
Minimum Solder Mask Sliver Constraint: (2.83mil < 10mil) Between Pad C67-2(5135.488mil,4681.613mil) on Top Layer And Via (5068.8mil,4707.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.83mil]
Minimum Solder Mask Sliver Constraint: (8.055mil < 10mil) Between Pad C68-1(5024.032mil,4795.787mil) on Top Layer And Via (4990.8mil,4847.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.055mil]
Minimum Solder Mask Sliver Constraint: (8.055mil < 10mil) Between Pad C68-1(5024.032mil,4795.787mil) on Top Layer And Via (5014.8mil,4847.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.055mil]
Minimum Solder Mask Sliver Constraint: (7.655mil < 10mil) Between Pad C68-1(5024.032mil,4795.787mil) on Top Layer And Via (5041.6mil,4847.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.655mil]
Minimum Solder Mask Sliver Constraint: (7.655mil < 10mil) Between Pad C68-1(5024.032mil,4795.787mil) on Top Layer And Via (5065.6mil,4847.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.655mil]
Minimum Solder Mask Sliver Constraint: (0.81mil < 10mil) Between Pad C68-1(5024.032mil,4795.787mil) on Top Layer And Via (5088.7mil,4774.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.81mil]
Minimum Solder Mask Sliver Constraint: (0.81mil < 10mil) Between Pad C68-1(5024.032mil,4795.787mil) on Top Layer And Via (5088.7mil,4798.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.81mil]
Minimum Solder Mask Sliver Constraint: (0.81mil < 10mil) Between Pad C68-1(5024.032mil,4795.787mil) on Top Layer And Via (5088.7mil,4822.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.81mil]
Minimum Solder Mask Sliver Constraint: (3.407mil < 10mil) Between Pad C68-2(5024.032mil,4681.613mil) on Top Layer And Via (5087mil,4638.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.407mil]
Minimum Solder Mask Sliver Constraint: (4.21mil < 10mil) Between Pad C68-2(5024.032mil,4681.613mil) on Top Layer And Via (5092.1mil,4662.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.21mil]
Minimum Solder Mask Sliver Constraint: (4.21mil < 10mil) Between Pad C68-2(5024.032mil,4681.613mil) on Top Layer And Via (5092.1mil,4684.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.21mil]
Minimum Solder Mask Sliver Constraint: (4.91mil < 10mil) Between Pad C68-2(5024.032mil,4681.613mil) on Top Layer And Via (5092.8mil,4707.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.91mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C69-1(4801.12mil,4795.787mil) on Top Layer And Pad C70-1(4689.664mil,4795.787mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (9.062mil < 10mil) Between Pad C69-1(4801.12mil,4795.787mil) on Top Layer And Via (4728.2mil,4776.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.062mil]
Minimum Solder Mask Sliver Constraint: (9.062mil < 10mil) Between Pad C69-1(4801.12mil,4795.787mil) on Top Layer And Via (4728.2mil,4800.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.062mil]
Minimum Solder Mask Sliver Constraint: (9.062mil < 10mil) Between Pad C69-1(4801.12mil,4795.787mil) on Top Layer And Via (4728.2mil,4824.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.062mil]
Minimum Solder Mask Sliver Constraint: (9.055mil < 10mil) Between Pad C69-1(4801.12mil,4795.787mil) on Top Layer And Via (4752.2mil,4848.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.055mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C69-2(4801.12mil,4681.613mil) on Top Layer And Pad C70-2(4689.664mil,4681.613mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C70-1(4689.664mil,4795.787mil) on Top Layer And Pad C71-1(4578.208mil,4795.787mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (9.672mil < 10mil) Between Pad C70-1(4689.664mil,4795.787mil) on Top Layer And Via (4633mil,4848.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.672mil]
Minimum Solder Mask Sliver Constraint: (9.255mil < 10mil) Between Pad C70-1(4689.664mil,4795.787mil) on Top Layer And Via (4657mil,4848.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.255mil]
Minimum Solder Mask Sliver Constraint: (9.355mil < 10mil) Between Pad C70-1(4689.664mil,4795.787mil) on Top Layer And Via (4680.1mil,4849mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.355mil]
Minimum Solder Mask Sliver Constraint: (9.355mil < 10mil) Between Pad C70-1(4689.664mil,4795.787mil) on Top Layer And Via (4704.1mil,4849mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.355mil]
Minimum Solder Mask Sliver Constraint: (9.055mil < 10mil) Between Pad C70-1(4689.664mil,4795.787mil) on Top Layer And Via (4728.2mil,4848.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.055mil]
Minimum Solder Mask Sliver Constraint: (3.229mil < 10mil) Between Pad C70-1(4689.664mil,4795.787mil) on Top Layer And Via (4752.2mil,4752.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.229mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C70-2(4689.664mil,4681.613mil) on Top Layer And Pad C71-2(4578.208mil,4681.613mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (2.706mil < 10mil) Between Pad C70-2(4689.664mil,4681.613mil) on Top Layer And Via (4623.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.706mil]
Minimum Solder Mask Sliver Constraint: (1.255mil < 10mil) Between Pad C71-1(4578.208mil,4795.787mil) on Top Layer And Via (4518.7mil,4752.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.254mil]
Minimum Solder Mask Sliver Constraint: (9.155mil < 10mil) Between Pad C71-1(4578.208mil,4795.787mil) on Top Layer And Via (4541.7mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.155mil]
Minimum Solder Mask Sliver Constraint: (9.155mil < 10mil) Between Pad C71-1(4578.208mil,4795.787mil) on Top Layer And Via (4565.7mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.155mil]
Minimum Solder Mask Sliver Constraint: (9.655mil < 10mil) Between Pad C71-1(4578.208mil,4795.787mil) on Top Layer And Via (4587mil,4849.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.655mil]
Minimum Solder Mask Sliver Constraint: (9.655mil < 10mil) Between Pad C71-1(4578.208mil,4795.787mil) on Top Layer And Via (4611mil,4849.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.655mil]
Minimum Solder Mask Sliver Constraint: (9.382mil < 10mil) Between Pad C71-1(4578.208mil,4795.787mil) on Top Layer And Via (4633mil,4848.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.382mil]
Minimum Solder Mask Sliver Constraint: (7.85mil < 10mil) Between Pad C71-2(4578.208mil,4681.613mil) on Top Layer And Via (4506.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.85mil]
Minimum Solder Mask Sliver Constraint: (6.504mil < 10mil) Between Pad C71-2(4578.208mil,4681.613mil) on Top Layer And Via (4508.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.504mil]
Minimum Solder Mask Sliver Constraint: (4.65mil < 10mil) Between Pad C71-2(4578.208mil,4681.613mil) on Top Layer And Via (4509.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.65mil]
Minimum Solder Mask Sliver Constraint: (1.837mil < 10mil) Between Pad C71-2(4578.208mil,4681.613mil) on Top Layer And Via (4643.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.837mil]
Minimum Solder Mask Sliver Constraint: (5.834mil < 10mil) Between Pad C71-2(4578.208mil,4681.613mil) on Top Layer And Via (4647.9mil,4714.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.834mil]
Minimum Solder Mask Sliver Constraint: (9.234mil < 10mil) Between Pad C71-2(4578.208mil,4681.613mil) on Top Layer And Via (4651.3mil,4692.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.234mil]
Minimum Solder Mask Sliver Constraint: (2.709mil < 10mil) Between Pad C72-1(4320.9mil,4698.087mil) on Top Layer And Via (4257.6mil,4739.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.709mil]
Minimum Solder Mask Sliver Constraint: (3.805mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Pad C73-2(4206.265mil,4533.144mil) on Top Layer [Top Solder] Mask Sliver [3.805mil]
Minimum Solder Mask Sliver Constraint: (8.942mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Via (4248.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.942mil]
Minimum Solder Mask Sliver Constraint: (7.692mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Via (4249.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.692mil]
Minimum Solder Mask Sliver Constraint: (5.496mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Via (4252.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.496mil]
Minimum Solder Mask Sliver Constraint: (1.542mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Via (4255.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.542mil]
Minimum Solder Mask Sliver Constraint: (9.455mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Via (4281.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.455mil]
Minimum Solder Mask Sliver Constraint: (9.455mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Via (4305.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.455mil]
Minimum Solder Mask Sliver Constraint: (9.455mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Via (4329.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.455mil]
Minimum Solder Mask Sliver Constraint: (8.555mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Via (4354.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.555mil]
Minimum Solder Mask Sliver Constraint: (9.126mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Via (4378.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.126mil]
Minimum Solder Mask Sliver Constraint: (7.342mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Via (4392.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.342mil]
Minimum Solder Mask Sliver Constraint: (9.392mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Via (4394.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.392mil]
Minimum Solder Mask Sliver Constraint: (3.082mil < 10mil) Between Pad C73-1(4124.135mil,4612.456mil) on Top Layer And Via (4062.4mil,4616.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.082mil]
Minimum Solder Mask Sliver Constraint: (2.49mil < 10mil) Between Pad C73-1(4124.135mil,4612.456mil) on Top Layer And Via (4086.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.49mil]
Minimum Solder Mask Sliver Constraint: (2.098mil < 10mil) Between Pad C73-1(4124.135mil,4612.456mil) on Top Layer And Via (4110.7mil,4664.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.098mil]
Minimum Solder Mask Sliver Constraint: (4.744mil < 10mil) Between Pad C73-1(4124.135mil,4612.456mil) on Top Layer And Via (4134.7mil,4688.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.744mil]
Minimum Solder Mask Sliver Constraint: (2.9mil < 10mil) Between Pad C73-2(4206.265mil,4533.144mil) on Top Layer And Via (4159.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.9mil]
Minimum Solder Mask Sliver Constraint: (4.224mil < 10mil) Between Pad C73-2(4206.265mil,4533.144mil) on Top Layer And Via (4183mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.224mil]
Minimum Solder Mask Sliver Constraint: (6.786mil < 10mil) Between Pad C73-2(4206.265mil,4533.144mil) on Top Layer And Via (4207mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.786mil]
Minimum Solder Mask Sliver Constraint: (7.391mil < 10mil) Between Pad C73-2(4206.265mil,4533.144mil) on Top Layer And Via (4231.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.391mil]
Minimum Solder Mask Sliver Constraint: (3.179mil < 10mil) Between Pad C73-2(4206.265mil,4533.144mil) on Top Layer And Via (4279.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.179mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C74-1(5358.4mil,4795.787mil) on Top Layer And Pad C75-1(5469.856mil,4795.787mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (8.755mil < 10mil) Between Pad C74-1(5358.4mil,4795.787mil) on Top Layer And Via (5319.5mil,4848.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.755mil]
Minimum Solder Mask Sliver Constraint: (8.755mil < 10mil) Between Pad C74-1(5358.4mil,4795.787mil) on Top Layer And Via (5343.5mil,4848.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.755mil]
Minimum Solder Mask Sliver Constraint: (9.155mil < 10mil) Between Pad C74-1(5358.4mil,4795.787mil) on Top Layer And Via (5365.9mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.155mil]
Minimum Solder Mask Sliver Constraint: (9.155mil < 10mil) Between Pad C74-1(5358.4mil,4795.787mil) on Top Layer And Via (5389.9mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.155mil]
Minimum Solder Mask Sliver Constraint: (9.452mil < 10mil) Between Pad C74-1(5358.4mil,4795.787mil) on Top Layer And Via (5414.4mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.452mil]
Minimum Solder Mask Sliver Constraint: (6.456mil < 10mil) Between Pad C74-2(5358.4mil,4681.613mil) on Top Layer And Pad C75-2(5469.856mil,4681.613mil) on Top Layer [Top Solder] Mask Sliver [6.456mil]
Minimum Solder Mask Sliver Constraint: (9.642mil < 10mil) Between Pad C74-2(5358.4mil,4681.613mil) on Top Layer And Via (5284.9mil,4663.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.642mil]
Minimum Solder Mask Sliver Constraint: (9.642mil < 10mil) Between Pad C74-2(5358.4mil,4681.613mil) on Top Layer And Via (5284.9mil,4685.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.642mil]
Minimum Solder Mask Sliver Constraint: (9.855mil < 10mil) Between Pad C74-2(5358.4mil,4681.613mil) on Top Layer And Via (5430.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.855mil]
Minimum Solder Mask Sliver Constraint: (8.242mil < 10mil) Between Pad C74-2(5358.4mil,4681.613mil) on Top Layer And Via (5430.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.242mil]
Minimum Solder Mask Sliver Constraint: (8.242mil < 10mil) Between Pad C74-2(5358.4mil,4681.613mil) on Top Layer And Via (5430.5mil,4686.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.242mil]
Minimum Solder Mask Sliver Constraint: (9.367mil < 10mil) Between Pad C75-1(5469.856mil,4795.787mil) on Top Layer And Via (5414.4mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.367mil]
Minimum Solder Mask Sliver Constraint: (9.155mil < 10mil) Between Pad C75-1(5469.856mil,4795.787mil) on Top Layer And Via (5438.4mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.155mil]
Minimum Solder Mask Sliver Constraint: (9.155mil < 10mil) Between Pad C75-1(5469.856mil,4795.787mil) on Top Layer And Via (5462mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.155mil]
Minimum Solder Mask Sliver Constraint: (9.155mil < 10mil) Between Pad C75-1(5469.856mil,4795.787mil) on Top Layer And Via (5486mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.155mil]
Minimum Solder Mask Sliver Constraint: (9.199mil < 10mil) Between Pad C75-1(5469.856mil,4795.787mil) on Top Layer And Via (5507.932mil,4848.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.199mil]
Minimum Solder Mask Sliver Constraint: (2.195mil < 10mil) Between Pad C75-2(5469.856mil,4681.613mil) on Top Layer And Via (5406.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.195mil]
Minimum Solder Mask Sliver Constraint: (2.016mil < 10mil) Between Pad C76-1(5627.086mil,4570mil) on Top Layer And Via (5669.1mil,4631.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.016mil]
Minimum Solder Mask Sliver Constraint: (0.33mil < 10mil) Between Pad C76-1(5627.086mil,4570mil) on Top Layer And Via (5669.9mil,4512mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.33mil]
Minimum Solder Mask Sliver Constraint: (7.241mil < 10mil) Between Pad C76-2(5512.913mil,4570mil) on Top Layer And Via (5478.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.241mil]
Minimum Solder Mask Sliver Constraint: (7.142mil < 10mil) Between Pad C76-2(5512.913mil,4570mil) on Top Layer And Via (5502.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.142mil]
Minimum Solder Mask Sliver Constraint: (7.142mil < 10mil) Between Pad C76-2(5512.913mil,4570mil) on Top Layer And Via (5526.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.142mil]
Minimum Solder Mask Sliver Constraint: (8.118mil < 10mil) Between Pad C9-1(4743.984mil,5809.1mil) on Bottom Layer And Pad R33-1(4743.849mil,5841.903mil) on Bottom Layer [Bottom Solder] Mask Sliver [8.118mil]
Minimum Solder Mask Sliver Constraint: (8.115mil < 10mil) Between Pad C9-2(4779.413mil,5809.103mil) on Bottom Layer And Pad R33-2(4777.313mil,5841.903mil) on Bottom Layer [Bottom Solder] Mask Sliver [8.115mil]
Minimum Solder Mask Sliver Constraint: (5.039mil < 10mil) Between Pad D1-2(5503.4mil,5404.682mil) on Bottom Layer And Via (5497.928mil,5442.852mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.039mil]
Minimum Solder Mask Sliver Constraint: (8.754mil < 10mil) Between Pad D1-2(5503.4mil,5404.682mil) on Bottom Layer And Via (5525.3mil,5442.4mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.754mil]
Minimum Solder Mask Sliver Constraint: (8.536mil < 10mil) Between Pad D1-2(5503.4mil,5404.682mil) on Bottom Layer And Via (5541.542mil,5413.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.536mil]
Minimum Solder Mask Sliver Constraint: (5.804mil < 10mil) Between Pad IC1-4(5639.4mil,5085.453mil) on Top Layer And Via (5669.4mil,5115.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.804mil]
Minimum Solder Mask Sliver Constraint: (8.115mil < 10mil) Between Pad IC1-5(5639.4mil,5292.146mil) on Top Layer And Via (5672.2mil,5285.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.115mil]
Minimum Solder Mask Sliver Constraint: (0.23mil < 10mil) Between Pad IC1-7(5539.4mil,5292.146mil) on Top Layer And Via (5515.229mil,5322.798mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.23mil]
Minimum Solder Mask Sliver Constraint: (1.843mil < 10mil) Between Pad IC1-8(5489.4mil,5292.146mil) on Top Layer And Via (5515.229mil,5322.798mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.842mil]
Minimum Solder Mask Sliver Constraint: (7.299mil < 10mil) Between Pad IC2-1(5281.5mil,5195.925mil) on Bottom Layer And Via (5310mil,5237.281mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.299mil]
Minimum Solder Mask Sliver Constraint: (6.826mil < 10mil) Between Pad IC2-2(5331.5mil,5195.925mil) on Bottom Layer And Via (5310mil,5237.281mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.826mil]
Minimum Solder Mask Sliver Constraint: (5.834mil < 10mil) Between Pad IC2-3(5381.5mil,5195.925mil) on Bottom Layer And Via (5363.741mil,5152.641mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.834mil]
Minimum Solder Mask Sliver Constraint: (4.937mil < 10mil) Between Pad IC2-3(5381.5mil,5195.925mil) on Bottom Layer And Via (5400.2mil,5237.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.937mil]
Minimum Solder Mask Sliver Constraint: (6.518mil < 10mil) Between Pad IC2-6(5381.5mil,4999.075mil) on Bottom Layer And Via (5403.4mil,5039.582mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.518mil]
Minimum Solder Mask Sliver Constraint: (2.598mil < 10mil) Between Pad IC2-7(5331.5mil,4999.075mil) on Bottom Layer And Via (5305.201mil,4996.617mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.598mil]
Minimum Solder Mask Sliver Constraint: (9.597mil < 10mil) Between Pad IC3-3(5376.2mil,5085.053mil) on Top Layer And Via (5403.4mil,5039.582mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.597mil]
Minimum Solder Mask Sliver Constraint: (6.222mil < 10mil) Between Pad IC3-4(5426.2mil,5085.053mil) on Top Layer And Via (5403.4mil,5039.582mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.222mil]
Minimum Solder Mask Sliver Constraint: (9.607mil < 10mil) Between Pad IC3-5(5426.2mil,5291.747mil) on Top Layer And Via (5454.279mil,5336.038mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.607mil]
Minimum Solder Mask Sliver Constraint: (9.286mil < 10mil) Between Pad IC3-7(5326.2mil,5291.747mil) on Top Layer And Via (5310mil,5237.281mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.286mil]
Minimum Solder Mask Sliver Constraint: (5.315mil < 10mil) Between Pad IC4-1(5639.4mil,5085.453mil) on Bottom Layer And Via (5669.4mil,5115.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.315mil]
Minimum Solder Mask Sliver Constraint: (1.843mil < 10mil) Between Pad IC4-5(5489.4mil,5292.146mil) on Bottom Layer And Via (5515.229mil,5322.798mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.842mil]
Minimum Solder Mask Sliver Constraint: (0.23mil < 10mil) Between Pad IC4-6(5539.4mil,5292.146mil) on Bottom Layer And Via (5515.229mil,5322.798mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [0.23mil]
Minimum Solder Mask Sliver Constraint: (8.115mil < 10mil) Between Pad IC4-8(5639.4mil,5292.146mil) on Bottom Layer And Via (5672.2mil,5285.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.115mil]
Minimum Solder Mask Sliver Constraint: (2.082mil < 10mil) Between Pad JP1-0(5832.6mil,5039.838mil) on Top Layer And Pad JP2-0(5828.74mil,4954.016mil) on Top Layer [Top Solder] Mask Sliver [2.082mil]
Minimum Solder Mask Sliver Constraint: (4.861mil < 10mil) Between Pad JP10-2(4185mil,5820mil) on Top Layer And Via (4152.2mil,5750.458mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.861mil]
Minimum Solder Mask Sliver Constraint: (6.363mil < 10mil) Between Pad JP10-3(4285mil,5820mil) on Top Layer And Via (4325.3mil,5775.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.363mil]
Minimum Solder Mask Sliver Constraint: (9.863mil < 10mil) Between Pad JP10-5(4485mil,5820mil) on Top Layer And Via (4528.8mil,5865.658mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.863mil]
Minimum Solder Mask Sliver Constraint: (9.863mil < 10mil) Between Pad JP11-1(4485mil,5820mil) on Bottom Layer And Via (4528.8mil,5865.658mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.863mil]
Minimum Solder Mask Sliver Constraint: (6.363mil < 10mil) Between Pad JP11-3(4285mil,5820mil) on Bottom Layer And Via (4325.3mil,5775.4mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.363mil]
Minimum Solder Mask Sliver Constraint: (4.861mil < 10mil) Between Pad JP11-4(4185mil,5820mil) on Bottom Layer And Via (4152.2mil,5750.458mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.861mil]
Minimum Solder Mask Sliver Constraint: (5.12mil < 10mil) Between Pad JP12-1(4030mil,4360mil) on Multi-Layer And Via (3989.7mil,4425mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.12mil] / [Bottom Solder] Mask Sliver [5.12mil]
Minimum Solder Mask Sliver Constraint: (3.59mil < 10mil) Between Pad JP12-1(4030mil,4360mil) on Multi-Layer And Via (3993.1mil,4295.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.59mil] / [Bottom Solder] Mask Sliver [3.59mil]
Minimum Solder Mask Sliver Constraint: (1.929mil < 10mil) Between Pad JP12-1(4030mil,4360mil) on Multi-Layer And Via (4013.7mil,4425mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.929mil] / [Bottom Solder] Mask Sliver [1.929mil]
Minimum Solder Mask Sliver Constraint: (1.329mil < 10mil) Between Pad JP12-1(4030mil,4360mil) on Multi-Layer And Via (4017.1mil,4295.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.329mil] / [Bottom Solder] Mask Sliver [1.329mil]
Minimum Solder Mask Sliver Constraint: (1.929mil < 10mil) Between Pad JP12-1(4030mil,4360mil) on Multi-Layer And Via (4037.7mil,4425mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.929mil] / [Bottom Solder] Mask Sliver [1.929mil]
Minimum Solder Mask Sliver Constraint: (1.329mil < 10mil) Between Pad JP12-1(4030mil,4360mil) on Multi-Layer And Via (4041.1mil,4295.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.329mil] / [Bottom Solder] Mask Sliver [1.329mil]
Minimum Solder Mask Sliver Constraint: (3.03mil < 10mil) Between Pad JP12-1(4030mil,4360mil) on Multi-Layer And Via (4061.7mil,4425mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.03mil] / [Bottom Solder] Mask Sliver [3.03mil]
Minimum Solder Mask Sliver Constraint: (3.148mil < 10mil) Between Pad JP12-1(4030mil,4360mil) on Multi-Layer And Via (4065.1mil,4295.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.148mil] / [Bottom Solder] Mask Sliver [3.148mil]
Minimum Solder Mask Sliver Constraint: (1.318mil < 10mil) Between Pad JP12-2(4030mil,4160mil) on Multi-Layer And Via (3993.3mil,4097.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.318mil] / [Bottom Solder] Mask Sliver [1.318mil]
Minimum Solder Mask Sliver Constraint: (0.564mil < 10mil) Between Pad JP12-2(4030mil,4160mil) on Multi-Layer And Via (3993.6mil,4221.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.564mil] / [Bottom Solder] Mask Sliver [0.564mil]
Minimum Solder Mask Sliver Constraint: (0.962mil < 10mil) Between Pad JP12-2(4030mil,4160mil) on Multi-Layer And Via (4065.3mil,4097.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.962mil] / [Bottom Solder] Mask Sliver [0.962mil]
Minimum Solder Mask Sliver Constraint: (0.358mil < 10mil) Between Pad JP12-2(4030mil,4160mil) on Multi-Layer And Via (4065.6mil,4221.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.358mil] / [Bottom Solder] Mask Sliver [0.358mil]
Minimum Solder Mask Sliver Constraint: (4.392mil < 10mil) Between Pad JP1-4(5721.947mil,5295.476mil) on Top Layer And Via (5672.2mil,5285.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.392mil]
Minimum Solder Mask Sliver Constraint: (8.309mil < 10mil) Between Pad JP2-0(5828.74mil,4490.866mil) on Top Layer And Via (5751.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.309mil]
Minimum Solder Mask Sliver Constraint: (4.227mil < 10mil) Between Pad JP2-0(5828.74mil,4490.866mil) on Top Layer And Via (5751.6mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.227mil]
Minimum Solder Mask Sliver Constraint: (0.638mil < 10mil) Between Pad JP2-0(5828.74mil,4490.866mil) on Top Layer And Via (5775.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.638mil]
Minimum Solder Mask Sliver Constraint: (3.632mil < 10mil) Between Pad JP2-1(5718.087mil,4598.866mil) on Top Layer And Via (5669.1mil,4583.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.632mil]
Minimum Solder Mask Sliver Constraint: (3.632mil < 10mil) Between Pad JP2-1(5718.087mil,4598.866mil) on Top Layer And Via (5669.1mil,4607.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.632mil]
Minimum Solder Mask Sliver Constraint: (9.698mil < 10mil) Between Pad JP2-1(5718.087mil,4598.866mil) on Top Layer And Via (5669.1mil,4631.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.697mil]
Minimum Solder Mask Sliver Constraint: (1.759mil < 10mil) Between Pad JP2-1(5718.087mil,4598.866mil) on Top Layer And Via (5765.2mil,4582.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.759mil]
Minimum Solder Mask Sliver Constraint: (3.632mil < 10mil) Between Pad JP2-2(5718.087mil,4648.079mil) on Top Layer And Via (5669.1mil,4631.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.632mil]
Minimum Solder Mask Sliver Constraint: (3.632mil < 10mil) Between Pad JP2-2(5718.087mil,4648.079mil) on Top Layer And Via (5669.1mil,4655.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.632mil]
Minimum Solder Mask Sliver Constraint: (8.864mil < 10mil) Between Pad JP2-2(5718.087mil,4648.079mil) on Top Layer And Via (5669.1mil,4679.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.864mil]
Minimum Solder Mask Sliver Constraint: (3.632mil < 10mil) Between Pad JP2-3(5718.087mil,4697.291mil) on Top Layer And Via (5669.1mil,4679.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.632mil]
Minimum Solder Mask Sliver Constraint: (3.732mil < 10mil) Between Pad JP2-3(5718.087mil,4697.291mil) on Top Layer And Via (5669mil,4704.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.732mil]
Minimum Solder Mask Sliver Constraint: (8.665mil < 10mil) Between Pad JP2-3(5718.087mil,4697.291mil) on Top Layer And Via (5669mil,4728.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.665mil]
Minimum Solder Mask Sliver Constraint: (3.732mil < 10mil) Between Pad JP2-4(5718.087mil,4746.504mil) on Top Layer And Via (5669mil,4728.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.732mil]
Minimum Solder Mask Sliver Constraint: (3.732mil < 10mil) Between Pad JP2-4(5718.087mil,4746.504mil) on Top Layer And Via (5669mil,4752.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.732mil]
Minimum Solder Mask Sliver Constraint: (7.89mil < 10mil) Between Pad JP2-4(5718.087mil,4746.504mil) on Top Layer And Via (5669mil,4776.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.89mil]
Minimum Solder Mask Sliver Constraint: (3.752mil < 10mil) Between Pad JP2-5(5718.087mil,4795.717mil) on Top Layer And Via (5669mil,4776.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.752mil]
Minimum Solder Mask Sliver Constraint: (3.732mil < 10mil) Between Pad JP2-5(5718.087mil,4795.717mil) on Top Layer And Via (5669mil,4800.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.732mil]
Minimum Solder Mask Sliver Constraint: (7.162mil < 10mil) Between Pad JP2-5(5718.087mil,4795.717mil) on Top Layer And Via (5669mil,4824.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.162mil]
Minimum Solder Mask Sliver Constraint: (3.862mil < 10mil) Between Pad JP2-6(5718.087mil,4844.929mil) on Top Layer And Via (5669mil,4824.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.862mil]
Minimum Solder Mask Sliver Constraint: (3.31mil < 10mil) Between Pad JP2-6(5718.087mil,4844.929mil) on Top Layer And Via (5674.3mil,4874.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.31mil]
Minimum Solder Mask Sliver Constraint: (1.454mil < 10mil) Between Pad JP3-0(5839.567mil,4564.685mil) on Bottom Layer And Via (5765.2mil,4558.6mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.454mil]
Minimum Solder Mask Sliver Constraint: (1.454mil < 10mil) Between Pad JP3-0(5839.567mil,4564.685mil) on Bottom Layer And Via (5765.2mil,4582.6mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.454mil]
Minimum Solder Mask Sliver Constraint: (3.528mil < 10mil) Between Pad JP3-0(5839.567mil,4564.685mil) on Bottom Layer And Via (5766.4mil,4513.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.528mil]
Minimum Solder Mask Sliver Constraint: (0.254mil < 10mil) Between Pad JP3-0(5839.567mil,4564.685mil) on Bottom Layer And Via (5766.4mil,4537.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [0.254mil]
Minimum Solder Mask Sliver Constraint: (0.354mil < 10mil) Between Pad JP3-0(5839.567mil,4929.409mil) on Bottom Layer And Pad JP4-0(5839.567mil,5013.504mil) on Bottom Layer [Bottom Solder] Mask Sliver [0.354mil]
Minimum Solder Mask Sliver Constraint: (9.878mil < 10mil) Between Pad JP4-2(5728.913mil,5221.016mil) on Bottom Layer And Via (5678.1mil,5189.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.878mil]
Minimum Solder Mask Sliver Constraint: (5.459mil < 10mil) Between Pad JP4-3(5728.913mil,5171.803mil) on Bottom Layer And Via (5678.1mil,5189.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.459mil]
Minimum Solder Mask Sliver Constraint: (3.463mil < 10mil) Between Pad JP5-1(4055mil,5210mil) on Bottom Layer And Via (4119.3mil,5247.4mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.463mil]
Minimum Solder Mask Sliver Constraint: (6.363mil < 10mil) Between Pad JP5-5(4055mil,4810mil) on Bottom Layer And Via (4052.2mil,4850.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.363mil]
Minimum Solder Mask Sliver Constraint: (5.963mil < 10mil) Between Pad JP6-1(4056.9mil,4810.4mil) on Top Layer And Via (4052.2mil,4850.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.963mil]
Minimum Solder Mask Sliver Constraint: (9.063mil < 10mil) Between Pad JP6-1(4056.9mil,4810.4mil) on Top Layer And Via (4112.9mil,4853.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.063mil]
Minimum Solder Mask Sliver Constraint: (5.477mil < 10mil) Between Pad JP6-5(4056.9mil,5210.4mil) on Top Layer And Via (4119.3mil,5247.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.477mil]
Minimum Solder Mask Sliver Constraint: (3.657mil < 10mil) Between Pad JP9-1(4840mil,4045mil) on Multi-Layer And Via (4779.3mil,3997.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.657mil] / [Bottom Solder] Mask Sliver [3.657mil]
Minimum Solder Mask Sliver Constraint: (4.164mil < 10mil) Between Pad JP9-1(4840mil,4045mil) on Multi-Layer And Via (4779.3mil,4093.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.164mil] / [Bottom Solder] Mask Sliver [4.164mil]
Minimum Solder Mask Sliver Constraint: (2.684mil < 10mil) Between Pad JP9-1(4840mil,4045mil) on Multi-Layer And Via (4810.2mil,4123.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.684mil] / [Bottom Solder] Mask Sliver [2.684mil]
Minimum Solder Mask Sliver Constraint: (3.437mil < 10mil) Between Pad JP9-1(4840mil,4045mil) on Multi-Layer And Via (4899.4mil,3995.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.437mil] / [Bottom Solder] Mask Sliver [3.437mil]
Minimum Solder Mask Sliver Constraint: (2.06mil < 10mil) Between Pad JP9-1(4840mil,4045mil) on Multi-Layer And Via (4899.4mil,4091.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.06mil] / [Bottom Solder] Mask Sliver [2.06mil]
Minimum Solder Mask Sliver Constraint: (2.732mil < 10mil) Between Pad JP9-2(5040mil,4045mil) on Multi-Layer And Via (4981.7mil,3994.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.732mil] / [Bottom Solder] Mask Sliver [2.732mil]
Minimum Solder Mask Sliver Constraint: (0.811mil < 10mil) Between Pad JP9-2(5040mil,4045mil) on Multi-Layer And Via (4981.7mil,4090.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.811mil] / [Bottom Solder] Mask Sliver [0.811mil]
Minimum Solder Mask Sliver Constraint: (6.836mil < 10mil) Between Pad JP9-2(5040mil,4045mil) on Multi-Layer And Via (5017mil,4130.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.836mil] / [Bottom Solder] Mask Sliver [6.836mil]
Minimum Solder Mask Sliver Constraint: (2.952mil < 10mil) Between Pad JP9-2(5040mil,4045mil) on Multi-Layer And Via (5041mil,4130.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.952mil] / [Bottom Solder] Mask Sliver [2.952mil]
Minimum Solder Mask Sliver Constraint: (7.519mil < 10mil) Between Pad JP9-2(5040mil,4045mil) on Multi-Layer And Via (5065mil,4130.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.519mil] / [Bottom Solder] Mask Sliver [7.519mil]
Minimum Solder Mask Sliver Constraint: (8.287mil < 10mil) Between Pad JP9-2(5040mil,4045mil) on Multi-Layer And Via (5105.5mil,3997mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.287mil] / [Bottom Solder] Mask Sliver [8.287mil]
Minimum Solder Mask Sliver Constraint: (2.571mil < 10mil) Between Pad JP9-2(5040mil,4045mil) on Multi-Layer And Via (5105.5mil,4021mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.571mil] / [Bottom Solder] Mask Sliver [2.571mil]
Minimum Solder Mask Sliver Constraint: (2.429mil < 10mil) Between Pad JP9-2(5040mil,4045mil) on Multi-Layer And Via (5105.5mil,4045mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.429mil] / [Bottom Solder] Mask Sliver [2.429mil]
Minimum Solder Mask Sliver Constraint: (2.571mil < 10mil) Between Pad JP9-2(5040mil,4045mil) on Multi-Layer And Via (5105.5mil,4069mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.571mil] / [Bottom Solder] Mask Sliver [2.571mil]
Minimum Solder Mask Sliver Constraint: (8.287mil < 10mil) Between Pad JP9-2(5040mil,4045mil) on Multi-Layer And Via (5105.5mil,4093mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.287mil] / [Bottom Solder] Mask Sliver [8.287mil]
Minimum Solder Mask Sliver Constraint: (4.222mil < 10mil) Between Pad JP9-3(5240mil,4045mil) on Multi-Layer And Via (5178.5mil,3998mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.222mil] / [Bottom Solder] Mask Sliver [4.222mil]
Minimum Solder Mask Sliver Constraint: (5.059mil < 10mil) Between Pad JP9-3(5240mil,4045mil) on Multi-Layer And Via (5178.5mil,4094mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.059mil] / [Bottom Solder] Mask Sliver [5.059mil]
Minimum Solder Mask Sliver Constraint: (9.076mil < 10mil) Between Pad JP9-3(5240mil,4045mil) on Multi-Layer And Via (5216.8mil,4133mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.076mil] / [Bottom Solder] Mask Sliver [9.076mil]
Minimum Solder Mask Sliver Constraint: (5.249mil < 10mil) Between Pad JP9-3(5240mil,4045mil) on Multi-Layer And Via (5240.8mil,4133mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.249mil] / [Bottom Solder] Mask Sliver [5.249mil]
Minimum Solder Mask Sliver Constraint: (9.606mil < 10mil) Between Pad JP9-3(5240mil,4045mil) on Multi-Layer And Via (5264.8mil,4133mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.606mil] / [Bottom Solder] Mask Sliver [9.606mil]
Minimum Solder Mask Sliver Constraint: (6.37mil < 10mil) Between Pad JP9-3(5240mil,4045mil) on Multi-Layer And Via (5309.3mil,4020.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.37mil] / [Bottom Solder] Mask Sliver [6.37mil]
Minimum Solder Mask Sliver Constraint: (4.058mil < 10mil) Between Pad LED1-A(4004.8mil,5869.165mil) on Top Layer And Via (4004.6mil,5835.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.058mil]
Minimum Solder Mask Sliver Constraint: (6.599mil < 10mil) Between Pad LED1-K(4004.8mil,5802.235mil) on Top Layer And Via (4004.6mil,5835.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.599mil]
Minimum Solder Mask Sliver Constraint: (1.843mil < 10mil) Between Pad NT1-1(4622.602mil,4932.5mil) on Top Layer And Pad NT1-2(4642.287mil,4932.5mil) on Top Layer [Top Solder] Mask Sliver [1.843mil]
Minimum Solder Mask Sliver Constraint: (1.843mil < 10mil) Between Pad NT2-1(4552.2mil,4951.8mil) on Top Layer And Pad NT2-2(4552.2mil,4971.485mil) on Top Layer [Top Solder] Mask Sliver [1.843mil]
Minimum Solder Mask Sliver Constraint: (4.032mil < 10mil) Between Pad NT2-2(4552.2mil,4971.485mil) on Top Layer And Via (4544.597mil,4994.577mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.032mil]
Minimum Solder Mask Sliver Constraint: (1.843mil < 10mil) Between Pad NT3-1(5281.4mil,4940.1mil) on Top Layer And Pad NT3-2(5281.4mil,4920.415mil) on Top Layer [Top Solder] Mask Sliver [1.843mil]
Minimum Solder Mask Sliver Constraint: (5.13mil < 10mil) Between Pad NT3-2(5281.4mil,4920.415mil) on Top Layer And Via (5273.1mil,4896.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.13mil]
Minimum Solder Mask Sliver Constraint: (8.412mil < 10mil) Between Pad NT3-2(5281.4mil,4920.415mil) on Top Layer And Via (5297.1mil,4896.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.412mil]
Minimum Solder Mask Sliver Constraint: (1.843mil < 10mil) Between Pad NT4-1(4560.815mil,4922.9mil) on Top Layer And Pad NT4-2(4580.5mil,4922.9mil) on Top Layer [Top Solder] Mask Sliver [1.843mil]
Minimum Solder Mask Sliver Constraint: (6.274mil < 10mil) Between Pad NT4-1(4560.815mil,4922.9mil) on Top Layer And Via (4565.7mil,4896.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.274mil]
Minimum Solder Mask Sliver Constraint: (0.435mil < 10mil) Between Pad NT4-1(4560.815mil,4922.9mil) on Top Layer And Via (4569.557mil,4941.68mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.435mil]
Minimum Solder Mask Sliver Constraint: (9.725mil < 10mil) Between Pad NT4-2(4580.5mil,4922.9mil) on Top Layer And Via (4565.7mil,4896.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.725mil]
Minimum Solder Mask Sliver Constraint: (1.456mil < 10mil) Between Pad NT4-2(4580.5mil,4922.9mil) on Top Layer And Via (4569.557mil,4941.68mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.456mil]
Minimum Solder Mask Sliver Constraint: (6.133mil < 10mil) Between Pad NT4-2(4580.5mil,4922.9mil) on Top Layer And Via (4587mil,4897.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.133mil]
Minimum Solder Mask Sliver Constraint: (4.98mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5005mil,4478mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.98mil]
Minimum Solder Mask Sliver Constraint: (4.98mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5005mil,4502mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.98mil]
Minimum Solder Mask Sliver Constraint: (4.98mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5005mil,4526mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.98mil]
Minimum Solder Mask Sliver Constraint: (4.98mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5005mil,4550mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.98mil]
Minimum Solder Mask Sliver Constraint: (4.98mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5005mil,4574mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.98mil]
Minimum Solder Mask Sliver Constraint: (6.721mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5031mil,4382mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.721mil]
Minimum Solder Mask Sliver Constraint: (6.721mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5055mil,4382mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.721mil]
Minimum Solder Mask Sliver Constraint: (6.721mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5079mil,4382mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.721mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5103mil,4406mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5103mil,4430mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5103mil,4454mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5103mil,4478mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5103mil,4502mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5103mil,4526mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5103mil,4550mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q10-D(5053.819mil,4495.552mil) on Bottom Layer And Via (5103mil,4574mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (8.83mil < 10mil) Between Pad Q10-D(5108.937mil,4495.552mil) on Bottom Layer And Via (5175mil,4406mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.83mil]
Minimum Solder Mask Sliver Constraint: (8.445mil < 10mil) Between Pad Q10-D(5108.937mil,4495.552mil) on Bottom Layer And Via (5175mil,4430mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.445mil]
Minimum Solder Mask Sliver Constraint: (8.445mil < 10mil) Between Pad Q10-D(5108.937mil,4495.552mil) on Bottom Layer And Via (5175mil,4454mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.445mil]
Minimum Solder Mask Sliver Constraint: (8.445mil < 10mil) Between Pad Q10-D(5108.937mil,4495.552mil) on Bottom Layer And Via (5175mil,4478mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.445mil]
Minimum Solder Mask Sliver Constraint: (8.445mil < 10mil) Between Pad Q10-D(5108.937mil,4495.552mil) on Bottom Layer And Via (5175mil,4502mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.445mil]
Minimum Solder Mask Sliver Constraint: (8.445mil < 10mil) Between Pad Q10-D(5108.937mil,4495.552mil) on Bottom Layer And Via (5175mil,4526mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.445mil]
Minimum Solder Mask Sliver Constraint: (8.445mil < 10mil) Between Pad Q10-D(5108.937mil,4495.552mil) on Bottom Layer And Via (5175mil,4550mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.445mil]
Minimum Solder Mask Sliver Constraint: (8.445mil < 10mil) Between Pad Q10-D(5108.937mil,4495.552mil) on Bottom Layer And Via (5175mil,4574mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.445mil]
Minimum Solder Mask Sliver Constraint: (2.055mil < 10mil) Between Pad Q10-D(5162.087mil,4495.552mil) on Bottom Layer And Via (5103mil,4406mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.055mil]
Minimum Solder Mask Sliver Constraint: (1.468mil < 10mil) Between Pad Q10-D(5162.087mil,4495.552mil) on Bottom Layer And Via (5103mil,4430mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.468mil]
Minimum Solder Mask Sliver Constraint: (1.468mil < 10mil) Between Pad Q10-D(5162.087mil,4495.552mil) on Bottom Layer And Via (5103mil,4454mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.468mil]
Minimum Solder Mask Sliver Constraint: (1.468mil < 10mil) Between Pad Q10-D(5162.087mil,4495.552mil) on Bottom Layer And Via (5103mil,4478mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.468mil]
Minimum Solder Mask Sliver Constraint: (1.468mil < 10mil) Between Pad Q10-D(5162.087mil,4495.552mil) on Bottom Layer And Via (5103mil,4502mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.468mil]
Minimum Solder Mask Sliver Constraint: (1.468mil < 10mil) Between Pad Q10-D(5162.087mil,4495.552mil) on Bottom Layer And Via (5103mil,4526mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.468mil]
Minimum Solder Mask Sliver Constraint: (1.468mil < 10mil) Between Pad Q10-D(5162.087mil,4495.552mil) on Bottom Layer And Via (5103mil,4550mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.468mil]
Minimum Solder Mask Sliver Constraint: (1.468mil < 10mil) Between Pad Q10-D(5162.087mil,4495.552mil) on Bottom Layer And Via (5103mil,4574mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.468mil]
Minimum Solder Mask Sliver Constraint: (7.121mil < 10mil) Between Pad Q10-S(5269.371mil,4520.552mil) on Bottom Layer And Via (5313.35mil,4539.11mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.121mil]
Minimum Solder Mask Sliver Constraint: (7.031mil < 10mil) Between Pad Q10-S(5269.371mil,4570.552mil) on Bottom Layer And Via (5313.35mil,4563.11mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.031mil]
Minimum Solder Mask Sliver Constraint: (7.215mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4388mil,4124mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.215mil]
Minimum Solder Mask Sliver Constraint: (7.215mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4388mil,4148mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.215mil]
Minimum Solder Mask Sliver Constraint: (7.215mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4388mil,4172mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.215mil]
Minimum Solder Mask Sliver Constraint: (7.215mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4388mil,4196mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.215mil]
Minimum Solder Mask Sliver Constraint: (7.215mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4388mil,4220mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.215mil]
Minimum Solder Mask Sliver Constraint: (7.215mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4388mil,4244mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.215mil]
Minimum Solder Mask Sliver Constraint: (7.169mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4416mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.169mil]
Minimum Solder Mask Sliver Constraint: (9.569mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4422.7mil,4038.6mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.569mil]
Minimum Solder Mask Sliver Constraint: (7.169mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4440mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.169mil]
Minimum Solder Mask Sliver Constraint: (9.569mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4446.7mil,4038.6mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.569mil]
Minimum Solder Mask Sliver Constraint: (7.169mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4464mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.169mil]
Minimum Solder Mask Sliver Constraint: (9.569mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4470.7mil,4038.6mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.569mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4488mil,4077mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4488mil,4101mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4488mil,4125mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4488mil,4149mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4488mil,4173mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4488mil,4197mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4488mil,4221mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q11-D(4439.054mil,4155mil) on Bottom Layer And Via (4488mil,4245mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (0.348mil < 10mil) Between Pad Q11-D(4494.172mil,4155mil) on Bottom Layer And Via (4546.4mil,4059.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [0.348mil]
Minimum Solder Mask Sliver Constraint: (8.21mil < 10mil) Between Pad Q11-D(4494.172mil,4155mil) on Bottom Layer And Via (4560mil,4077mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.21mil]
Minimum Solder Mask Sliver Constraint: (8.21mil < 10mil) Between Pad Q11-D(4494.172mil,4155mil) on Bottom Layer And Via (4560mil,4101mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.21mil]
Minimum Solder Mask Sliver Constraint: (8.21mil < 10mil) Between Pad Q11-D(4494.172mil,4155mil) on Bottom Layer And Via (4560mil,4125mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.21mil]
Minimum Solder Mask Sliver Constraint: (8.21mil < 10mil) Between Pad Q11-D(4494.172mil,4155mil) on Bottom Layer And Via (4560mil,4149mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.21mil]
Minimum Solder Mask Sliver Constraint: (8.21mil < 10mil) Between Pad Q11-D(4494.172mil,4155mil) on Bottom Layer And Via (4560mil,4173mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.21mil]
Minimum Solder Mask Sliver Constraint: (8.21mil < 10mil) Between Pad Q11-D(4494.172mil,4155mil) on Bottom Layer And Via (4560mil,4197mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.21mil]
Minimum Solder Mask Sliver Constraint: (8.21mil < 10mil) Between Pad Q11-D(4494.172mil,4155mil) on Bottom Layer And Via (4560mil,4221mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.21mil]
Minimum Solder Mask Sliver Constraint: (8.692mil < 10mil) Between Pad Q11-D(4494.172mil,4155mil) on Bottom Layer And Via (4560mil,4245mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.692mil]
Minimum Solder Mask Sliver Constraint: (1.704mil < 10mil) Between Pad Q11-D(4547.322mil,4155mil) on Bottom Layer And Via (4488mil,4077mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.704mil]
Minimum Solder Mask Sliver Constraint: (1.704mil < 10mil) Between Pad Q11-D(4547.322mil,4155mil) on Bottom Layer And Via (4488mil,4101mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.704mil]
Minimum Solder Mask Sliver Constraint: (1.704mil < 10mil) Between Pad Q11-D(4547.322mil,4155mil) on Bottom Layer And Via (4488mil,4125mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.704mil]
Minimum Solder Mask Sliver Constraint: (1.704mil < 10mil) Between Pad Q11-D(4547.322mil,4155mil) on Bottom Layer And Via (4488mil,4149mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.704mil]
Minimum Solder Mask Sliver Constraint: (1.704mil < 10mil) Between Pad Q11-D(4547.322mil,4155mil) on Bottom Layer And Via (4488mil,4173mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.704mil]
Minimum Solder Mask Sliver Constraint: (1.704mil < 10mil) Between Pad Q11-D(4547.322mil,4155mil) on Bottom Layer And Via (4488mil,4197mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.704mil]
Minimum Solder Mask Sliver Constraint: (1.704mil < 10mil) Between Pad Q11-D(4547.322mil,4155mil) on Bottom Layer And Via (4488mil,4221mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.704mil]
Minimum Solder Mask Sliver Constraint: (2.416mil < 10mil) Between Pad Q11-D(4547.322mil,4155mil) on Bottom Layer And Via (4488mil,4245mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.416mil]
Minimum Solder Mask Sliver Constraint: (9.909mil < 10mil) Between Pad Q11-G(4654.606mil,4080mil) on Bottom Layer And Via (4642mil,4118mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.909mil]
Minimum Solder Mask Sliver Constraint: (9.909mil < 10mil) Between Pad Q11-G(4654.606mil,4080mil) on Bottom Layer And Via (4666mil,4118mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.909mil]
Minimum Solder Mask Sliver Constraint: (7.91mil < 10mil) Between Pad Q11-S(4654.606mil,4130mil) on Bottom Layer And Via (4642mil,4166mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.91mil]
Minimum Solder Mask Sliver Constraint: (7.91mil < 10mil) Between Pad Q11-S(4654.606mil,4130mil) on Bottom Layer And Via (4666mil,4166mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.91mil]
Minimum Solder Mask Sliver Constraint: (9.909mil < 10mil) Between Pad Q11-S(4654.606mil,4180mil) on Bottom Layer And Via (4642mil,4142mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.909mil]
Minimum Solder Mask Sliver Constraint: (5.91mil < 10mil) Between Pad Q11-S(4654.606mil,4180mil) on Bottom Layer And Via (4642mil,4214mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.91mil]
Minimum Solder Mask Sliver Constraint: (9.909mil < 10mil) Between Pad Q11-S(4654.606mil,4180mil) on Bottom Layer And Via (4666mil,4142mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.909mil]
Minimum Solder Mask Sliver Constraint: (5.91mil < 10mil) Between Pad Q11-S(4654.606mil,4180mil) on Bottom Layer And Via (4666mil,4214mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.91mil]
Minimum Solder Mask Sliver Constraint: (8.498mil < 10mil) Between Pad Q11-S(4654.606mil,4180mil) on Bottom Layer And Via (4690mil,4214mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.498mil]
Minimum Solder Mask Sliver Constraint: (3.91mil < 10mil) Between Pad Q11-S(4654.606mil,4230mil) on Bottom Layer And Via (4642mil,4262mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.91mil]
Minimum Solder Mask Sliver Constraint: (3.91mil < 10mil) Between Pad Q11-S(4654.606mil,4230mil) on Bottom Layer And Via (4666mil,4262mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.91mil]
Minimum Solder Mask Sliver Constraint: (6.786mil < 10mil) Between Pad Q11-S(4654.606mil,4230mil) on Bottom Layer And Via (4690mil,4262mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.786mil]
Minimum Solder Mask Sliver Constraint: (4.215mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4391mil,4364mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.215mil]
Minimum Solder Mask Sliver Constraint: (4.215mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4391mil,4388mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.215mil]
Minimum Solder Mask Sliver Constraint: (4.215mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4391mil,4412mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.215mil]
Minimum Solder Mask Sliver Constraint: (4.215mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4391mil,4436mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.215mil]
Minimum Solder Mask Sliver Constraint: (4.215mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4391mil,4460mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.215mil]
Minimum Solder Mask Sliver Constraint: (4.169mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4416mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.169mil]
Minimum Solder Mask Sliver Constraint: (4.169mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4440mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.169mil]
Minimum Solder Mask Sliver Constraint: (4.169mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4464mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.169mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4488mil,4293mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4488mil,4317mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4488mil,4341mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4488mil,4365mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4488mil,4389mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4488mil,4413mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4488mil,4437mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (5.107mil < 10mil) Between Pad Q12-D(4439.054mil,4380mil) on Bottom Layer And Via (4488mil,4461mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.107mil]
Minimum Solder Mask Sliver Constraint: (8.258mil < 10mil) Between Pad Q12-D(4494.172mil,4380mil) on Bottom Layer And Via (4560mil,4293mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.258mil]
Minimum Solder Mask Sliver Constraint: (8.21mil < 10mil) Between Pad Q12-D(4494.172mil,4380mil) on Bottom Layer And Via (4560mil,4317mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.21mil]
Minimum Solder Mask Sliver Constraint: (8.21mil < 10mil) Between Pad Q12-D(4494.172mil,4380mil) on Bottom Layer And Via (4560mil,4341mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.21mil]
Minimum Solder Mask Sliver Constraint: (8.21mil < 10mil) Between Pad Q12-D(4494.172mil,4380mil) on Bottom Layer And Via (4560mil,4365mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.21mil]
Minimum Solder Mask Sliver Constraint: (8.21mil < 10mil) Between Pad Q12-D(4494.172mil,4380mil) on Bottom Layer And Via (4560mil,4389mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.21mil]
Minimum Solder Mask Sliver Constraint: (8.21mil < 10mil) Between Pad Q12-D(4494.172mil,4380mil) on Bottom Layer And Via (4560mil,4413mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.21mil]
Minimum Solder Mask Sliver Constraint: (8.21mil < 10mil) Between Pad Q12-D(4494.172mil,4380mil) on Bottom Layer And Via (4560mil,4437mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.21mil]
Minimum Solder Mask Sliver Constraint: (8.21mil < 10mil) Between Pad Q12-D(4494.172mil,4380mil) on Bottom Layer And Via (4560mil,4461mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.21mil]
Minimum Solder Mask Sliver Constraint: (1.776mil < 10mil) Between Pad Q12-D(4547.322mil,4380mil) on Bottom Layer And Via (4488mil,4293mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.776mil]
Minimum Solder Mask Sliver Constraint: (1.704mil < 10mil) Between Pad Q12-D(4547.322mil,4380mil) on Bottom Layer And Via (4488mil,4317mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.704mil]
Minimum Solder Mask Sliver Constraint: (1.704mil < 10mil) Between Pad Q12-D(4547.322mil,4380mil) on Bottom Layer And Via (4488mil,4341mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.704mil]
Minimum Solder Mask Sliver Constraint: (1.704mil < 10mil) Between Pad Q12-D(4547.322mil,4380mil) on Bottom Layer And Via (4488mil,4365mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.704mil]
Minimum Solder Mask Sliver Constraint: (1.704mil < 10mil) Between Pad Q12-D(4547.322mil,4380mil) on Bottom Layer And Via (4488mil,4389mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.704mil]
Minimum Solder Mask Sliver Constraint: (1.704mil < 10mil) Between Pad Q12-D(4547.322mil,4380mil) on Bottom Layer And Via (4488mil,4413mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.704mil]
Minimum Solder Mask Sliver Constraint: (1.704mil < 10mil) Between Pad Q12-D(4547.322mil,4380mil) on Bottom Layer And Via (4488mil,4437mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.704mil]
Minimum Solder Mask Sliver Constraint: (1.704mil < 10mil) Between Pad Q12-D(4547.322mil,4380mil) on Bottom Layer And Via (4488mil,4461mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.704mil]
Minimum Solder Mask Sliver Constraint: (1.91mil < 10mil) Between Pad Q12-S(4654.606mil,4405mil) on Bottom Layer And Via (4640mil,4375mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.91mil]
Minimum Solder Mask Sliver Constraint: (1.91mil < 10mil) Between Pad Q12-S(4654.606mil,4405mil) on Bottom Layer And Via (4664mil,4375mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.91mil]
Minimum Solder Mask Sliver Constraint: (4.034mil < 10mil) Between Pad Q12-S(4654.606mil,4405mil) on Bottom Layer And Via (4688mil,4375mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.034mil]
Minimum Solder Mask Sliver Constraint: (3.91mil < 10mil) Between Pad Q12-S(4654.606mil,4455mil) on Bottom Layer And Via (4640mil,4423mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.91mil]
Minimum Solder Mask Sliver Constraint: (3.91mil < 10mil) Between Pad Q12-S(4654.606mil,4455mil) on Bottom Layer And Via (4664mil,4423mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.91mil]
Minimum Solder Mask Sliver Constraint: (5.788mil < 10mil) Between Pad Q12-S(4654.606mil,4455mil) on Bottom Layer And Via (4688mil,4423mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.788mil]
Minimum Solder Mask Sliver Constraint: (3.169mil < 10mil) Between Pad Q1-D(5346.731mil,4155mil) on Bottom Layer And Via (5326mil,4265mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.169mil]
Minimum Solder Mask Sliver Constraint: (3.169mil < 10mil) Between Pad Q1-D(5346.731mil,4155mil) on Bottom Layer And Via (5350mil,4265mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.169mil]
Minimum Solder Mask Sliver Constraint: (3.169mil < 10mil) Between Pad Q1-D(5346.731mil,4155mil) on Bottom Layer And Via (5374mil,4265mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.169mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q1-D(5346.731mil,4155mil) on Bottom Layer And Via (5398mil,4073mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q1-D(5346.731mil,4155mil) on Bottom Layer And Via (5398mil,4097mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q1-D(5346.731mil,4155mil) on Bottom Layer And Via (5398mil,4121mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q1-D(5346.731mil,4155mil) on Bottom Layer And Via (5398mil,4145mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q1-D(5346.731mil,4155mil) on Bottom Layer And Via (5398mil,4169mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q1-D(5346.731mil,4155mil) on Bottom Layer And Via (5398mil,4193mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q1-D(5346.731mil,4155mil) on Bottom Layer And Via (5398mil,4217mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q1-D(5346.731mil,4155mil) on Bottom Layer And Via (5398mil,4241mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (6.377mil < 10mil) Between Pad Q1-G(5562.283mil,4080mil) on Bottom Layer And Pad Q7-D(5626.731mil,4155mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.377mil]
Minimum Solder Mask Sliver Constraint: (8.368mil < 10mil) Between Pad Q1-G(5562.283mil,4080mil) on Bottom Layer And Via (5607.6mil,4077mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.368mil]
Minimum Solder Mask Sliver Constraint: (8.824mil < 10mil) Between Pad Q1-G(5562.283mil,4080mil) on Bottom Layer And Via (5607.6mil,4101mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.824mil]
Minimum Solder Mask Sliver Constraint: (6.377mil < 10mil) Between Pad Q1-S(5562.283mil,4130mil) on Bottom Layer And Pad Q7-D(5626.731mil,4155mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.377mil]
Minimum Solder Mask Sliver Constraint: (8.368mil < 10mil) Between Pad Q1-S(5562.283mil,4130mil) on Bottom Layer And Via (5607.6mil,4125mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.368mil]
Minimum Solder Mask Sliver Constraint: (8.498mil < 10mil) Between Pad Q1-S(5562.283mil,4130mil) on Bottom Layer And Via (5607.6mil,4149mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.498mil]
Minimum Solder Mask Sliver Constraint: (6.377mil < 10mil) Between Pad Q1-S(5562.283mil,4180mil) on Bottom Layer And Pad Q7-D(5626.731mil,4155mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.377mil]
Minimum Solder Mask Sliver Constraint: (8.368mil < 10mil) Between Pad Q1-S(5562.283mil,4180mil) on Bottom Layer And Via (5607.6mil,4173mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.368mil]
Minimum Solder Mask Sliver Constraint: (8.37mil < 10mil) Between Pad Q1-S(5562.283mil,4180mil) on Bottom Layer And Via (5607.6mil,4197mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.37mil]
Minimum Solder Mask Sliver Constraint: (6.377mil < 10mil) Between Pad Q1-S(5562.283mil,4230mil) on Bottom Layer And Pad Q7-D(5626.731mil,4155mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.377mil]
Minimum Solder Mask Sliver Constraint: (8.368mil < 10mil) Between Pad Q1-S(5562.283mil,4230mil) on Bottom Layer And Via (5607.6mil,4221mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.368mil]
Minimum Solder Mask Sliver Constraint: (8.368mil < 10mil) Between Pad Q1-S(5562.283mil,4230mil) on Bottom Layer And Via (5607.6mil,4245mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.368mil]
Minimum Solder Mask Sliver Constraint: (8.17mil < 10mil) Between Pad Q2-D(5346.731mil,4380mil) on Bottom Layer And Via (5326mil,4265mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.17mil]
Minimum Solder Mask Sliver Constraint: (8.17mil < 10mil) Between Pad Q2-D(5346.731mil,4380mil) on Bottom Layer And Via (5350mil,4265mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.17mil]
Minimum Solder Mask Sliver Constraint: (8.17mil < 10mil) Between Pad Q2-D(5346.731mil,4380mil) on Bottom Layer And Via (5374mil,4265mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.17mil]
Minimum Solder Mask Sliver Constraint: (9.053mil < 10mil) Between Pad Q2-D(5346.731mil,4380mil) on Bottom Layer And Via (5398.3mil,4482.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.052mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q2-D(5346.731mil,4380mil) on Bottom Layer And Via (5398mil,4289mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q2-D(5346.731mil,4380mil) on Bottom Layer And Via (5398mil,4313mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q2-D(5346.731mil,4380mil) on Bottom Layer And Via (5398mil,4337mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q2-D(5346.731mil,4380mil) on Bottom Layer And Via (5398mil,4361mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q2-D(5346.731mil,4380mil) on Bottom Layer And Via (5398mil,4385mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q2-D(5346.731mil,4380mil) on Bottom Layer And Via (5398mil,4409mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q2-D(5346.731mil,4380mil) on Bottom Layer And Via (5398mil,4433mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (7.43mil < 10mil) Between Pad Q2-D(5346.731mil,4380mil) on Bottom Layer And Via (5398mil,4457mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.43mil]
Minimum Solder Mask Sliver Constraint: (6.512mil < 10mil) Between Pad Q2-D(5401.849mil,4380mil) on Bottom Layer And Via (5350.3mil,4482.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.512mil]
Minimum Solder Mask Sliver Constraint: (5.712mil < 10mil) Between Pad Q2-D(5401.849mil,4380mil) on Bottom Layer And Via (5374.3mil,4482.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.712mil]
Minimum Solder Mask Sliver Constraint: (5.712mil < 10mil) Between Pad Q2-D(5401.849mil,4380mil) on Bottom Layer And Via (5398.3mil,4482.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.712mil]
Minimum Solder Mask Sliver Constraint: (5.712mil < 10mil) Between Pad Q2-D(5401.849mil,4380mil) on Bottom Layer And Via (5422.3mil,4482.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.712mil]
Minimum Solder Mask Sliver Constraint: (5.712mil < 10mil) Between Pad Q2-D(5401.849mil,4380mil) on Bottom Layer And Via (5446.3mil,4482.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.712mil]
Minimum Solder Mask Sliver Constraint: (8.651mil < 10mil) Between Pad Q2-D(5454.999mil,4380mil) on Bottom Layer And Via (5398.3mil,4482.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.651mil]
Minimum Solder Mask Sliver Constraint: (0.649mil < 10mil) Between Pad Q2-D(5454.999mil,4380mil) on Bottom Layer And Via (5398mil,4289mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [0.649mil]
Minimum Solder Mask Sliver Constraint: (5.712mil < 10mil) Between Pad Q2-D(5454.999mil,4380mil) on Bottom Layer And Via (5422.3mil,4482.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.712mil]
Minimum Solder Mask Sliver Constraint: (5.712mil < 10mil) Between Pad Q2-D(5454.999mil,4380mil) on Bottom Layer And Via (5446.3mil,4482.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.712mil]
Minimum Solder Mask Sliver Constraint: (5.912mil < 10mil) Between Pad Q2-D(5454.999mil,4380mil) on Bottom Layer And Via (5471.8mil,4482.9mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.912mil]
Minimum Solder Mask Sliver Constraint: (6.377mil < 10mil) Between Pad Q2-G(5562.283mil,4305mil) on Bottom Layer And Pad Q8-D(5626.731mil,4380mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.377mil]
Minimum Solder Mask Sliver Constraint: (8.368mil < 10mil) Between Pad Q2-G(5562.283mil,4305mil) on Bottom Layer And Via (5607.6mil,4293mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.368mil]
Minimum Solder Mask Sliver Constraint: (8.368mil < 10mil) Between Pad Q2-G(5562.283mil,4305mil) on Bottom Layer And Via (5607.6mil,4317mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.368mil]
Minimum Solder Mask Sliver Constraint: (6.377mil < 10mil) Between Pad Q2-S(5562.283mil,4355mil) on Bottom Layer And Pad Q8-D(5626.731mil,4380mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.377mil]
Minimum Solder Mask Sliver Constraint: (8.368mil < 10mil) Between Pad Q2-S(5562.283mil,4355mil) on Bottom Layer And Via (5607.6mil,4341mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.368mil]
Minimum Solder Mask Sliver Constraint: (8.368mil < 10mil) Between Pad Q2-S(5562.283mil,4355mil) on Bottom Layer And Via (5607.6mil,4365mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.368mil]
Minimum Solder Mask Sliver Constraint: (6.377mil < 10mil) Between Pad Q2-S(5562.283mil,4405mil) on Bottom Layer And Pad Q8-D(5626.731mil,4380mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.377mil]
Minimum Solder Mask Sliver Constraint: (8.368mil < 10mil) Between Pad Q2-S(5562.283mil,4405mil) on Bottom Layer And Via (5607.6mil,4389mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.368mil]
Minimum Solder Mask Sliver Constraint: (8.368mil < 10mil) Between Pad Q2-S(5562.283mil,4405mil) on Bottom Layer And Via (5607.6mil,4413mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.368mil]
Minimum Solder Mask Sliver Constraint: (6.377mil < 10mil) Between Pad Q2-S(5562.283mil,4455mil) on Bottom Layer And Pad Q8-D(5626.731mil,4380mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.377mil]
Minimum Solder Mask Sliver Constraint: (8.409mil < 10mil) Between Pad Q2-S(5562.283mil,4455mil) on Bottom Layer And Via (5607.6mil,4437mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.409mil]
Minimum Solder Mask Sliver Constraint: (8.368mil < 10mil) Between Pad Q2-S(5562.283mil,4455mil) on Bottom Layer And Via (5607.6mil,4461mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.368mil]
Minimum Solder Mask Sliver Constraint: (5.894mil < 10mil) Between Pad Q3-D(4768.347mil,4270.276mil) on Bottom Layer And Via (4747mil,4383mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.894mil]
Minimum Solder Mask Sliver Constraint: (5.894mil < 10mil) Between Pad Q3-D(4768.347mil,4270.276mil) on Bottom Layer And Via (4771mil,4383mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.894mil]
Minimum Solder Mask Sliver Constraint: (5.894mil < 10mil) Between Pad Q3-D(4768.347mil,4270.276mil) on Bottom Layer And Via (4795mil,4383mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.894mil]
Minimum Solder Mask Sliver Constraint: (6.815mil < 10mil) Between Pad Q3-D(4768.347mil,4270.276mil) on Bottom Layer And Via (4819mil,4191mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.815mil]
Minimum Solder Mask Sliver Constraint: (6.815mil < 10mil) Between Pad Q3-D(4768.347mil,4270.276mil) on Bottom Layer And Via (4819mil,4215mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.815mil]
Minimum Solder Mask Sliver Constraint: (6.815mil < 10mil) Between Pad Q3-D(4768.347mil,4270.276mil) on Bottom Layer And Via (4819mil,4239mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.815mil]
Minimum Solder Mask Sliver Constraint: (6.815mil < 10mil) Between Pad Q3-D(4768.347mil,4270.276mil) on Bottom Layer And Via (4819mil,4263mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.815mil]
Minimum Solder Mask Sliver Constraint: (6.815mil < 10mil) Between Pad Q3-D(4768.347mil,4270.276mil) on Bottom Layer And Via (4819mil,4287mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.815mil]
Minimum Solder Mask Sliver Constraint: (6.815mil < 10mil) Between Pad Q3-D(4768.347mil,4270.276mil) on Bottom Layer And Via (4819mil,4311mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.815mil]
Minimum Solder Mask Sliver Constraint: (6.815mil < 10mil) Between Pad Q3-D(4768.347mil,4270.276mil) on Bottom Layer And Via (4819mil,4335mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.815mil]
Minimum Solder Mask Sliver Constraint: (6.815mil < 10mil) Between Pad Q3-D(4768.347mil,4270.276mil) on Bottom Layer And Via (4819mil,4359mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.815mil]
Minimum Solder Mask Sliver Constraint: (9.917mil < 10mil) Between Pad Q3-D(4823.465mil,4270.276mil) on Bottom Layer And Via (4891mil,4191mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.917mil]
Minimum Solder Mask Sliver Constraint: (9.917mil < 10mil) Between Pad Q3-D(4823.465mil,4270.276mil) on Bottom Layer And Via (4891mil,4215mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.917mil]
Minimum Solder Mask Sliver Constraint: (9.917mil < 10mil) Between Pad Q3-D(4823.465mil,4270.276mil) on Bottom Layer And Via (4891mil,4239mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.917mil]
Minimum Solder Mask Sliver Constraint: (9.917mil < 10mil) Between Pad Q3-D(4823.465mil,4270.276mil) on Bottom Layer And Via (4891mil,4263mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.917mil]
Minimum Solder Mask Sliver Constraint: (9.917mil < 10mil) Between Pad Q3-D(4823.465mil,4270.276mil) on Bottom Layer And Via (4891mil,4287mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.917mil]
Minimum Solder Mask Sliver Constraint: (9.917mil < 10mil) Between Pad Q3-D(4823.465mil,4270.276mil) on Bottom Layer And Via (4891mil,4311mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.917mil]
Minimum Solder Mask Sliver Constraint: (9.917mil < 10mil) Between Pad Q3-D(4823.465mil,4270.276mil) on Bottom Layer And Via (4891mil,4335mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.917mil]
Minimum Solder Mask Sliver Constraint: (0.411mil < 10mil) Between Pad Q3-D(4876.615mil,4270.276mil) on Bottom Layer And Via (4819mil,4359mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [0.411mil]
Minimum Solder Mask Sliver Constraint: (5.445mil < 10mil) Between Pad Q4-D(4770.078mil,4495.276mil) on Bottom Layer And Via (4747mil,4383mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.445mil]
Minimum Solder Mask Sliver Constraint: (5.445mil < 10mil) Between Pad Q4-D(4770.078mil,4495.276mil) on Bottom Layer And Via (4771mil,4383mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.445mil]
Minimum Solder Mask Sliver Constraint: (5.445mil < 10mil) Between Pad Q4-D(4770.078mil,4495.276mil) on Bottom Layer And Via (4795mil,4383mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.445mil]
Minimum Solder Mask Sliver Constraint: (5.083mil < 10mil) Between Pad Q4-D(4770.078mil,4495.276mil) on Bottom Layer And Via (4819mil,4407mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.083mil]
Minimum Solder Mask Sliver Constraint: (5.083mil < 10mil) Between Pad Q4-D(4770.078mil,4495.276mil) on Bottom Layer And Via (4819mil,4431mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.083mil]
Minimum Solder Mask Sliver Constraint: (5.083mil < 10mil) Between Pad Q4-D(4770.078mil,4495.276mil) on Bottom Layer And Via (4819mil,4455mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.083mil]
Minimum Solder Mask Sliver Constraint: (5.083mil < 10mil) Between Pad Q4-D(4770.078mil,4495.276mil) on Bottom Layer And Via (4819mil,4479mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.083mil]
Minimum Solder Mask Sliver Constraint: (5.083mil < 10mil) Between Pad Q4-D(4770.078mil,4495.276mil) on Bottom Layer And Via (4819mil,4503mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.083mil]
Minimum Solder Mask Sliver Constraint: (5.083mil < 10mil) Between Pad Q4-D(4770.078mil,4495.276mil) on Bottom Layer And Via (4819mil,4527mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.083mil]
Minimum Solder Mask Sliver Constraint: (5.083mil < 10mil) Between Pad Q4-D(4770.078mil,4495.276mil) on Bottom Layer And Via (4819mil,4551mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.083mil]
Minimum Solder Mask Sliver Constraint: (5.083mil < 10mil) Between Pad Q4-D(4770.078mil,4495.276mil) on Bottom Layer And Via (4819mil,4575mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.083mil]
Minimum Solder Mask Sliver Constraint: (8.364mil < 10mil) Between Pad Q4-D(4825.196mil,4495.276mil) on Bottom Layer And Via (4891mil,4407mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.364mil]
Minimum Solder Mask Sliver Constraint: (8.186mil < 10mil) Between Pad Q4-D(4825.196mil,4495.276mil) on Bottom Layer And Via (4891mil,4431mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.186mil]
Minimum Solder Mask Sliver Constraint: (8.186mil < 10mil) Between Pad Q4-D(4825.196mil,4495.276mil) on Bottom Layer And Via (4891mil,4455mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.186mil]
Minimum Solder Mask Sliver Constraint: (8.186mil < 10mil) Between Pad Q4-D(4825.196mil,4495.276mil) on Bottom Layer And Via (4891mil,4479mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.186mil]
Minimum Solder Mask Sliver Constraint: (8.186mil < 10mil) Between Pad Q4-D(4825.196mil,4495.276mil) on Bottom Layer And Via (4891mil,4503mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.186mil]
Minimum Solder Mask Sliver Constraint: (8.186mil < 10mil) Between Pad Q4-D(4825.196mil,4495.276mil) on Bottom Layer And Via (4891mil,4527mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.186mil]
Minimum Solder Mask Sliver Constraint: (8.186mil < 10mil) Between Pad Q4-D(4825.196mil,4495.276mil) on Bottom Layer And Via (4891mil,4551mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.186mil]
Minimum Solder Mask Sliver Constraint: (8.186mil < 10mil) Between Pad Q4-D(4825.196mil,4495.276mil) on Bottom Layer And Via (4891mil,4575mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.186mil]
Minimum Solder Mask Sliver Constraint: (1.993mil < 10mil) Between Pad Q4-D(4878.346mil,4495.276mil) on Bottom Layer And Via (4819mil,4407mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.993mil]
Minimum Solder Mask Sliver Constraint: (1.728mil < 10mil) Between Pad Q4-D(4878.346mil,4495.276mil) on Bottom Layer And Via (4819mil,4431mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.728mil]
Minimum Solder Mask Sliver Constraint: (1.728mil < 10mil) Between Pad Q4-D(4878.346mil,4495.276mil) on Bottom Layer And Via (4819mil,4455mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.728mil]
Minimum Solder Mask Sliver Constraint: (1.728mil < 10mil) Between Pad Q4-D(4878.346mil,4495.276mil) on Bottom Layer And Via (4819mil,4479mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.728mil]
Minimum Solder Mask Sliver Constraint: (1.728mil < 10mil) Between Pad Q4-D(4878.346mil,4495.276mil) on Bottom Layer And Via (4819mil,4503mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.728mil]
Minimum Solder Mask Sliver Constraint: (1.728mil < 10mil) Between Pad Q4-D(4878.346mil,4495.276mil) on Bottom Layer And Via (4819mil,4527mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.728mil]
Minimum Solder Mask Sliver Constraint: (1.728mil < 10mil) Between Pad Q4-D(4878.346mil,4495.276mil) on Bottom Layer And Via (4819mil,4551mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.728mil]
Minimum Solder Mask Sliver Constraint: (1.728mil < 10mil) Between Pad Q4-D(4878.346mil,4495.276mil) on Bottom Layer And Via (4819mil,4575mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.728mil]
Minimum Solder Mask Sliver Constraint: (8.421mil < 10mil) Between Pad Q4-G(4985.63mil,4420.276mil) on Bottom Layer And Via (5031mil,4406mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.421mil]
Minimum Solder Mask Sliver Constraint: (8.421mil < 10mil) Between Pad Q4-G(4985.63mil,4420.276mil) on Bottom Layer And Via (5031mil,4430mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.421mil]
Minimum Solder Mask Sliver Constraint: (3.634mil < 10mil) Between Pad Q4-S(4985.63mil,4470.276mil) on Bottom Layer And Via (4981mil,4502mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.634mil]
Minimum Solder Mask Sliver Constraint: (3.634mil < 10mil) Between Pad Q4-S(4985.63mil,4470.276mil) on Bottom Layer And Via (5005mil,4502mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.634mil]
Minimum Solder Mask Sliver Constraint: (8.421mil < 10mil) Between Pad Q4-S(4985.63mil,4470.276mil) on Bottom Layer And Via (5031mil,4454mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.421mil]
Minimum Solder Mask Sliver Constraint: (8.421mil < 10mil) Between Pad Q4-S(4985.63mil,4470.276mil) on Bottom Layer And Via (5031mil,4478mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.421mil]
Minimum Solder Mask Sliver Constraint: (1.634mil < 10mil) Between Pad Q4-S(4985.63mil,4520.276mil) on Bottom Layer And Via (4981mil,4550mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.634mil]
Minimum Solder Mask Sliver Constraint: (1.634mil < 10mil) Between Pad Q4-S(4985.63mil,4520.276mil) on Bottom Layer And Via (5005mil,4550mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.634mil]
Minimum Solder Mask Sliver Constraint: (8.481mil < 10mil) Between Pad Q4-S(4985.63mil,4520.276mil) on Bottom Layer And Via (5031mil,4502mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.481mil]
Minimum Solder Mask Sliver Constraint: (8.421mil < 10mil) Between Pad Q4-S(4985.63mil,4520.276mil) on Bottom Layer And Via (5031mil,4526mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.421mil]
Minimum Solder Mask Sliver Constraint: (8.736mil < 10mil) Between Pad Q4-S(4985.63mil,4570.276mil) on Bottom Layer And Via (5031mil,4550mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.736mil]
Minimum Solder Mask Sliver Constraint: (8.421mil < 10mil) Between Pad Q4-S(4985.63mil,4570.276mil) on Bottom Layer And Via (5031mil,4574mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.421mil]
Minimum Solder Mask Sliver Constraint: (7.169mil < 10mil) Between Pad Q5-D(4154.448mil,4155mil) on Bottom Layer And Via (4135mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.169mil]
Minimum Solder Mask Sliver Constraint: (7.169mil < 10mil) Between Pad Q5-D(4154.448mil,4155mil) on Bottom Layer And Via (4159mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.169mil]
Minimum Solder Mask Sliver Constraint: (7.169mil < 10mil) Between Pad Q5-D(4154.448mil,4155mil) on Bottom Layer And Via (4183mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.169mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q5-D(4154.448mil,4155mil) on Bottom Layer And Via (4207mil,4077mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q5-D(4154.448mil,4155mil) on Bottom Layer And Via (4207mil,4101mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q5-D(4154.448mil,4155mil) on Bottom Layer And Via (4207mil,4125mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q5-D(4154.448mil,4155mil) on Bottom Layer And Via (4207mil,4149mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q5-D(4154.448mil,4155mil) on Bottom Layer And Via (4207mil,4173mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q5-D(4154.448mil,4155mil) on Bottom Layer And Via (4207mil,4197mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q5-D(4154.448mil,4155mil) on Bottom Layer And Via (4207mil,4221mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q5-D(4154.448mil,4155mil) on Bottom Layer And Via (4207mil,4245mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (9.051mil < 10mil) Between Pad Q5-G(4370mil,4080mil) on Bottom Layer And Via (4416mil,4077mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.051mil]
Minimum Solder Mask Sliver Constraint: (9.492mil < 10mil) Between Pad Q5-G(4370mil,4080mil) on Bottom Layer And Via (4416mil,4101mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.492mil]
Minimum Solder Mask Sliver Constraint: (9.051mil < 10mil) Between Pad Q5-S(4370mil,4130mil) on Bottom Layer And Via (4416mil,4125mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.051mil]
Minimum Solder Mask Sliver Constraint: (9.177mil < 10mil) Between Pad Q5-S(4370mil,4130mil) on Bottom Layer And Via (4416mil,4149mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.177mil]
Minimum Solder Mask Sliver Constraint: (3.91mil < 10mil) Between Pad Q5-S(4370mil,4180mil) on Bottom Layer And Via (4364mil,4148mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.91mil]
Minimum Solder Mask Sliver Constraint: (3.91mil < 10mil) Between Pad Q5-S(4370mil,4180mil) on Bottom Layer And Via (4388mil,4148mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.91mil]
Minimum Solder Mask Sliver Constraint: (9.051mil < 10mil) Between Pad Q5-S(4370mil,4180mil) on Bottom Layer And Via (4416mil,4173mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.051mil]
Minimum Solder Mask Sliver Constraint: (9.053mil < 10mil) Between Pad Q5-S(4370mil,4180mil) on Bottom Layer And Via (4416mil,4197mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.053mil]
Minimum Solder Mask Sliver Constraint: (5.91mil < 10mil) Between Pad Q5-S(4370mil,4230mil) on Bottom Layer And Via (4364mil,4196mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.91mil]
Minimum Solder Mask Sliver Constraint: (5.91mil < 10mil) Between Pad Q5-S(4370mil,4230mil) on Bottom Layer And Via (4388mil,4196mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.91mil]
Minimum Solder Mask Sliver Constraint: (9.051mil < 10mil) Between Pad Q5-S(4370mil,4230mil) on Bottom Layer And Via (4416mil,4221mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.051mil]
Minimum Solder Mask Sliver Constraint: (9.051mil < 10mil) Between Pad Q5-S(4370mil,4230mil) on Bottom Layer And Via (4416mil,4245mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.051mil]
Minimum Solder Mask Sliver Constraint: (4.169mil < 10mil) Between Pad Q6-D(4154.448mil,4380mil) on Bottom Layer And Via (4135mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.169mil]
Minimum Solder Mask Sliver Constraint: (4.169mil < 10mil) Between Pad Q6-D(4154.448mil,4380mil) on Bottom Layer And Via (4159mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.169mil]
Minimum Solder Mask Sliver Constraint: (4.169mil < 10mil) Between Pad Q6-D(4154.448mil,4380mil) on Bottom Layer And Via (4183mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.169mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q6-D(4154.448mil,4380mil) on Bottom Layer And Via (4207mil,4293mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q6-D(4154.448mil,4380mil) on Bottom Layer And Via (4207mil,4317mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q6-D(4154.448mil,4380mil) on Bottom Layer And Via (4207mil,4341mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q6-D(4154.448mil,4380mil) on Bottom Layer And Via (4207mil,4365mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q6-D(4154.448mil,4380mil) on Bottom Layer And Via (4207mil,4389mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q6-D(4154.448mil,4380mil) on Bottom Layer And Via (4207mil,4413mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q6-D(4154.448mil,4380mil) on Bottom Layer And Via (4207mil,4437mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (8.713mil < 10mil) Between Pad Q6-D(4154.448mil,4380mil) on Bottom Layer And Via (4207mil,4461mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.713mil]
Minimum Solder Mask Sliver Constraint: (8.873mil < 10mil) Between Pad Q6-D(4209.566mil,4380mil) on Bottom Layer And Via (4159.5mil,4485.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.873mil]
Minimum Solder Mask Sliver Constraint: (8.512mil < 10mil) Between Pad Q6-D(4209.566mil,4380mil) on Bottom Layer And Via (4183.5mil,4485.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.512mil]
Minimum Solder Mask Sliver Constraint: (8.512mil < 10mil) Between Pad Q6-D(4209.566mil,4380mil) on Bottom Layer And Via (4207.5mil,4485.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.512mil]
Minimum Solder Mask Sliver Constraint: (8.512mil < 10mil) Between Pad Q6-D(4209.566mil,4380mil) on Bottom Layer And Via (4231.5mil,4485.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.512mil]
Minimum Solder Mask Sliver Constraint: (8.512mil < 10mil) Between Pad Q6-D(4209.566mil,4380mil) on Bottom Layer And Via (4255.5mil,4485.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.512mil]
Minimum Solder Mask Sliver Constraint: (8.512mil < 10mil) Between Pad Q6-D(4262.716mil,4380mil) on Bottom Layer And Via (4231.5mil,4485.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.512mil]
Minimum Solder Mask Sliver Constraint: (8.512mil < 10mil) Between Pad Q6-D(4262.716mil,4380mil) on Bottom Layer And Via (4255.5mil,4485.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.512mil]
Minimum Solder Mask Sliver Constraint: (8.512mil < 10mil) Between Pad Q6-D(4262.716mil,4380mil) on Bottom Layer And Via (4279.5mil,4485.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.512mil]
Minimum Solder Mask Sliver Constraint: (8.512mil < 10mil) Between Pad Q6-D(4262.716mil,4380mil) on Bottom Layer And Via (4303.5mil,4485.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.512mil]
Minimum Solder Mask Sliver Constraint: (9.051mil < 10mil) Between Pad Q6-G(4370mil,4305mil) on Bottom Layer And Via (4416mil,4293mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.051mil]
Minimum Solder Mask Sliver Constraint: (9.051mil < 10mil) Between Pad Q6-G(4370mil,4305mil) on Bottom Layer And Via (4416mil,4317mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.051mil]
Minimum Solder Mask Sliver Constraint: (4.91mil < 10mil) Between Pad Q6-S(4370mil,4355mil) on Bottom Layer And Via (4367mil,4388mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.91mil]
Minimum Solder Mask Sliver Constraint: (4.91mil < 10mil) Between Pad Q6-S(4370mil,4355mil) on Bottom Layer And Via (4391mil,4388mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.91mil]
Minimum Solder Mask Sliver Constraint: (9.051mil < 10mil) Between Pad Q6-S(4370mil,4355mil) on Bottom Layer And Via (4416mil,4341mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.051mil]
Minimum Solder Mask Sliver Constraint: (9.051mil < 10mil) Between Pad Q6-S(4370mil,4355mil) on Bottom Layer And Via (4416mil,4365mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.051mil]
Minimum Solder Mask Sliver Constraint: (2.91mil < 10mil) Between Pad Q6-S(4370mil,4405mil) on Bottom Layer And Via (4367mil,4436mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.91mil]
Minimum Solder Mask Sliver Constraint: (2.91mil < 10mil) Between Pad Q6-S(4370mil,4405mil) on Bottom Layer And Via (4391mil,4436mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.91mil]
Minimum Solder Mask Sliver Constraint: (9.051mil < 10mil) Between Pad Q6-S(4370mil,4405mil) on Bottom Layer And Via (4416mil,4389mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.051mil]
Minimum Solder Mask Sliver Constraint: (9.051mil < 10mil) Between Pad Q6-S(4370mil,4405mil) on Bottom Layer And Via (4416mil,4413mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.051mil]
Minimum Solder Mask Sliver Constraint: (9.091mil < 10mil) Between Pad Q6-S(4370mil,4455mil) on Bottom Layer And Via (4416mil,4437mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.091mil]
Minimum Solder Mask Sliver Constraint: (9.051mil < 10mil) Between Pad Q6-S(4370mil,4455mil) on Bottom Layer And Via (4416mil,4461mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.051mil]
Minimum Solder Mask Sliver Constraint: (7.169mil < 10mil) Between Pad Q7-D(5626.731mil,4155mil) on Bottom Layer And Via (5607.6mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.169mil]
Minimum Solder Mask Sliver Constraint: (7.169mil < 10mil) Between Pad Q7-D(5626.731mil,4155mil) on Bottom Layer And Via (5631.6mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.169mil]
Minimum Solder Mask Sliver Constraint: (7.169mil < 10mil) Between Pad Q7-D(5626.731mil,4155mil) on Bottom Layer And Via (5655.6mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.169mil]
Minimum Solder Mask Sliver Constraint: (9.758mil < 10mil) Between Pad Q7-D(5626.731mil,4155mil) on Bottom Layer And Via (5677.4mil,4048.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.758mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q7-D(5626.731mil,4155mil) on Bottom Layer And Via (5679.6mil,4077mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q7-D(5626.731mil,4155mil) on Bottom Layer And Via (5679.6mil,4101mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q7-D(5626.731mil,4155mil) on Bottom Layer And Via (5679.6mil,4125mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q7-D(5626.731mil,4155mil) on Bottom Layer And Via (5679.6mil,4149mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q7-D(5626.731mil,4155mil) on Bottom Layer And Via (5679.6mil,4173mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q7-D(5626.731mil,4155mil) on Bottom Layer And Via (5679.6mil,4197mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q7-D(5626.731mil,4155mil) on Bottom Layer And Via (5679.6mil,4221mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q7-D(5626.731mil,4155mil) on Bottom Layer And Via (5679.6mil,4245mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (9.212mil < 10mil) Between Pad Q7-D(5681.849mil,4155mil) on Bottom Layer And Via (5653.4mil,4048.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.212mil]
Minimum Solder Mask Sliver Constraint: (9.212mil < 10mil) Between Pad Q7-D(5681.849mil,4155mil) on Bottom Layer And Via (5677.4mil,4048.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.212mil]
Minimum Solder Mask Sliver Constraint: (9.212mil < 10mil) Between Pad Q7-D(5681.849mil,4155mil) on Bottom Layer And Via (5701.4mil,4048.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.212mil]
Minimum Solder Mask Sliver Constraint: (9.212mil < 10mil) Between Pad Q7-D(5681.849mil,4155mil) on Bottom Layer And Via (5725.4mil,4048.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.212mil]
Minimum Solder Mask Sliver Constraint: (9.212mil < 10mil) Between Pad Q7-D(5734.999mil,4155mil) on Bottom Layer And Via (5701.4mil,4048.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.212mil]
Minimum Solder Mask Sliver Constraint: (9.212mil < 10mil) Between Pad Q7-D(5734.999mil,4155mil) on Bottom Layer And Via (5725.4mil,4048.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.212mil]
Minimum Solder Mask Sliver Constraint: (9.212mil < 10mil) Between Pad Q7-D(5734.999mil,4155mil) on Bottom Layer And Via (5749.4mil,4048.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.212mil]
Minimum Solder Mask Sliver Constraint: (9.212mil < 10mil) Between Pad Q7-D(5734.999mil,4155mil) on Bottom Layer And Via (5773.4mil,4048.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.212mil]
Minimum Solder Mask Sliver Constraint: (2.268mil < 10mil) Between Pad Q7-S(5842.283mil,4130mil) on Bottom Layer And Via (5881.5mil,4132.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.268mil]
Minimum Solder Mask Sliver Constraint: (5.291mil < 10mil) Between Pad Q7-S(5842.283mil,4130mil) on Bottom Layer And Via (5881.5mil,4156.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.291mil]
Minimum Solder Mask Sliver Constraint: (3.946mil < 10mil) Between Pad Q7-S(5842.283mil,4180mil) on Bottom Layer And Via (5881.5mil,4156.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.946mil]
Minimum Solder Mask Sliver Constraint: (2.268mil < 10mil) Between Pad Q7-S(5842.283mil,4180mil) on Bottom Layer And Via (5881.5mil,4180.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.268mil]
Minimum Solder Mask Sliver Constraint: (4.228mil < 10mil) Between Pad Q7-S(5842.283mil,4180mil) on Bottom Layer And Via (5881.5mil,4204.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.228mil]
Minimum Solder Mask Sliver Constraint: (4.954mil < 10mil) Between Pad Q7-S(5842.283mil,4230mil) on Bottom Layer And Via (5881.5mil,4204.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.954mil]
Minimum Solder Mask Sliver Constraint: (2.268mil < 10mil) Between Pad Q7-S(5842.283mil,4230mil) on Bottom Layer And Via (5881.5mil,4228.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.268mil]
Minimum Solder Mask Sliver Constraint: (3.361mil < 10mil) Between Pad Q7-S(5842.283mil,4230mil) on Bottom Layer And Via (5881.5mil,4252.3mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.361mil]
Minimum Solder Mask Sliver Constraint: (4.17mil < 10mil) Between Pad Q8-D(5626.731mil,4380mil) on Bottom Layer And Via (5607.6mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.17mil]
Minimum Solder Mask Sliver Constraint: (4.17mil < 10mil) Between Pad Q8-D(5626.731mil,4380mil) on Bottom Layer And Via (5631.6mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.17mil]
Minimum Solder Mask Sliver Constraint: (4.17mil < 10mil) Between Pad Q8-D(5626.731mil,4380mil) on Bottom Layer And Via (5655.6mil,4269mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.17mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q8-D(5626.731mil,4380mil) on Bottom Layer And Via (5679.6mil,4293mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q8-D(5626.731mil,4380mil) on Bottom Layer And Via (5679.6mil,4317mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q8-D(5626.731mil,4380mil) on Bottom Layer And Via (5679.6mil,4341mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q8-D(5626.731mil,4380mil) on Bottom Layer And Via (5679.6mil,4365mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q8-D(5626.731mil,4380mil) on Bottom Layer And Via (5679.6mil,4389mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q8-D(5626.731mil,4380mil) on Bottom Layer And Via (5679.6mil,4413mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q8-D(5626.731mil,4380mil) on Bottom Layer And Via (5679.6mil,4437mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (9.03mil < 10mil) Between Pad Q8-D(5626.731mil,4380mil) on Bottom Layer And Via (5679.6mil,4461mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.03mil]
Minimum Solder Mask Sliver Constraint: (4.368mil < 10mil) Between Pad Q8-S(5842.283mil,4355mil) on Bottom Layer And Via (5883.6mil,4353mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.368mil]
Minimum Solder Mask Sliver Constraint: (5.226mil < 10mil) Between Pad Q8-S(5842.283mil,4355mil) on Bottom Layer And Via (5883.6mil,4377mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.226mil]
Minimum Solder Mask Sliver Constraint: (7.988mil < 10mil) Between Pad Q8-S(5842.283mil,4405mil) on Bottom Layer And Via (5883.6mil,4377mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.988mil]
Minimum Solder Mask Sliver Constraint: (4.368mil < 10mil) Between Pad Q8-S(5842.283mil,4405mil) on Bottom Layer And Via (5883.6mil,4401mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.368mil]
Minimum Solder Mask Sliver Constraint: (4.704mil < 10mil) Between Pad Q8-S(5842.283mil,4405mil) on Bottom Layer And Via (5883.6mil,4425mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.704mil]
Minimum Solder Mask Sliver Constraint: (1.91mil < 10mil) Between Pad Q8-S(5842.283mil,4455mil) on Bottom Layer And Via (5835.6mil,4425mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.91mil]
Minimum Solder Mask Sliver Constraint: (1.91mil < 10mil) Between Pad Q8-S(5842.283mil,4455mil) on Bottom Layer And Via (5859.6mil,4425mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.91mil]
Minimum Solder Mask Sliver Constraint: (9.217mil < 10mil) Between Pad Q8-S(5842.283mil,4455mil) on Bottom Layer And Via (5883.6mil,4425mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.217mil]
Minimum Solder Mask Sliver Constraint: (4.368mil < 10mil) Between Pad Q8-S(5842.283mil,4455mil) on Bottom Layer And Via (5883.6mil,4449mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.368mil]
Minimum Solder Mask Sliver Constraint: (4.419mil < 10mil) Between Pad Q8-S(5842.283mil,4455mil) on Bottom Layer And Via (5883.6mil,4473mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.419mil]
Minimum Solder Mask Sliver Constraint: (2.082mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5007.899mil,4245.276mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.082mil]
Minimum Solder Mask Sliver Constraint: (2.082mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5007.899mil,4269.276mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.082mil]
Minimum Solder Mask Sliver Constraint: (2.082mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5007.899mil,4293.276mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.082mil]
Minimum Solder Mask Sliver Constraint: (2.082mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5007.899mil,4317.276mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.082mil]
Minimum Solder Mask Sliver Constraint: (2.082mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5007.899mil,4341.276mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.082mil]
Minimum Solder Mask Sliver Constraint: (2.082mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5007.899mil,4365.276mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.082mil]
Minimum Solder Mask Sliver Constraint: (9.477mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5017mil,4154.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.478mil]
Minimum Solder Mask Sliver Constraint: (4.618mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5031mil,4382mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.618mil]
Minimum Solder Mask Sliver Constraint: (9.021mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5041mil,4154.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.021mil]
Minimum Solder Mask Sliver Constraint: (4.618mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5055mil,4382mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.618mil]
Minimum Solder Mask Sliver Constraint: (9.021mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5065mil,4154.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.021mil]
Minimum Solder Mask Sliver Constraint: (4.618mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5079mil,4382mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.618mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5103mil,4190mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5103mil,4214mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5103mil,4238mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5103mil,4262mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5103mil,4286mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5103mil,4310mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5103mil,4334mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (5.343mil < 10mil) Between Pad Q9-D(5053.819mil,4270.552mil) on Bottom Layer And Via (5103mil,4358mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.343mil]
Minimum Solder Mask Sliver Constraint: (8.445mil < 10mil) Between Pad Q9-D(5108.937mil,4270.552mil) on Bottom Layer And Via (5175mil,4190mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.445mil]
Minimum Solder Mask Sliver Constraint: (8.445mil < 10mil) Between Pad Q9-D(5108.937mil,4270.552mil) on Bottom Layer And Via (5175mil,4214mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.445mil]
Minimum Solder Mask Sliver Constraint: (8.445mil < 10mil) Between Pad Q9-D(5108.937mil,4270.552mil) on Bottom Layer And Via (5175mil,4238mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.445mil]
Minimum Solder Mask Sliver Constraint: (8.445mil < 10mil) Between Pad Q9-D(5108.937mil,4270.552mil) on Bottom Layer And Via (5175mil,4262mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.445mil]
Minimum Solder Mask Sliver Constraint: (8.445mil < 10mil) Between Pad Q9-D(5108.937mil,4270.552mil) on Bottom Layer And Via (5175mil,4286mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.445mil]
Minimum Solder Mask Sliver Constraint: (8.445mil < 10mil) Between Pad Q9-D(5108.937mil,4270.552mil) on Bottom Layer And Via (5175mil,4310mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.445mil]
Minimum Solder Mask Sliver Constraint: (8.445mil < 10mil) Between Pad Q9-D(5108.937mil,4270.552mil) on Bottom Layer And Via (5175mil,4334mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.445mil]
Minimum Solder Mask Sliver Constraint: (8.529mil < 10mil) Between Pad Q9-D(5108.937mil,4270.552mil) on Bottom Layer And Via (5175mil,4358mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.529mil]
Minimum Solder Mask Sliver Constraint: (1.468mil < 10mil) Between Pad Q9-D(5162.087mil,4270.552mil) on Bottom Layer And Via (5103mil,4190mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.468mil]
Minimum Solder Mask Sliver Constraint: (1.468mil < 10mil) Between Pad Q9-D(5162.087mil,4270.552mil) on Bottom Layer And Via (5103mil,4214mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.468mil]
Minimum Solder Mask Sliver Constraint: (1.468mil < 10mil) Between Pad Q9-D(5162.087mil,4270.552mil) on Bottom Layer And Via (5103mil,4238mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.468mil]
Minimum Solder Mask Sliver Constraint: (1.468mil < 10mil) Between Pad Q9-D(5162.087mil,4270.552mil) on Bottom Layer And Via (5103mil,4262mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.468mil]
Minimum Solder Mask Sliver Constraint: (1.468mil < 10mil) Between Pad Q9-D(5162.087mil,4270.552mil) on Bottom Layer And Via (5103mil,4286mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.468mil]
Minimum Solder Mask Sliver Constraint: (1.468mil < 10mil) Between Pad Q9-D(5162.087mil,4270.552mil) on Bottom Layer And Via (5103mil,4310mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.468mil]
Minimum Solder Mask Sliver Constraint: (1.468mil < 10mil) Between Pad Q9-D(5162.087mil,4270.552mil) on Bottom Layer And Via (5103mil,4334mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.468mil]
Minimum Solder Mask Sliver Constraint: (1.597mil < 10mil) Between Pad Q9-D(5162.087mil,4270.552mil) on Bottom Layer And Via (5103mil,4358mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.597mil]
Minimum Solder Mask Sliver Constraint: (0.461mil < 10mil) Between Pad Q9-S(5269.371mil,4295.552mil) on Bottom Layer And Via (5262mil,4267mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [0.461mil]
Minimum Solder Mask Sliver Constraint: (0.461mil < 10mil) Between Pad Q9-S(5269.371mil,4295.552mil) on Bottom Layer And Via (5286mil,4267mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [0.461mil]
Minimum Solder Mask Sliver Constraint: (2.461mil < 10mil) Between Pad Q9-S(5269.371mil,4345.552mil) on Bottom Layer And Via (5262mil,4315mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.461mil]
Minimum Solder Mask Sliver Constraint: (2.461mil < 10mil) Between Pad Q9-S(5269.371mil,4345.552mil) on Bottom Layer And Via (5286mil,4315mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.461mil]
Minimum Solder Mask Sliver Constraint: (1.51mil < 10mil) Between Pad R10-1(4155.403mil,5149.951mil) on Bottom Layer And Via (4177.6mil,5168.6mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.51mil]
Minimum Solder Mask Sliver Constraint: (7.054mil < 10mil) Between Pad R10-2(4155.403mil,5116.487mil) on Bottom Layer And Via (4156mil,5087.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.054mil]
Minimum Solder Mask Sliver Constraint: (6.303mil < 10mil) Between Pad R1-1(4087.697mil,5426.751mil) on Top Layer And Via (4117.7mil,5434.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.303mil]
Minimum Solder Mask Sliver Constraint: (1.967mil < 10mil) Between Pad R12-1(4155.903mil,4950.251mil) on Bottom Layer And Via (4179.6mil,4967.6mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.967mil]
Minimum Solder Mask Sliver Constraint: (3.849mil < 10mil) Between Pad R12-2(4155.903mil,4916.787mil) on Bottom Layer And Via (4152.494mil,4891.206mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.849mil]
Minimum Solder Mask Sliver Constraint: (9.866mil < 10mil) Between Pad R13-1(5145.897mil,5011.049mil) on Bottom Layer And Via (5174.8mil,4987.4mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.866mil]
Minimum Solder Mask Sliver Constraint: (7.522mil < 10mil) Between Pad R13-2(5145.897mil,5044.513mil) on Bottom Layer And Via (5114.674mil,5048.512mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.522mil]
Minimum Solder Mask Sliver Constraint: (1.29mil < 10mil) Between Pad R13-2(5145.897mil,5044.513mil) on Bottom Layer And Via (5170.888mil,5047.056mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.29mil]
Minimum Solder Mask Sliver Constraint: (9.98mil < 10mil) Between Pad R15-1(5346.403mil,4971.049mil) on Top Layer And Pad R23-2(5379.1mil,4972.184mil) on Top Layer [Top Solder] Mask Sliver [9.98mil]
Minimum Solder Mask Sliver Constraint: (0.811mil < 10mil) Between Pad R18-1(4155.903mil,4913.749mil) on Top Layer And Via (4152.494mil,4891.206mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.811mil]
Minimum Solder Mask Sliver Constraint: (3.78mil < 10mil) Between Pad R18-2(4155.903mil,4947.213mil) on Top Layer And Via (4179.6mil,4967.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.78mil]
Minimum Solder Mask Sliver Constraint: (5.217mil < 10mil) Between Pad R19-1(4155.403mil,5010.049mil) on Top Layer And Via (4155.5mil,4983.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.217mil]
Minimum Solder Mask Sliver Constraint: (4.017mil < 10mil) Between Pad R20-1(4155.403mil,5113.449mil) on Top Layer And Via (4156mil,5087.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.017mil]
Minimum Solder Mask Sliver Constraint: (3.645mil < 10mil) Between Pad R20-2(4155.403mil,5146.913mil) on Top Layer And Via (4177.6mil,5168.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.645mil]
Minimum Solder Mask Sliver Constraint: (7.226mil < 10mil) Between Pad R2-2(5704.813mil,4970.703mil) on Bottom Layer And Via (5707.471mil,5001.63mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.226mil]
Minimum Solder Mask Sliver Constraint: (5.467mil < 10mil) Between Pad R24-2(5360.387mil,5390.003mil) on Top Layer And Pad R26-2(5332.203mil,5389.813mil) on Top Layer [Top Solder] Mask Sliver [5.467mil]
Minimum Solder Mask Sliver Constraint: (6.803mil < 10mil) Between Pad R26-1(5332.203mil,5356.349mil) on Top Layer And Via (5301.7mil,5347.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.803mil]
Minimum Solder Mask Sliver Constraint: (5.581mil < 10mil) Between Pad R30-1(4202.4mil,4817.805mil) on Top Layer And Via (4185.1mil,4786.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.581mil]
Minimum Solder Mask Sliver Constraint: (3.524mil < 10mil) Between Pad R30-1(4202.4mil,4817.805mil) on Top Layer And Via (4230.7mil,4835.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.524mil]
Minimum Solder Mask Sliver Constraint: (7.152mil < 10mil) Between Pad R30-2(4166.209mil,4853.995mil) on Top Layer And Via (4152.494mil,4891.206mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.152mil]
Minimum Solder Mask Sliver Constraint: (5.991mil < 10mil) Between Pad R31-2(4466.603mil,5437.987mil) on Top Layer And Via (4498.2mil,5465.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.991mil]
Minimum Solder Mask Sliver Constraint: (9.037mil < 10mil) Between Pad R32-2(5070.981mil,4963.5mil) on Top Layer And Via (5048.2mil,4926.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.037mil]
Minimum Solder Mask Sliver Constraint: (9.355mil < 10mil) Between Pad R35-1(5109.049mil,5317.923mil) on Top Layer And Pad R41-2(5109.049mil,5283.883mil) on Top Layer [Top Solder] Mask Sliver [9.355mil]
Minimum Solder Mask Sliver Constraint: (9.355mil < 10mil) Between Pad R35-2(5142.513mil,5317.923mil) on Top Layer And Pad R41-1(5142.513mil,5283.883mil) on Top Layer [Top Solder] Mask Sliver [9.355mil]
Minimum Solder Mask Sliver Constraint: (8.625mil < 10mil) Between Pad R36-2(4852.765mil,5701.4mil) on Bottom Layer And Via (4868.1mil,5669.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.625mil]
Minimum Solder Mask Sliver Constraint: (5.554mil < 10mil) Between Pad R40-1(5142.513mil,5386.003mil) on Top Layer And Via (5169.8mil,5380.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.554mil]
Minimum Solder Mask Sliver Constraint: (5.896mil < 10mil) Between Pad R40-2(5109.049mil,5386.003mil) on Top Layer And Via (5106.6mil,5415.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.896mil]
Minimum Solder Mask Sliver Constraint: (8.817mil < 10mil) Between Pad R4-1(4161.151mil,5473.903mil) on Top Layer And Via (4191.7mil,5472.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.817mil]
Minimum Solder Mask Sliver Constraint: (9.355mil < 10mil) Between Pad R41-1(5142.513mil,5283.883mil) on Top Layer And Pad R42-2(5142.513mil,5249.843mil) on Top Layer [Top Solder] Mask Sliver [9.355mil]
Minimum Solder Mask Sliver Constraint: (9.355mil < 10mil) Between Pad R41-2(5109.049mil,5283.883mil) on Top Layer And Pad R42-1(5109.049mil,5249.843mil) on Top Layer [Top Solder] Mask Sliver [9.355mil]
Minimum Solder Mask Sliver Constraint: (1.697mil < 10mil) Between Pad R4-2(4127.687mil,5473.903mil) on Top Layer And Via (4104.3mil,5487.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.697mil]
Minimum Solder Mask Sliver Constraint: (9.355mil < 10mil) Between Pad R42-1(5109.049mil,5249.843mil) on Top Layer And Pad R46-2(5109.049mil,5215.803mil) on Top Layer [Top Solder] Mask Sliver [9.355mil]
Minimum Solder Mask Sliver Constraint: (9.355mil < 10mil) Between Pad R42-2(5142.513mil,5249.843mil) on Top Layer And Pad R46-1(5142.513mil,5215.803mil) on Top Layer [Top Solder] Mask Sliver [9.355mil]
Minimum Solder Mask Sliver Constraint: (9.524mil < 10mil) Between Pad R43-2(4956.503mil,4966.587mil) on Bottom Layer And Via (4933.742mil,4995.058mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.524mil]
Minimum Solder Mask Sliver Constraint: (9.031mil < 10mil) Between Pad R45-2(4691.5mil,4943.7mil) on Bottom Layer And Via (4721.6mil,4926.2mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.031mil]
Minimum Solder Mask Sliver Constraint: (1.737mil < 10mil) Between Pad R48-1(4585.097mil,4995.651mil) on Top Layer And Via (4560.543mil,5010.757mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.737mil]
Minimum Solder Mask Sliver Constraint: (6.178mil < 10mil) Between Pad R49-1(4595.397mil,5491.451mil) on Top Layer And Via (4589.9mil,5519.361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.178mil]
Minimum Solder Mask Sliver Constraint: (4.834mil < 10mil) Between Pad R50-1(4997.703mil,4996.051mil) on Bottom Layer And Via (5017.1mil,5021mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.834mil]
Minimum Solder Mask Sliver Constraint: (3.534mil < 10mil) Between Pad R50-2(4997.703mil,4962.587mil) on Bottom Layer And Via (5014.65mil,4938.05mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.534mil]
Minimum Solder Mask Sliver Constraint: (6.873mil < 10mil) Between Pad R5-1(4161.451mil,5524.103mil) on Top Layer And Via (4190.056mil,5521.156mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.873mil]
Minimum Solder Mask Sliver Constraint: (2.35mil < 10mil) Between Pad R51-2(4830.731mil,5036.111mil) on Bottom Layer And Via (4837.938mil,5062.162mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.35mil]
Minimum Solder Mask Sliver Constraint: (2.537mil < 10mil) Between Pad R51-2(4830.731mil,5036.111mil) on Bottom Layer And Via (4855mil,5045.434mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.537mil]
Minimum Solder Mask Sliver Constraint: (1.355mil < 10mil) Between Pad R5-2(4127.987mil,5524.103mil) on Top Layer And Via (4104.9mil,5533mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.355mil]
Minimum Solder Mask Sliver Constraint: (9.177mil < 10mil) Between Pad R52-1(4659.368mil,5004mil) on Bottom Layer And Via (4628.458mil,5004mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.177mil]
Minimum Solder Mask Sliver Constraint: (0.476mil < 10mil) Between Pad R52-1(4659.368mil,5004mil) on Bottom Layer And Via (4675mil,4981.055mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [0.476mil]
Minimum Solder Mask Sliver Constraint: (1.605mil < 10mil) Between Pad R52-2(4692.832mil,5004mil) on Bottom Layer And Via (4675mil,4981.055mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.605mil]
Minimum Solder Mask Sliver Constraint: (3.817mil < 10mil) Between Pad R53-1(4558.303mil,5491.451mil) on Top Layer And Via (4567.1mil,5517mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.817mil]
Minimum Solder Mask Sliver Constraint: (9.3mil < 10mil) Between Pad R55-1(5359.25mil,4784.652mil) on Bottom Layer And Via (5273.1mil,4776.4mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.3mil]
Minimum Solder Mask Sliver Constraint: (9.3mil < 10mil) Between Pad R55-1(5359.25mil,4784.652mil) on Bottom Layer And Via (5273.1mil,4800.4mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.3mil]
Minimum Solder Mask Sliver Constraint: (9.843mil < 10mil) Between Pad R55-1(5359.25mil,4784.652mil) on Bottom Layer And Via (5273.1mil,4824.4mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.843mil]
Minimum Solder Mask Sliver Constraint: (2.3mil < 10mil) Between Pad R55-1(5359.25mil,4784.652mil) on Bottom Layer And Via (5438.4mil,4776.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.3mil]
Minimum Solder Mask Sliver Constraint: (2.3mil < 10mil) Between Pad R55-1(5359.25mil,4784.652mil) on Bottom Layer And Via (5438.4mil,4800.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.3mil]
Minimum Solder Mask Sliver Constraint: (3.245mil < 10mil) Between Pad R55-1(5359.25mil,4784.652mil) on Bottom Layer And Via (5438.4mil,4824.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.245mil]
Minimum Solder Mask Sliver Constraint: (5.902mil < 10mil) Between Pad R8-2(5528.387mil,5598.997mil) on Bottom Layer And Via (5521.458mil,5628.6mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.902mil]
Minimum Solder Mask Sliver Constraint: (5.907mil < 10mil) Between Pad S1-1(4826.548mil,5845.2mil) on Bottom Layer And Via (4864.03mil,5822.53mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.907mil]
Minimum Solder Mask Sliver Constraint: (8.677mil < 10mil) Between Pad S2-2(5245.052mil,5845.7mil) on Bottom Layer And Via (5204.8mil,5867.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.677mil]
Minimum Solder Mask Sliver Constraint: (0.742mil < 10mil) Between Pad S3-(5387.698mil,5809.27mil) on Multi-Layer And Via (5404.2mil,5783.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.742mil] / [Bottom Solder] Mask Sliver [0.742mil]
Minimum Solder Mask Sliver Constraint: (0.317mil < 10mil) Between Pad S3-(5387.698mil,5809.27mil) on Multi-Layer And Via (5417.4mil,5812.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.317mil] / [Bottom Solder] Mask Sliver [0.317mil]
Minimum Solder Mask Sliver Constraint: (6.077mil < 10mil) Between Pad S3-1(5297.148mil,5844.7mil) on Bottom Layer And Via (5334.8mil,5860.6mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.077mil]
Minimum Solder Mask Sliver Constraint: (6.377mil < 10mil) Between Pad S3-2(5478.252mil,5844.7mil) on Bottom Layer And Via (5440.3mil,5870.4mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.377mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-1(4971.996mil,5358.662mil) on Bottom Layer And Pad U1-2(4971.996mil,5378.347mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.345mil < 10mil) Between Pad U1-1(4971.996mil,5358.662mil) on Bottom Layer And Via (4994.802mil,5336.553mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.345mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-10(4971.996mil,5535.828mil) on Bottom Layer And Pad U1-11(4971.996mil,5555.512mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-10(4971.996mil,5535.828mil) on Bottom Layer And Pad U1-9(4971.996mil,5516.142mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (8.735mil < 10mil) Between Pad U1-10(4971.996mil,5535.828mil) on Bottom Layer And Via (5029.964mil,5537.654mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.735mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-11(4971.996mil,5555.512mil) on Bottom Layer And Pad U1-12(4971.996mil,5575.198mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (6.89mil < 10mil) Between Pad U11-1(5627.953mil,5488.193mil) on Bottom Layer And Pad U11-2(5627.983mil,5513.863mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.89mil]
Minimum Solder Mask Sliver Constraint: (6.82mil < 10mil) Between Pad U11-10(5627.953mil,5718.503mil) on Bottom Layer And Pad U11-11(5627.943mil,5744.103mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.82mil]
Minimum Solder Mask Sliver Constraint: (6.81mil < 10mil) Between Pad U11-10(5627.953mil,5718.503mil) on Bottom Layer And Pad U11-9(5627.953mil,5692.913mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.81mil]
Minimum Solder Mask Sliver Constraint: (6.81mil < 10mil) Between Pad U11-11(5627.943mil,5744.103mil) on Bottom Layer And Pad U11-12(5627.953mil,5769.693mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.81mil]
Minimum Solder Mask Sliver Constraint: (6.81mil < 10mil) Between Pad U11-12(5627.953mil,5769.693mil) on Bottom Layer And Pad U11-13(5627.953mil,5795.283mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.81mil]
Minimum Solder Mask Sliver Constraint: (6.81mil < 10mil) Between Pad U11-13(5627.953mil,5795.283mil) on Bottom Layer And Pad U11-14(5627.953mil,5820.873mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.81mil]
Minimum Solder Mask Sliver Constraint: (6.81mil < 10mil) Between Pad U11-14(5627.953mil,5820.873mil) on Bottom Layer And Pad U11-15(5627.953mil,5846.463mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.81mil]
Minimum Solder Mask Sliver Constraint: (4.288mil < 10mil) Between Pad U11-15(5627.953mil,5846.463mil) on Bottom Layer And Via (5593.3mil,5871.5mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.288mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-12(4971.996mil,5575.198mil) on Bottom Layer And Pad U1-13(4971.996mil,5594.883mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (6.81mil < 10mil) Between Pad U11-2(5627.983mil,5513.863mil) on Bottom Layer And Pad U11-3(5627.743mil,5539.453mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.81mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-13(4971.996mil,5594.883mil) on Bottom Layer And Pad U1-14(4971.996mil,5614.568mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (6.81mil < 10mil) Between Pad U11-3(5627.743mil,5539.453mil) on Bottom Layer And Pad U11-4(5628.053mil,5565.043mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.81mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-14(4971.996mil,5614.568mil) on Bottom Layer And Pad U1-15(4971.996mil,5634.253mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (6.73mil < 10mil) Between Pad U11-4(5628.053mil,5565.043mil) on Bottom Layer And Pad U11-5(5627.953mil,5590.553mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.73mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-15(4971.996mil,5634.253mil) on Bottom Layer And Pad U1-16(4971.996mil,5653.938mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (6.81mil < 10mil) Between Pad U11-5(5627.953mil,5590.553mil) on Bottom Layer And Pad U11-6(5627.943mil,5616.143mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.81mil]
Minimum Solder Mask Sliver Constraint: (3.299mil < 10mil) Between Pad U1-16(4971.996mil,5653.938mil) on Bottom Layer And Via (4975.2mil,5677mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.299mil]
Minimum Solder Mask Sliver Constraint: (6.81mil < 10mil) Between Pad U11-6(5627.943mil,5616.143mil) on Bottom Layer And Pad U11-7(5627.953mil,5641.733mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.81mil]
Minimum Solder Mask Sliver Constraint: (7.229mil < 10mil) Between Pad U11-6(5627.943mil,5616.143mil) on Bottom Layer And Via (5688.4mil,5621.8mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.229mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-17(5042.862mil,5724.804mil) on Bottom Layer And Pad U1-18(5062.547mil,5724.804mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (5.499mil < 10mil) Between Pad U1-17(5042.862mil,5724.804mil) on Bottom Layer And Via (5017.6mil,5734.342mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.499mil]
Minimum Solder Mask Sliver Constraint: (6.81mil < 10mil) Between Pad U11-7(5627.953mil,5641.733mil) on Bottom Layer And Pad U11-8(5627.953mil,5667.323mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.81mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-18(5062.547mil,5724.804mil) on Bottom Layer And Pad U1-19(5082.232mil,5724.804mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (6.81mil < 10mil) Between Pad U11-8(5627.953mil,5667.323mil) on Bottom Layer And Pad U11-9(5627.953mil,5692.913mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.81mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-19(5082.232mil,5724.804mil) on Bottom Layer And Pad U1-20(5101.917mil,5724.804mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-2(4971.996mil,5378.347mil) on Bottom Layer And Pad U1-3(4971.996mil,5398.032mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-20(5101.917mil,5724.804mil) on Bottom Layer And Pad U1-21(5121.602mil,5724.804mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-21(5121.602mil,5724.804mil) on Bottom Layer And Pad U1-22(5141.287mil,5724.804mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-22(5141.287mil,5724.804mil) on Bottom Layer And Pad U1-23(5160.972mil,5724.804mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-23(5160.972mil,5724.804mil) on Bottom Layer And Pad U1-24(5180.658mil,5724.804mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (6.268mil < 10mil) Between Pad U1-23(5160.972mil,5724.804mil) on Bottom Layer And Via (5181.7mil,5770.079mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.268mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-24(5180.658mil,5724.804mil) on Bottom Layer And Pad U1-25(5200.343mil,5724.804mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-25(5200.343mil,5724.804mil) on Bottom Layer And Pad U1-26(5220.028mil,5724.804mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (4.64mil < 10mil) Between Pad U1-25(5200.343mil,5724.804mil) on Bottom Layer And Via (5181.7mil,5770.079mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.64mil]
Minimum Solder Mask Sliver Constraint: (9.108mil < 10mil) Between Pad U1-25(5200.343mil,5724.804mil) on Bottom Layer And Via (5219.931mil,5775.542mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.108mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-26(5220.028mil,5724.804mil) on Bottom Layer And Pad U1-27(5239.713mil,5724.804mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (1.447mil < 10mil) Between Pad U1-26(5220.028mil,5724.804mil) on Bottom Layer And Via (5219.931mil,5775.542mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [1.447mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-27(5239.713mil,5724.804mil) on Bottom Layer And Pad U1-28(5259.398mil,5724.804mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (9.239mil < 10mil) Between Pad U1-27(5239.713mil,5724.804mil) on Bottom Layer And Via (5219.931mil,5775.542mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [9.239mil]
Minimum Solder Mask Sliver Constraint: (2.817mil < 10mil) Between Pad U1-27(5239.713mil,5724.804mil) on Bottom Layer And Via (5242.8mil,5776.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.817mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-28(5259.398mil,5724.804mil) on Bottom Layer And Pad U1-29(5279.083mil,5724.804mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (8.09mil < 10mil) Between Pad U1-28(5259.398mil,5724.804mil) on Bottom Layer And Via (5242.8mil,5776.7mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [8.09mil]
Minimum Solder Mask Sliver Constraint: (5.446mil < 10mil) Between Pad U1-28(5259.398mil,5724.804mil) on Bottom Layer And Via (5279.083mil,5770.079mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.446mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-29(5279.083mil,5724.804mil) on Bottom Layer And Pad U1-30(5298.768mil,5724.804mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-3(4971.996mil,5398.032mil) on Bottom Layer And Pad U1-4(4971.996mil,5417.717mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-30(5298.768mil,5724.804mil) on Bottom Layer And Pad U1-31(5318.453mil,5724.804mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (5.446mil < 10mil) Between Pad U1-30(5298.768mil,5724.804mil) on Bottom Layer And Via (5279.083mil,5770.079mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.446mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-31(5318.453mil,5724.804mil) on Bottom Layer And Pad U1-32(5338.138mil,5724.804mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-33(5409.004mil,5653.938mil) on Bottom Layer And Pad U1-34(5409.004mil,5634.253mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (7.952mil < 10mil) Between Pad U1-33(5409.004mil,5653.938mil) on Bottom Layer And Via (5429.134mil,5681.653mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.952mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-34(5409.004mil,5634.253mil) on Bottom Layer And Pad U1-35(5409.004mil,5614.568mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-35(5409.004mil,5614.568mil) on Bottom Layer And Pad U1-36(5409.004mil,5594.883mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-36(5409.004mil,5594.883mil) on Bottom Layer And Pad U1-37(5409.004mil,5575.198mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-37(5409.004mil,5575.198mil) on Bottom Layer And Pad U1-38(5409.004mil,5555.512mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-38(5409.004mil,5555.512mil) on Bottom Layer And Pad U1-39(5409.004mil,5535.828mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-39(5409.004mil,5535.828mil) on Bottom Layer And Pad U1-40(5409.004mil,5516.143mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (6.535mil < 10mil) Between Pad U1-39(5409.004mil,5535.828mil) on Bottom Layer And Via (5459.028mil,5519.35mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.535mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-4(4971.996mil,5417.717mil) on Bottom Layer And Pad U1-5(4971.996mil,5437.402mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-40(5409.004mil,5516.143mil) on Bottom Layer And Pad U1-41(5409.004mil,5496.457mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (0.983mil < 10mil) Between Pad U1-40(5409.004mil,5516.143mil) on Bottom Layer And Via (5459.028mil,5519.35mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [0.983mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-41(5409.004mil,5496.457mil) on Bottom Layer And Pad U1-42(5409.004mil,5476.772mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-42(5409.004mil,5476.772mil) on Bottom Layer And Pad U1-43(5409.004mil,5457.087mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-43(5409.004mil,5457.087mil) on Bottom Layer And Pad U1-44(5409.004mil,5437.402mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-44(5409.004mil,5437.402mil) on Bottom Layer And Pad U1-45(5409.004mil,5417.717mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-45(5409.004mil,5417.717mil) on Bottom Layer And Pad U1-46(5409.004mil,5398.032mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-46(5409.004mil,5398.032mil) on Bottom Layer And Pad U1-47(5409.004mil,5378.347mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-47(5409.004mil,5378.347mil) on Bottom Layer And Pad U1-48(5409.004mil,5358.662mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (7.802mil < 10mil) Between Pad U1-48(5409.004mil,5358.662mil) on Bottom Layer And Via (5454.279mil,5336.038mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [7.802mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-49(5338.138mil,5287.796mil) on Bottom Layer And Pad U1-50(5318.453mil,5287.796mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-5(4971.996mil,5437.402mil) on Bottom Layer And Pad U1-6(4971.996mil,5457.087mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-50(5318.453mil,5287.796mil) on Bottom Layer And Pad U1-51(5298.768mil,5287.796mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.862mil < 10mil) Between Pad U1-50(5318.453mil,5287.796mil) on Bottom Layer And Via (5310mil,5237.281mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.862mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-51(5298.768mil,5287.796mil) on Bottom Layer And Pad U1-52(5279.083mil,5287.796mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (4.04mil < 10mil) Between Pad U1-51(5298.768mil,5287.796mil) on Bottom Layer And Via (5310mil,5237.281mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.04mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-52(5279.083mil,5287.796mil) on Bottom Layer And Pad U1-53(5259.398mil,5287.796mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-53(5259.398mil,5287.796mil) on Bottom Layer And Pad U1-54(5239.713mil,5287.796mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-54(5239.713mil,5287.796mil) on Bottom Layer And Pad U1-55(5220.028mil,5287.796mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-55(5220.028mil,5287.796mil) on Bottom Layer And Pad U1-56(5200.343mil,5287.796mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-56(5200.343mil,5287.796mil) on Bottom Layer And Pad U1-57(5180.658mil,5287.796mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-57(5180.658mil,5287.796mil) on Bottom Layer And Pad U1-58(5160.972mil,5287.796mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-58(5160.972mil,5287.796mil) on Bottom Layer And Pad U1-59(5141.287mil,5287.796mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-59(5141.287mil,5287.796mil) on Bottom Layer And Pad U1-60(5121.602mil,5287.796mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-6(4971.996mil,5457.087mil) on Bottom Layer And Pad U1-7(4971.996mil,5476.772mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-60(5121.602mil,5287.796mil) on Bottom Layer And Pad U1-61(5101.917mil,5287.796mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-61(5101.917mil,5287.796mil) on Bottom Layer And Pad U1-62(5082.232mil,5287.796mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-62(5082.232mil,5287.796mil) on Bottom Layer And Pad U1-63(5062.547mil,5287.796mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-63(5062.547mil,5287.796mil) on Bottom Layer And Pad U1-64(5042.862mil,5287.796mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-7(4971.996mil,5476.772mil) on Bottom Layer And Pad U1-8(4971.996mil,5496.457mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U1-8(4971.996mil,5496.457mil) on Bottom Layer And Pad U1-9(4971.996mil,5516.142mil) on Bottom Layer [Bottom Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-1(4364.399mil,5439.042mil) on Bottom Layer And Pad U2-2(4364.399mil,5464.633mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-10(4364.399mil,5669.358mil) on Bottom Layer And Pad U2-9(4364.399mil,5643.767mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-11(4651.801mil,5669.358mil) on Bottom Layer And Pad U2-12(4651.801mil,5643.767mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (9.238mil < 10mil) Between Pad U2-11(4651.801mil,5669.358mil) on Bottom Layer And Pad XT2-3(4721.861mil,5634.365mil) on Bottom Layer [Bottom Solder] Mask Sliver [9.238mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-12(4651.801mil,5643.767mil) on Bottom Layer And Pad U2-13(4651.801mil,5618.176mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (6.99mil < 10mil) Between Pad U2-12(4651.801mil,5643.767mil) on Bottom Layer And Pad XT2-3(4721.861mil,5634.365mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.99mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-13(4651.801mil,5618.176mil) on Bottom Layer And Pad U2-14(4651.801mil,5592.586mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (6.99mil < 10mil) Between Pad U2-13(4651.801mil,5618.176mil) on Bottom Layer And Pad XT2-3(4721.861mil,5634.365mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.99mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-14(4651.801mil,5592.586mil) on Bottom Layer And Pad U2-15(4651.801mil,5566.995mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (6.99mil < 10mil) Between Pad U2-14(4651.801mil,5592.586mil) on Bottom Layer And Pad XT2-2(4721.861mil,5567.435mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.99mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-15(4651.801mil,5566.995mil) on Bottom Layer And Pad U2-16(4651.801mil,5541.405mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (6.99mil < 10mil) Between Pad U2-15(4651.801mil,5566.995mil) on Bottom Layer And Pad XT2-2(4721.861mil,5567.435mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.99mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-16(4651.801mil,5541.405mil) on Bottom Layer And Pad U2-17(4651.801mil,5515.814mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (6.99mil < 10mil) Between Pad U2-16(4651.801mil,5541.405mil) on Bottom Layer And Pad XT2-2(4721.861mil,5567.435mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.99mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-17(4651.801mil,5515.814mil) on Bottom Layer And Pad U2-18(4651.801mil,5490.223mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (0.089mil < 10mil) Between Pad U2-17(4651.801mil,5515.814mil) on Bottom Layer And Via (4698.2mil,5516.9mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [0.089mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-18(4651.801mil,5490.223mil) on Bottom Layer And Pad U2-19(4651.801mil,5464.633mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-19(4651.801mil,5464.633mil) on Bottom Layer And Pad U2-20(4651.801mil,5439.042mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-2(4364.399mil,5464.633mil) on Bottom Layer And Pad U2-3(4364.399mil,5490.223mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-3(4364.399mil,5490.223mil) on Bottom Layer And Pad U2-4(4364.399mil,5515.814mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-4(4364.399mil,5515.814mil) on Bottom Layer And Pad U2-5(4364.399mil,5541.405mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-5(4364.399mil,5541.405mil) on Bottom Layer And Pad U2-6(4364.399mil,5566.995mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-6(4364.399mil,5566.995mil) on Bottom Layer And Pad U2-7(4364.399mil,5592.586mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (2.367mil < 10mil) Between Pad U2-6(4364.399mil,5566.995mil) on Bottom Layer And Via (4413.105mil,5566.995mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [2.367mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-7(4364.399mil,5592.586mil) on Bottom Layer And Pad U2-8(4364.399mil,5618.176mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (3.473mil < 10mil) Between Pad U2-7(4364.399mil,5592.586mil) on Bottom Layer And Via (4414.207mil,5592.193mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [3.473mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad U2-8(4364.399mil,5618.176mil) on Bottom Layer And Pad U2-9(4364.399mil,5643.767mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (9.214mil < 10mil) Between Pad U3-4(4515.621mil,5584.8mil) on Top Layer And Via (4458.1mil,5530.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.214mil]
Minimum Solder Mask Sliver Constraint: (4.25mil < 10mil) Between Pad U3-4(4515.621mil,5584.8mil) on Top Layer And Via (4567.1mil,5517mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.25mil]
Minimum Solder Mask Sliver Constraint: (8.78mil < 10mil) Between Pad U4-1(5129.119mil,5022.302mil) on Top Layer And Pad U4-2(5129.119mil,4984.9mil) on Top Layer [Top Solder] Mask Sliver [8.78mil]
Minimum Solder Mask Sliver Constraint: (0.692mil < 10mil) Between Pad U4-1(5129.119mil,5022.302mil) on Top Layer And Via (5114.674mil,5048.512mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.692mil]
Minimum Solder Mask Sliver Constraint: (8.78mil < 10mil) Between Pad U4-2(5129.119mil,4984.9mil) on Top Layer And Pad U4-3(5129.119mil,4947.498mil) on Top Layer [Top Solder] Mask Sliver [8.78mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-1(5066.548mil,5398.906mil) on Top Layer And Pad U5-2(5046.863mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (0.59mil < 10mil) Between Pad U5-1(5066.548mil,5398.906mil) on Top Layer And Via (5085.829mil,5427.082mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.59mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-10(4889.383mil,5398.906mil) on Top Layer And Pad U5-11(4869.698mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-10(4889.383mil,5398.906mil) on Top Layer And Pad U5-9(4909.068mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-11(4869.698mil,5398.906mil) on Top Layer And Pad U5-12(4850.013mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-12(4850.013mil,5398.906mil) on Top Layer And Pad U5-13(4830.328mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-13(4830.328mil,5398.906mil) on Top Layer And Pad U5-14(4810.642mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-14(4810.642mil,5398.906mil) on Top Layer And Pad U5-15(4790.957mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-15(4790.957mil,5398.906mil) on Top Layer And Pad U5-16(4771.272mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-16(4771.272mil,5398.906mil) on Top Layer And Pad U5-17(4751.587mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-17(4751.587mil,5398.906mil) on Top Layer And Pad U5-18(4731.902mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.676mil < 10mil) Between Pad U5-17(4751.587mil,5398.906mil) on Top Layer And Via (4745.699mil,5355.599mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.676mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-18(4731.902mil,5398.906mil) on Top Layer And Pad U5-19(4712.217mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (5.912mil < 10mil) Between Pad U5-18(4731.902mil,5398.906mil) on Top Layer And Via (4745.699mil,5355.599mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.912mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-19(4712.217mil,5398.906mil) on Top Layer And Pad U5-20(4692.532mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.735mil < 10mil) Between Pad U5-19(4712.217mil,5398.906mil) on Top Layer And Via (4712.1mil,5443.058mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.735mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-2(5046.863mil,5398.906mil) on Top Layer And Pad U5-3(5027.178mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-20(4692.532mil,5398.906mil) on Top Layer And Pad U5-21(4672.847mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-21(4672.847mil,5398.906mil) on Top Layer And Pad U5-22(4653.162mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.195mil < 10mil) Between Pad U5-21(4672.847mil,5398.906mil) on Top Layer And Via (4669.199mil,5355.599mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.195mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-22(4653.162mil,5398.906mil) on Top Layer And Pad U5-23(4633.477mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (9.486mil < 10mil) Between Pad U5-22(4653.162mil,5398.906mil) on Top Layer And Via (4633.686mil,5355.431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.486mil]
Minimum Solder Mask Sliver Constraint: (7.182mil < 10mil) Between Pad U5-22(4653.162mil,5398.906mil) on Top Layer And Via (4669.199mil,5355.599mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.182mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-23(4633.477mil,5398.906mil) on Top Layer And Pad U5-24(4613.792mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.059mil < 10mil) Between Pad U5-23(4633.477mil,5398.906mil) on Top Layer And Via (4633.686mil,5355.431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.059mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-24(4613.792mil,5398.906mil) on Top Layer And Pad U5-25(4594.107mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (9.765mil < 10mil) Between Pad U5-24(4613.792mil,5398.906mil) on Top Layer And Via (4633.686mil,5355.431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.765mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-25(4594.107mil,5398.906mil) on Top Layer And Pad U5-26(4574.422mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-26(4574.422mil,5398.906mil) on Top Layer And Pad U5-27(4554.737mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-27(4554.737mil,5398.906mil) on Top Layer And Pad U5-28(4535.052mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (5.798mil < 10mil) Between Pad U5-27(4554.737mil,5398.906mil) on Top Layer And Via (4557.1mil,5351.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.799mil]
Minimum Solder Mask Sliver Constraint: (6.741mil < 10mil) Between Pad U5-28(4535.052mil,5398.906mil) on Top Layer And Via (4526.4mil,5352.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.741mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-29(4535.052mil,5099.694mil) on Top Layer And Pad U5-30(4554.737mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-3(5027.178mil,5398.906mil) on Top Layer And Pad U5-4(5007.493mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-30(4554.737mil,5099.694mil) on Top Layer And Pad U5-31(4574.422mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-31(4574.422mil,5099.694mil) on Top Layer And Pad U5-32(4594.107mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-32(4594.107mil,5099.694mil) on Top Layer And Pad U5-33(4613.792mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-33(4613.792mil,5099.694mil) on Top Layer And Pad U5-34(4633.477mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-34(4633.477mil,5099.694mil) on Top Layer And Pad U5-35(4653.162mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-35(4653.162mil,5099.694mil) on Top Layer And Pad U5-36(4672.847mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-36(4672.847mil,5099.694mil) on Top Layer And Pad U5-37(4692.532mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-37(4692.532mil,5099.694mil) on Top Layer And Pad U5-38(4712.217mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-38(4712.217mil,5099.694mil) on Top Layer And Pad U5-39(4731.902mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-39(4731.902mil,5099.694mil) on Top Layer And Pad U5-40(4751.587mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-4(5007.493mil,5398.906mil) on Top Layer And Pad U5-5(4987.808mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-40(4751.587mil,5099.694mil) on Top Layer And Pad U5-41(4771.272mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (8.655mil < 10mil) Between Pad U5-40(4751.587mil,5099.694mil) on Top Layer And Via (4752.655mil,5049.642mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.655mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-41(4771.272mil,5099.694mil) on Top Layer And Pad U5-42(4790.957mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-42(4790.957mil,5099.694mil) on Top Layer And Pad U5-43(4810.642mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-43(4810.642mil,5099.694mil) on Top Layer And Pad U5-44(4830.328mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-44(4830.328mil,5099.694mil) on Top Layer And Pad U5-45(4850.013mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-45(4850.013mil,5099.694mil) on Top Layer And Pad U5-46(4869.698mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (0.184mil < 10mil) Between Pad U5-45(4850.013mil,5099.694mil) on Top Layer And Via (4837.938mil,5062.162mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.184mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-46(4869.698mil,5099.694mil) on Top Layer And Pad U5-47(4889.383mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-47(4889.383mil,5099.694mil) on Top Layer And Pad U5-48(4909.068mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-48(4909.068mil,5099.694mil) on Top Layer And Pad U5-49(4928.753mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-49(4928.753mil,5099.694mil) on Top Layer And Pad U5-50(4948.438mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (9.487mil < 10mil) Between Pad U5-49(4928.753mil,5099.694mil) on Top Layer And Via (4937.095mil,5050.005mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.487mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-5(4987.808mil,5398.906mil) on Top Layer And Pad U5-6(4968.123mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-50(4948.438mil,5099.694mil) on Top Layer And Pad U5-51(4968.123mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-51(4968.123mil,5099.694mil) on Top Layer And Pad U5-52(4987.808mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-52(4987.808mil,5099.694mil) on Top Layer And Pad U5-53(5007.493mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-53(5007.493mil,5099.694mil) on Top Layer And Pad U5-54(5027.178mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (3.041mil < 10mil) Between Pad U5-53(5007.493mil,5099.694mil) on Top Layer And Via (5017.4mil,5057.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.041mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-54(5027.178mil,5099.694mil) on Top Layer And Pad U5-55(5046.863mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.985mil < 10mil) Between Pad U5-54(5027.178mil,5099.694mil) on Top Layer And Via (5017.4mil,5057.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.985mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-55(5046.863mil,5099.694mil) on Top Layer And Pad U5-56(5066.548mil,5099.694mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.921mil < 10mil) Between Pad U5-57(4800.8mil,5249.3mil) on Top Layer And Via (4895.903mil,5161.458mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.921mil]
Minimum Solder Mask Sliver Constraint: (2.921mil < 10mil) Between Pad U5-57(4800.8mil,5249.3mil) on Top Layer And Via (4925.945mil,5161.458mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.921mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-6(4968.123mil,5398.906mil) on Top Layer And Pad U5-7(4948.438mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-7(4948.438mil,5398.906mil) on Top Layer And Pad U5-8(4928.753mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (2.874mil < 10mil) Between Pad U5-8(4928.753mil,5398.906mil) on Top Layer And Pad U5-9(4909.068mil,5398.906mil) on Top Layer [Top Solder] Mask Sliver [2.874mil]
Minimum Solder Mask Sliver Constraint: (8.209mil < 10mil) Between Pad U5-8(4928.753mil,5398.906mil) on Top Layer And Via (4911.074mil,5355.574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.209mil]
Minimum Solder Mask Sliver Constraint: (2.007mil < 10mil) Between Pad U5-9(4909.068mil,5398.906mil) on Top Layer And Via (4911.074mil,5355.574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.007mil]
Minimum Solder Mask Sliver Constraint: (6.809mil < 10mil) Between Pad USB1-1(4267.364mil,5437.012mil) on Bottom Layer And Pad USB1-2(4267.364mil,5468.506mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.809mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad USB1-2(4267.364mil,5468.506mil) on Bottom Layer And Pad USB1-3(4267.364mil,5500.002mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad USB1-3(4267.364mil,5500.002mil) on Bottom Layer And Pad USB1-4(4267.364mil,5531.498mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (6.811mil < 10mil) Between Pad USB1-4(4267.364mil,5531.498mil) on Bottom Layer And Pad USB1-5(4267.364mil,5562.994mil) on Bottom Layer [Bottom Solder] Mask Sliver [6.811mil]
Minimum Solder Mask Sliver Constraint: (4.48mil < 10mil) Between Pad USB1-5(4026.89mil,5324.808mil) on Bottom Layer And Via (4036.3mil,5267.1mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [4.48mil]
Minimum Solder Mask Sliver Constraint: (5.03mil < 10mil) Between Pad USB1-5(4243.426mil,5675.2mil) on Bottom Layer And Via (4252.098mil,5733.458mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.03mil]
Minimum Solder Mask Sliver Constraint: (8.963mil < 10mil) Between Pad USB1-MH2(4145mil,5413.39mil) on Multi-Layer And Via (4117.7mil,5434.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.963mil] / [Bottom Solder] Mask Sliver [8.963mil]
Minimum Solder Mask Sliver Constraint: (6.314mil < 10mil) Between Pad XT1-2(4673.239mil,5843.665mil) on Bottom Layer And Via (4710.15mil,5885.1mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [6.314mil]
Minimum Solder Mask Sliver Constraint: (5.155mil < 10mil) Between Pad XT2-4(4804.539mil,5634.365mil) on Bottom Layer And Via (4786.1mil,5677mil) from Top Layer to Bottom Layer [Bottom Solder] Mask Sliver [5.155mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3965.7mil,4425mil) from Top Layer to Bottom Layer And Via (3965.7mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3965.7mil,4425mil) from Top Layer to Bottom Layer And Via (3989.7mil,4425mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.887mil < 10mil) Between Via (3965.7mil,4449mil) from Top Layer to Bottom Layer And Via (3966.1mil,4473.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.887mil] / [Bottom Solder] Mask Sliver [1.887mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3965.7mil,4449mil) from Top Layer to Bottom Layer And Via (3989.7mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3966.1mil,4473.6mil) from Top Layer to Bottom Layer And Via (3966.1mil,4497.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3966.1mil,4473.6mil) from Top Layer to Bottom Layer And Via (3990.1mil,4473.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.184mil < 10mil) Between Via (3966.1mil,4497.6mil) from Top Layer to Bottom Layer And Via (3966.1mil,4521.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.184mil] / [Bottom Solder] Mask Sliver [1.184mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3966.1mil,4497.6mil) from Top Layer to Bottom Layer And Via (3990.1mil,4497.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3966.1mil,4521.5mil) from Top Layer to Bottom Layer And Via (3966.1mil,4545.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3966.1mil,4521.5mil) from Top Layer to Bottom Layer And Via (3990.1mil,4521.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.686mil < 10mil) Between Via (3966.1mil,4545.5mil) from Top Layer to Bottom Layer And Via (3966.4mil,4568.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.686mil] / [Bottom Solder] Mask Sliver [0.686mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3966.1mil,4545.5mil) from Top Layer to Bottom Layer And Via (3990.1mil,4545.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3966.4mil,4568.9mil) from Top Layer to Bottom Layer And Via (3966.4mil,4592.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3966.4mil,4568.9mil) from Top Layer to Bottom Layer And Via (3990.4mil,4568.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.484mil < 10mil) Between Via (3966.4mil,4592.9mil) from Top Layer to Bottom Layer And Via (3966.4mil,4616.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.484mil] / [Bottom Solder] Mask Sliver [0.484mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3966.4mil,4592.9mil) from Top Layer to Bottom Layer And Via (3990.4mil,4592.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3966.4mil,4616.1mil) from Top Layer to Bottom Layer And Via (3966.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3966.4mil,4616.1mil) from Top Layer to Bottom Layer And Via (3990.4mil,4616.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3966.4mil,4640.1mil) from Top Layer to Bottom Layer And Via (3990.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3966.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (3966.7mil,4686.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.963mil < 10mil) Between Via (3966.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (3990.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.963mil] / [Bottom Solder] Mask Sliver [9.963mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3966.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (3990.7mil,4662.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.389mil < 10mil) Between Via (3966.7mil,4686.6mil) from Top Layer to Bottom Layer And Via (3967.2mil,4710.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.389mil] / [Bottom Solder] Mask Sliver [1.389mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3966.7mil,4686.6mil) from Top Layer to Bottom Layer And Via (3990.7mil,4686.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3967.2mil,4710.7mil) from Top Layer to Bottom Layer And Via (3967.2mil,4734.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3967.2mil,4710.7mil) from Top Layer to Bottom Layer And Via (3991.2mil,4710.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3967.2mil,4734.7mil) from Top Layer to Bottom Layer And Via (3991.2mil,4734.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3969.1mil,4295.6mil) from Top Layer to Bottom Layer And Via (3993.1mil,4295.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3969.3mil,4073.9mil) from Top Layer to Bottom Layer And Via (3969.3mil,4097.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3969.3mil,4073.9mil) from Top Layer to Bottom Layer And Via (3993.3mil,4073.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3969.3mil,4097.9mil) from Top Layer to Bottom Layer And Via (3993.3mil,4097.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3969.6mil,4221.4mil) from Top Layer to Bottom Layer And Via (3969.6mil,4245.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3969.6mil,4221.4mil) from Top Layer to Bottom Layer And Via (3993.6mil,4221.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3969.6mil,4245.4mil) from Top Layer to Bottom Layer And Via (3993.6mil,4245.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3989.7mil,4425mil) from Top Layer to Bottom Layer And Via (3989.7mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3989.7mil,4425mil) from Top Layer to Bottom Layer And Via (4013.7mil,4425mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.887mil < 10mil) Between Via (3989.7mil,4449mil) from Top Layer to Bottom Layer And Via (3990.1mil,4473.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.887mil] / [Bottom Solder] Mask Sliver [1.887mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3989.7mil,4449mil) from Top Layer to Bottom Layer And Via (4013.7mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3990.1mil,4473.6mil) from Top Layer to Bottom Layer And Via (3990.1mil,4497.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3990.1mil,4473.6mil) from Top Layer to Bottom Layer And Via (4014.1mil,4473.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.184mil < 10mil) Between Via (3990.1mil,4497.6mil) from Top Layer to Bottom Layer And Via (3990.1mil,4521.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.184mil] / [Bottom Solder] Mask Sliver [1.184mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3990.1mil,4497.6mil) from Top Layer to Bottom Layer And Via (4014.1mil,4497.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3990.1mil,4521.5mil) from Top Layer to Bottom Layer And Via (3990.1mil,4545.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3990.1mil,4521.5mil) from Top Layer to Bottom Layer And Via (4014.1mil,4521.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.686mil < 10mil) Between Via (3990.1mil,4545.5mil) from Top Layer to Bottom Layer And Via (3990.4mil,4568.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.686mil] / [Bottom Solder] Mask Sliver [0.686mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3990.1mil,4545.5mil) from Top Layer to Bottom Layer And Via (4014.1mil,4545.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3990.4mil,4568.9mil) from Top Layer to Bottom Layer And Via (3990.4mil,4592.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3990.4mil,4568.9mil) from Top Layer to Bottom Layer And Via (4014.4mil,4568.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.484mil < 10mil) Between Via (3990.4mil,4592.9mil) from Top Layer to Bottom Layer And Via (3990.4mil,4616.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.484mil] / [Bottom Solder] Mask Sliver [0.484mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3990.4mil,4592.9mil) from Top Layer to Bottom Layer And Via (4014.4mil,4592.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3990.4mil,4616.1mil) from Top Layer to Bottom Layer And Via (3990.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3990.4mil,4616.1mil) from Top Layer to Bottom Layer And Via (4014.4mil,4616.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3990.4mil,4640.1mil) from Top Layer to Bottom Layer And Via (4014.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3990.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (3990.7mil,4686.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.963mil < 10mil) Between Via (3990.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (4014.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.963mil] / [Bottom Solder] Mask Sliver [9.963mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3990.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (4014.7mil,4662.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.389mil < 10mil) Between Via (3990.7mil,4686.6mil) from Top Layer to Bottom Layer And Via (3991.2mil,4710.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.389mil] / [Bottom Solder] Mask Sliver [1.389mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3990.7mil,4686.6mil) from Top Layer to Bottom Layer And Via (4014.7mil,4686.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3991.2mil,4710.7mil) from Top Layer to Bottom Layer And Via (3991.2mil,4734.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3991.2mil,4710.7mil) from Top Layer to Bottom Layer And Via (4015.2mil,4710.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.468mil < 10mil) Between Via (3991.2mil,4734.7mil) from Top Layer to Bottom Layer And Via (3993.3mil,4760.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.468mil] / [Bottom Solder] Mask Sliver [3.468mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3991.2mil,4734.7mil) from Top Layer to Bottom Layer And Via (4015.2mil,4734.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3993.1mil,4295.6mil) from Top Layer to Bottom Layer And Via (4017.1mil,4295.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3993.3mil,4073.9mil) from Top Layer to Bottom Layer And Via (3993.3mil,4097.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3993.3mil,4073.9mil) from Top Layer to Bottom Layer And Via (4017.3mil,4073.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3993.3mil,4097.9mil) from Top Layer to Bottom Layer And Via (4017.3mil,4097.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.202mil < 10mil) Between Via (3993.3mil,4760.8mil) from Top Layer to Bottom Layer And Via (4020.2mil,4759.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.202mil] / [Bottom Solder] Mask Sliver [4.202mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3993.6mil,4221.4mil) from Top Layer to Bottom Layer And Via (3993.6mil,4245.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3993.6mil,4221.4mil) from Top Layer to Bottom Layer And Via (4017.6mil,4221.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (3993.6mil,4245.4mil) from Top Layer to Bottom Layer And Via (4017.6mil,4245.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4013.7mil,4425mil) from Top Layer to Bottom Layer And Via (4013.7mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4013.7mil,4425mil) from Top Layer to Bottom Layer And Via (4037.7mil,4425mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.887mil < 10mil) Between Via (4013.7mil,4449mil) from Top Layer to Bottom Layer And Via (4014.1mil,4473.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.887mil] / [Bottom Solder] Mask Sliver [1.887mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4013.7mil,4449mil) from Top Layer to Bottom Layer And Via (4037.7mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4014.1mil,4473.6mil) from Top Layer to Bottom Layer And Via (4014.1mil,4497.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4014.1mil,4473.6mil) from Top Layer to Bottom Layer And Via (4038.1mil,4473.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.184mil < 10mil) Between Via (4014.1mil,4497.6mil) from Top Layer to Bottom Layer And Via (4014.1mil,4521.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.184mil] / [Bottom Solder] Mask Sliver [1.184mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4014.1mil,4497.6mil) from Top Layer to Bottom Layer And Via (4038.1mil,4497.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4014.1mil,4521.5mil) from Top Layer to Bottom Layer And Via (4014.1mil,4545.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4014.1mil,4521.5mil) from Top Layer to Bottom Layer And Via (4038.1mil,4521.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.686mil < 10mil) Between Via (4014.1mil,4545.5mil) from Top Layer to Bottom Layer And Via (4014.4mil,4568.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.686mil] / [Bottom Solder] Mask Sliver [0.686mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4014.1mil,4545.5mil) from Top Layer to Bottom Layer And Via (4038.1mil,4545.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4014.4mil,4568.9mil) from Top Layer to Bottom Layer And Via (4014.4mil,4592.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4014.4mil,4568.9mil) from Top Layer to Bottom Layer And Via (4038.4mil,4568.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.484mil < 10mil) Between Via (4014.4mil,4592.9mil) from Top Layer to Bottom Layer And Via (4014.4mil,4616.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.484mil] / [Bottom Solder] Mask Sliver [0.484mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4014.4mil,4592.9mil) from Top Layer to Bottom Layer And Via (4038.4mil,4592.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4014.4mil,4616.1mil) from Top Layer to Bottom Layer And Via (4014.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4014.4mil,4616.1mil) from Top Layer to Bottom Layer And Via (4038.4mil,4616.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4014.4mil,4640.1mil) from Top Layer to Bottom Layer And Via (4038.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4014.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (4014.7mil,4686.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.963mil < 10mil) Between Via (4014.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (4038.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.963mil] / [Bottom Solder] Mask Sliver [9.963mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4014.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (4038.7mil,4662.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.389mil < 10mil) Between Via (4014.7mil,4686.6mil) from Top Layer to Bottom Layer And Via (4015.2mil,4710.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.389mil] / [Bottom Solder] Mask Sliver [1.389mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4014.7mil,4686.6mil) from Top Layer to Bottom Layer And Via (4038.7mil,4686.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4015.2mil,4710.7mil) from Top Layer to Bottom Layer And Via (4015.2mil,4734.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4015.2mil,4710.7mil) from Top Layer to Bottom Layer And Via (4039.2mil,4710.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.877mil < 10mil) Between Via (4015.2mil,4734.7mil) from Top Layer to Bottom Layer And Via (4020.2mil,4759.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.877mil] / [Bottom Solder] Mask Sliver [2.877mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4015.2mil,4734.7mil) from Top Layer to Bottom Layer And Via (4039.2mil,4734.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4017.1mil,4295.6mil) from Top Layer to Bottom Layer And Via (4041.1mil,4295.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4017.3mil,4073.9mil) from Top Layer to Bottom Layer And Via (4017.3mil,4097.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4017.3mil,4073.9mil) from Top Layer to Bottom Layer And Via (4041.3mil,4073.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4017.3mil,4097.9mil) from Top Layer to Bottom Layer And Via (4041.3mil,4097.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4017.6mil,4221.4mil) from Top Layer to Bottom Layer And Via (4017.6mil,4245.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4017.6mil,4221.4mil) from Top Layer to Bottom Layer And Via (4041.6mil,4221.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4017.6mil,4245.4mil) from Top Layer to Bottom Layer And Via (4041.6mil,4245.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.764mil < 10mil) Between Via (4020.2mil,4759.8mil) from Top Layer to Bottom Layer And Via (4039.2mil,4734.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.764mil] / [Bottom Solder] Mask Sliver [8.764mil]
Minimum Solder Mask Sliver Constraint: (5.701mil < 10mil) Between Via (4020.2mil,4759.8mil) from Top Layer to Bottom Layer And Via (4048.6mil,4758.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.701mil] / [Bottom Solder] Mask Sliver [5.701mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4037.7mil,4425mil) from Top Layer to Bottom Layer And Via (4037.7mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4037.7mil,4425mil) from Top Layer to Bottom Layer And Via (4061.7mil,4425mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.887mil < 10mil) Between Via (4037.7mil,4449mil) from Top Layer to Bottom Layer And Via (4038.1mil,4473.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.887mil] / [Bottom Solder] Mask Sliver [1.887mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4037.7mil,4449mil) from Top Layer to Bottom Layer And Via (4061.7mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4038.1mil,4473.6mil) from Top Layer to Bottom Layer And Via (4038.1mil,4497.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4038.1mil,4473.6mil) from Top Layer to Bottom Layer And Via (4062.1mil,4473.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.184mil < 10mil) Between Via (4038.1mil,4497.6mil) from Top Layer to Bottom Layer And Via (4038.1mil,4521.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.184mil] / [Bottom Solder] Mask Sliver [1.184mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4038.1mil,4497.6mil) from Top Layer to Bottom Layer And Via (4062.1mil,4497.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4038.1mil,4521.5mil) from Top Layer to Bottom Layer And Via (4038.1mil,4545.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4038.1mil,4521.5mil) from Top Layer to Bottom Layer And Via (4062.1mil,4521.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.686mil < 10mil) Between Via (4038.1mil,4545.5mil) from Top Layer to Bottom Layer And Via (4038.4mil,4568.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.686mil] / [Bottom Solder] Mask Sliver [0.686mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4038.1mil,4545.5mil) from Top Layer to Bottom Layer And Via (4062.1mil,4545.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4038.4mil,4568.9mil) from Top Layer to Bottom Layer And Via (4038.4mil,4592.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4038.4mil,4568.9mil) from Top Layer to Bottom Layer And Via (4062.4mil,4568.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.484mil < 10mil) Between Via (4038.4mil,4592.9mil) from Top Layer to Bottom Layer And Via (4038.4mil,4616.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.484mil] / [Bottom Solder] Mask Sliver [0.484mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4038.4mil,4592.9mil) from Top Layer to Bottom Layer And Via (4062.4mil,4592.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4038.4mil,4616.1mil) from Top Layer to Bottom Layer And Via (4038.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4038.4mil,4616.1mil) from Top Layer to Bottom Layer And Via (4062.4mil,4616.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4038.4mil,4640.1mil) from Top Layer to Bottom Layer And Via (4062.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4038.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (4038.7mil,4686.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.963mil < 10mil) Between Via (4038.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (4062.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.963mil] / [Bottom Solder] Mask Sliver [9.963mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4038.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (4062.7mil,4662.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.389mil < 10mil) Between Via (4038.7mil,4686.6mil) from Top Layer to Bottom Layer And Via (4039.2mil,4710.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.389mil] / [Bottom Solder] Mask Sliver [1.389mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4038.7mil,4686.6mil) from Top Layer to Bottom Layer And Via (4062.7mil,4686.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4039.2mil,4710.7mil) from Top Layer to Bottom Layer And Via (4039.2mil,4734.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4039.2mil,4710.7mil) from Top Layer to Bottom Layer And Via (4063.2mil,4710.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.152mil < 10mil) Between Via (4039.2mil,4734.7mil) from Top Layer to Bottom Layer And Via (4048.6mil,4758.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.152mil] / [Bottom Solder] Mask Sliver [3.152mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4039.2mil,4734.7mil) from Top Layer to Bottom Layer And Via (4063.2mil,4734.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4041.1mil,4295.6mil) from Top Layer to Bottom Layer And Via (4065.1mil,4295.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4041.3mil,4073.9mil) from Top Layer to Bottom Layer And Via (4041.3mil,4097.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4041.3mil,4073.9mil) from Top Layer to Bottom Layer And Via (4065.3mil,4073.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4041.3mil,4097.9mil) from Top Layer to Bottom Layer And Via (4065.3mil,4097.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4041.6mil,4221.4mil) from Top Layer to Bottom Layer And Via (4041.6mil,4245.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4041.6mil,4221.4mil) from Top Layer to Bottom Layer And Via (4065.6mil,4221.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4041.6mil,4245.4mil) from Top Layer to Bottom Layer And Via (4065.6mil,4245.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.461mil < 10mil) Between Via (4048.6mil,4758.8mil) from Top Layer to Bottom Layer And Via (4063.2mil,4734.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.461mil] / [Bottom Solder] Mask Sliver [5.461mil]
Minimum Solder Mask Sliver Constraint: (1.887mil < 10mil) Between Via (4048.6mil,4758.8mil) from Top Layer to Bottom Layer And Via (4073.2mil,4758.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.887mil] / [Bottom Solder] Mask Sliver [1.887mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4061.7mil,4425mil) from Top Layer to Bottom Layer And Via (4061.7mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4061.7mil,4425mil) from Top Layer to Bottom Layer And Via (4085.7mil,4425mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.887mil < 10mil) Between Via (4061.7mil,4449mil) from Top Layer to Bottom Layer And Via (4062.1mil,4473.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.887mil] / [Bottom Solder] Mask Sliver [1.887mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4061.7mil,4449mil) from Top Layer to Bottom Layer And Via (4085.7mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4062.1mil,4473.6mil) from Top Layer to Bottom Layer And Via (4062.1mil,4497.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4062.1mil,4473.6mil) from Top Layer to Bottom Layer And Via (4086.1mil,4473.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.184mil < 10mil) Between Via (4062.1mil,4497.6mil) from Top Layer to Bottom Layer And Via (4062.1mil,4521.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.184mil] / [Bottom Solder] Mask Sliver [1.184mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4062.1mil,4497.6mil) from Top Layer to Bottom Layer And Via (4086.1mil,4497.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4062.1mil,4521.5mil) from Top Layer to Bottom Layer And Via (4062.1mil,4545.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4062.1mil,4521.5mil) from Top Layer to Bottom Layer And Via (4086.1mil,4521.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.686mil < 10mil) Between Via (4062.1mil,4545.5mil) from Top Layer to Bottom Layer And Via (4062.4mil,4568.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.686mil] / [Bottom Solder] Mask Sliver [0.686mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4062.1mil,4545.5mil) from Top Layer to Bottom Layer And Via (4086.1mil,4545.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4062.4mil,4568.9mil) from Top Layer to Bottom Layer And Via (4062.4mil,4592.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4062.4mil,4568.9mil) from Top Layer to Bottom Layer And Via (4086.4mil,4568.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.484mil < 10mil) Between Via (4062.4mil,4592.9mil) from Top Layer to Bottom Layer And Via (4062.4mil,4616.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.484mil] / [Bottom Solder] Mask Sliver [0.484mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4062.4mil,4592.9mil) from Top Layer to Bottom Layer And Via (4086.4mil,4592.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4062.4mil,4616.1mil) from Top Layer to Bottom Layer And Via (4062.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4062.4mil,4616.1mil) from Top Layer to Bottom Layer And Via (4086.4mil,4616.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4062.4mil,4640.1mil) from Top Layer to Bottom Layer And Via (4086.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4062.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (4062.7mil,4686.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.963mil < 10mil) Between Via (4062.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (4086.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.963mil] / [Bottom Solder] Mask Sliver [9.963mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4062.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (4086.7mil,4662.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.389mil < 10mil) Between Via (4062.7mil,4686.6mil) from Top Layer to Bottom Layer And Via (4063.2mil,4710.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.389mil] / [Bottom Solder] Mask Sliver [1.389mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4062.7mil,4686.6mil) from Top Layer to Bottom Layer And Via (4086.7mil,4686.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4063.2mil,4710.7mil) from Top Layer to Bottom Layer And Via (4063.2mil,4734.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4063.2mil,4710.7mil) from Top Layer to Bottom Layer And Via (4087.2mil,4710.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.007mil < 10mil) Between Via (4063.2mil,4734.7mil) from Top Layer to Bottom Layer And Via (4073.2mil,4758.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.007mil] / [Bottom Solder] Mask Sliver [3.007mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4063.2mil,4734.7mil) from Top Layer to Bottom Layer And Via (4087.2mil,4734.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4065.1mil,4295.6mil) from Top Layer to Bottom Layer And Via (4089.1mil,4295.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4065.3mil,4073.9mil) from Top Layer to Bottom Layer And Via (4065.3mil,4097.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4065.3mil,4073.9mil) from Top Layer to Bottom Layer And Via (4089.3mil,4073.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4065.3mil,4097.9mil) from Top Layer to Bottom Layer And Via (4089.3mil,4097.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4065.6mil,4221.4mil) from Top Layer to Bottom Layer And Via (4065.6mil,4245.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4065.6mil,4221.4mil) from Top Layer to Bottom Layer And Via (4089.6mil,4221.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4065.6mil,4245.4mil) from Top Layer to Bottom Layer And Via (4089.6mil,4245.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.81mil < 10mil) Between Via (4073.2mil,4758.4mil) from Top Layer to Bottom Layer And Via (4087.2mil,4734.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.81mil] / [Bottom Solder] Mask Sliver [4.81mil]
Minimum Solder Mask Sliver Constraint: (3.184mil < 10mil) Between Via (4073.2mil,4758.4mil) from Top Layer to Bottom Layer And Via (4099.1mil,4758.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.184mil] / [Bottom Solder] Mask Sliver [3.184mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4085.7mil,4425mil) from Top Layer to Bottom Layer And Via (4085.7mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.887mil < 10mil) Between Via (4085.7mil,4449mil) from Top Layer to Bottom Layer And Via (4086.1mil,4473.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.887mil] / [Bottom Solder] Mask Sliver [1.887mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4086.1mil,4473.6mil) from Top Layer to Bottom Layer And Via (4086.1mil,4497.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.184mil < 10mil) Between Via (4086.1mil,4497.6mil) from Top Layer to Bottom Layer And Via (4086.1mil,4521.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.184mil] / [Bottom Solder] Mask Sliver [1.184mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4086.1mil,4521.5mil) from Top Layer to Bottom Layer And Via (4086.1mil,4545.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.686mil < 10mil) Between Via (4086.1mil,4545.5mil) from Top Layer to Bottom Layer And Via (4086.4mil,4568.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.686mil] / [Bottom Solder] Mask Sliver [0.686mil]
Minimum Solder Mask Sliver Constraint: (2.563mil < 10mil) Between Via (4086.1mil,4545.5mil) from Top Layer to Bottom Layer And Via (4111.3mil,4543.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.563mil] / [Bottom Solder] Mask Sliver [2.563mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4086.4mil,4568.9mil) from Top Layer to Bottom Layer And Via (4086.4mil,4592.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.986mil < 10mil) Between Via (4086.4mil,4568.9mil) from Top Layer to Bottom Layer And Via (4110.1mil,4569.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.986mil] / [Bottom Solder] Mask Sliver [0.986mil]
Minimum Solder Mask Sliver Constraint: (0.484mil < 10mil) Between Via (4086.4mil,4592.9mil) from Top Layer to Bottom Layer And Via (4086.4mil,4616.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.484mil] / [Bottom Solder] Mask Sliver [0.484mil]
Minimum Solder Mask Sliver Constraint: (0.784mil < 10mil) Between Via (4086.4mil,4592.9mil) from Top Layer to Bottom Layer And Via (4109.9mil,4593.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.784mil] / [Bottom Solder] Mask Sliver [0.784mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4086.4mil,4616.1mil) from Top Layer to Bottom Layer And Via (4086.4mil,4640.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.591mil < 10mil) Between Via (4086.4mil,4616.1mil) from Top Layer to Bottom Layer And Via (4110.7mil,4616.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.591mil] / [Bottom Solder] Mask Sliver [1.591mil]
Minimum Solder Mask Sliver Constraint: (1.591mil < 10mil) Between Via (4086.4mil,4640.1mil) from Top Layer to Bottom Layer And Via (4110.7mil,4640.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.591mil] / [Bottom Solder] Mask Sliver [1.591mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4086.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (4086.7mil,4686.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.774mil < 10mil) Between Via (4086.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (4110.7mil,4640.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.774mil] / [Bottom Solder] Mask Sliver [9.774mil]
Minimum Solder Mask Sliver Constraint: (1.375mil < 10mil) Between Via (4086.7mil,4662.6mil) from Top Layer to Bottom Layer And Via (4110.7mil,4664.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.375mil] / [Bottom Solder] Mask Sliver [1.375mil]
Minimum Solder Mask Sliver Constraint: (1.389mil < 10mil) Between Via (4086.7mil,4686.6mil) from Top Layer to Bottom Layer And Via (4087.2mil,4710.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.389mil] / [Bottom Solder] Mask Sliver [1.389mil]
Minimum Solder Mask Sliver Constraint: (9.774mil < 10mil) Between Via (4086.7mil,4686.6mil) from Top Layer to Bottom Layer And Via (4110.7mil,4664.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.774mil] / [Bottom Solder] Mask Sliver [9.774mil]
Minimum Solder Mask Sliver Constraint: (1.375mil < 10mil) Between Via (4086.7mil,4686.6mil) from Top Layer to Bottom Layer And Via (4110.7mil,4688.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.375mil] / [Bottom Solder] Mask Sliver [1.375mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4087.2mil,4710.7mil) from Top Layer to Bottom Layer And Via (4087.2mil,4734.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.474mil < 10mil) Between Via (4087.2mil,4710.7mil) from Top Layer to Bottom Layer And Via (4110.7mil,4688.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.474mil] / [Bottom Solder] Mask Sliver [9.474mil]
Minimum Solder Mask Sliver Constraint: (0.868mil < 10mil) Between Via (4087.2mil,4710.7mil) from Top Layer to Bottom Layer And Via (4110.7mil,4712.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.869mil] / [Bottom Solder] Mask Sliver [0.869mil]
Minimum Solder Mask Sliver Constraint: (3.982mil < 10mil) Between Via (4087.2mil,4734.7mil) from Top Layer to Bottom Layer And Via (4099.1mil,4758.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.982mil] / [Bottom Solder] Mask Sliver [3.982mil]
Minimum Solder Mask Sliver Constraint: (9.474mil < 10mil) Between Via (4087.2mil,4734.7mil) from Top Layer to Bottom Layer And Via (4110.7mil,4712.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.474mil] / [Bottom Solder] Mask Sliver [9.474mil]
Minimum Solder Mask Sliver Constraint: (0.868mil < 10mil) Between Via (4087.2mil,4734.7mil) from Top Layer to Bottom Layer And Via (4110.7mil,4736.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.869mil] / [Bottom Solder] Mask Sliver [0.869mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4089.3mil,4073.9mil) from Top Layer to Bottom Layer And Via (4089.3mil,4097.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4089.6mil,4221.4mil) from Top Layer to Bottom Layer And Via (4089.6mil,4245.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.066mil < 10mil) Between Via (4099.1mil,4758.6mil) from Top Layer to Bottom Layer And Via (4110.7mil,4736.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.066mil] / [Bottom Solder] Mask Sliver [2.066mil]
Minimum Solder Mask Sliver Constraint: (1.184mil < 10mil) Between Via (4109.9mil,4593.1mil) from Top Layer to Bottom Layer And Via (4110.1mil,4569.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.184mil] / [Bottom Solder] Mask Sliver [1.184mil]
Minimum Solder Mask Sliver Constraint: (0.897mil < 10mil) Between Via (4109.9mil,4593.1mil) from Top Layer to Bottom Layer And Via (4110.7mil,4616.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.897mil] / [Bottom Solder] Mask Sliver [0.897mil]
Minimum Solder Mask Sliver Constraint: (3.784mil < 10mil) Between Via (4109.9mil,4593.1mil) from Top Layer to Bottom Layer And Via (4136.4mil,4593.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.784mil] / [Bottom Solder] Mask Sliver [3.784mil]
Minimum Solder Mask Sliver Constraint: (3.012mil < 10mil) Between Via (4110.1mil,4569.2mil) from Top Layer to Bottom Layer And Via (4111.3mil,4543.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.012mil] / [Bottom Solder] Mask Sliver [3.012mil]
Minimum Solder Mask Sliver Constraint: (3.884mil < 10mil) Between Via (4110.1mil,4569.2mil) from Top Layer to Bottom Layer And Via (4136.7mil,4569mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.884mil] / [Bottom Solder] Mask Sliver [3.884mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4110.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (4110.7mil,4640.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4110.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (4134.7mil,4616.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4110.7mil,4640.7mil) from Top Layer to Bottom Layer And Via (4110.7mil,4664.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4110.7mil,4640.7mil) from Top Layer to Bottom Layer And Via (4134.7mil,4640.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4110.7mil,4664.7mil) from Top Layer to Bottom Layer And Via (4110.7mil,4688.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4110.7mil,4664.7mil) from Top Layer to Bottom Layer And Via (4134.7mil,4664.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4110.7mil,4688.7mil) from Top Layer to Bottom Layer And Via (4110.7mil,4712.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4110.7mil,4688.7mil) from Top Layer to Bottom Layer And Via (4134.7mil,4688.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4110.7mil,4712.7mil) from Top Layer to Bottom Layer And Via (4110.7mil,4736.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4110.7mil,4712.7mil) from Top Layer to Bottom Layer And Via (4134.7mil,4712.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4110.7mil,4736.7mil) from Top Layer to Bottom Layer And Via (4134.7mil,4736.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.408mil < 10mil) Between Via (4133.4mil,4413mil) from Top Layer to Bottom Layer And Via (4135.8mil,4436mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.408mil] / [Bottom Solder] Mask Sliver [0.408mil]
Minimum Solder Mask Sliver Constraint: (1.337mil < 10mil) Between Via (4133.4mil,4413mil) from Top Layer to Bottom Layer And Via (4135mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.337mil] / [Bottom Solder] Mask Sliver [1.337mil]
Minimum Solder Mask Sliver Constraint: (2.797mil < 10mil) Between Via (4133.4mil,4413mil) from Top Layer to Bottom Layer And Via (4158.8mil,4415.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.797mil] / [Bottom Solder] Mask Sliver [2.797mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4134.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (4134.7mil,4640.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.945mil < 10mil) Between Via (4134.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (4136.4mil,4593.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.945mil] / [Bottom Solder] Mask Sliver [0.945mil]
Minimum Solder Mask Sliver Constraint: (2.289mil < 10mil) Between Via (4134.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (4159.7mil,4617.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.289mil] / [Bottom Solder] Mask Sliver [2.289mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4134.7mil,4640.7mil) from Top Layer to Bottom Layer And Via (4134.7mil,4664.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.289mil < 10mil) Between Via (4134.7mil,4640.7mil) from Top Layer to Bottom Layer And Via (4159.7mil,4641.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.289mil] / [Bottom Solder] Mask Sliver [2.289mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4134.7mil,4664.7mil) from Top Layer to Bottom Layer And Via (4134.7mil,4688.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.289mil < 10mil) Between Via (4134.7mil,4664.7mil) from Top Layer to Bottom Layer And Via (4159.7mil,4665.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.289mil] / [Bottom Solder] Mask Sliver [2.289mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4134.7mil,4688.7mil) from Top Layer to Bottom Layer And Via (4134.7mil,4712.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.289mil < 10mil) Between Via (4134.7mil,4688.7mil) from Top Layer to Bottom Layer And Via (4159.7mil,4689.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.289mil] / [Bottom Solder] Mask Sliver [2.289mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4134.7mil,4712.7mil) from Top Layer to Bottom Layer And Via (4134.7mil,4736.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.289mil < 10mil) Between Via (4134.7mil,4712.7mil) from Top Layer to Bottom Layer And Via (4159.7mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.289mil] / [Bottom Solder] Mask Sliver [2.289mil]
Minimum Solder Mask Sliver Constraint: (2.193mil < 10mil) Between Via (4134.7mil,4736.7mil) from Top Layer to Bottom Layer And Via (4135.4mil,4761.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.193mil] / [Bottom Solder] Mask Sliver [2.193mil]
Minimum Solder Mask Sliver Constraint: (2.289mil < 10mil) Between Via (4134.7mil,4736.7mil) from Top Layer to Bottom Layer And Via (4159.7mil,4737.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.289mil] / [Bottom Solder] Mask Sliver [2.289mil]
Minimum Solder Mask Sliver Constraint: (1.784mil < 10mil) Between Via (4135.4mil,4761.6mil) from Top Layer to Bottom Layer And Via (4159.9mil,4761.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.784mil] / [Bottom Solder] Mask Sliver [1.784mil]
Minimum Solder Mask Sliver Constraint: (2.785mil < 10mil) Between Via (4135.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4135.8mil,4460mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.785mil] / [Bottom Solder] Mask Sliver [2.785mil]
Minimum Solder Mask Sliver Constraint: (3.237mil < 10mil) Between Via (4135.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4146.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.237mil] / [Bottom Solder] Mask Sliver [3.237mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4159.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135.8mil,4436mil) from Top Layer to Bottom Layer And Via (4135.8mil,4460mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.16mil < 10mil) Between Via (4135.8mil,4436mil) from Top Layer to Bottom Layer And Via (4158.8mil,4415.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.16mil] / [Bottom Solder] Mask Sliver [8.16mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135.8mil,4436mil) from Top Layer to Bottom Layer And Via (4159.8mil,4436mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135.8mil,4460mil) from Top Layer to Bottom Layer And Via (4159.8mil,4460mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4077mil) from Top Layer to Bottom Layer And Via (4135mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4077mil) from Top Layer to Bottom Layer And Via (4159mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4101mil) from Top Layer to Bottom Layer And Via (4135mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4101mil) from Top Layer to Bottom Layer And Via (4159mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4125mil) from Top Layer to Bottom Layer And Via (4135mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4125mil) from Top Layer to Bottom Layer And Via (4159mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4149mil) from Top Layer to Bottom Layer And Via (4135mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4149mil) from Top Layer to Bottom Layer And Via (4159mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4173mil) from Top Layer to Bottom Layer And Via (4135mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4173mil) from Top Layer to Bottom Layer And Via (4159mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4197mil) from Top Layer to Bottom Layer And Via (4135mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4197mil) from Top Layer to Bottom Layer And Via (4159mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4221mil) from Top Layer to Bottom Layer And Via (4135mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4221mil) from Top Layer to Bottom Layer And Via (4159mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4245mil) from Top Layer to Bottom Layer And Via (4135mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4245mil) from Top Layer to Bottom Layer And Via (4159mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4269mil) from Top Layer to Bottom Layer And Via (4135mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4269mil) from Top Layer to Bottom Layer And Via (4159mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4293mil) from Top Layer to Bottom Layer And Via (4135mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4293mil) from Top Layer to Bottom Layer And Via (4159mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4317mil) from Top Layer to Bottom Layer And Via (4135mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4317mil) from Top Layer to Bottom Layer And Via (4159mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4341mil) from Top Layer to Bottom Layer And Via (4135mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4341mil) from Top Layer to Bottom Layer And Via (4159mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4365mil) from Top Layer to Bottom Layer And Via (4135mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4365mil) from Top Layer to Bottom Layer And Via (4159mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4135mil,4389mil) from Top Layer to Bottom Layer And Via (4159mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.385mil < 10mil) Between Via (4136.4mil,4593.1mil) from Top Layer to Bottom Layer And Via (4136.7mil,4569mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.385mil] / [Bottom Solder] Mask Sliver [1.385mil]
Minimum Solder Mask Sliver Constraint: (1.384mil < 10mil) Between Via (4136.4mil,4593.1mil) from Top Layer to Bottom Layer And Via (4160.5mil,4592.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.384mil] / [Bottom Solder] Mask Sliver [1.384mil]
Minimum Solder Mask Sliver Constraint: (4.324mil < 10mil) Between Via (4146.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4159.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.324mil] / [Bottom Solder] Mask Sliver [4.324mil]
Minimum Solder Mask Sliver Constraint: (3.557mil < 10mil) Between Via (4146.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4161.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.556mil] / [Bottom Solder] Mask Sliver [3.556mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4146.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4170.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.938mil < 10mil) Between Via (4155.5mil,4983.1mil) from Top Layer to Bottom Layer And Via (4179.6mil,4967.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.938mil] / [Bottom Solder] Mask Sliver [5.938mil]
Minimum Solder Mask Sliver Constraint: (3.684mil < 10mil) Between Via (4158.8mil,4415.4mil) from Top Layer to Bottom Layer And Via (4159mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.684mil] / [Bottom Solder] Mask Sliver [3.684mil]
Minimum Solder Mask Sliver Constraint: (1.602mil < 10mil) Between Via (4158.8mil,4415.4mil) from Top Layer to Bottom Layer And Via (4183mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.602mil] / [Bottom Solder] Mask Sliver [1.602mil]
Minimum Solder Mask Sliver Constraint: (9.721mil < 10mil) Between Via (4158.8mil,4415.4mil) from Top Layer to Bottom Layer And Via (4183mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.721mil] / [Bottom Solder] Mask Sliver [9.721mil]
Minimum Solder Mask Sliver Constraint: (2.785mil < 10mil) Between Via (4159.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4159.8mil,4460mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.785mil] / [Bottom Solder] Mask Sliver [2.785mil]
Minimum Solder Mask Sliver Constraint: (3.237mil < 10mil) Between Via (4159.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4170.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.237mil] / [Bottom Solder] Mask Sliver [3.237mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4183.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159.7mil,4617.2mil) from Top Layer to Bottom Layer And Via (4159.7mil,4641.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.597mil < 10mil) Between Via (4159.7mil,4617.2mil) from Top Layer to Bottom Layer And Via (4160.5mil,4592.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.597mil] / [Bottom Solder] Mask Sliver [1.597mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159.7mil,4617.2mil) from Top Layer to Bottom Layer And Via (4183.7mil,4617.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159.7mil,4641.2mil) from Top Layer to Bottom Layer And Via (4159.7mil,4665.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159.7mil,4641.2mil) from Top Layer to Bottom Layer And Via (4183.7mil,4641.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159.7mil,4665.2mil) from Top Layer to Bottom Layer And Via (4159.7mil,4689.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159.7mil,4665.2mil) from Top Layer to Bottom Layer And Via (4183.7mil,4665.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159.7mil,4689.2mil) from Top Layer to Bottom Layer And Via (4159.7mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159.7mil,4689.2mil) from Top Layer to Bottom Layer And Via (4183.7mil,4689.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159.7mil,4713.2mil) from Top Layer to Bottom Layer And Via (4159.7mil,4737.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159.7mil,4713.2mil) from Top Layer to Bottom Layer And Via (4183.7mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.685mil < 10mil) Between Via (4159.7mil,4737.2mil) from Top Layer to Bottom Layer And Via (4159.9mil,4761.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.684mil] / [Bottom Solder] Mask Sliver [1.684mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159.7mil,4737.2mil) from Top Layer to Bottom Layer And Via (4183.7mil,4737.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159.8mil,4436mil) from Top Layer to Bottom Layer And Via (4159.8mil,4460mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.952mil < 10mil) Between Via (4159.8mil,4436mil) from Top Layer to Bottom Layer And Via (4183mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.952mil] / [Bottom Solder] Mask Sliver [9.952mil]
Minimum Solder Mask Sliver Constraint: (0.505mil < 10mil) Between Via (4159.8mil,4436mil) from Top Layer to Bottom Layer And Via (4183mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.505mil] / [Bottom Solder] Mask Sliver [0.505mil]
Minimum Solder Mask Sliver Constraint: (9.952mil < 10mil) Between Via (4159.8mil,4460mil) from Top Layer to Bottom Layer And Via (4183mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.952mil] / [Bottom Solder] Mask Sliver [9.952mil]
Minimum Solder Mask Sliver Constraint: (0.505mil < 10mil) Between Via (4159.8mil,4460mil) from Top Layer to Bottom Layer And Via (4183mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.505mil] / [Bottom Solder] Mask Sliver [0.505mil]
Minimum Solder Mask Sliver Constraint: (3.191mil < 10mil) Between Via (4159.9mil,4761.6mil) from Top Layer to Bottom Layer And Via (4160.5mil,4787.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.191mil] / [Bottom Solder] Mask Sliver [3.191mil]
Minimum Solder Mask Sliver Constraint: (1.885mil < 10mil) Between Via (4159.9mil,4761.6mil) from Top Layer to Bottom Layer And Via (4184.5mil,4761.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.884mil] / [Bottom Solder] Mask Sliver [1.884mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4077mil) from Top Layer to Bottom Layer And Via (4159mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4077mil) from Top Layer to Bottom Layer And Via (4183mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4101mil) from Top Layer to Bottom Layer And Via (4159mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4101mil) from Top Layer to Bottom Layer And Via (4183mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4125mil) from Top Layer to Bottom Layer And Via (4159mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4125mil) from Top Layer to Bottom Layer And Via (4183mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4149mil) from Top Layer to Bottom Layer And Via (4159mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4149mil) from Top Layer to Bottom Layer And Via (4183mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4173mil) from Top Layer to Bottom Layer And Via (4159mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4173mil) from Top Layer to Bottom Layer And Via (4183mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4197mil) from Top Layer to Bottom Layer And Via (4159mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4197mil) from Top Layer to Bottom Layer And Via (4183mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4221mil) from Top Layer to Bottom Layer And Via (4159mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4221mil) from Top Layer to Bottom Layer And Via (4183mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4245mil) from Top Layer to Bottom Layer And Via (4159mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4245mil) from Top Layer to Bottom Layer And Via (4183mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4269mil) from Top Layer to Bottom Layer And Via (4159mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4269mil) from Top Layer to Bottom Layer And Via (4183mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4293mil) from Top Layer to Bottom Layer And Via (4159mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4293mil) from Top Layer to Bottom Layer And Via (4183mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4317mil) from Top Layer to Bottom Layer And Via (4159mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4317mil) from Top Layer to Bottom Layer And Via (4183mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4341mil) from Top Layer to Bottom Layer And Via (4159mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4341mil) from Top Layer to Bottom Layer And Via (4183mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4365mil) from Top Layer to Bottom Layer And Via (4159mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4365mil) from Top Layer to Bottom Layer And Via (4183mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4159mil,4389mil) from Top Layer to Bottom Layer And Via (4183mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.908mil < 10mil) Between Via (4160.5mil,4787.5mil) from Top Layer to Bottom Layer And Via (4185.1mil,4786.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.908mil] / [Bottom Solder] Mask Sliver [1.908mil]
Minimum Solder Mask Sliver Constraint: (0.553mil < 10mil) Between Via (4161.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4170.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.553mil] / [Bottom Solder] Mask Sliver [0.553mil]
Minimum Solder Mask Sliver Constraint: (9.47mil < 10mil) Between Via (4161.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4183.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.47mil] / [Bottom Solder] Mask Sliver [9.47mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4161.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4185.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.324mil < 10mil) Between Via (4170.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4183.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.324mil] / [Bottom Solder] Mask Sliver [4.324mil]
Minimum Solder Mask Sliver Constraint: (3.557mil < 10mil) Between Via (4170.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4185.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.556mil] / [Bottom Solder] Mask Sliver [3.556mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4170.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4194.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.789mil < 10mil) Between Via (4183.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4183mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.789mil] / [Bottom Solder] Mask Sliver [1.789mil]
Minimum Solder Mask Sliver Constraint: (3.237mil < 10mil) Between Via (4183.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4194.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.237mil] / [Bottom Solder] Mask Sliver [3.237mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4207.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.761mil < 10mil) Between Via (4183.5mil,4554mil) from Top Layer to Bottom Layer And Via (4185.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.761mil] / [Bottom Solder] Mask Sliver [0.761mil]
Minimum Solder Mask Sliver Constraint: (4.693mil < 10mil) Between Via (4183.5mil,4554mil) from Top Layer to Bottom Layer And Via (4201.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.693mil] / [Bottom Solder] Mask Sliver [4.693mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183.5mil,4554mil) from Top Layer to Bottom Layer And Via (4207.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183.7mil,4617.2mil) from Top Layer to Bottom Layer And Via (4183.7mil,4641.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183.7mil,4641.2mil) from Top Layer to Bottom Layer And Via (4183.7mil,4665.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.007mil < 10mil) Between Via (4183.7mil,4641.2mil) from Top Layer to Bottom Layer And Via (4209.4mil,4642.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.007mil] / [Bottom Solder] Mask Sliver [3.007mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183.7mil,4665.2mil) from Top Layer to Bottom Layer And Via (4183.7mil,4689.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.724mil < 10mil) Between Via (4183.7mil,4665.2mil) from Top Layer to Bottom Layer And Via (4208.1mil,4666.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.724mil] / [Bottom Solder] Mask Sliver [1.724mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183.7mil,4689.2mil) from Top Layer to Bottom Layer And Via (4183.7mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.724mil < 10mil) Between Via (4183.7mil,4689.2mil) from Top Layer to Bottom Layer And Via (4208.1mil,4690.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.724mil] / [Bottom Solder] Mask Sliver [1.724mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183.7mil,4713.2mil) from Top Layer to Bottom Layer And Via (4183.7mil,4737.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.724mil < 10mil) Between Via (4183.7mil,4713.2mil) from Top Layer to Bottom Layer And Via (4208.1mil,4714.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.724mil] / [Bottom Solder] Mask Sliver [1.724mil]
Minimum Solder Mask Sliver Constraint: (1.897mil < 10mil) Between Via (4183.7mil,4737.2mil) from Top Layer to Bottom Layer And Via (4184.5mil,4761.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.897mil] / [Bottom Solder] Mask Sliver [1.897mil]
Minimum Solder Mask Sliver Constraint: (1.724mil < 10mil) Between Via (4183.7mil,4737.2mil) from Top Layer to Bottom Layer And Via (4208.1mil,4738.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.724mil] / [Bottom Solder] Mask Sliver [1.724mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4077mil) from Top Layer to Bottom Layer And Via (4183mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4077mil) from Top Layer to Bottom Layer And Via (4207mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4101mil) from Top Layer to Bottom Layer And Via (4183mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4101mil) from Top Layer to Bottom Layer And Via (4207mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4125mil) from Top Layer to Bottom Layer And Via (4183mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4125mil) from Top Layer to Bottom Layer And Via (4207mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4149mil) from Top Layer to Bottom Layer And Via (4183mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4149mil) from Top Layer to Bottom Layer And Via (4207mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4173mil) from Top Layer to Bottom Layer And Via (4183mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4173mil) from Top Layer to Bottom Layer And Via (4207mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4197mil) from Top Layer to Bottom Layer And Via (4183mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4197mil) from Top Layer to Bottom Layer And Via (4207mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4221mil) from Top Layer to Bottom Layer And Via (4183mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4221mil) from Top Layer to Bottom Layer And Via (4207mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4245mil) from Top Layer to Bottom Layer And Via (4183mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4245mil) from Top Layer to Bottom Layer And Via (4207mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4269mil) from Top Layer to Bottom Layer And Via (4183mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4269mil) from Top Layer to Bottom Layer And Via (4207mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4293mil) from Top Layer to Bottom Layer And Via (4183mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4293mil) from Top Layer to Bottom Layer And Via (4207mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4317mil) from Top Layer to Bottom Layer And Via (4183mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4317mil) from Top Layer to Bottom Layer And Via (4207mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4341mil) from Top Layer to Bottom Layer And Via (4183mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4341mil) from Top Layer to Bottom Layer And Via (4207mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4365mil) from Top Layer to Bottom Layer And Via (4183mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4365mil) from Top Layer to Bottom Layer And Via (4207mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4389mil) from Top Layer to Bottom Layer And Via (4183mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4389mil) from Top Layer to Bottom Layer And Via (4207mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4413mil) from Top Layer to Bottom Layer And Via (4183mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4413mil) from Top Layer to Bottom Layer And Via (4207mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4437mil) from Top Layer to Bottom Layer And Via (4183mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4437mil) from Top Layer to Bottom Layer And Via (4207mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4183mil,4461mil) from Top Layer to Bottom Layer And Via (4207mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.891mil < 10mil) Between Via (4184.5mil,4761.8mil) from Top Layer to Bottom Layer And Via (4185.1mil,4786.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.891mil] / [Bottom Solder] Mask Sliver [1.891mil]
Minimum Solder Mask Sliver Constraint: (0.897mil < 10mil) Between Via (4184.5mil,4761.8mil) from Top Layer to Bottom Layer And Via (4208.1mil,4762.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.897mil] / [Bottom Solder] Mask Sliver [0.897mil]
Minimum Solder Mask Sliver Constraint: (0.284mil < 10mil) Between Via (4185.1mil,4786.4mil) from Top Layer to Bottom Layer And Via (4208.1mil,4786.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.284mil] / [Bottom Solder] Mask Sliver [0.284mil]
Minimum Solder Mask Sliver Constraint: (0.553mil < 10mil) Between Via (4185.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4194.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.553mil] / [Bottom Solder] Mask Sliver [0.553mil]
Minimum Solder Mask Sliver Constraint: (9.47mil < 10mil) Between Via (4185.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4207.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.47mil] / [Bottom Solder] Mask Sliver [9.47mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4185.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4209.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.324mil < 10mil) Between Via (4194.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4207.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.324mil] / [Bottom Solder] Mask Sliver [4.324mil]
Minimum Solder Mask Sliver Constraint: (3.557mil < 10mil) Between Via (4194.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4209.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.556mil] / [Bottom Solder] Mask Sliver [3.556mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4194.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4218.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.422mil < 10mil) Between Via (4201.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4224.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.422mil] / [Bottom Solder] Mask Sliver [9.422mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4201.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4225.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.789mil < 10mil) Between Via (4207.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4207mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.789mil] / [Bottom Solder] Mask Sliver [1.789mil]
Minimum Solder Mask Sliver Constraint: (3.237mil < 10mil) Between Via (4207.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4218.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.237mil] / [Bottom Solder] Mask Sliver [3.237mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4231.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.761mil < 10mil) Between Via (4207.5mil,4554mil) from Top Layer to Bottom Layer And Via (4209.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.761mil] / [Bottom Solder] Mask Sliver [0.761mil]
Minimum Solder Mask Sliver Constraint: (4.693mil < 10mil) Between Via (4207.5mil,4554mil) from Top Layer to Bottom Layer And Via (4225.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.693mil] / [Bottom Solder] Mask Sliver [4.693mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207.5mil,4554mil) from Top Layer to Bottom Layer And Via (4231.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4077mil) from Top Layer to Bottom Layer And Via (4207mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4077mil) from Top Layer to Bottom Layer And Via (4231mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4101mil) from Top Layer to Bottom Layer And Via (4207mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4101mil) from Top Layer to Bottom Layer And Via (4231mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4125mil) from Top Layer to Bottom Layer And Via (4207mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4125mil) from Top Layer to Bottom Layer And Via (4231mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4149mil) from Top Layer to Bottom Layer And Via (4207mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4149mil) from Top Layer to Bottom Layer And Via (4231mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4173mil) from Top Layer to Bottom Layer And Via (4207mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4173mil) from Top Layer to Bottom Layer And Via (4231mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4197mil) from Top Layer to Bottom Layer And Via (4207mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4197mil) from Top Layer to Bottom Layer And Via (4231mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4221mil) from Top Layer to Bottom Layer And Via (4207mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4221mil) from Top Layer to Bottom Layer And Via (4231mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4245mil) from Top Layer to Bottom Layer And Via (4207mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4245mil) from Top Layer to Bottom Layer And Via (4231mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4269mil) from Top Layer to Bottom Layer And Via (4207mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4269mil) from Top Layer to Bottom Layer And Via (4231mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4293mil) from Top Layer to Bottom Layer And Via (4207mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4293mil) from Top Layer to Bottom Layer And Via (4231mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4317mil) from Top Layer to Bottom Layer And Via (4207mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4317mil) from Top Layer to Bottom Layer And Via (4231mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4341mil) from Top Layer to Bottom Layer And Via (4207mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4341mil) from Top Layer to Bottom Layer And Via (4231mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4365mil) from Top Layer to Bottom Layer And Via (4207mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4365mil) from Top Layer to Bottom Layer And Via (4231mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4389mil) from Top Layer to Bottom Layer And Via (4207mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4389mil) from Top Layer to Bottom Layer And Via (4231mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4413mil) from Top Layer to Bottom Layer And Via (4207mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4413mil) from Top Layer to Bottom Layer And Via (4231mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4437mil) from Top Layer to Bottom Layer And Via (4207mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4437mil) from Top Layer to Bottom Layer And Via (4231mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4207mil,4461mil) from Top Layer to Bottom Layer And Via (4231mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4208.1mil,4666.6mil) from Top Layer to Bottom Layer And Via (4208.1mil,4690.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.618mil < 10mil) Between Via (4208.1mil,4666.6mil) from Top Layer to Bottom Layer And Via (4209.4mil,4642.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.618mil] / [Bottom Solder] Mask Sliver [1.618mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4208.1mil,4666.6mil) from Top Layer to Bottom Layer And Via (4232.1mil,4666.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4208.1mil,4690.6mil) from Top Layer to Bottom Layer And Via (4208.1mil,4714.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4208.1mil,4690.6mil) from Top Layer to Bottom Layer And Via (4232.1mil,4690.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4208.1mil,4714.6mil) from Top Layer to Bottom Layer And Via (4208.1mil,4738.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4208.1mil,4714.6mil) from Top Layer to Bottom Layer And Via (4232.1mil,4714.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4208.1mil,4738.6mil) from Top Layer to Bottom Layer And Via (4208.1mil,4762.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4208.1mil,4738.6mil) from Top Layer to Bottom Layer And Via (4232.1mil,4738.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4208.1mil,4762.6mil) from Top Layer to Bottom Layer And Via (4208.1mil,4786.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4208.1mil,4762.6mil) from Top Layer to Bottom Layer And Via (4232.1mil,4762.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4208.1mil,4786.6mil) from Top Layer to Bottom Layer And Via (4232.1mil,4786.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.553mil < 10mil) Between Via (4209.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4218.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.553mil] / [Bottom Solder] Mask Sliver [0.553mil]
Minimum Solder Mask Sliver Constraint: (9.47mil < 10mil) Between Via (4209.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4231.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.47mil] / [Bottom Solder] Mask Sliver [9.47mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4209.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4233.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.324mil < 10mil) Between Via (4218.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4231.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.324mil] / [Bottom Solder] Mask Sliver [4.324mil]
Minimum Solder Mask Sliver Constraint: (3.557mil < 10mil) Between Via (4218.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4233.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.556mil] / [Bottom Solder] Mask Sliver [3.556mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4218.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4242.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.018mil < 10mil) Between Via (4224.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4225.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.018mil] / [Bottom Solder] Mask Sliver [0.018mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4224.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4248.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.422mil < 10mil) Between Via (4225.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4248.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.422mil] / [Bottom Solder] Mask Sliver [9.422mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4225.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4249.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.684mil < 10mil) Between Via (4230.6mil,4859.7mil) from Top Layer to Bottom Layer And Via (4230.7mil,4835.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.684mil] / [Bottom Solder] Mask Sliver [1.684mil]
Minimum Solder Mask Sliver Constraint: (2.108mil < 10mil) Between Via (4230.6mil,4859.7mil) from Top Layer to Bottom Layer And Via (4255.4mil,4858.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.108mil] / [Bottom Solder] Mask Sliver [2.108mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4230.7mil,4811.3mil) from Top Layer to Bottom Layer And Via (4230.7mil,4835.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.023mil < 10mil) Between Via (4230.7mil,4811.3mil) from Top Layer to Bottom Layer And Via (4232.1mil,4786.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.023mil] / [Bottom Solder] Mask Sliver [2.023mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4230.7mil,4811.3mil) from Top Layer to Bottom Layer And Via (4254.7mil,4811.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4230.7mil,4835.3mil) from Top Layer to Bottom Layer And Via (4254.7mil,4835.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.789mil < 10mil) Between Via (4231.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4231mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.789mil] / [Bottom Solder] Mask Sliver [1.789mil]
Minimum Solder Mask Sliver Constraint: (3.237mil < 10mil) Between Via (4231.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4242.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.237mil] / [Bottom Solder] Mask Sliver [3.237mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4255.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.761mil < 10mil) Between Via (4231.5mil,4554mil) from Top Layer to Bottom Layer And Via (4233.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.761mil] / [Bottom Solder] Mask Sliver [0.761mil]
Minimum Solder Mask Sliver Constraint: (4.693mil < 10mil) Between Via (4231.5mil,4554mil) from Top Layer to Bottom Layer And Via (4249.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.693mil] / [Bottom Solder] Mask Sliver [4.693mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231.5mil,4554mil) from Top Layer to Bottom Layer And Via (4255.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4077mil) from Top Layer to Bottom Layer And Via (4231mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4077mil) from Top Layer to Bottom Layer And Via (4255mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4101mil) from Top Layer to Bottom Layer And Via (4231mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4101mil) from Top Layer to Bottom Layer And Via (4255mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4125mil) from Top Layer to Bottom Layer And Via (4231mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4125mil) from Top Layer to Bottom Layer And Via (4255mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4149mil) from Top Layer to Bottom Layer And Via (4231mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4149mil) from Top Layer to Bottom Layer And Via (4255mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4173mil) from Top Layer to Bottom Layer And Via (4231mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4173mil) from Top Layer to Bottom Layer And Via (4255mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4197mil) from Top Layer to Bottom Layer And Via (4231mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4197mil) from Top Layer to Bottom Layer And Via (4255mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4221mil) from Top Layer to Bottom Layer And Via (4231mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4221mil) from Top Layer to Bottom Layer And Via (4255mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4245mil) from Top Layer to Bottom Layer And Via (4231mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4245mil) from Top Layer to Bottom Layer And Via (4255mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4269mil) from Top Layer to Bottom Layer And Via (4231mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4269mil) from Top Layer to Bottom Layer And Via (4255mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4293mil) from Top Layer to Bottom Layer And Via (4231mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4293mil) from Top Layer to Bottom Layer And Via (4255mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4317mil) from Top Layer to Bottom Layer And Via (4231mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4317mil) from Top Layer to Bottom Layer And Via (4255mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4341mil) from Top Layer to Bottom Layer And Via (4231mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4341mil) from Top Layer to Bottom Layer And Via (4255mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4365mil) from Top Layer to Bottom Layer And Via (4231mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4365mil) from Top Layer to Bottom Layer And Via (4255mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4389mil) from Top Layer to Bottom Layer And Via (4231mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4389mil) from Top Layer to Bottom Layer And Via (4255mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4413mil) from Top Layer to Bottom Layer And Via (4231mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4413mil) from Top Layer to Bottom Layer And Via (4255mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4437mil) from Top Layer to Bottom Layer And Via (4231mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4437mil) from Top Layer to Bottom Layer And Via (4255mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4231mil,4461mil) from Top Layer to Bottom Layer And Via (4255mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4232.1mil,4666.6mil) from Top Layer to Bottom Layer And Via (4232.1mil,4690.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.803mil < 10mil) Between Via (4232.1mil,4666.6mil) from Top Layer to Bottom Layer And Via (4257.6mil,4667.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.803mil] / [Bottom Solder] Mask Sliver [2.803mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4232.1mil,4690.6mil) from Top Layer to Bottom Layer And Via (4232.1mil,4714.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.803mil < 10mil) Between Via (4232.1mil,4690.6mil) from Top Layer to Bottom Layer And Via (4257.6mil,4691.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.803mil] / [Bottom Solder] Mask Sliver [2.803mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4232.1mil,4714.6mil) from Top Layer to Bottom Layer And Via (4232.1mil,4738.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.803mil < 10mil) Between Via (4232.1mil,4714.6mil) from Top Layer to Bottom Layer And Via (4257.6mil,4715.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.803mil] / [Bottom Solder] Mask Sliver [2.803mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4232.1mil,4738.6mil) from Top Layer to Bottom Layer And Via (4232.1mil,4762.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.803mil < 10mil) Between Via (4232.1mil,4738.6mil) from Top Layer to Bottom Layer And Via (4257.6mil,4739.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.803mil] / [Bottom Solder] Mask Sliver [2.803mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4232.1mil,4762.6mil) from Top Layer to Bottom Layer And Via (4232.1mil,4786.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.803mil < 10mil) Between Via (4232.1mil,4762.6mil) from Top Layer to Bottom Layer And Via (4257.6mil,4763.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.803mil] / [Bottom Solder] Mask Sliver [2.803mil]
Minimum Solder Mask Sliver Constraint: (2.803mil < 10mil) Between Via (4232.1mil,4786.6mil) from Top Layer to Bottom Layer And Via (4257.6mil,4787.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.803mil] / [Bottom Solder] Mask Sliver [2.803mil]
Minimum Solder Mask Sliver Constraint: (0.553mil < 10mil) Between Via (4233.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4242.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.553mil] / [Bottom Solder] Mask Sliver [0.553mil]
Minimum Solder Mask Sliver Constraint: (9.47mil < 10mil) Between Via (4233.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4255.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.47mil] / [Bottom Solder] Mask Sliver [9.47mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4233.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4257.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.324mil < 10mil) Between Via (4242.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4255.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.324mil] / [Bottom Solder] Mask Sliver [4.324mil]
Minimum Solder Mask Sliver Constraint: (3.557mil < 10mil) Between Via (4242.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4257.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.556mil] / [Bottom Solder] Mask Sliver [3.556mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4242.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4266.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.018mil < 10mil) Between Via (4248.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4249.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.018mil] / [Bottom Solder] Mask Sliver [0.018mil]
Minimum Solder Mask Sliver Constraint: (0.826mil < 10mil) Between Via (4248.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4252.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.826mil] / [Bottom Solder] Mask Sliver [0.826mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4248.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4272.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.422mil < 10mil) Between Via (4249.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4272.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.422mil] / [Bottom Solder] Mask Sliver [9.422mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4249.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4273.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.914mil < 10mil) Between Via (4252.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4272.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.914mil] / [Bottom Solder] Mask Sliver [7.914mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4252.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4276.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4254.3mil,4976.3mil) from Top Layer to Bottom Layer And Via (4254.3mil,5000.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4254.3mil,4976.3mil) from Top Layer to Bottom Layer And Via (4278.3mil,4976.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4254.3mil,5000.3mil) from Top Layer to Bottom Layer And Via (4278.3mil,5000.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4254.7mil,4811.3mil) from Top Layer to Bottom Layer And Via (4254.7mil,4835.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.16mil < 10mil) Between Via (4254.7mil,4811.3mil) from Top Layer to Bottom Layer And Via (4257.6mil,4787.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.16mil] / [Bottom Solder] Mask Sliver [1.16mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4254.7mil,4811.3mil) from Top Layer to Bottom Layer And Via (4278.7mil,4811.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.594mil < 10mil) Between Via (4254.7mil,4835.3mil) from Top Layer to Bottom Layer And Via (4255.4mil,4858.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.594mil] / [Bottom Solder] Mask Sliver [0.594mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4254.7mil,4835.3mil) from Top Layer to Bottom Layer And Via (4278.7mil,4835.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255.4mil,4858.6mil) from Top Layer to Bottom Layer And Via (4255.4mil,4882.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255.4mil,4858.6mil) from Top Layer to Bottom Layer And Via (4279.4mil,4858.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255.4mil,4882.6mil) from Top Layer to Bottom Layer And Via (4279.4mil,4882.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.789mil < 10mil) Between Via (4255.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4255mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.789mil] / [Bottom Solder] Mask Sliver [1.789mil]
Minimum Solder Mask Sliver Constraint: (3.237mil < 10mil) Between Via (4255.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4266.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.237mil] / [Bottom Solder] Mask Sliver [3.237mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4279.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.761mil < 10mil) Between Via (4255.5mil,4554mil) from Top Layer to Bottom Layer And Via (4257.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.761mil] / [Bottom Solder] Mask Sliver [0.761mil]
Minimum Solder Mask Sliver Constraint: (4.693mil < 10mil) Between Via (4255.5mil,4554mil) from Top Layer to Bottom Layer And Via (4273.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.693mil] / [Bottom Solder] Mask Sliver [4.693mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255.5mil,4554mil) from Top Layer to Bottom Layer And Via (4279.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4077mil) from Top Layer to Bottom Layer And Via (4255mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4077mil) from Top Layer to Bottom Layer And Via (4279mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4101mil) from Top Layer to Bottom Layer And Via (4255mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4101mil) from Top Layer to Bottom Layer And Via (4279mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4125mil) from Top Layer to Bottom Layer And Via (4255mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4125mil) from Top Layer to Bottom Layer And Via (4279mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4149mil) from Top Layer to Bottom Layer And Via (4255mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4149mil) from Top Layer to Bottom Layer And Via (4279mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4173mil) from Top Layer to Bottom Layer And Via (4255mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4173mil) from Top Layer to Bottom Layer And Via (4279mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4197mil) from Top Layer to Bottom Layer And Via (4255mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4197mil) from Top Layer to Bottom Layer And Via (4279mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4221mil) from Top Layer to Bottom Layer And Via (4255mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4221mil) from Top Layer to Bottom Layer And Via (4279mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4245mil) from Top Layer to Bottom Layer And Via (4255mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4245mil) from Top Layer to Bottom Layer And Via (4279mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4269mil) from Top Layer to Bottom Layer And Via (4255mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4269mil) from Top Layer to Bottom Layer And Via (4279mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4293mil) from Top Layer to Bottom Layer And Via (4255mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4293mil) from Top Layer to Bottom Layer And Via (4279mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4317mil) from Top Layer to Bottom Layer And Via (4255mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4317mil) from Top Layer to Bottom Layer And Via (4279mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4341mil) from Top Layer to Bottom Layer And Via (4255mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4341mil) from Top Layer to Bottom Layer And Via (4279mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4365mil) from Top Layer to Bottom Layer And Via (4255mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4365mil) from Top Layer to Bottom Layer And Via (4279mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4389mil) from Top Layer to Bottom Layer And Via (4255mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4389mil) from Top Layer to Bottom Layer And Via (4279mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4413mil) from Top Layer to Bottom Layer And Via (4255mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4413mil) from Top Layer to Bottom Layer And Via (4279mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4437mil) from Top Layer to Bottom Layer And Via (4255mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4437mil) from Top Layer to Bottom Layer And Via (4279mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4255mil,4461mil) from Top Layer to Bottom Layer And Via (4279mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.553mil < 10mil) Between Via (4257.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4266.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.553mil] / [Bottom Solder] Mask Sliver [0.553mil]
Minimum Solder Mask Sliver Constraint: (9.47mil < 10mil) Between Via (4257.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4279.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.47mil] / [Bottom Solder] Mask Sliver [9.47mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4257.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4281.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4257.6mil,4667.6mil) from Top Layer to Bottom Layer And Via (4257.6mil,4691.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4257.6mil,4667.6mil) from Top Layer to Bottom Layer And Via (4281.6mil,4667.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4257.6mil,4691.6mil) from Top Layer to Bottom Layer And Via (4257.6mil,4715.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4257.6mil,4691.6mil) from Top Layer to Bottom Layer And Via (4281.6mil,4691.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4257.6mil,4715.6mil) from Top Layer to Bottom Layer And Via (4257.6mil,4739.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4257.6mil,4715.6mil) from Top Layer to Bottom Layer And Via (4281.6mil,4715.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4257.6mil,4739.6mil) from Top Layer to Bottom Layer And Via (4257.6mil,4763.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4257.6mil,4739.6mil) from Top Layer to Bottom Layer And Via (4281.6mil,4739.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4257.6mil,4763.6mil) from Top Layer to Bottom Layer And Via (4257.6mil,4787.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4257.6mil,4763.6mil) from Top Layer to Bottom Layer And Via (4281.6mil,4763.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.015mil < 10mil) Between Via (4257.6mil,4787.6mil) from Top Layer to Bottom Layer And Via (4278.7mil,4811.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.015mil] / [Bottom Solder] Mask Sliver [9.015mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4257.6mil,4787.6mil) from Top Layer to Bottom Layer And Via (4281.6mil,4787.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.324mil < 10mil) Between Via (4266.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4279.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.324mil] / [Bottom Solder] Mask Sliver [4.324mil]
Minimum Solder Mask Sliver Constraint: (3.557mil < 10mil) Between Via (4266.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4281.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.556mil] / [Bottom Solder] Mask Sliver [3.556mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4266.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4290.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.018mil < 10mil) Between Via (4272.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4273.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.018mil] / [Bottom Solder] Mask Sliver [0.018mil]
Minimum Solder Mask Sliver Constraint: (0.826mil < 10mil) Between Via (4272.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4276.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.826mil] / [Bottom Solder] Mask Sliver [0.826mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4272.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4296.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.422mil < 10mil) Between Via (4273.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4296.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.422mil] / [Bottom Solder] Mask Sliver [9.422mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4273.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4297.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.914mil < 10mil) Between Via (4276.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4296.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.914mil] / [Bottom Solder] Mask Sliver [7.914mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4276.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4300.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4278.3mil,4976.3mil) from Top Layer to Bottom Layer And Via (4278.3mil,5000.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4278.3mil,4976.3mil) from Top Layer to Bottom Layer And Via (4302.3mil,4976.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4278.3mil,5000.3mil) from Top Layer to Bottom Layer And Via (4302.3mil,5000.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4278.7mil,4811.3mil) from Top Layer to Bottom Layer And Via (4278.7mil,4835.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.16mil < 10mil) Between Via (4278.7mil,4811.3mil) from Top Layer to Bottom Layer And Via (4281.6mil,4787.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.16mil] / [Bottom Solder] Mask Sliver [1.16mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4278.7mil,4811.3mil) from Top Layer to Bottom Layer And Via (4302.7mil,4811.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.594mil < 10mil) Between Via (4278.7mil,4835.3mil) from Top Layer to Bottom Layer And Via (4279.4mil,4858.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.594mil] / [Bottom Solder] Mask Sliver [0.594mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4278.7mil,4835.3mil) from Top Layer to Bottom Layer And Via (4302.7mil,4835.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279.4mil,4858.6mil) from Top Layer to Bottom Layer And Via (4279.4mil,4882.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279.4mil,4858.6mil) from Top Layer to Bottom Layer And Via (4303.4mil,4858.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279.4mil,4882.6mil) from Top Layer to Bottom Layer And Via (4303.4mil,4882.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.789mil < 10mil) Between Via (4279.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4279mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.789mil] / [Bottom Solder] Mask Sliver [1.789mil]
Minimum Solder Mask Sliver Constraint: (3.237mil < 10mil) Between Via (4279.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4290.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.237mil] / [Bottom Solder] Mask Sliver [3.237mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4303.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.761mil < 10mil) Between Via (4279.5mil,4554mil) from Top Layer to Bottom Layer And Via (4281.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.761mil] / [Bottom Solder] Mask Sliver [0.761mil]
Minimum Solder Mask Sliver Constraint: (4.693mil < 10mil) Between Via (4279.5mil,4554mil) from Top Layer to Bottom Layer And Via (4297.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.693mil] / [Bottom Solder] Mask Sliver [4.693mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279.5mil,4554mil) from Top Layer to Bottom Layer And Via (4303.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4077mil) from Top Layer to Bottom Layer And Via (4279mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4077mil) from Top Layer to Bottom Layer And Via (4303mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4101mil) from Top Layer to Bottom Layer And Via (4279mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4101mil) from Top Layer to Bottom Layer And Via (4303mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4125mil) from Top Layer to Bottom Layer And Via (4279mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4125mil) from Top Layer to Bottom Layer And Via (4303mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4149mil) from Top Layer to Bottom Layer And Via (4279mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4149mil) from Top Layer to Bottom Layer And Via (4303mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4173mil) from Top Layer to Bottom Layer And Via (4279mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4173mil) from Top Layer to Bottom Layer And Via (4303mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4197mil) from Top Layer to Bottom Layer And Via (4279mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4197mil) from Top Layer to Bottom Layer And Via (4303mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4221mil) from Top Layer to Bottom Layer And Via (4279mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4221mil) from Top Layer to Bottom Layer And Via (4303mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4245mil) from Top Layer to Bottom Layer And Via (4279mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4245mil) from Top Layer to Bottom Layer And Via (4303mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4269mil) from Top Layer to Bottom Layer And Via (4279mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4269mil) from Top Layer to Bottom Layer And Via (4303mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4293mil) from Top Layer to Bottom Layer And Via (4279mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4293mil) from Top Layer to Bottom Layer And Via (4303mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4317mil) from Top Layer to Bottom Layer And Via (4279mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4317mil) from Top Layer to Bottom Layer And Via (4303mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4341mil) from Top Layer to Bottom Layer And Via (4279mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4341mil) from Top Layer to Bottom Layer And Via (4303mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4365mil) from Top Layer to Bottom Layer And Via (4279mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4365mil) from Top Layer to Bottom Layer And Via (4303mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4389mil) from Top Layer to Bottom Layer And Via (4279mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4389mil) from Top Layer to Bottom Layer And Via (4303mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4413mil) from Top Layer to Bottom Layer And Via (4279mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4413mil) from Top Layer to Bottom Layer And Via (4303mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4437mil) from Top Layer to Bottom Layer And Via (4279mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4437mil) from Top Layer to Bottom Layer And Via (4303mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4279mil,4461mil) from Top Layer to Bottom Layer And Via (4303mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.553mil < 10mil) Between Via (4281.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4290.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.553mil] / [Bottom Solder] Mask Sliver [0.553mil]
Minimum Solder Mask Sliver Constraint: (9.47mil < 10mil) Between Via (4281.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4303.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.47mil] / [Bottom Solder] Mask Sliver [9.47mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4281.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4305.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4281.6mil,4667.6mil) from Top Layer to Bottom Layer And Via (4281.6mil,4691.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.289mil < 10mil) Between Via (4281.6mil,4667.6mil) from Top Layer to Bottom Layer And Via (4305.6mil,4668.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.289mil] / [Bottom Solder] Mask Sliver [1.289mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4281.6mil,4691.6mil) from Top Layer to Bottom Layer And Via (4281.6mil,4715.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.289mil < 10mil) Between Via (4281.6mil,4691.6mil) from Top Layer to Bottom Layer And Via (4305.6mil,4692.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.289mil] / [Bottom Solder] Mask Sliver [1.289mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4281.6mil,4715.6mil) from Top Layer to Bottom Layer And Via (4281.6mil,4739.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.289mil < 10mil) Between Via (4281.6mil,4715.6mil) from Top Layer to Bottom Layer And Via (4305.6mil,4716.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.289mil] / [Bottom Solder] Mask Sliver [1.289mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4281.6mil,4739.6mil) from Top Layer to Bottom Layer And Via (4281.6mil,4763.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.289mil < 10mil) Between Via (4281.6mil,4739.6mil) from Top Layer to Bottom Layer And Via (4305.6mil,4740.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.289mil] / [Bottom Solder] Mask Sliver [1.289mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4281.6mil,4763.6mil) from Top Layer to Bottom Layer And Via (4281.6mil,4787.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.289mil < 10mil) Between Via (4281.6mil,4763.6mil) from Top Layer to Bottom Layer And Via (4305.6mil,4764.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.289mil] / [Bottom Solder] Mask Sliver [1.289mil]
Minimum Solder Mask Sliver Constraint: (9.015mil < 10mil) Between Via (4281.6mil,4787.6mil) from Top Layer to Bottom Layer And Via (4302.7mil,4811.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.015mil] / [Bottom Solder] Mask Sliver [9.015mil]
Minimum Solder Mask Sliver Constraint: (1.289mil < 10mil) Between Via (4281.6mil,4787.6mil) from Top Layer to Bottom Layer And Via (4305.6mil,4788.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.289mil] / [Bottom Solder] Mask Sliver [1.289mil]
Minimum Solder Mask Sliver Constraint: (4.324mil < 10mil) Between Via (4290.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4303.5mil,4485.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.324mil] / [Bottom Solder] Mask Sliver [4.324mil]
Minimum Solder Mask Sliver Constraint: (3.557mil < 10mil) Between Via (4290.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4305.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.556mil] / [Bottom Solder] Mask Sliver [3.556mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4290.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4314.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.018mil < 10mil) Between Via (4296.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4297.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.018mil] / [Bottom Solder] Mask Sliver [0.018mil]
Minimum Solder Mask Sliver Constraint: (0.826mil < 10mil) Between Via (4296.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4300.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.826mil] / [Bottom Solder] Mask Sliver [0.826mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4296.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4320.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.422mil < 10mil) Between Via (4297.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4320.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.422mil] / [Bottom Solder] Mask Sliver [9.422mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4297.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4321.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.914mil < 10mil) Between Via (4300.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4320.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.914mil] / [Bottom Solder] Mask Sliver [7.914mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4300.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4324.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4302.3mil,4976.3mil) from Top Layer to Bottom Layer And Via (4302.3mil,5000.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4302.3mil,4976.3mil) from Top Layer to Bottom Layer And Via (4326.3mil,4976.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4302.3mil,5000.3mil) from Top Layer to Bottom Layer And Via (4326.3mil,5000.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4302.7mil,4811.3mil) from Top Layer to Bottom Layer And Via (4302.7mil,4835.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.664mil < 10mil) Between Via (4302.7mil,4811.3mil) from Top Layer to Bottom Layer And Via (4305.6mil,4788.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.664mil] / [Bottom Solder] Mask Sliver [0.664mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4302.7mil,4811.3mil) from Top Layer to Bottom Layer And Via (4326.7mil,4811.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.594mil < 10mil) Between Via (4302.7mil,4835.3mil) from Top Layer to Bottom Layer And Via (4303.4mil,4858.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.594mil] / [Bottom Solder] Mask Sliver [0.594mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4302.7mil,4835.3mil) from Top Layer to Bottom Layer And Via (4326.7mil,4835.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303.4mil,4858.6mil) from Top Layer to Bottom Layer And Via (4303.4mil,4882.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303.4mil,4858.6mil) from Top Layer to Bottom Layer And Via (4327.4mil,4858.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303.4mil,4882.6mil) from Top Layer to Bottom Layer And Via (4327.4mil,4882.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.789mil < 10mil) Between Via (4303.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4303mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.789mil] / [Bottom Solder] Mask Sliver [1.789mil]
Minimum Solder Mask Sliver Constraint: (3.237mil < 10mil) Between Via (4303.5mil,4485.5mil) from Top Layer to Bottom Layer And Via (4314.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.237mil] / [Bottom Solder] Mask Sliver [3.237mil]
Minimum Solder Mask Sliver Constraint: (0.761mil < 10mil) Between Via (4303.5mil,4554mil) from Top Layer to Bottom Layer And Via (4305.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.761mil] / [Bottom Solder] Mask Sliver [0.761mil]
Minimum Solder Mask Sliver Constraint: (4.693mil < 10mil) Between Via (4303.5mil,4554mil) from Top Layer to Bottom Layer And Via (4321.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.693mil] / [Bottom Solder] Mask Sliver [4.693mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303.5mil,4554mil) from Top Layer to Bottom Layer And Via (4327.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4077mil) from Top Layer to Bottom Layer And Via (4303mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4101mil) from Top Layer to Bottom Layer And Via (4303mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4125mil) from Top Layer to Bottom Layer And Via (4303mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4149mil) from Top Layer to Bottom Layer And Via (4303mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4173mil) from Top Layer to Bottom Layer And Via (4303mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4197mil) from Top Layer to Bottom Layer And Via (4303mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4221mil) from Top Layer to Bottom Layer And Via (4303mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4245mil) from Top Layer to Bottom Layer And Via (4303mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4269mil) from Top Layer to Bottom Layer And Via (4303mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4293mil) from Top Layer to Bottom Layer And Via (4303mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4317mil) from Top Layer to Bottom Layer And Via (4303mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4341mil) from Top Layer to Bottom Layer And Via (4303mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4365mil) from Top Layer to Bottom Layer And Via (4303mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4389mil) from Top Layer to Bottom Layer And Via (4303mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4413mil) from Top Layer to Bottom Layer And Via (4303mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4303mil,4437mil) from Top Layer to Bottom Layer And Via (4303mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.553mil < 10mil) Between Via (4305.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4314.3mil,4509.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.553mil] / [Bottom Solder] Mask Sliver [0.553mil]
Minimum Solder Mask Sliver Constraint: (9.47mil < 10mil) Between Via (4305.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4327.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.47mil] / [Bottom Solder] Mask Sliver [9.47mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4305.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4329.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4305.6mil,4668.1mil) from Top Layer to Bottom Layer And Via (4305.6mil,4692.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4305.6mil,4668.1mil) from Top Layer to Bottom Layer And Via (4329.6mil,4668.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4305.6mil,4692.1mil) from Top Layer to Bottom Layer And Via (4305.6mil,4716.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4305.6mil,4692.1mil) from Top Layer to Bottom Layer And Via (4329.6mil,4692.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4305.6mil,4716.1mil) from Top Layer to Bottom Layer And Via (4305.6mil,4740.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4305.6mil,4716.1mil) from Top Layer to Bottom Layer And Via (4329.6mil,4716.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4305.6mil,4740.1mil) from Top Layer to Bottom Layer And Via (4305.6mil,4764.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4305.6mil,4740.1mil) from Top Layer to Bottom Layer And Via (4329.6mil,4740.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4305.6mil,4764.1mil) from Top Layer to Bottom Layer And Via (4305.6mil,4788.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4305.6mil,4764.1mil) from Top Layer to Bottom Layer And Via (4329.6mil,4764.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.644mil < 10mil) Between Via (4305.6mil,4788.1mil) from Top Layer to Bottom Layer And Via (4326.7mil,4811.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.644mil] / [Bottom Solder] Mask Sliver [8.644mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4305.6mil,4788.1mil) from Top Layer to Bottom Layer And Via (4329.6mil,4788.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.557mil < 10mil) Between Via (4314.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4329.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.556mil] / [Bottom Solder] Mask Sliver [3.556mil]
Minimum Solder Mask Sliver Constraint: (1.297mil < 10mil) Between Via (4314.3mil,4509.1mil) from Top Layer to Bottom Layer And Via (4338.3mil,4509.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.297mil] / [Bottom Solder] Mask Sliver [1.297mil]
Minimum Solder Mask Sliver Constraint: (0.018mil < 10mil) Between Via (4320.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4321.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.018mil] / [Bottom Solder] Mask Sliver [0.018mil]
Minimum Solder Mask Sliver Constraint: (0.826mil < 10mil) Between Via (4320.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4324.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.826mil] / [Bottom Solder] Mask Sliver [0.826mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4320.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4344.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.422mil < 10mil) Between Via (4321.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4344.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.422mil] / [Bottom Solder] Mask Sliver [9.422mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4321.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4345.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.914mil < 10mil) Between Via (4324.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4344.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.914mil] / [Bottom Solder] Mask Sliver [7.914mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4324.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4348.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4326.3mil,4976.3mil) from Top Layer to Bottom Layer And Via (4326.3mil,5000.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4326.7mil,4811.3mil) from Top Layer to Bottom Layer And Via (4326.7mil,4835.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.664mil < 10mil) Between Via (4326.7mil,4811.3mil) from Top Layer to Bottom Layer And Via (4329.6mil,4788.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.664mil] / [Bottom Solder] Mask Sliver [0.664mil]
Minimum Solder Mask Sliver Constraint: (3.607mil < 10mil) Between Via (4326.7mil,4811.3mil) from Top Layer to Bottom Layer And Via (4353mil,4812.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.607mil] / [Bottom Solder] Mask Sliver [3.607mil]
Minimum Solder Mask Sliver Constraint: (0.594mil < 10mil) Between Via (4326.7mil,4835.3mil) from Top Layer to Bottom Layer And Via (4327.4mil,4858.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.594mil] / [Bottom Solder] Mask Sliver [0.594mil]
Minimum Solder Mask Sliver Constraint: (3.027mil < 10mil) Between Via (4326.7mil,4835.3mil) from Top Layer to Bottom Layer And Via (4352.4mil,4836.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.027mil] / [Bottom Solder] Mask Sliver [3.027mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4327.4mil,4858.6mil) from Top Layer to Bottom Layer And Via (4327.4mil,4882.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4327.4mil,4858.6mil) from Top Layer to Bottom Layer And Via (4351.4mil,4858.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4327.4mil,4882.6mil) from Top Layer to Bottom Layer And Via (4351.4mil,4882.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.761mil < 10mil) Between Via (4327.5mil,4554mil) from Top Layer to Bottom Layer And Via (4329.4mil,4530.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.761mil] / [Bottom Solder] Mask Sliver [0.761mil]
Minimum Solder Mask Sliver Constraint: (4.693mil < 10mil) Between Via (4327.5mil,4554mil) from Top Layer to Bottom Layer And Via (4345.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.693mil] / [Bottom Solder] Mask Sliver [4.693mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4327.5mil,4554mil) from Top Layer to Bottom Layer And Via (4351.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.47mil < 10mil) Between Via (4329.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4351.5mil,4554mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.47mil] / [Bottom Solder] Mask Sliver [9.47mil]
Minimum Solder Mask Sliver Constraint: (2.1mil < 10mil) Between Via (4329.4mil,4530.6mil) from Top Layer to Bottom Layer And Via (4354.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.1mil] / [Bottom Solder] Mask Sliver [2.1mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4329.6mil,4668.1mil) from Top Layer to Bottom Layer And Via (4329.6mil,4692.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4329.6mil,4692.1mil) from Top Layer to Bottom Layer And Via (4329.6mil,4716.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.686mil < 10mil) Between Via (4329.6mil,4692.1mil) from Top Layer to Bottom Layer And Via (4353mil,4692.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.686mil] / [Bottom Solder] Mask Sliver [0.686mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4329.6mil,4716.1mil) from Top Layer to Bottom Layer And Via (4329.6mil,4740.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.686mil < 10mil) Between Via (4329.6mil,4716.1mil) from Top Layer to Bottom Layer And Via (4353mil,4716.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.686mil] / [Bottom Solder] Mask Sliver [0.686mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4329.6mil,4740.1mil) from Top Layer to Bottom Layer And Via (4329.6mil,4764.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.686mil < 10mil) Between Via (4329.6mil,4740.1mil) from Top Layer to Bottom Layer And Via (4353mil,4740.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.686mil] / [Bottom Solder] Mask Sliver [0.686mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4329.6mil,4764.1mil) from Top Layer to Bottom Layer And Via (4329.6mil,4788.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.686mil < 10mil) Between Via (4329.6mil,4764.1mil) from Top Layer to Bottom Layer And Via (4353mil,4764.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.686mil] / [Bottom Solder] Mask Sliver [0.686mil]
Minimum Solder Mask Sliver Constraint: (0.686mil < 10mil) Between Via (4329.6mil,4788.1mil) from Top Layer to Bottom Layer And Via (4353mil,4788.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.686mil] / [Bottom Solder] Mask Sliver [0.686mil]
Minimum Solder Mask Sliver Constraint: (4.105mil < 10mil) Between Via (4338.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4354.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.105mil] / [Bottom Solder] Mask Sliver [4.105mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4338.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4362.3mil,4509.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.018mil < 10mil) Between Via (4344.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4345.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.018mil] / [Bottom Solder] Mask Sliver [0.018mil]
Minimum Solder Mask Sliver Constraint: (0.826mil < 10mil) Between Via (4344.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4348.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.826mil] / [Bottom Solder] Mask Sliver [0.826mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4344.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4368.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.422mil < 10mil) Between Via (4345.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4368.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.422mil] / [Bottom Solder] Mask Sliver [9.422mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4345.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4369.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.914mil < 10mil) Between Via (4348.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4368.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.914mil] / [Bottom Solder] Mask Sliver [7.914mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4348.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4372.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4351.4mil,4858.6mil) from Top Layer to Bottom Layer And Via (4351.4mil,4882.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4351.4mil,4858.6mil) from Top Layer to Bottom Layer And Via (4375.4mil,4858.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.721mil < 10mil) Between Via (4351.4mil,4858.6mil) from Top Layer to Bottom Layer And Via (4375.6mil,4837mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.721mil] / [Bottom Solder] Mask Sliver [9.721mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4351.4mil,4882.6mil) from Top Layer to Bottom Layer And Via (4375.4mil,4882.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.693mil < 10mil) Between Via (4351.5mil,4554mil) from Top Layer to Bottom Layer And Via (4369.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.693mil] / [Bottom Solder] Mask Sliver [4.693mil]
Minimum Solder Mask Sliver Constraint: (2.1mil < 10mil) Between Via (4351.5mil,4554mil) from Top Layer to Bottom Layer And Via (4376.3mil,4554.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.1mil] / [Bottom Solder] Mask Sliver [2.1mil]
Minimum Solder Mask Sliver Constraint: (1.691mil < 10mil) Between Via (4352.4mil,4836.8mil) from Top Layer to Bottom Layer And Via (4353mil,4812.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.691mil] / [Bottom Solder] Mask Sliver [1.691mil]
Minimum Solder Mask Sliver Constraint: (8.973mil < 10mil) Between Via (4352.4mil,4836.8mil) from Top Layer to Bottom Layer And Via (4375.4mil,4858.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.973mil] / [Bottom Solder] Mask Sliver [8.973mil]
Minimum Solder Mask Sliver Constraint: (0.484mil < 10mil) Between Via (4352.4mil,4836.8mil) from Top Layer to Bottom Layer And Via (4375.6mil,4837mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.484mil] / [Bottom Solder] Mask Sliver [0.484mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4353mil,4692.4mil) from Top Layer to Bottom Layer And Via (4353mil,4716.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4353mil,4692.4mil) from Top Layer to Bottom Layer And Via (4377mil,4692.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4353mil,4716.4mil) from Top Layer to Bottom Layer And Via (4353mil,4740.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4353mil,4716.4mil) from Top Layer to Bottom Layer And Via (4377mil,4716.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4353mil,4740.4mil) from Top Layer to Bottom Layer And Via (4353mil,4764.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4353mil,4740.4mil) from Top Layer to Bottom Layer And Via (4377mil,4740.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4353mil,4764.4mil) from Top Layer to Bottom Layer And Via (4353mil,4788.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4353mil,4764.4mil) from Top Layer to Bottom Layer And Via (4377mil,4764.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4353mil,4788.4mil) from Top Layer to Bottom Layer And Via (4353mil,4812.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4353mil,4788.4mil) from Top Layer to Bottom Layer And Via (4377mil,4788.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4353mil,4812.4mil) from Top Layer to Bottom Layer And Via (4377mil,4812.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.352mil < 10mil) Between Via (4354.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4362.3mil,4509.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.352mil] / [Bottom Solder] Mask Sliver [0.352mil]
Minimum Solder Mask Sliver Constraint: (9.47mil < 10mil) Between Via (4354.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4376.3mil,4554.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.47mil] / [Bottom Solder] Mask Sliver [9.47mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4354.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4378.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.105mil < 10mil) Between Via (4362.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4378.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.105mil] / [Bottom Solder] Mask Sliver [4.105mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4362.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4386.3mil,4509.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4364mil,4124mil) from Top Layer to Bottom Layer And Via (4364mil,4148mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4364mil,4124mil) from Top Layer to Bottom Layer And Via (4388mil,4124mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4364mil,4148mil) from Top Layer to Bottom Layer And Via (4364mil,4172mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4364mil,4148mil) from Top Layer to Bottom Layer And Via (4388mil,4148mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4364mil,4172mil) from Top Layer to Bottom Layer And Via (4364mil,4196mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4364mil,4172mil) from Top Layer to Bottom Layer And Via (4388mil,4172mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4364mil,4196mil) from Top Layer to Bottom Layer And Via (4364mil,4220mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4364mil,4196mil) from Top Layer to Bottom Layer And Via (4388mil,4196mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4364mil,4220mil) from Top Layer to Bottom Layer And Via (4364mil,4244mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4364mil,4220mil) from Top Layer to Bottom Layer And Via (4388mil,4220mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4364mil,4244mil) from Top Layer to Bottom Layer And Via (4388mil,4244mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4367mil,4364mil) from Top Layer to Bottom Layer And Via (4367mil,4388mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4367mil,4364mil) from Top Layer to Bottom Layer And Via (4391mil,4364mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4367mil,4388mil) from Top Layer to Bottom Layer And Via (4367mil,4412mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4367mil,4388mil) from Top Layer to Bottom Layer And Via (4391mil,4388mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4367mil,4412mil) from Top Layer to Bottom Layer And Via (4367mil,4436mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4367mil,4412mil) from Top Layer to Bottom Layer And Via (4391mil,4412mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4367mil,4436mil) from Top Layer to Bottom Layer And Via (4367mil,4460mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4367mil,4436mil) from Top Layer to Bottom Layer And Via (4391mil,4436mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4367mil,4460mil) from Top Layer to Bottom Layer And Via (4391mil,4460mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.018mil < 10mil) Between Via (4368.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4369.35mil,4574.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.018mil] / [Bottom Solder] Mask Sliver [0.018mil]
Minimum Solder Mask Sliver Constraint: (0.826mil < 10mil) Between Via (4368.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4372.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.826mil] / [Bottom Solder] Mask Sliver [0.826mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4368.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4392.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.422mil < 10mil) Between Via (4369.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4392.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.422mil] / [Bottom Solder] Mask Sliver [9.422mil]
Minimum Solder Mask Sliver Constraint: (2.1mil < 10mil) Between Via (4369.35mil,4574.8mil) from Top Layer to Bottom Layer And Via (4394.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.1mil] / [Bottom Solder] Mask Sliver [2.1mil]
Minimum Solder Mask Sliver Constraint: (6.295mil < 10mil) Between Via (4372.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4388.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.295mil] / [Bottom Solder] Mask Sliver [6.295mil]
Minimum Solder Mask Sliver Constraint: (7.914mil < 10mil) Between Via (4372.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4392.1mil,4597.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.914mil] / [Bottom Solder] Mask Sliver [7.914mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4372.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4396.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4375.4mil,4858.6mil) from Top Layer to Bottom Layer And Via (4375.4mil,4882.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.712mil < 10mil) Between Via (4375.4mil,4858.6mil) from Top Layer to Bottom Layer And Via (4400.8mil,4859.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.712mil] / [Bottom Solder] Mask Sliver [2.712mil]
Minimum Solder Mask Sliver Constraint: (2.779mil < 10mil) Between Via (4375.4mil,4882.6mil) from Top Layer to Bottom Layer And Via (4400.8mil,4884.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.779mil] / [Bottom Solder] Mask Sliver [2.779mil]
Minimum Solder Mask Sliver Constraint: (1.923mil < 10mil) Between Via (4375.6mil,4837mil) from Top Layer to Bottom Layer And Via (4377mil,4812.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.923mil] / [Bottom Solder] Mask Sliver [1.923mil]
Minimum Solder Mask Sliver Constraint: (2.512mil < 10mil) Between Via (4375.6mil,4837mil) from Top Layer to Bottom Layer And Via (4400.8mil,4835.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.512mil] / [Bottom Solder] Mask Sliver [2.512mil]
Minimum Solder Mask Sliver Constraint: (0.761mil < 10mil) Between Via (4376.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4378.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.761mil] / [Bottom Solder] Mask Sliver [0.761mil]
Minimum Solder Mask Sliver Constraint: (4.693mil < 10mil) Between Via (4376.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4394.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.693mil] / [Bottom Solder] Mask Sliver [4.693mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4376.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4400.3mil,4554.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4377mil,4692.4mil) from Top Layer to Bottom Layer And Via (4377mil,4716.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4377mil,4716.4mil) from Top Layer to Bottom Layer And Via (4377mil,4740.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4377mil,4740.4mil) from Top Layer to Bottom Layer And Via (4377mil,4764.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.091mil < 10mil) Between Via (4377mil,4740.4mil) from Top Layer to Bottom Layer And Via (4400.8mil,4739.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.091mil] / [Bottom Solder] Mask Sliver [1.091mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4377mil,4764.4mil) from Top Layer to Bottom Layer And Via (4377mil,4788.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.091mil < 10mil) Between Via (4377mil,4764.4mil) from Top Layer to Bottom Layer And Via (4400.8mil,4763.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.091mil] / [Bottom Solder] Mask Sliver [1.091mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4377mil,4788.4mil) from Top Layer to Bottom Layer And Via (4377mil,4812.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.091mil < 10mil) Between Via (4377mil,4788.4mil) from Top Layer to Bottom Layer And Via (4400.8mil,4787.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.091mil] / [Bottom Solder] Mask Sliver [1.091mil]
Minimum Solder Mask Sliver Constraint: (1.091mil < 10mil) Between Via (4377mil,4812.4mil) from Top Layer to Bottom Layer And Via (4400.8mil,4811.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.091mil] / [Bottom Solder] Mask Sliver [1.091mil]
Minimum Solder Mask Sliver Constraint: (0.352mil < 10mil) Between Via (4378.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4386.3mil,4509.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.352mil] / [Bottom Solder] Mask Sliver [0.352mil]
Minimum Solder Mask Sliver Constraint: (9.47mil < 10mil) Between Via (4378.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4400.3mil,4554.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.47mil] / [Bottom Solder] Mask Sliver [9.47mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4378.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4402.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4382mil,5041mil) from Top Layer to Bottom Layer And Via (4382mil,5065mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4382mil,5041mil) from Top Layer to Bottom Layer And Via (4406mil,5041mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4382mil,5065mil) from Top Layer to Bottom Layer And Via (4382mil,5089mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4382mil,5065mil) from Top Layer to Bottom Layer And Via (4406mil,5065mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4382mil,5089mil) from Top Layer to Bottom Layer And Via (4382mil,5113mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4382mil,5089mil) from Top Layer to Bottom Layer And Via (4406mil,5089mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4382mil,5113mil) from Top Layer to Bottom Layer And Via (4406mil,5113mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.774mil < 10mil) Between Via (4382mil,5113mil) from Top Layer to Bottom Layer And Via (4406mil,5134.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.774mil] / [Bottom Solder] Mask Sliver [9.774mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4382mil,5134.9mil) from Top Layer to Bottom Layer And Via (4382mil,5158.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.774mil < 10mil) Between Via (4382mil,5134.9mil) from Top Layer to Bottom Layer And Via (4406mil,5113mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.774mil] / [Bottom Solder] Mask Sliver [9.774mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4382mil,5134.9mil) from Top Layer to Bottom Layer And Via (4406mil,5134.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4382mil,5158.9mil) from Top Layer to Bottom Layer And Via (4382mil,5182.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4382mil,5158.9mil) from Top Layer to Bottom Layer And Via (4406mil,5158.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4382mil,5182.9mil) from Top Layer to Bottom Layer And Via (4382mil,5206.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4382mil,5182.9mil) from Top Layer to Bottom Layer And Via (4406mil,5182.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4382mil,5206.9mil) from Top Layer to Bottom Layer And Via (4406mil,5206.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.105mil < 10mil) Between Via (4386.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4402.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.105mil] / [Bottom Solder] Mask Sliver [4.105mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4386.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4410.3mil,4509.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.489mil < 10mil) Between Via (4388.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4396.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.489mil] / [Bottom Solder] Mask Sliver [2.489mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4388.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4412.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4388mil,4124mil) from Top Layer to Bottom Layer And Via (4388mil,4148mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.301mil < 10mil) Between Via (4388mil,4124mil) from Top Layer to Bottom Layer And Via (4416mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.301mil] / [Bottom Solder] Mask Sliver [5.301mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4388mil,4148mil) from Top Layer to Bottom Layer And Via (4388mil,4172mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.301mil < 10mil) Between Via (4388mil,4148mil) from Top Layer to Bottom Layer And Via (4416mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.301mil] / [Bottom Solder] Mask Sliver [5.301mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4388mil,4172mil) from Top Layer to Bottom Layer And Via (4388mil,4196mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.301mil < 10mil) Between Via (4388mil,4172mil) from Top Layer to Bottom Layer And Via (4416mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.301mil] / [Bottom Solder] Mask Sliver [5.301mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4388mil,4196mil) from Top Layer to Bottom Layer And Via (4388mil,4220mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.301mil < 10mil) Between Via (4388mil,4196mil) from Top Layer to Bottom Layer And Via (4416mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.301mil] / [Bottom Solder] Mask Sliver [5.301mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4388mil,4220mil) from Top Layer to Bottom Layer And Via (4388mil,4244mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.301mil < 10mil) Between Via (4388mil,4220mil) from Top Layer to Bottom Layer And Via (4416mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.301mil] / [Bottom Solder] Mask Sliver [5.301mil]
Minimum Solder Mask Sliver Constraint: (5.301mil < 10mil) Between Via (4388mil,4244mil) from Top Layer to Bottom Layer And Via (4416mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.301mil] / [Bottom Solder] Mask Sliver [5.301mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4391mil,4364mil) from Top Layer to Bottom Layer And Via (4391mil,4388mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.304mil < 10mil) Between Via (4391mil,4364mil) from Top Layer to Bottom Layer And Via (4416mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.304mil] / [Bottom Solder] Mask Sliver [2.304mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4391mil,4388mil) from Top Layer to Bottom Layer And Via (4391mil,4412mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.304mil < 10mil) Between Via (4391mil,4388mil) from Top Layer to Bottom Layer And Via (4416mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.304mil] / [Bottom Solder] Mask Sliver [2.304mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4391mil,4412mil) from Top Layer to Bottom Layer And Via (4391mil,4436mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.304mil < 10mil) Between Via (4391mil,4412mil) from Top Layer to Bottom Layer And Via (4416mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.304mil] / [Bottom Solder] Mask Sliver [2.304mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4391mil,4436mil) from Top Layer to Bottom Layer And Via (4391mil,4460mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.304mil < 10mil) Between Via (4391mil,4436mil) from Top Layer to Bottom Layer And Via (4416mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.304mil] / [Bottom Solder] Mask Sliver [2.304mil]
Minimum Solder Mask Sliver Constraint: (2.304mil < 10mil) Between Via (4391mil,4460mil) from Top Layer to Bottom Layer And Via (4416mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.304mil] / [Bottom Solder] Mask Sliver [2.304mil]
Minimum Solder Mask Sliver Constraint: (0.826mil < 10mil) Between Via (4392.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4396.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.826mil] / [Bottom Solder] Mask Sliver [0.826mil]
Minimum Solder Mask Sliver Constraint: (2.1mil < 10mil) Between Via (4392.1mil,4597.5mil) from Top Layer to Bottom Layer And Via (4416.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.1mil] / [Bottom Solder] Mask Sliver [2.1mil]
Minimum Solder Mask Sliver Constraint: (9.422mil < 10mil) Between Via (4394.15mil,4575.7mil) from Top Layer to Bottom Layer And Via (4416.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.422mil] / [Bottom Solder] Mask Sliver [9.422mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4394.15mil,4575.7mil) from Top Layer to Bottom Layer And Via (4418.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (6.295mil < 10mil) Between Via (4396.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4412.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.295mil] / [Bottom Solder] Mask Sliver [6.295mil]
Minimum Solder Mask Sliver Constraint: (7.778mil < 10mil) Between Via (4396.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4416.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.778mil] / [Bottom Solder] Mask Sliver [7.778mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4396.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4420.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.761mil < 10mil) Between Via (4400.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4402.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.761mil] / [Bottom Solder] Mask Sliver [0.761mil]
Minimum Solder Mask Sliver Constraint: (4.693mil < 10mil) Between Via (4400.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4418.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.693mil] / [Bottom Solder] Mask Sliver [4.693mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4400.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4424.3mil,4554.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4400.8mil,4739.8mil) from Top Layer to Bottom Layer And Via (4400.8mil,4763.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4400.8mil,4739.8mil) from Top Layer to Bottom Layer And Via (4424.8mil,4739.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4400.8mil,4763.8mil) from Top Layer to Bottom Layer And Via (4400.8mil,4787.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4400.8mil,4763.8mil) from Top Layer to Bottom Layer And Via (4424.8mil,4763.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4400.8mil,4787.8mil) from Top Layer to Bottom Layer And Via (4400.8mil,4811.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4400.8mil,4787.8mil) from Top Layer to Bottom Layer And Via (4424.8mil,4787.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4400.8mil,4811.8mil) from Top Layer to Bottom Layer And Via (4400.8mil,4835.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4400.8mil,4811.8mil) from Top Layer to Bottom Layer And Via (4424.8mil,4811.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4400.8mil,4835.8mil) from Top Layer to Bottom Layer And Via (4400.8mil,4859.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4400.8mil,4835.8mil) from Top Layer to Bottom Layer And Via (4424.8mil,4835.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.284mil < 10mil) Between Via (4400.8mil,4859.8mil) from Top Layer to Bottom Layer And Via (4400.8mil,4884.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.284mil] / [Bottom Solder] Mask Sliver [2.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4400.8mil,4859.8mil) from Top Layer to Bottom Layer And Via (4424.8mil,4859.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.393mil < 10mil) Between Via (4400.8mil,4884.8mil) from Top Layer to Bottom Layer And Via (4426.7mil,4888.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.393mil] / [Bottom Solder] Mask Sliver [3.393mil]
Minimum Solder Mask Sliver Constraint: (0.352mil < 10mil) Between Via (4402.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4410.3mil,4509.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.352mil] / [Bottom Solder] Mask Sliver [0.352mil]
Minimum Solder Mask Sliver Constraint: (9.47mil < 10mil) Between Via (4402.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4424.3mil,4554.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.47mil] / [Bottom Solder] Mask Sliver [9.47mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4402.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4426.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4406mil,5041mil) from Top Layer to Bottom Layer And Via (4406mil,5065mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4406mil,5041mil) from Top Layer to Bottom Layer And Via (4430mil,5041mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4406mil,5065mil) from Top Layer to Bottom Layer And Via (4406mil,5089mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4406mil,5065mil) from Top Layer to Bottom Layer And Via (4430mil,5065mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4406mil,5089mil) from Top Layer to Bottom Layer And Via (4406mil,5113mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4406mil,5089mil) from Top Layer to Bottom Layer And Via (4430mil,5089mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4406mil,5113mil) from Top Layer to Bottom Layer And Via (4430mil,5113mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.774mil < 10mil) Between Via (4406mil,5113mil) from Top Layer to Bottom Layer And Via (4430mil,5134.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.774mil] / [Bottom Solder] Mask Sliver [9.774mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4406mil,5134.9mil) from Top Layer to Bottom Layer And Via (4406mil,5158.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.774mil < 10mil) Between Via (4406mil,5134.9mil) from Top Layer to Bottom Layer And Via (4430mil,5113mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.774mil] / [Bottom Solder] Mask Sliver [9.774mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4406mil,5134.9mil) from Top Layer to Bottom Layer And Via (4430mil,5134.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4406mil,5158.9mil) from Top Layer to Bottom Layer And Via (4406mil,5182.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4406mil,5158.9mil) from Top Layer to Bottom Layer And Via (4430mil,5158.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4406mil,5182.9mil) from Top Layer to Bottom Layer And Via (4406mil,5206.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4406mil,5182.9mil) from Top Layer to Bottom Layer And Via (4430mil,5182.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4406mil,5206.9mil) from Top Layer to Bottom Layer And Via (4430mil,5206.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.105mil < 10mil) Between Via (4410.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4426.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.105mil] / [Bottom Solder] Mask Sliver [4.105mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4410.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4434.3mil,4509.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.519mil < 10mil) Between Via (4412.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4413.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.518mil] / [Bottom Solder] Mask Sliver [1.518mil]
Minimum Solder Mask Sliver Constraint: (2.489mil < 10mil) Between Via (4412.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4420.1mil,4620.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.489mil] / [Bottom Solder] Mask Sliver [2.489mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4412.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4436.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.506mil < 10mil) Between Via (4413.105mil,5566.995mil) from Top Layer to Bottom Layer And Via (4414.207mil,5592.193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.505mil] / [Bottom Solder] Mask Sliver [2.505mil]
Minimum Solder Mask Sliver Constraint: (8.146mil < 10mil) Between Via (4413.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4434.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.146mil] / [Bottom Solder] Mask Sliver [8.146mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4413.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4437.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.51mil < 10mil) Between Via (4414.207mil,5592.193mil) from Top Layer to Bottom Layer And Via (4439.4mil,5593.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.51mil] / [Bottom Solder] Mask Sliver [2.51mil]
Minimum Solder Mask Sliver Constraint: (0.018mil < 10mil) Between Via (4416.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4418.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.018mil] / [Bottom Solder] Mask Sliver [0.018mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4440.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4077mil) from Top Layer to Bottom Layer And Via (4416mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4077mil) from Top Layer to Bottom Layer And Via (4440mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4101mil) from Top Layer to Bottom Layer And Via (4416mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4101mil) from Top Layer to Bottom Layer And Via (4440mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4125mil) from Top Layer to Bottom Layer And Via (4416mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4125mil) from Top Layer to Bottom Layer And Via (4440mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4149mil) from Top Layer to Bottom Layer And Via (4416mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4149mil) from Top Layer to Bottom Layer And Via (4440mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4173mil) from Top Layer to Bottom Layer And Via (4416mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4173mil) from Top Layer to Bottom Layer And Via (4440mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4197mil) from Top Layer to Bottom Layer And Via (4416mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4197mil) from Top Layer to Bottom Layer And Via (4440mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4221mil) from Top Layer to Bottom Layer And Via (4416mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4221mil) from Top Layer to Bottom Layer And Via (4440mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4245mil) from Top Layer to Bottom Layer And Via (4416mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4245mil) from Top Layer to Bottom Layer And Via (4440mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4269mil) from Top Layer to Bottom Layer And Via (4416mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4269mil) from Top Layer to Bottom Layer And Via (4440mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4293mil) from Top Layer to Bottom Layer And Via (4416mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4293mil) from Top Layer to Bottom Layer And Via (4440mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4317mil) from Top Layer to Bottom Layer And Via (4416mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4317mil) from Top Layer to Bottom Layer And Via (4440mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4341mil) from Top Layer to Bottom Layer And Via (4416mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4341mil) from Top Layer to Bottom Layer And Via (4440mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4365mil) from Top Layer to Bottom Layer And Via (4416mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4365mil) from Top Layer to Bottom Layer And Via (4440mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4389mil) from Top Layer to Bottom Layer And Via (4416mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4389mil) from Top Layer to Bottom Layer And Via (4440mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4413mil) from Top Layer to Bottom Layer And Via (4416mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4413mil) from Top Layer to Bottom Layer And Via (4440mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4437mil) from Top Layer to Bottom Layer And Via (4416mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4437mil) from Top Layer to Bottom Layer And Via (4440mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4416mil,4461mil) from Top Layer to Bottom Layer And Via (4440mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.422mil < 10mil) Between Via (4418.15mil,4575.7mil) from Top Layer to Bottom Layer And Via (4440.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.422mil] / [Bottom Solder] Mask Sliver [9.422mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4418.15mil,4575.7mil) from Top Layer to Bottom Layer And Via (4442.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (6.295mil < 10mil) Between Via (4420.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4436.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.295mil] / [Bottom Solder] Mask Sliver [6.295mil]
Minimum Solder Mask Sliver Constraint: (7.778mil < 10mil) Between Via (4420.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4440.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.778mil] / [Bottom Solder] Mask Sliver [7.778mil]
Minimum Solder Mask Sliver Constraint: (2.1mil < 10mil) Between Via (4420.1mil,4620.7mil) from Top Layer to Bottom Layer And Via (4444.9mil,4621.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.1mil] / [Bottom Solder] Mask Sliver [2.1mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4422.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4422.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4422.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4446.7mil,3966.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4422.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4422.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4422.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4446.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4422.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4422.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4422.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4446.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4422.7mil,4038.6mil) from Top Layer to Bottom Layer And Via (4446.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.761mil < 10mil) Between Via (4424.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4426.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.761mil] / [Bottom Solder] Mask Sliver [0.761mil]
Minimum Solder Mask Sliver Constraint: (4.693mil < 10mil) Between Via (4424.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4442.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.693mil] / [Bottom Solder] Mask Sliver [4.693mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4424.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4448.3mil,4554.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4424.8mil,4739.8mil) from Top Layer to Bottom Layer And Via (4424.8mil,4763.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.373mil < 10mil) Between Via (4424.8mil,4739.8mil) from Top Layer to Bottom Layer And Via (4447.7mil,4752.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.373mil] / [Bottom Solder] Mask Sliver [3.373mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4424.8mil,4763.8mil) from Top Layer to Bottom Layer And Via (4424.8mil,4787.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.909mil < 10mil) Between Via (4424.8mil,4763.8mil) from Top Layer to Bottom Layer And Via (4447.7mil,4752.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.909mil] / [Bottom Solder] Mask Sliver [2.909mil]
Minimum Solder Mask Sliver Constraint: (3.373mil < 10mil) Between Via (4424.8mil,4763.8mil) from Top Layer to Bottom Layer And Via (4447.7mil,4776.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.373mil] / [Bottom Solder] Mask Sliver [3.373mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4424.8mil,4787.8mil) from Top Layer to Bottom Layer And Via (4424.8mil,4811.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.909mil < 10mil) Between Via (4424.8mil,4787.8mil) from Top Layer to Bottom Layer And Via (4447.7mil,4776.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.909mil] / [Bottom Solder] Mask Sliver [2.909mil]
Minimum Solder Mask Sliver Constraint: (3.373mil < 10mil) Between Via (4424.8mil,4787.8mil) from Top Layer to Bottom Layer And Via (4447.7mil,4800.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.373mil] / [Bottom Solder] Mask Sliver [3.373mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4424.8mil,4811.8mil) from Top Layer to Bottom Layer And Via (4424.8mil,4835.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.909mil < 10mil) Between Via (4424.8mil,4811.8mil) from Top Layer to Bottom Layer And Via (4447.7mil,4800.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.909mil] / [Bottom Solder] Mask Sliver [2.909mil]
Minimum Solder Mask Sliver Constraint: (3.373mil < 10mil) Between Via (4424.8mil,4811.8mil) from Top Layer to Bottom Layer And Via (4447.7mil,4824.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.373mil] / [Bottom Solder] Mask Sliver [3.373mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4424.8mil,4835.8mil) from Top Layer to Bottom Layer And Via (4424.8mil,4859.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.909mil < 10mil) Between Via (4424.8mil,4835.8mil) from Top Layer to Bottom Layer And Via (4447.7mil,4824.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.909mil] / [Bottom Solder] Mask Sliver [2.909mil]
Minimum Solder Mask Sliver Constraint: (3.373mil < 10mil) Between Via (4424.8mil,4835.8mil) from Top Layer to Bottom Layer And Via (4447.7mil,4848.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.373mil] / [Bottom Solder] Mask Sliver [3.373mil]
Minimum Solder Mask Sliver Constraint: (5.647mil < 10mil) Between Via (4424.8mil,4859.8mil) from Top Layer to Bottom Layer And Via (4426.7mil,4888.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.647mil] / [Bottom Solder] Mask Sliver [5.647mil]
Minimum Solder Mask Sliver Constraint: (2.909mil < 10mil) Between Via (4424.8mil,4859.8mil) from Top Layer to Bottom Layer And Via (4447.7mil,4848.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.909mil] / [Bottom Solder] Mask Sliver [2.909mil]
Minimum Solder Mask Sliver Constraint: (3.373mil < 10mil) Between Via (4424.8mil,4859.8mil) from Top Layer to Bottom Layer And Via (4447.7mil,4872.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.373mil] / [Bottom Solder] Mask Sliver [3.373mil]
Minimum Solder Mask Sliver Constraint: (0.352mil < 10mil) Between Via (4426.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4434.3mil,4509.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.352mil] / [Bottom Solder] Mask Sliver [0.352mil]
Minimum Solder Mask Sliver Constraint: (9.47mil < 10mil) Between Via (4426.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4448.3mil,4554.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.47mil] / [Bottom Solder] Mask Sliver [9.47mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4426.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4450.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (6.276mil < 10mil) Between Via (4426.4mil,4059.3mil) from Top Layer to Bottom Layer And Via (4446.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.276mil] / [Bottom Solder] Mask Sliver [6.276mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4426.4mil,4059.3mil) from Top Layer to Bottom Layer And Via (4450.4mil,4059.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.564mil < 10mil) Between Via (4426.7mil,4888.1mil) from Top Layer to Bottom Layer And Via (4447.7mil,4872.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.564mil] / [Bottom Solder] Mask Sliver [3.564mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4430mil,5041mil) from Top Layer to Bottom Layer And Via (4430mil,5065mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4430mil,5065mil) from Top Layer to Bottom Layer And Via (4430mil,5089mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4430mil,5089mil) from Top Layer to Bottom Layer And Via (4430mil,5113mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4430mil,5134.9mil) from Top Layer to Bottom Layer And Via (4430mil,5158.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4430mil,5158.9mil) from Top Layer to Bottom Layer And Via (4430mil,5182.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4430mil,5182.9mil) from Top Layer to Bottom Layer And Via (4430mil,5206.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.105mil < 10mil) Between Via (4434.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4450.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.105mil] / [Bottom Solder] Mask Sliver [4.105mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4434.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4458.3mil,4509.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.307mil < 10mil) Between Via (4434.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4437.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.307mil] / [Bottom Solder] Mask Sliver [0.307mil]
Minimum Solder Mask Sliver Constraint: (7.059mil < 10mil) Between Via (4434.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4455.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.06mil] / [Bottom Solder] Mask Sliver [7.06mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4434.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4458.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.519mil < 10mil) Between Via (4436.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4437.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.518mil] / [Bottom Solder] Mask Sliver [1.518mil]
Minimum Solder Mask Sliver Constraint: (1.898mil < 10mil) Between Via (4436.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4444.9mil,4621.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.898mil] / [Bottom Solder] Mask Sliver [1.898mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4436.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4460.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.146mil < 10mil) Between Via (4437.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4458.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.146mil] / [Bottom Solder] Mask Sliver [8.146mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4437.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4461.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.018mil < 10mil) Between Via (4440.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4442.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.018mil] / [Bottom Solder] Mask Sliver [0.018mil]
Minimum Solder Mask Sliver Constraint: (0.826mil < 10mil) Between Via (4440.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4444.9mil,4621.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.826mil] / [Bottom Solder] Mask Sliver [0.826mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4464.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4077mil) from Top Layer to Bottom Layer And Via (4440mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4077mil) from Top Layer to Bottom Layer And Via (4464mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4101mil) from Top Layer to Bottom Layer And Via (4440mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4101mil) from Top Layer to Bottom Layer And Via (4464mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4125mil) from Top Layer to Bottom Layer And Via (4440mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4125mil) from Top Layer to Bottom Layer And Via (4464mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4149mil) from Top Layer to Bottom Layer And Via (4440mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4149mil) from Top Layer to Bottom Layer And Via (4464mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4173mil) from Top Layer to Bottom Layer And Via (4440mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4173mil) from Top Layer to Bottom Layer And Via (4464mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4197mil) from Top Layer to Bottom Layer And Via (4440mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4197mil) from Top Layer to Bottom Layer And Via (4464mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4221mil) from Top Layer to Bottom Layer And Via (4440mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4221mil) from Top Layer to Bottom Layer And Via (4464mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4245mil) from Top Layer to Bottom Layer And Via (4440mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4245mil) from Top Layer to Bottom Layer And Via (4464mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4269mil) from Top Layer to Bottom Layer And Via (4440mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4269mil) from Top Layer to Bottom Layer And Via (4464mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4293mil) from Top Layer to Bottom Layer And Via (4440mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4293mil) from Top Layer to Bottom Layer And Via (4464mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4317mil) from Top Layer to Bottom Layer And Via (4440mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4317mil) from Top Layer to Bottom Layer And Via (4464mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4341mil) from Top Layer to Bottom Layer And Via (4440mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4341mil) from Top Layer to Bottom Layer And Via (4464mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4365mil) from Top Layer to Bottom Layer And Via (4440mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4365mil) from Top Layer to Bottom Layer And Via (4464mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4389mil) from Top Layer to Bottom Layer And Via (4440mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4389mil) from Top Layer to Bottom Layer And Via (4464mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4413mil) from Top Layer to Bottom Layer And Via (4440mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4413mil) from Top Layer to Bottom Layer And Via (4464mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4437mil) from Top Layer to Bottom Layer And Via (4440mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4437mil) from Top Layer to Bottom Layer And Via (4464mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4440mil,4461mil) from Top Layer to Bottom Layer And Via (4464mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.422mil < 10mil) Between Via (4442.15mil,4575.7mil) from Top Layer to Bottom Layer And Via (4464.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.422mil] / [Bottom Solder] Mask Sliver [9.422mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4442.15mil,4575.7mil) from Top Layer to Bottom Layer And Via (4466.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.102mil < 10mil) Between Via (4444.9mil,4621.6mil) from Top Layer to Bottom Layer And Via (4460.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.102mil] / [Bottom Solder] Mask Sliver [5.102mil]
Minimum Solder Mask Sliver Constraint: (7.914mil < 10mil) Between Via (4444.9mil,4621.6mil) from Top Layer to Bottom Layer And Via (4464.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.914mil] / [Bottom Solder] Mask Sliver [7.914mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4444.9mil,4621.6mil) from Top Layer to Bottom Layer And Via (4468.9mil,4621.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4446.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4446.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4446.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4470.7mil,3966.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4446.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4446.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4446.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4470.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4446.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4446.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4446.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4470.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4446.7mil,4038.6mil) from Top Layer to Bottom Layer And Via (4470.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4447.7mil,4752.3mil) from Top Layer to Bottom Layer And Via (4447.7mil,4776.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4447.7mil,4752.3mil) from Top Layer to Bottom Layer And Via (4471.7mil,4752.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4447.7mil,4776.3mil) from Top Layer to Bottom Layer And Via (4447.7mil,4800.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4447.7mil,4776.3mil) from Top Layer to Bottom Layer And Via (4471.7mil,4776.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4447.7mil,4800.3mil) from Top Layer to Bottom Layer And Via (4447.7mil,4824.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4447.7mil,4800.3mil) from Top Layer to Bottom Layer And Via (4471.7mil,4800.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4447.7mil,4824.3mil) from Top Layer to Bottom Layer And Via (4447.7mil,4848.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4447.7mil,4824.3mil) from Top Layer to Bottom Layer And Via (4471.7mil,4824.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4447.7mil,4848.3mil) from Top Layer to Bottom Layer And Via (4447.7mil,4872.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4447.7mil,4848.3mil) from Top Layer to Bottom Layer And Via (4471.7mil,4848.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4447.7mil,4872.3mil) from Top Layer to Bottom Layer And Via (4447.7mil,4896.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4447.7mil,4872.3mil) from Top Layer to Bottom Layer And Via (4471.7mil,4872.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4447.7mil,4896.3mil) from Top Layer to Bottom Layer And Via (4471.7mil,4896.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.761mil < 10mil) Between Via (4448.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4450.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.761mil] / [Bottom Solder] Mask Sliver [0.761mil]
Minimum Solder Mask Sliver Constraint: (4.693mil < 10mil) Between Via (4448.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4466.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.693mil] / [Bottom Solder] Mask Sliver [4.693mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4448.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4472.3mil,4554.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.352mil < 10mil) Between Via (4450.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4458.3mil,4509.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.352mil] / [Bottom Solder] Mask Sliver [0.352mil]
Minimum Solder Mask Sliver Constraint: (9.47mil < 10mil) Between Via (4450.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4472.3mil,4554.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.47mil] / [Bottom Solder] Mask Sliver [9.47mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4450.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4474.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (6.276mil < 10mil) Between Via (4450.4mil,4059.3mil) from Top Layer to Bottom Layer And Via (4470.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.276mil] / [Bottom Solder] Mask Sliver [6.276mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4450.4mil,4059.3mil) from Top Layer to Bottom Layer And Via (4474.4mil,4059.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4455.1mil,4713.2mil) from Top Layer to Bottom Layer And Via (4479.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.105mil < 10mil) Between Via (4458.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4474.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.105mil] / [Bottom Solder] Mask Sliver [4.105mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4458.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4482.3mil,4509.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.307mil < 10mil) Between Via (4458.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4461.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.307mil] / [Bottom Solder] Mask Sliver [0.307mil]
Minimum Solder Mask Sliver Constraint: (7.059mil < 10mil) Between Via (4458.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4479.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.06mil] / [Bottom Solder] Mask Sliver [7.06mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4458.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4482.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.519mil < 10mil) Between Via (4460.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4461.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.518mil] / [Bottom Solder] Mask Sliver [1.518mil]
Minimum Solder Mask Sliver Constraint: (1.898mil < 10mil) Between Via (4460.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4468.9mil,4621.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.898mil] / [Bottom Solder] Mask Sliver [1.898mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4460.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4484.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.146mil < 10mil) Between Via (4461.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4482.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.146mil] / [Bottom Solder] Mask Sliver [8.146mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4461.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4485.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.018mil < 10mil) Between Via (4464.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4466.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.018mil] / [Bottom Solder] Mask Sliver [0.018mil]
Minimum Solder Mask Sliver Constraint: (0.826mil < 10mil) Between Via (4464.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4468.9mil,4621.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.826mil] / [Bottom Solder] Mask Sliver [0.826mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4488.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4077mil) from Top Layer to Bottom Layer And Via (4464mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4077mil) from Top Layer to Bottom Layer And Via (4488mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4101mil) from Top Layer to Bottom Layer And Via (4464mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4101mil) from Top Layer to Bottom Layer And Via (4488mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4125mil) from Top Layer to Bottom Layer And Via (4464mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4125mil) from Top Layer to Bottom Layer And Via (4488mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4149mil) from Top Layer to Bottom Layer And Via (4464mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4149mil) from Top Layer to Bottom Layer And Via (4488mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4173mil) from Top Layer to Bottom Layer And Via (4464mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4173mil) from Top Layer to Bottom Layer And Via (4488mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4197mil) from Top Layer to Bottom Layer And Via (4464mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4197mil) from Top Layer to Bottom Layer And Via (4488mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4221mil) from Top Layer to Bottom Layer And Via (4464mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4221mil) from Top Layer to Bottom Layer And Via (4488mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4245mil) from Top Layer to Bottom Layer And Via (4464mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4245mil) from Top Layer to Bottom Layer And Via (4488mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4269mil) from Top Layer to Bottom Layer And Via (4464mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4269mil) from Top Layer to Bottom Layer And Via (4488mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4293mil) from Top Layer to Bottom Layer And Via (4464mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4293mil) from Top Layer to Bottom Layer And Via (4488mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4317mil) from Top Layer to Bottom Layer And Via (4464mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4317mil) from Top Layer to Bottom Layer And Via (4488mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4341mil) from Top Layer to Bottom Layer And Via (4464mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4341mil) from Top Layer to Bottom Layer And Via (4488mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4365mil) from Top Layer to Bottom Layer And Via (4464mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4365mil) from Top Layer to Bottom Layer And Via (4488mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4389mil) from Top Layer to Bottom Layer And Via (4464mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4389mil) from Top Layer to Bottom Layer And Via (4488mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4413mil) from Top Layer to Bottom Layer And Via (4464mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4413mil) from Top Layer to Bottom Layer And Via (4488mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4437mil) from Top Layer to Bottom Layer And Via (4464mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4437mil) from Top Layer to Bottom Layer And Via (4488mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4464mil,4461mil) from Top Layer to Bottom Layer And Via (4488mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.422mil < 10mil) Between Via (4466.15mil,4575.7mil) from Top Layer to Bottom Layer And Via (4488.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.422mil] / [Bottom Solder] Mask Sliver [9.422mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4466.15mil,4575.7mil) from Top Layer to Bottom Layer And Via (4490.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.102mil < 10mil) Between Via (4468.9mil,4621.6mil) from Top Layer to Bottom Layer And Via (4484.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.102mil] / [Bottom Solder] Mask Sliver [5.102mil]
Minimum Solder Mask Sliver Constraint: (7.914mil < 10mil) Between Via (4468.9mil,4621.6mil) from Top Layer to Bottom Layer And Via (4488.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.914mil] / [Bottom Solder] Mask Sliver [7.914mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4468.9mil,4621.6mil) from Top Layer to Bottom Layer And Via (4492.9mil,4621.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4470.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4470.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4470.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4494.7mil,3966.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4470.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4470.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4470.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4494.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4470.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4470.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4470.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4494.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4470.7mil,4038.6mil) from Top Layer to Bottom Layer And Via (4494.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4471.7mil,4752.3mil) from Top Layer to Bottom Layer And Via (4471.7mil,4776.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.289mil < 10mil) Between Via (4471.7mil,4752.3mil) from Top Layer to Bottom Layer And Via (4494.7mil,4752.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.289mil] / [Bottom Solder] Mask Sliver [0.289mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4471.7mil,4776.3mil) from Top Layer to Bottom Layer And Via (4471.7mil,4800.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.289mil < 10mil) Between Via (4471.7mil,4776.3mil) from Top Layer to Bottom Layer And Via (4494.7mil,4776.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.289mil] / [Bottom Solder] Mask Sliver [0.289mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4471.7mil,4800.3mil) from Top Layer to Bottom Layer And Via (4471.7mil,4824.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.289mil < 10mil) Between Via (4471.7mil,4800.3mil) from Top Layer to Bottom Layer And Via (4494.7mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.289mil] / [Bottom Solder] Mask Sliver [0.289mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4471.7mil,4824.3mil) from Top Layer to Bottom Layer And Via (4471.7mil,4848.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.289mil < 10mil) Between Via (4471.7mil,4824.3mil) from Top Layer to Bottom Layer And Via (4494.7mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.289mil] / [Bottom Solder] Mask Sliver [0.289mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4471.7mil,4848.3mil) from Top Layer to Bottom Layer And Via (4471.7mil,4872.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.289mil < 10mil) Between Via (4471.7mil,4848.3mil) from Top Layer to Bottom Layer And Via (4494.7mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.289mil] / [Bottom Solder] Mask Sliver [0.289mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4471.7mil,4872.3mil) from Top Layer to Bottom Layer And Via (4471.7mil,4896.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.289mil < 10mil) Between Via (4471.7mil,4872.3mil) from Top Layer to Bottom Layer And Via (4494.7mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.289mil] / [Bottom Solder] Mask Sliver [0.289mil]
Minimum Solder Mask Sliver Constraint: (0.761mil < 10mil) Between Via (4472.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4474.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.761mil] / [Bottom Solder] Mask Sliver [0.761mil]
Minimum Solder Mask Sliver Constraint: (4.693mil < 10mil) Between Via (4472.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4490.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.693mil] / [Bottom Solder] Mask Sliver [4.693mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4472.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4496.3mil,4554.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.352mil < 10mil) Between Via (4474.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4482.3mil,4509.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.352mil] / [Bottom Solder] Mask Sliver [0.352mil]
Minimum Solder Mask Sliver Constraint: (9.47mil < 10mil) Between Via (4474.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4496.3mil,4554.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.47mil] / [Bottom Solder] Mask Sliver [9.47mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4474.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4498.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (6.276mil < 10mil) Between Via (4474.4mil,4059.3mil) from Top Layer to Bottom Layer And Via (4494.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.276mil] / [Bottom Solder] Mask Sliver [6.276mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4474.4mil,4059.3mil) from Top Layer to Bottom Layer And Via (4498.4mil,4059.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4479.1mil,4713.2mil) from Top Layer to Bottom Layer And Via (4503.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.105mil < 10mil) Between Via (4482.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4498.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.105mil] / [Bottom Solder] Mask Sliver [4.105mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4482.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4506.3mil,4509.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.307mil < 10mil) Between Via (4482.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4485.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.307mil] / [Bottom Solder] Mask Sliver [0.307mil]
Minimum Solder Mask Sliver Constraint: (7.059mil < 10mil) Between Via (4482.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4503.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.06mil] / [Bottom Solder] Mask Sliver [7.06mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4482.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4506.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.519mil < 10mil) Between Via (4484.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4485.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.518mil] / [Bottom Solder] Mask Sliver [1.518mil]
Minimum Solder Mask Sliver Constraint: (1.898mil < 10mil) Between Via (4484.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4492.9mil,4621.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.898mil] / [Bottom Solder] Mask Sliver [1.898mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4484.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4508.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.146mil < 10mil) Between Via (4485.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4506.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.146mil] / [Bottom Solder] Mask Sliver [8.146mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4485.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4509.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.018mil < 10mil) Between Via (4488.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4490.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.018mil] / [Bottom Solder] Mask Sliver [0.018mil]
Minimum Solder Mask Sliver Constraint: (0.826mil < 10mil) Between Via (4488.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4492.9mil,4621.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.826mil] / [Bottom Solder] Mask Sliver [0.826mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4512.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4077mil) from Top Layer to Bottom Layer And Via (4488mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4077mil) from Top Layer to Bottom Layer And Via (4512mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4101mil) from Top Layer to Bottom Layer And Via (4488mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4101mil) from Top Layer to Bottom Layer And Via (4512mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4125mil) from Top Layer to Bottom Layer And Via (4488mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4125mil) from Top Layer to Bottom Layer And Via (4512mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4149mil) from Top Layer to Bottom Layer And Via (4488mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4149mil) from Top Layer to Bottom Layer And Via (4512mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4173mil) from Top Layer to Bottom Layer And Via (4488mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4173mil) from Top Layer to Bottom Layer And Via (4512mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4197mil) from Top Layer to Bottom Layer And Via (4488mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4197mil) from Top Layer to Bottom Layer And Via (4512mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4221mil) from Top Layer to Bottom Layer And Via (4488mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4221mil) from Top Layer to Bottom Layer And Via (4512mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4245mil) from Top Layer to Bottom Layer And Via (4488mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4245mil) from Top Layer to Bottom Layer And Via (4512mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4269mil) from Top Layer to Bottom Layer And Via (4488mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4269mil) from Top Layer to Bottom Layer And Via (4512mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4293mil) from Top Layer to Bottom Layer And Via (4488mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4293mil) from Top Layer to Bottom Layer And Via (4512mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4317mil) from Top Layer to Bottom Layer And Via (4488mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4317mil) from Top Layer to Bottom Layer And Via (4512mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4341mil) from Top Layer to Bottom Layer And Via (4488mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4341mil) from Top Layer to Bottom Layer And Via (4512mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4365mil) from Top Layer to Bottom Layer And Via (4488mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4365mil) from Top Layer to Bottom Layer And Via (4512mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4389mil) from Top Layer to Bottom Layer And Via (4488mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4389mil) from Top Layer to Bottom Layer And Via (4512mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4413mil) from Top Layer to Bottom Layer And Via (4488mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4413mil) from Top Layer to Bottom Layer And Via (4512mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4437mil) from Top Layer to Bottom Layer And Via (4488mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4437mil) from Top Layer to Bottom Layer And Via (4512mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4488mil,4461mil) from Top Layer to Bottom Layer And Via (4512mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.422mil < 10mil) Between Via (4490.15mil,4575.7mil) from Top Layer to Bottom Layer And Via (4512.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.422mil] / [Bottom Solder] Mask Sliver [9.422mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4490.15mil,4575.7mil) from Top Layer to Bottom Layer And Via (4514.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.102mil < 10mil) Between Via (4492.9mil,4621.6mil) from Top Layer to Bottom Layer And Via (4508.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.102mil] / [Bottom Solder] Mask Sliver [5.102mil]
Minimum Solder Mask Sliver Constraint: (7.914mil < 10mil) Between Via (4492.9mil,4621.6mil) from Top Layer to Bottom Layer And Via (4512.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.914mil] / [Bottom Solder] Mask Sliver [7.914mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4492.9mil,4621.6mil) from Top Layer to Bottom Layer And Via (4516.9mil,4621.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4494.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4518.7mil,3966.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4494.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4518.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4494.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4518.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,4038.6mil) from Top Layer to Bottom Layer And Via (4518.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,4752.8mil) from Top Layer to Bottom Layer And Via (4494.7mil,4776.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,4752.8mil) from Top Layer to Bottom Layer And Via (4518.7mil,4752.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,4776.8mil) from Top Layer to Bottom Layer And Via (4494.7mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,4776.8mil) from Top Layer to Bottom Layer And Via (4518.7mil,4776.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,4800.8mil) from Top Layer to Bottom Layer And Via (4494.7mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,4800.8mil) from Top Layer to Bottom Layer And Via (4518.7mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,4824.8mil) from Top Layer to Bottom Layer And Via (4494.7mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,4824.8mil) from Top Layer to Bottom Layer And Via (4518.7mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,4848.8mil) from Top Layer to Bottom Layer And Via (4494.7mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,4848.8mil) from Top Layer to Bottom Layer And Via (4518.7mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4494.7mil,4872.8mil) from Top Layer to Bottom Layer And Via (4518.7mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.761mil < 10mil) Between Via (4496.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4498.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.761mil] / [Bottom Solder] Mask Sliver [0.761mil]
Minimum Solder Mask Sliver Constraint: (4.693mil < 10mil) Between Via (4496.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4514.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.693mil] / [Bottom Solder] Mask Sliver [4.693mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4496.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4520.3mil,4554.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.352mil < 10mil) Between Via (4498.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4506.3mil,4509.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.352mil] / [Bottom Solder] Mask Sliver [0.352mil]
Minimum Solder Mask Sliver Constraint: (9.47mil < 10mil) Between Via (4498.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4520.3mil,4554.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.47mil] / [Bottom Solder] Mask Sliver [9.47mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4498.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4522.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (6.276mil < 10mil) Between Via (4498.4mil,4059.3mil) from Top Layer to Bottom Layer And Via (4518.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.276mil] / [Bottom Solder] Mask Sliver [6.276mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4498.4mil,4059.3mil) from Top Layer to Bottom Layer And Via (4522.4mil,4059.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4503.1mil,4713.2mil) from Top Layer to Bottom Layer And Via (4527.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.105mil < 10mil) Between Via (4506.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4522.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.105mil] / [Bottom Solder] Mask Sliver [4.105mil]
Minimum Solder Mask Sliver Constraint: (6.459mil < 10mil) Between Via (4506.3mil,4509.9mil) from Top Layer to Bottom Layer And Via (4535.4mil,4512mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.459mil] / [Bottom Solder] Mask Sliver [6.459mil]
Minimum Solder Mask Sliver Constraint: (0.307mil < 10mil) Between Via (4506.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4509.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.307mil] / [Bottom Solder] Mask Sliver [0.307mil]
Minimum Solder Mask Sliver Constraint: (7.059mil < 10mil) Between Via (4506.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4527.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.06mil] / [Bottom Solder] Mask Sliver [7.06mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4506.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4530.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.519mil < 10mil) Between Via (4508.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4509.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.518mil] / [Bottom Solder] Mask Sliver [1.518mil]
Minimum Solder Mask Sliver Constraint: (1.898mil < 10mil) Between Via (4508.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4516.9mil,4621.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.898mil] / [Bottom Solder] Mask Sliver [1.898mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4508.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4532.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.146mil < 10mil) Between Via (4509.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4530.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.146mil] / [Bottom Solder] Mask Sliver [8.146mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4509.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4533.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.018mil < 10mil) Between Via (4512.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4514.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.018mil] / [Bottom Solder] Mask Sliver [0.018mil]
Minimum Solder Mask Sliver Constraint: (0.826mil < 10mil) Between Via (4512.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4516.9mil,4621.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.826mil] / [Bottom Solder] Mask Sliver [0.826mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4536.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4077mil) from Top Layer to Bottom Layer And Via (4512mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4077mil) from Top Layer to Bottom Layer And Via (4536mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4101mil) from Top Layer to Bottom Layer And Via (4512mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4101mil) from Top Layer to Bottom Layer And Via (4536mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4125mil) from Top Layer to Bottom Layer And Via (4512mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4125mil) from Top Layer to Bottom Layer And Via (4536mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4149mil) from Top Layer to Bottom Layer And Via (4512mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4149mil) from Top Layer to Bottom Layer And Via (4536mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4173mil) from Top Layer to Bottom Layer And Via (4512mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4173mil) from Top Layer to Bottom Layer And Via (4536mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4197mil) from Top Layer to Bottom Layer And Via (4512mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4197mil) from Top Layer to Bottom Layer And Via (4536mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4221mil) from Top Layer to Bottom Layer And Via (4512mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4221mil) from Top Layer to Bottom Layer And Via (4536mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4245mil) from Top Layer to Bottom Layer And Via (4512mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4245mil) from Top Layer to Bottom Layer And Via (4536mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4269mil) from Top Layer to Bottom Layer And Via (4512mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4269mil) from Top Layer to Bottom Layer And Via (4536mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4293mil) from Top Layer to Bottom Layer And Via (4512mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4293mil) from Top Layer to Bottom Layer And Via (4536mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4317mil) from Top Layer to Bottom Layer And Via (4512mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4317mil) from Top Layer to Bottom Layer And Via (4536mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4341mil) from Top Layer to Bottom Layer And Via (4512mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4341mil) from Top Layer to Bottom Layer And Via (4536mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4365mil) from Top Layer to Bottom Layer And Via (4512mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4365mil) from Top Layer to Bottom Layer And Via (4536mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4389mil) from Top Layer to Bottom Layer And Via (4512mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4389mil) from Top Layer to Bottom Layer And Via (4536mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4413mil) from Top Layer to Bottom Layer And Via (4512mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4413mil) from Top Layer to Bottom Layer And Via (4536mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4437mil) from Top Layer to Bottom Layer And Via (4512mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4437mil) from Top Layer to Bottom Layer And Via (4536mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4512mil,4461mil) from Top Layer to Bottom Layer And Via (4536mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.422mil < 10mil) Between Via (4514.15mil,4575.7mil) from Top Layer to Bottom Layer And Via (4536.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.422mil] / [Bottom Solder] Mask Sliver [9.422mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4514.15mil,4575.7mil) from Top Layer to Bottom Layer And Via (4538.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.102mil < 10mil) Between Via (4516.9mil,4621.6mil) from Top Layer to Bottom Layer And Via (4532.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.102mil] / [Bottom Solder] Mask Sliver [5.102mil]
Minimum Solder Mask Sliver Constraint: (7.914mil < 10mil) Between Via (4516.9mil,4621.6mil) from Top Layer to Bottom Layer And Via (4536.9mil,4598.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.914mil] / [Bottom Solder] Mask Sliver [7.914mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4516.9mil,4621.6mil) from Top Layer to Bottom Layer And Via (4540.9mil,4621.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4518.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4518.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4518.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4542.7mil,3966.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4518.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4518.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4518.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4542.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4518.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4518.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4518.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4542.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4518.7mil,4038.6mil) from Top Layer to Bottom Layer And Via (4542.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4518.7mil,4752.8mil) from Top Layer to Bottom Layer And Via (4518.7mil,4776.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.284mil < 10mil) Between Via (4518.7mil,4752.8mil) from Top Layer to Bottom Layer And Via (4541.7mil,4752.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.284mil] / [Bottom Solder] Mask Sliver [0.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4518.7mil,4776.8mil) from Top Layer to Bottom Layer And Via (4518.7mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.284mil < 10mil) Between Via (4518.7mil,4776.8mil) from Top Layer to Bottom Layer And Via (4541.7mil,4776.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.284mil] / [Bottom Solder] Mask Sliver [0.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4518.7mil,4800.8mil) from Top Layer to Bottom Layer And Via (4518.7mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.284mil < 10mil) Between Via (4518.7mil,4800.8mil) from Top Layer to Bottom Layer And Via (4541.7mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.284mil] / [Bottom Solder] Mask Sliver [0.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4518.7mil,4824.8mil) from Top Layer to Bottom Layer And Via (4518.7mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.284mil < 10mil) Between Via (4518.7mil,4824.8mil) from Top Layer to Bottom Layer And Via (4541.7mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.284mil] / [Bottom Solder] Mask Sliver [0.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4518.7mil,4848.8mil) from Top Layer to Bottom Layer And Via (4518.7mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.284mil < 10mil) Between Via (4518.7mil,4848.8mil) from Top Layer to Bottom Layer And Via (4541.7mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.284mil] / [Bottom Solder] Mask Sliver [0.284mil]
Minimum Solder Mask Sliver Constraint: (0.284mil < 10mil) Between Via (4518.7mil,4872.8mil) from Top Layer to Bottom Layer And Via (4541.7mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.284mil] / [Bottom Solder] Mask Sliver [0.284mil]
Minimum Solder Mask Sliver Constraint: (0.761mil < 10mil) Between Via (4520.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4522.2mil,4531.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.761mil] / [Bottom Solder] Mask Sliver [0.761mil]
Minimum Solder Mask Sliver Constraint: (4.693mil < 10mil) Between Via (4520.3mil,4554.9mil) from Top Layer to Bottom Layer And Via (4538.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.693mil] / [Bottom Solder] Mask Sliver [4.693mil]
Minimum Solder Mask Sliver Constraint: (0.831mil < 10mil) Between Via (4522.2mil,4531.5mil) from Top Layer to Bottom Layer And Via (4535.4mil,4512mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.831mil] / [Bottom Solder] Mask Sliver [0.831mil]
Minimum Solder Mask Sliver Constraint: (6.276mil < 10mil) Between Via (4522.4mil,4059.3mil) from Top Layer to Bottom Layer And Via (4542.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.276mil] / [Bottom Solder] Mask Sliver [6.276mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4522.4mil,4059.3mil) from Top Layer to Bottom Layer And Via (4546.4mil,4059.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.986mil < 10mil) Between Via (4526.4mil,5352.2mil) from Top Layer to Bottom Layer And Via (4557.1mil,5351.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.986mil] / [Bottom Solder] Mask Sliver [7.986mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4527.1mil,4713.2mil) from Top Layer to Bottom Layer And Via (4551.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.307mil < 10mil) Between Via (4530.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4533.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.307mil] / [Bottom Solder] Mask Sliver [0.307mil]
Minimum Solder Mask Sliver Constraint: (7.059mil < 10mil) Between Via (4530.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4551.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.06mil] / [Bottom Solder] Mask Sliver [7.06mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4530.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4554.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.519mil < 10mil) Between Via (4532.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4533.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.518mil] / [Bottom Solder] Mask Sliver [1.518mil]
Minimum Solder Mask Sliver Constraint: (1.898mil < 10mil) Between Via (4532.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4540.9mil,4621.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.898mil] / [Bottom Solder] Mask Sliver [1.898mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4532.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4556.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.146mil < 10mil) Between Via (4533.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4554.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.146mil] / [Bottom Solder] Mask Sliver [8.146mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4533.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4557.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.018mil < 10mil) Between Via (4536.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4538.15mil,4575.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.018mil] / [Bottom Solder] Mask Sliver [0.018mil]
Minimum Solder Mask Sliver Constraint: (0.826mil < 10mil) Between Via (4536.9mil,4598.4mil) from Top Layer to Bottom Layer And Via (4540.9mil,4621.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.826mil] / [Bottom Solder] Mask Sliver [0.826mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4077mil) from Top Layer to Bottom Layer And Via (4536mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4077mil) from Top Layer to Bottom Layer And Via (4560mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4101mil) from Top Layer to Bottom Layer And Via (4536mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4101mil) from Top Layer to Bottom Layer And Via (4560mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4125mil) from Top Layer to Bottom Layer And Via (4536mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4125mil) from Top Layer to Bottom Layer And Via (4560mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4149mil) from Top Layer to Bottom Layer And Via (4536mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4149mil) from Top Layer to Bottom Layer And Via (4560mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4173mil) from Top Layer to Bottom Layer And Via (4536mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4173mil) from Top Layer to Bottom Layer And Via (4560mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4197mil) from Top Layer to Bottom Layer And Via (4536mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4197mil) from Top Layer to Bottom Layer And Via (4560mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4221mil) from Top Layer to Bottom Layer And Via (4536mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4221mil) from Top Layer to Bottom Layer And Via (4560mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4245mil) from Top Layer to Bottom Layer And Via (4536mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4245mil) from Top Layer to Bottom Layer And Via (4560mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4269mil) from Top Layer to Bottom Layer And Via (4536mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4269mil) from Top Layer to Bottom Layer And Via (4560mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4293mil) from Top Layer to Bottom Layer And Via (4536mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4293mil) from Top Layer to Bottom Layer And Via (4560mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4317mil) from Top Layer to Bottom Layer And Via (4536mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4317mil) from Top Layer to Bottom Layer And Via (4560mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4341mil) from Top Layer to Bottom Layer And Via (4536mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4341mil) from Top Layer to Bottom Layer And Via (4560mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4365mil) from Top Layer to Bottom Layer And Via (4536mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4365mil) from Top Layer to Bottom Layer And Via (4560mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4389mil) from Top Layer to Bottom Layer And Via (4536mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4389mil) from Top Layer to Bottom Layer And Via (4560mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4413mil) from Top Layer to Bottom Layer And Via (4536mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4413mil) from Top Layer to Bottom Layer And Via (4560mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4437mil) from Top Layer to Bottom Layer And Via (4536mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4437mil) from Top Layer to Bottom Layer And Via (4560mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4536mil,4461mil) from Top Layer to Bottom Layer And Via (4560mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.102mil < 10mil) Between Via (4540.9mil,4621.6mil) from Top Layer to Bottom Layer And Via (4556.4mil,4644.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.102mil] / [Bottom Solder] Mask Sliver [5.102mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4541.7mil,4752.8mil) from Top Layer to Bottom Layer And Via (4541.7mil,4776.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4541.7mil,4752.8mil) from Top Layer to Bottom Layer And Via (4565.7mil,4752.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4541.7mil,4776.8mil) from Top Layer to Bottom Layer And Via (4541.7mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4541.7mil,4776.8mil) from Top Layer to Bottom Layer And Via (4565.7mil,4776.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4541.7mil,4800.8mil) from Top Layer to Bottom Layer And Via (4541.7mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4541.7mil,4800.8mil) from Top Layer to Bottom Layer And Via (4565.7mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4541.7mil,4824.8mil) from Top Layer to Bottom Layer And Via (4541.7mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4541.7mil,4824.8mil) from Top Layer to Bottom Layer And Via (4565.7mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4541.7mil,4848.8mil) from Top Layer to Bottom Layer And Via (4541.7mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4541.7mil,4848.8mil) from Top Layer to Bottom Layer And Via (4565.7mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4541.7mil,4872.8mil) from Top Layer to Bottom Layer And Via (4565.7mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4542.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4542.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4542.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4566.7mil,3966.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4542.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4542.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4542.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4566.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4542.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4542.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4542.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4566.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4542.7mil,4038.6mil) from Top Layer to Bottom Layer And Via (4566.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (6.276mil < 10mil) Between Via (4546.4mil,4059.3mil) from Top Layer to Bottom Layer And Via (4566.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.276mil] / [Bottom Solder] Mask Sliver [6.276mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4546.4mil,4059.3mil) from Top Layer to Bottom Layer And Via (4570.4mil,4059.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4551.1mil,4713.2mil) from Top Layer to Bottom Layer And Via (4575.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.307mil < 10mil) Between Via (4554.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4557.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.307mil] / [Bottom Solder] Mask Sliver [0.307mil]
Minimum Solder Mask Sliver Constraint: (7.059mil < 10mil) Between Via (4554.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4575.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.06mil] / [Bottom Solder] Mask Sliver [7.06mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4554.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4578.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.519mil < 10mil) Between Via (4556.4mil,4644.7mil) from Top Layer to Bottom Layer And Via (4557.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.518mil] / [Bottom Solder] Mask Sliver [1.518mil]
Minimum Solder Mask Sliver Constraint: (8.146mil < 10mil) Between Via (4557.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4578.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.146mil] / [Bottom Solder] Mask Sliver [8.146mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4557.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4581.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4077mil) from Top Layer to Bottom Layer And Via (4560mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4077mil) from Top Layer to Bottom Layer And Via (4584mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4101mil) from Top Layer to Bottom Layer And Via (4560mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4101mil) from Top Layer to Bottom Layer And Via (4584mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4125mil) from Top Layer to Bottom Layer And Via (4560mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4125mil) from Top Layer to Bottom Layer And Via (4584mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4149mil) from Top Layer to Bottom Layer And Via (4560mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4149mil) from Top Layer to Bottom Layer And Via (4584mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4173mil) from Top Layer to Bottom Layer And Via (4560mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4173mil) from Top Layer to Bottom Layer And Via (4584mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4197mil) from Top Layer to Bottom Layer And Via (4560mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4197mil) from Top Layer to Bottom Layer And Via (4584mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4221mil) from Top Layer to Bottom Layer And Via (4560mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4221mil) from Top Layer to Bottom Layer And Via (4584mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4245mil) from Top Layer to Bottom Layer And Via (4560mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4245mil) from Top Layer to Bottom Layer And Via (4584mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4269mil) from Top Layer to Bottom Layer And Via (4560mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4269mil) from Top Layer to Bottom Layer And Via (4584mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4293mil) from Top Layer to Bottom Layer And Via (4560mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4293mil) from Top Layer to Bottom Layer And Via (4584mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4317mil) from Top Layer to Bottom Layer And Via (4560mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4317mil) from Top Layer to Bottom Layer And Via (4584mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4341mil) from Top Layer to Bottom Layer And Via (4560mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4341mil) from Top Layer to Bottom Layer And Via (4584mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4365mil) from Top Layer to Bottom Layer And Via (4560mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4365mil) from Top Layer to Bottom Layer And Via (4584mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4389mil) from Top Layer to Bottom Layer And Via (4560mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4389mil) from Top Layer to Bottom Layer And Via (4584mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4413mil) from Top Layer to Bottom Layer And Via (4560mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4413mil) from Top Layer to Bottom Layer And Via (4584mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4437mil) from Top Layer to Bottom Layer And Via (4560mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4437mil) from Top Layer to Bottom Layer And Via (4584mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4560mil,4461mil) from Top Layer to Bottom Layer And Via (4584mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4565.7mil,4752.8mil) from Top Layer to Bottom Layer And Via (4565.7mil,4776.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.748mil < 10mil) Between Via (4565.7mil,4752.8mil) from Top Layer to Bottom Layer And Via (4587mil,4777.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.748mil] / [Bottom Solder] Mask Sliver [9.748mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4565.7mil,4776.8mil) from Top Layer to Bottom Layer And Via (4565.7mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9mil < 10mil) Between Via (4565.7mil,4776.8mil) from Top Layer to Bottom Layer And Via (4587mil,4753.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9mil] / [Bottom Solder] Mask Sliver [9mil]
Minimum Solder Mask Sliver Constraint: (9.748mil < 10mil) Between Via (4565.7mil,4776.8mil) from Top Layer to Bottom Layer And Via (4587mil,4801.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.748mil] / [Bottom Solder] Mask Sliver [9.748mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4565.7mil,4800.8mil) from Top Layer to Bottom Layer And Via (4565.7mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9mil < 10mil) Between Via (4565.7mil,4800.8mil) from Top Layer to Bottom Layer And Via (4587mil,4777.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9mil] / [Bottom Solder] Mask Sliver [9mil]
Minimum Solder Mask Sliver Constraint: (9.748mil < 10mil) Between Via (4565.7mil,4800.8mil) from Top Layer to Bottom Layer And Via (4587mil,4825.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.748mil] / [Bottom Solder] Mask Sliver [9.748mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4565.7mil,4824.8mil) from Top Layer to Bottom Layer And Via (4565.7mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9mil < 10mil) Between Via (4565.7mil,4824.8mil) from Top Layer to Bottom Layer And Via (4587mil,4801.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9mil] / [Bottom Solder] Mask Sliver [9mil]
Minimum Solder Mask Sliver Constraint: (9.748mil < 10mil) Between Via (4565.7mil,4824.8mil) from Top Layer to Bottom Layer And Via (4587mil,4849.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.748mil] / [Bottom Solder] Mask Sliver [9.748mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4565.7mil,4848.8mil) from Top Layer to Bottom Layer And Via (4565.7mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9mil < 10mil) Between Via (4565.7mil,4848.8mil) from Top Layer to Bottom Layer And Via (4587mil,4825.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9mil] / [Bottom Solder] Mask Sliver [9mil]
Minimum Solder Mask Sliver Constraint: (9.748mil < 10mil) Between Via (4565.7mil,4848.8mil) from Top Layer to Bottom Layer And Via (4587mil,4873.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.748mil] / [Bottom Solder] Mask Sliver [9.748mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4565.7mil,4872.8mil) from Top Layer to Bottom Layer And Via (4565.7mil,4896.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9mil < 10mil) Between Via (4565.7mil,4872.8mil) from Top Layer to Bottom Layer And Via (4587mil,4849.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9mil] / [Bottom Solder] Mask Sliver [9mil]
Minimum Solder Mask Sliver Constraint: (9.748mil < 10mil) Between Via (4565.7mil,4872.8mil) from Top Layer to Bottom Layer And Via (4587mil,4897.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.748mil] / [Bottom Solder] Mask Sliver [9.748mil]
Minimum Solder Mask Sliver Constraint: (9mil < 10mil) Between Via (4565.7mil,4896.8mil) from Top Layer to Bottom Layer And Via (4587mil,4873.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9mil] / [Bottom Solder] Mask Sliver [9mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4566.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4566.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4566.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4590.7mil,3966.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4566.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4566.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4566.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4590.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4566.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4566.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4566.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4590.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4566.7mil,4038.6mil) from Top Layer to Bottom Layer And Via (4590.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.206mil < 10mil) Between Via (4567.1mil,5517mil) from Top Layer to Bottom Layer And Via (4589.9mil,5519.361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.206mil] / [Bottom Solder] Mask Sliver [0.206mil]
Minimum Solder Mask Sliver Constraint: (6.276mil < 10mil) Between Via (4570.4mil,4059.3mil) from Top Layer to Bottom Layer And Via (4590.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.276mil] / [Bottom Solder] Mask Sliver [6.276mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4575.1mil,4713.2mil) from Top Layer to Bottom Layer And Via (4599.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.307mil < 10mil) Between Via (4578.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4581.7mil,4668.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.307mil] / [Bottom Solder] Mask Sliver [0.307mil]
Minimum Solder Mask Sliver Constraint: (7.059mil < 10mil) Between Via (4578.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4599.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.06mil] / [Bottom Solder] Mask Sliver [7.06mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4578.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4602.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.146mil < 10mil) Between Via (4581.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4602.5mil,4691.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.146mil] / [Bottom Solder] Mask Sliver [8.146mil]
Minimum Solder Mask Sliver Constraint: (2.1mil < 10mil) Between Via (4581.7mil,4668.9mil) from Top Layer to Bottom Layer And Via (4606.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.1mil] / [Bottom Solder] Mask Sliver [2.1mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4077mil) from Top Layer to Bottom Layer And Via (4584mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4101mil) from Top Layer to Bottom Layer And Via (4584mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4125mil) from Top Layer to Bottom Layer And Via (4584mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4149mil) from Top Layer to Bottom Layer And Via (4584mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4173mil) from Top Layer to Bottom Layer And Via (4584mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4197mil) from Top Layer to Bottom Layer And Via (4584mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4221mil) from Top Layer to Bottom Layer And Via (4584mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4245mil) from Top Layer to Bottom Layer And Via (4584mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4269mil) from Top Layer to Bottom Layer And Via (4584mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4293mil) from Top Layer to Bottom Layer And Via (4584mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4317mil) from Top Layer to Bottom Layer And Via (4584mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4341mil) from Top Layer to Bottom Layer And Via (4584mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4365mil) from Top Layer to Bottom Layer And Via (4584mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4389mil) from Top Layer to Bottom Layer And Via (4584mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4413mil) from Top Layer to Bottom Layer And Via (4584mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4584mil,4437mil) from Top Layer to Bottom Layer And Via (4584mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4587mil,4753.3mil) from Top Layer to Bottom Layer And Via (4587mil,4777.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4587mil,4753.3mil) from Top Layer to Bottom Layer And Via (4611mil,4753.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4587mil,4777.3mil) from Top Layer to Bottom Layer And Via (4587mil,4801.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4587mil,4777.3mil) from Top Layer to Bottom Layer And Via (4611mil,4777.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4587mil,4801.3mil) from Top Layer to Bottom Layer And Via (4587mil,4825.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4587mil,4801.3mil) from Top Layer to Bottom Layer And Via (4611mil,4801.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4587mil,4825.3mil) from Top Layer to Bottom Layer And Via (4587mil,4849.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4587mil,4825.3mil) from Top Layer to Bottom Layer And Via (4611mil,4825.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4587mil,4849.3mil) from Top Layer to Bottom Layer And Via (4587mil,4873.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4587mil,4849.3mil) from Top Layer to Bottom Layer And Via (4611mil,4849.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4587mil,4873.3mil) from Top Layer to Bottom Layer And Via (4587mil,4897.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4587mil,4873.3mil) from Top Layer to Bottom Layer And Via (4611mil,4873.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4587mil,4897.3mil) from Top Layer to Bottom Layer And Via (4611mil,4897.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4590.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4590.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4590.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4614.7mil,3966.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4590.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4590.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4590.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4614.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4590.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4590.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4590.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4614.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4590.7mil,4038.6mil) from Top Layer to Bottom Layer And Via (4614.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4599.1mil,4713.2mil) from Top Layer to Bottom Layer And Via (4623.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.059mil < 10mil) Between Via (4602.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4623.1mil,4713.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.06mil] / [Bottom Solder] Mask Sliver [7.06mil]
Minimum Solder Mask Sliver Constraint: (2.1mil < 10mil) Between Via (4602.5mil,4691.7mil) from Top Layer to Bottom Layer And Via (4627.3mil,4692.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.1mil] / [Bottom Solder] Mask Sliver [2.1mil]
Minimum Solder Mask Sliver Constraint: (8.146mil < 10mil) Between Via (4606.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4627.3mil,4692.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.146mil] / [Bottom Solder] Mask Sliver [8.146mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4606.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4630.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4611mil,4753.3mil) from Top Layer to Bottom Layer And Via (4611mil,4777.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.547mil < 10mil) Between Via (4611mil,4753.3mil) from Top Layer to Bottom Layer And Via (4633mil,4776.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.547mil] / [Bottom Solder] Mask Sliver [9.547mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4611mil,4777.3mil) from Top Layer to Bottom Layer And Via (4611mil,4801.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.547mil < 10mil) Between Via (4611mil,4777.3mil) from Top Layer to Bottom Layer And Via (4633mil,4800.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.547mil] / [Bottom Solder] Mask Sliver [9.547mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4611mil,4801.3mil) from Top Layer to Bottom Layer And Via (4611mil,4825.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.547mil < 10mil) Between Via (4611mil,4801.3mil) from Top Layer to Bottom Layer And Via (4633mil,4824.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.547mil] / [Bottom Solder] Mask Sliver [9.547mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4611mil,4825.3mil) from Top Layer to Bottom Layer And Via (4611mil,4849.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.547mil < 10mil) Between Via (4611mil,4825.3mil) from Top Layer to Bottom Layer And Via (4633mil,4848.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.547mil] / [Bottom Solder] Mask Sliver [9.547mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4611mil,4849.3mil) from Top Layer to Bottom Layer And Via (4611mil,4873.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.547mil < 10mil) Between Via (4611mil,4849.3mil) from Top Layer to Bottom Layer And Via (4633mil,4872.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.547mil] / [Bottom Solder] Mask Sliver [9.547mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4611mil,4873.3mil) from Top Layer to Bottom Layer And Via (4611mil,4897.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.547mil < 10mil) Between Via (4611mil,4873.3mil) from Top Layer to Bottom Layer And Via (4633mil,4896.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.547mil] / [Bottom Solder] Mask Sliver [9.547mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4614.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4614.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4614.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4638.7mil,3966.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4614.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4614.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4614.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4638.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4614.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4614.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4614.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4638.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4614.7mil,4038.6mil) from Top Layer to Bottom Layer And Via (4638.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4615mil,4531mil) from Top Layer to Bottom Layer And Via (4615mil,4555mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.014mil < 10mil) Between Via (4615mil,4531mil) from Top Layer to Bottom Layer And Via (4640mil,4519mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.014mil] / [Bottom Solder] Mask Sliver [5.014mil]
Minimum Solder Mask Sliver Constraint: (5.014mil < 10mil) Between Via (4615mil,4531mil) from Top Layer to Bottom Layer And Via (4640mil,4543mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.014mil] / [Bottom Solder] Mask Sliver [5.014mil]
Minimum Solder Mask Sliver Constraint: (5.014mil < 10mil) Between Via (4615mil,4555mil) from Top Layer to Bottom Layer And Via (4640mil,4543mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.014mil] / [Bottom Solder] Mask Sliver [5.014mil]
Minimum Solder Mask Sliver Constraint: (5.014mil < 10mil) Between Via (4615mil,4555mil) from Top Layer to Bottom Layer And Via (4640mil,4567mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.014mil] / [Bottom Solder] Mask Sliver [5.014mil]
Minimum Solder Mask Sliver Constraint: (2.1mil < 10mil) Between Via (4623.1mil,4713.2mil) from Top Layer to Bottom Layer And Via (4647.9mil,4714.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.1mil] / [Bottom Solder] Mask Sliver [2.1mil]
Minimum Solder Mask Sliver Constraint: (4.633mil < 10mil) Between Via (4625.6mil,5031.2mil) from Top Layer to Bottom Layer And Via (4628.458mil,5004mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.633mil] / [Bottom Solder] Mask Sliver [4.633mil]
Minimum Solder Mask Sliver Constraint: (0.307mil < 10mil) Between Via (4627.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4630.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.307mil] / [Bottom Solder] Mask Sliver [0.307mil]
Minimum Solder Mask Sliver Constraint: (7.059mil < 10mil) Between Via (4627.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4647.9mil,4714.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.06mil] / [Bottom Solder] Mask Sliver [7.06mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4627.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4651.3mil,4692.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.231mil < 10mil) Between Via (4628.458mil,5004mil) from Top Layer to Bottom Layer And Via (4628.8mil,4981.055mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.231mil] / [Bottom Solder] Mask Sliver [0.231mil]
Minimum Solder Mask Sliver Constraint: (2.195mil < 10mil) Between Via (4630.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4643.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.195mil] / [Bottom Solder] Mask Sliver [2.195mil]
Minimum Solder Mask Sliver Constraint: (8.146mil < 10mil) Between Via (4630.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4651.3mil,4692.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.146mil] / [Bottom Solder] Mask Sliver [8.146mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4630.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4654.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4633mil,4752.9mil) from Top Layer to Bottom Layer And Via (4633mil,4776.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4633mil,4752.9mil) from Top Layer to Bottom Layer And Via (4657mil,4752.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4633mil,4776.9mil) from Top Layer to Bottom Layer And Via (4633mil,4800.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4633mil,4776.9mil) from Top Layer to Bottom Layer And Via (4657mil,4776.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4633mil,4800.9mil) from Top Layer to Bottom Layer And Via (4633mil,4824.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4633mil,4800.9mil) from Top Layer to Bottom Layer And Via (4657mil,4800.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4633mil,4824.9mil) from Top Layer to Bottom Layer And Via (4633mil,4848.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4633mil,4824.9mil) from Top Layer to Bottom Layer And Via (4657mil,4824.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4633mil,4848.9mil) from Top Layer to Bottom Layer And Via (4633mil,4872.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4633mil,4848.9mil) from Top Layer to Bottom Layer And Via (4657mil,4848.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4633mil,4872.9mil) from Top Layer to Bottom Layer And Via (4633mil,4896.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4633mil,4872.9mil) from Top Layer to Bottom Layer And Via (4657mil,4872.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4633mil,4896.9mil) from Top Layer to Bottom Layer And Via (4657mil,4896.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4638.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4638.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4638.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4662.7mil,3966.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4638.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4638.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4638.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4662.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4638.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4638.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4638.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4662.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4638.7mil,4038.6mil) from Top Layer to Bottom Layer And Via (4662.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4351mil) from Top Layer to Bottom Layer And Via (4640mil,4375mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4351mil) from Top Layer to Bottom Layer And Via (4664mil,4351mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4375mil) from Top Layer to Bottom Layer And Via (4640mil,4399mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4375mil) from Top Layer to Bottom Layer And Via (4664mil,4375mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4399mil) from Top Layer to Bottom Layer And Via (4640mil,4423mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4399mil) from Top Layer to Bottom Layer And Via (4664mil,4399mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4423mil) from Top Layer to Bottom Layer And Via (4640mil,4447mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4423mil) from Top Layer to Bottom Layer And Via (4664mil,4423mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4447mil) from Top Layer to Bottom Layer And Via (4640mil,4471mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4447mil) from Top Layer to Bottom Layer And Via (4664mil,4447mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4471mil) from Top Layer to Bottom Layer And Via (4640mil,4495mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4471mil) from Top Layer to Bottom Layer And Via (4664mil,4471mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4495mil) from Top Layer to Bottom Layer And Via (4640mil,4519mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4495mil) from Top Layer to Bottom Layer And Via (4664mil,4495mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4519mil) from Top Layer to Bottom Layer And Via (4640mil,4543mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4519mil) from Top Layer to Bottom Layer And Via (4664mil,4519mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4543mil) from Top Layer to Bottom Layer And Via (4640mil,4567mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4543mil) from Top Layer to Bottom Layer And Via (4664mil,4543mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4640mil,4567mil) from Top Layer to Bottom Layer And Via (4664mil,4567mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4642mil,4118mil) from Top Layer to Bottom Layer And Via (4642mil,4142mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4642mil,4118mil) from Top Layer to Bottom Layer And Via (4666mil,4118mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4642mil,4142mil) from Top Layer to Bottom Layer And Via (4642mil,4166mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4642mil,4142mil) from Top Layer to Bottom Layer And Via (4666mil,4142mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4642mil,4166mil) from Top Layer to Bottom Layer And Via (4642mil,4190mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4642mil,4166mil) from Top Layer to Bottom Layer And Via (4666mil,4166mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4642mil,4190mil) from Top Layer to Bottom Layer And Via (4642mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4642mil,4190mil) from Top Layer to Bottom Layer And Via (4666mil,4190mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4642mil,4214mil) from Top Layer to Bottom Layer And Via (4642mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4642mil,4214mil) from Top Layer to Bottom Layer And Via (4666mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4642mil,4238mil) from Top Layer to Bottom Layer And Via (4642mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4642mil,4238mil) from Top Layer to Bottom Layer And Via (4666mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4642mil,4262mil) from Top Layer to Bottom Layer And Via (4666mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.807mil < 10mil) Between Via (4643.9mil,4648.8mil) from Top Layer to Bottom Layer And Via (4654.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.807mil] / [Bottom Solder] Mask Sliver [0.807mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4643.9mil,4648.8mil) from Top Layer to Bottom Layer And Via (4667.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4647.9mil,4714.1mil) from Top Layer to Bottom Layer And Via (4671.9mil,4714.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.307mil < 10mil) Between Via (4651.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4654.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.307mil] / [Bottom Solder] Mask Sliver [0.307mil]
Minimum Solder Mask Sliver Constraint: (7.059mil < 10mil) Between Via (4651.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4671.9mil,4714.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.06mil] / [Bottom Solder] Mask Sliver [7.06mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4651.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4675.3mil,4692.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.195mil < 10mil) Between Via (4654.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4667.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.195mil] / [Bottom Solder] Mask Sliver [2.195mil]
Minimum Solder Mask Sliver Constraint: (8.146mil < 10mil) Between Via (4654.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4675.3mil,4692.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.146mil] / [Bottom Solder] Mask Sliver [8.146mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4654.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4678.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4657mil,4752.9mil) from Top Layer to Bottom Layer And Via (4657mil,4776.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.384mil < 10mil) Between Via (4657mil,4752.9mil) from Top Layer to Bottom Layer And Via (4680.1mil,4753mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.384mil] / [Bottom Solder] Mask Sliver [0.384mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4657mil,4776.9mil) from Top Layer to Bottom Layer And Via (4657mil,4800.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.384mil < 10mil) Between Via (4657mil,4776.9mil) from Top Layer to Bottom Layer And Via (4680.1mil,4777mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.384mil] / [Bottom Solder] Mask Sliver [0.384mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4657mil,4800.9mil) from Top Layer to Bottom Layer And Via (4657mil,4824.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.384mil < 10mil) Between Via (4657mil,4800.9mil) from Top Layer to Bottom Layer And Via (4680.1mil,4801mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.384mil] / [Bottom Solder] Mask Sliver [0.384mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4657mil,4824.9mil) from Top Layer to Bottom Layer And Via (4657mil,4848.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.384mil < 10mil) Between Via (4657mil,4824.9mil) from Top Layer to Bottom Layer And Via (4680.1mil,4825mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.384mil] / [Bottom Solder] Mask Sliver [0.384mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4657mil,4848.9mil) from Top Layer to Bottom Layer And Via (4657mil,4872.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.384mil < 10mil) Between Via (4657mil,4848.9mil) from Top Layer to Bottom Layer And Via (4680.1mil,4849mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.384mil] / [Bottom Solder] Mask Sliver [0.384mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4657mil,4872.9mil) from Top Layer to Bottom Layer And Via (4657mil,4896.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.384mil < 10mil) Between Via (4657mil,4872.9mil) from Top Layer to Bottom Layer And Via (4680.1mil,4873mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.384mil] / [Bottom Solder] Mask Sliver [0.384mil]
Minimum Solder Mask Sliver Constraint: (0.384mil < 10mil) Between Via (4657mil,4896.9mil) from Top Layer to Bottom Layer And Via (4680.1mil,4897mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.384mil] / [Bottom Solder] Mask Sliver [0.384mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4662.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4662.7mil,3990.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.087mil < 10mil) Between Via (4662.7mil,3966.6mil) from Top Layer to Bottom Layer And Via (4686.5mil,3966.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.087mil] / [Bottom Solder] Mask Sliver [1.087mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4662.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4662.7mil,4014.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.087mil < 10mil) Between Via (4662.7mil,3990.6mil) from Top Layer to Bottom Layer And Via (4686.5mil,3990.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.087mil] / [Bottom Solder] Mask Sliver [1.087mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4662.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4662.7mil,4038.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.087mil < 10mil) Between Via (4662.7mil,4014.6mil) from Top Layer to Bottom Layer And Via (4686.5mil,4014.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.087mil] / [Bottom Solder] Mask Sliver [1.087mil]
Minimum Solder Mask Sliver Constraint: (1.087mil < 10mil) Between Via (4662.7mil,4038.6mil) from Top Layer to Bottom Layer And Via (4686.5mil,4038.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.087mil] / [Bottom Solder] Mask Sliver [1.087mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4351mil) from Top Layer to Bottom Layer And Via (4664mil,4375mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4351mil) from Top Layer to Bottom Layer And Via (4688mil,4351mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4375mil) from Top Layer to Bottom Layer And Via (4664mil,4399mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4375mil) from Top Layer to Bottom Layer And Via (4688mil,4375mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4399mil) from Top Layer to Bottom Layer And Via (4664mil,4423mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4399mil) from Top Layer to Bottom Layer And Via (4688mil,4399mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4423mil) from Top Layer to Bottom Layer And Via (4664mil,4447mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4423mil) from Top Layer to Bottom Layer And Via (4688mil,4423mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4447mil) from Top Layer to Bottom Layer And Via (4664mil,4471mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4447mil) from Top Layer to Bottom Layer And Via (4688mil,4447mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4471mil) from Top Layer to Bottom Layer And Via (4664mil,4495mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4471mil) from Top Layer to Bottom Layer And Via (4688mil,4471mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4495mil) from Top Layer to Bottom Layer And Via (4664mil,4519mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4495mil) from Top Layer to Bottom Layer And Via (4688mil,4495mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4519mil) from Top Layer to Bottom Layer And Via (4664mil,4543mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4519mil) from Top Layer to Bottom Layer And Via (4688mil,4519mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4543mil) from Top Layer to Bottom Layer And Via (4664mil,4567mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4543mil) from Top Layer to Bottom Layer And Via (4688mil,4543mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4664mil,4567mil) from Top Layer to Bottom Layer And Via (4688mil,4567mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4666mil,4118mil) from Top Layer to Bottom Layer And Via (4666mil,4142mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4666mil,4118mil) from Top Layer to Bottom Layer And Via (4690mil,4118mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4666mil,4142mil) from Top Layer to Bottom Layer And Via (4666mil,4166mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4666mil,4142mil) from Top Layer to Bottom Layer And Via (4690mil,4142mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4666mil,4166mil) from Top Layer to Bottom Layer And Via (4666mil,4190mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4666mil,4166mil) from Top Layer to Bottom Layer And Via (4690mil,4166mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4666mil,4190mil) from Top Layer to Bottom Layer And Via (4666mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4666mil,4190mil) from Top Layer to Bottom Layer And Via (4690mil,4190mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4666mil,4214mil) from Top Layer to Bottom Layer And Via (4666mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4666mil,4214mil) from Top Layer to Bottom Layer And Via (4690mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4666mil,4238mil) from Top Layer to Bottom Layer And Via (4666mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4666mil,4238mil) from Top Layer to Bottom Layer And Via (4690mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4666mil,4262mil) from Top Layer to Bottom Layer And Via (4690mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.807mil < 10mil) Between Via (4667.9mil,4648.8mil) from Top Layer to Bottom Layer And Via (4678.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.807mil] / [Bottom Solder] Mask Sliver [0.807mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4667.9mil,4648.8mil) from Top Layer to Bottom Layer And Via (4691.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4671.9mil,4714.1mil) from Top Layer to Bottom Layer And Via (4695.9mil,4714.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.307mil < 10mil) Between Via (4675.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4678.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.307mil] / [Bottom Solder] Mask Sliver [0.307mil]
Minimum Solder Mask Sliver Constraint: (7.059mil < 10mil) Between Via (4675.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4695.9mil,4714.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.06mil] / [Bottom Solder] Mask Sliver [7.06mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4675.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4699.3mil,4692.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.195mil < 10mil) Between Via (4678.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4691.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.195mil] / [Bottom Solder] Mask Sliver [2.195mil]
Minimum Solder Mask Sliver Constraint: (8.146mil < 10mil) Between Via (4678.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4699.3mil,4692.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.146mil] / [Bottom Solder] Mask Sliver [8.146mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4678.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4702.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4680.1mil,4753mil) from Top Layer to Bottom Layer And Via (4680.1mil,4777mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4680.1mil,4753mil) from Top Layer to Bottom Layer And Via (4704.1mil,4753mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4680.1mil,4777mil) from Top Layer to Bottom Layer And Via (4680.1mil,4801mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4680.1mil,4777mil) from Top Layer to Bottom Layer And Via (4704.1mil,4777mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4680.1mil,4801mil) from Top Layer to Bottom Layer And Via (4680.1mil,4825mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4680.1mil,4801mil) from Top Layer to Bottom Layer And Via (4704.1mil,4801mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4680.1mil,4825mil) from Top Layer to Bottom Layer And Via (4680.1mil,4849mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4680.1mil,4825mil) from Top Layer to Bottom Layer And Via (4704.1mil,4825mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4680.1mil,4849mil) from Top Layer to Bottom Layer And Via (4680.1mil,4873mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4680.1mil,4849mil) from Top Layer to Bottom Layer And Via (4704.1mil,4849mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4680.1mil,4873mil) from Top Layer to Bottom Layer And Via (4680.1mil,4897mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4680.1mil,4873mil) from Top Layer to Bottom Layer And Via (4704.1mil,4873mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4680.1mil,4897mil) from Top Layer to Bottom Layer And Via (4704.1mil,4897mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4686.5mil,3966.2mil) from Top Layer to Bottom Layer And Via (4686.5mil,3990.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4686.5mil,3966.2mil) from Top Layer to Bottom Layer And Via (4710.5mil,3966.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4686.5mil,3990.2mil) from Top Layer to Bottom Layer And Via (4686.5mil,4014.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4686.5mil,3990.2mil) from Top Layer to Bottom Layer And Via (4710.5mil,3990.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4686.5mil,4014.2mil) from Top Layer to Bottom Layer And Via (4686.5mil,4038.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4686.5mil,4014.2mil) from Top Layer to Bottom Layer And Via (4710.5mil,4014.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4686.5mil,4038.2mil) from Top Layer to Bottom Layer And Via (4710.5mil,4038.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4351mil) from Top Layer to Bottom Layer And Via (4688mil,4375mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.522mil < 10mil) Between Via (4688mil,4351mil) from Top Layer to Bottom Layer And Via (4702mil,4330mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.522mil] / [Bottom Solder] Mask Sliver [2.522mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4351mil) from Top Layer to Bottom Layer And Via (4712mil,4351mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4375mil) from Top Layer to Bottom Layer And Via (4688mil,4399mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4375mil) from Top Layer to Bottom Layer And Via (4712mil,4375mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4399mil) from Top Layer to Bottom Layer And Via (4688mil,4423mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4399mil) from Top Layer to Bottom Layer And Via (4712mil,4399mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4423mil) from Top Layer to Bottom Layer And Via (4688mil,4447mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4423mil) from Top Layer to Bottom Layer And Via (4712mil,4423mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4447mil) from Top Layer to Bottom Layer And Via (4688mil,4471mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4447mil) from Top Layer to Bottom Layer And Via (4712mil,4447mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4471mil) from Top Layer to Bottom Layer And Via (4688mil,4495mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4471mil) from Top Layer to Bottom Layer And Via (4712mil,4471mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4495mil) from Top Layer to Bottom Layer And Via (4688mil,4519mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4495mil) from Top Layer to Bottom Layer And Via (4712mil,4495mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4519mil) from Top Layer to Bottom Layer And Via (4688mil,4543mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4519mil) from Top Layer to Bottom Layer And Via (4712mil,4519mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4543mil) from Top Layer to Bottom Layer And Via (4688mil,4567mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4543mil) from Top Layer to Bottom Layer And Via (4712mil,4543mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4688mil,4567mil) from Top Layer to Bottom Layer And Via (4712mil,4567mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4690mil,4118mil) from Top Layer to Bottom Layer And Via (4690mil,4142mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4690mil,4118mil) from Top Layer to Bottom Layer And Via (4714mil,4118mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4690mil,4142mil) from Top Layer to Bottom Layer And Via (4690mil,4166mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4690mil,4142mil) from Top Layer to Bottom Layer And Via (4714mil,4142mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4690mil,4166mil) from Top Layer to Bottom Layer And Via (4690mil,4190mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4690mil,4166mil) from Top Layer to Bottom Layer And Via (4714mil,4166mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4690mil,4190mil) from Top Layer to Bottom Layer And Via (4690mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4690mil,4190mil) from Top Layer to Bottom Layer And Via (4714mil,4190mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4690mil,4214mil) from Top Layer to Bottom Layer And Via (4690mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4690mil,4214mil) from Top Layer to Bottom Layer And Via (4714mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4690mil,4238mil) from Top Layer to Bottom Layer And Via (4690mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4690mil,4238mil) from Top Layer to Bottom Layer And Via (4714mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.607mil < 10mil) Between Via (4690mil,4262mil) from Top Layer to Bottom Layer And Via (4702mil,4282mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.607mil] / [Bottom Solder] Mask Sliver [0.607mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4690mil,4262mil) from Top Layer to Bottom Layer And Via (4714mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.807mil < 10mil) Between Via (4691.9mil,4648.8mil) from Top Layer to Bottom Layer And Via (4702.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.807mil] / [Bottom Solder] Mask Sliver [0.807mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4691.9mil,4648.8mil) from Top Layer to Bottom Layer And Via (4715.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4695.9mil,4714.1mil) from Top Layer to Bottom Layer And Via (4719.9mil,4714.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.307mil < 10mil) Between Via (4699.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4702.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.307mil] / [Bottom Solder] Mask Sliver [0.307mil]
Minimum Solder Mask Sliver Constraint: (7.059mil < 10mil) Between Via (4699.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4719.9mil,4714.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.06mil] / [Bottom Solder] Mask Sliver [7.06mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4699.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4723.3mil,4692.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.195mil < 10mil) Between Via (4702.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4715.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.195mil] / [Bottom Solder] Mask Sliver [2.195mil]
Minimum Solder Mask Sliver Constraint: (8.146mil < 10mil) Between Via (4702.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4723.3mil,4692.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.146mil] / [Bottom Solder] Mask Sliver [8.146mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4702.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4726.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4702mil,4282mil) from Top Layer to Bottom Layer And Via (4702mil,4306mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.607mil < 10mil) Between Via (4702mil,4282mil) from Top Layer to Bottom Layer And Via (4714mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.607mil] / [Bottom Solder] Mask Sliver [0.607mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4702mil,4306mil) from Top Layer to Bottom Layer And Via (4702mil,4330mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.543mil < 10mil) Between Via (4702mil,4330mil) from Top Layer to Bottom Layer And Via (4712mil,4351mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.543mil] / [Bottom Solder] Mask Sliver [0.543mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4704.1mil,4753mil) from Top Layer to Bottom Layer And Via (4704.1mil,4777mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.385mil < 10mil) Between Via (4704.1mil,4753mil) from Top Layer to Bottom Layer And Via (4728.2mil,4752.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.385mil] / [Bottom Solder] Mask Sliver [1.385mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4704.1mil,4777mil) from Top Layer to Bottom Layer And Via (4704.1mil,4801mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.385mil < 10mil) Between Via (4704.1mil,4777mil) from Top Layer to Bottom Layer And Via (4728.2mil,4776.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.385mil] / [Bottom Solder] Mask Sliver [1.385mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4704.1mil,4801mil) from Top Layer to Bottom Layer And Via (4704.1mil,4825mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.385mil < 10mil) Between Via (4704.1mil,4801mil) from Top Layer to Bottom Layer And Via (4728.2mil,4800.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.385mil] / [Bottom Solder] Mask Sliver [1.385mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4704.1mil,4825mil) from Top Layer to Bottom Layer And Via (4704.1mil,4849mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.385mil < 10mil) Between Via (4704.1mil,4825mil) from Top Layer to Bottom Layer And Via (4728.2mil,4824.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.385mil] / [Bottom Solder] Mask Sliver [1.385mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4704.1mil,4849mil) from Top Layer to Bottom Layer And Via (4704.1mil,4873mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.385mil < 10mil) Between Via (4704.1mil,4849mil) from Top Layer to Bottom Layer And Via (4728.2mil,4848.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.385mil] / [Bottom Solder] Mask Sliver [1.385mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4704.1mil,4873mil) from Top Layer to Bottom Layer And Via (4704.1mil,4897mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.385mil < 10mil) Between Via (4704.1mil,4873mil) from Top Layer to Bottom Layer And Via (4728.2mil,4872.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.385mil] / [Bottom Solder] Mask Sliver [1.385mil]
Minimum Solder Mask Sliver Constraint: (1.385mil < 10mil) Between Via (4704.1mil,4897mil) from Top Layer to Bottom Layer And Via (4728.2mil,4896.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.385mil] / [Bottom Solder] Mask Sliver [1.385mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4710.5mil,3966.2mil) from Top Layer to Bottom Layer And Via (4710.5mil,3990.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4710.5mil,3966.2mil) from Top Layer to Bottom Layer And Via (4734.5mil,3966.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4710.5mil,3990.2mil) from Top Layer to Bottom Layer And Via (4710.5mil,4014.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4710.5mil,3990.2mil) from Top Layer to Bottom Layer And Via (4734.5mil,3990.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4710.5mil,4014.2mil) from Top Layer to Bottom Layer And Via (4710.5mil,4038.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4710.5mil,4014.2mil) from Top Layer to Bottom Layer And Via (4734.5mil,4014.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4710.5mil,4038.2mil) from Top Layer to Bottom Layer And Via (4734.5mil,4038.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.569mil < 10mil) Between Via (4712.1mil,5443.058mil) from Top Layer to Bottom Layer And Via (4721.444mil,5469.756mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.569mil] / [Bottom Solder] Mask Sliver [5.569mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4712mil,4351mil) from Top Layer to Bottom Layer And Via (4712mil,4375mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4712mil,4375mil) from Top Layer to Bottom Layer And Via (4712mil,4399mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4712mil,4399mil) from Top Layer to Bottom Layer And Via (4712mil,4423mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4712mil,4423mil) from Top Layer to Bottom Layer And Via (4712mil,4447mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4712mil,4447mil) from Top Layer to Bottom Layer And Via (4712mil,4471mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4712mil,4471mil) from Top Layer to Bottom Layer And Via (4712mil,4495mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4712mil,4495mil) from Top Layer to Bottom Layer And Via (4712mil,4519mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4712mil,4519mil) from Top Layer to Bottom Layer And Via (4712mil,4543mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4712mil,4543mil) from Top Layer to Bottom Layer And Via (4712mil,4567mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4714mil,4118mil) from Top Layer to Bottom Layer And Via (4714mil,4142mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4714mil,4142mil) from Top Layer to Bottom Layer And Via (4714mil,4166mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4714mil,4166mil) from Top Layer to Bottom Layer And Via (4714mil,4190mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4714mil,4190mil) from Top Layer to Bottom Layer And Via (4714mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4714mil,4214mil) from Top Layer to Bottom Layer And Via (4714mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4714mil,4238mil) from Top Layer to Bottom Layer And Via (4714mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.807mil < 10mil) Between Via (4715.9mil,4648.8mil) from Top Layer to Bottom Layer And Via (4726.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.807mil] / [Bottom Solder] Mask Sliver [0.807mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4715.9mil,4648.8mil) from Top Layer to Bottom Layer And Via (4739.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4719.9mil,4714.1mil) from Top Layer to Bottom Layer And Via (4743.9mil,4714.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.33mil < 10mil) Between Via (4721.444mil,5469.756mil) from Top Layer to Bottom Layer And Via (4724.384mil,5496.643mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.33mil] / [Bottom Solder] Mask Sliver [4.33mil]
Minimum Solder Mask Sliver Constraint: (7.513mil < 10mil) Between Via (4721.6mil,4926.2mil) from Top Layer to Bottom Layer And Via (4728.2mil,4896.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.513mil] / [Bottom Solder] Mask Sliver [7.513mil]
Minimum Solder Mask Sliver Constraint: (1.089mil < 10mil) Between Via (4721.6mil,4926.2mil) from Top Layer to Bottom Layer And Via (4745.4mil,4926.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.089mil] / [Bottom Solder] Mask Sliver [1.089mil]
Minimum Solder Mask Sliver Constraint: (0.307mil < 10mil) Between Via (4723.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4726.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.307mil] / [Bottom Solder] Mask Sliver [0.307mil]
Minimum Solder Mask Sliver Constraint: (7.059mil < 10mil) Between Via (4723.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4743.9mil,4714.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.06mil] / [Bottom Solder] Mask Sliver [7.06mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4723.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4747.3mil,4692.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.195mil < 10mil) Between Via (4726.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4739.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.195mil] / [Bottom Solder] Mask Sliver [2.195mil]
Minimum Solder Mask Sliver Constraint: (8.146mil < 10mil) Between Via (4726.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4747.3mil,4692.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.146mil] / [Bottom Solder] Mask Sliver [8.146mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4726.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4750.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4728.2mil,4752.7mil) from Top Layer to Bottom Layer And Via (4728.2mil,4776.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4728.2mil,4752.7mil) from Top Layer to Bottom Layer And Via (4752.2mil,4752.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4728.2mil,4776.7mil) from Top Layer to Bottom Layer And Via (4728.2mil,4800.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4728.2mil,4776.7mil) from Top Layer to Bottom Layer And Via (4752.2mil,4776.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4728.2mil,4800.7mil) from Top Layer to Bottom Layer And Via (4728.2mil,4824.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4728.2mil,4800.7mil) from Top Layer to Bottom Layer And Via (4752.2mil,4800.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4728.2mil,4824.7mil) from Top Layer to Bottom Layer And Via (4728.2mil,4848.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4728.2mil,4824.7mil) from Top Layer to Bottom Layer And Via (4752.2mil,4824.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4728.2mil,4848.7mil) from Top Layer to Bottom Layer And Via (4728.2mil,4872.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4728.2mil,4848.7mil) from Top Layer to Bottom Layer And Via (4752.2mil,4848.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4728.2mil,4872.7mil) from Top Layer to Bottom Layer And Via (4728.2mil,4896.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4728.2mil,4872.7mil) from Top Layer to Bottom Layer And Via (4752.2mil,4872.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4728.2mil,4896.7mil) from Top Layer to Bottom Layer And Via (4752.2mil,4896.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4734.5mil,3966.2mil) from Top Layer to Bottom Layer And Via (4734.5mil,3990.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4734.5mil,3990.2mil) from Top Layer to Bottom Layer And Via (4734.5mil,4014.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.896mil < 10mil) Between Via (4734.5mil,3990.2mil) from Top Layer to Bottom Layer And Via (4755.3mil,3973.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.896mil] / [Bottom Solder] Mask Sliver [3.896mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4734.5mil,4014.2mil) from Top Layer to Bottom Layer And Via (4734.5mil,4038.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.896mil < 10mil) Between Via (4734.5mil,4014.2mil) from Top Layer to Bottom Layer And Via (4755.3mil,3997.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.896mil] / [Bottom Solder] Mask Sliver [3.896mil]
Minimum Solder Mask Sliver Constraint: (3.896mil < 10mil) Between Via (4734.5mil,4038.2mil) from Top Layer to Bottom Layer And Via (4755.3mil,4021.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.896mil] / [Bottom Solder] Mask Sliver [3.896mil]
Minimum Solder Mask Sliver Constraint: (0.807mil < 10mil) Between Via (4739.9mil,4648.8mil) from Top Layer to Bottom Layer And Via (4750.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.807mil] / [Bottom Solder] Mask Sliver [0.807mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4739.9mil,4648.8mil) from Top Layer to Bottom Layer And Via (4763.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4743.9mil,4714.1mil) from Top Layer to Bottom Layer And Via (4767.9mil,4714.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.045mil < 10mil) Between Via (4745.4mil,4926.7mil) from Top Layer to Bottom Layer And Via (4752.2mil,4896.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.045mil] / [Bottom Solder] Mask Sliver [8.045mil]
Minimum Solder Mask Sliver Constraint: (1.184mil < 10mil) Between Via (4745.4mil,4926.7mil) from Top Layer to Bottom Layer And Via (4769.3mil,4926.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.184mil] / [Bottom Solder] Mask Sliver [1.184mil]
Minimum Solder Mask Sliver Constraint: (7.343mil < 10mil) Between Via (4746.977mil,5020.123mil) from Top Layer to Bottom Layer And Via (4752.655mil,5049.642mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.343mil] / [Bottom Solder] Mask Sliver [7.343mil]
Minimum Solder Mask Sliver Constraint: (5.023mil < 10mil) Between Via (4746.977mil,5020.123mil) from Top Layer to Bottom Layer And Via (4764.873mil,4998.927mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.023mil] / [Bottom Solder] Mask Sliver [5.023mil]
Minimum Solder Mask Sliver Constraint: (0.307mil < 10mil) Between Via (4747.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4750.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.307mil] / [Bottom Solder] Mask Sliver [0.307mil]
Minimum Solder Mask Sliver Constraint: (7.059mil < 10mil) Between Via (4747.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4767.9mil,4714.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.06mil] / [Bottom Solder] Mask Sliver [7.06mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4771.3mil,4692.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4191mil) from Top Layer to Bottom Layer And Via (4747mil,4215mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4191mil) from Top Layer to Bottom Layer And Via (4771mil,4191mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4215mil) from Top Layer to Bottom Layer And Via (4747mil,4239mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4215mil) from Top Layer to Bottom Layer And Via (4771mil,4215mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4239mil) from Top Layer to Bottom Layer And Via (4747mil,4263mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4239mil) from Top Layer to Bottom Layer And Via (4771mil,4239mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4263mil) from Top Layer to Bottom Layer And Via (4747mil,4287mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4263mil) from Top Layer to Bottom Layer And Via (4771mil,4263mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4287mil) from Top Layer to Bottom Layer And Via (4747mil,4311mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4287mil) from Top Layer to Bottom Layer And Via (4771mil,4287mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4311mil) from Top Layer to Bottom Layer And Via (4747mil,4335mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4311mil) from Top Layer to Bottom Layer And Via (4771mil,4311mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4335mil) from Top Layer to Bottom Layer And Via (4747mil,4359mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4335mil) from Top Layer to Bottom Layer And Via (4771mil,4335mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4359mil) from Top Layer to Bottom Layer And Via (4747mil,4383mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4359mil) from Top Layer to Bottom Layer And Via (4771mil,4359mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4383mil) from Top Layer to Bottom Layer And Via (4747mil,4407mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4383mil) from Top Layer to Bottom Layer And Via (4771mil,4383mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4407mil) from Top Layer to Bottom Layer And Via (4747mil,4431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4407mil) from Top Layer to Bottom Layer And Via (4771mil,4407mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4431mil) from Top Layer to Bottom Layer And Via (4747mil,4455mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4431mil) from Top Layer to Bottom Layer And Via (4771mil,4431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4455mil) from Top Layer to Bottom Layer And Via (4747mil,4479mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4455mil) from Top Layer to Bottom Layer And Via (4771mil,4455mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4479mil) from Top Layer to Bottom Layer And Via (4747mil,4503mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4479mil) from Top Layer to Bottom Layer And Via (4771mil,4479mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4503mil) from Top Layer to Bottom Layer And Via (4747mil,4527mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4503mil) from Top Layer to Bottom Layer And Via (4771mil,4503mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4527mil) from Top Layer to Bottom Layer And Via (4747mil,4551mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4527mil) from Top Layer to Bottom Layer And Via (4771mil,4527mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4551mil) from Top Layer to Bottom Layer And Via (4747mil,4575mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4551mil) from Top Layer to Bottom Layer And Via (4771mil,4551mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4747mil,4575mil) from Top Layer to Bottom Layer And Via (4771mil,4575mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.195mil < 10mil) Between Via (4750.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4763.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.195mil] / [Bottom Solder] Mask Sliver [2.195mil]
Minimum Solder Mask Sliver Constraint: (8.146mil < 10mil) Between Via (4750.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4771.3mil,4692.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.146mil] / [Bottom Solder] Mask Sliver [8.146mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4750.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4774.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4752.2mil,4752.7mil) from Top Layer to Bottom Layer And Via (4752.2mil,4776.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4752.2mil,4776.7mil) from Top Layer to Bottom Layer And Via (4752.2mil,4800.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4752.2mil,4800.7mil) from Top Layer to Bottom Layer And Via (4752.2mil,4824.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4752.2mil,4824.7mil) from Top Layer to Bottom Layer And Via (4752.2mil,4848.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4752.2mil,4848.7mil) from Top Layer to Bottom Layer And Via (4752.2mil,4872.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4752.2mil,4872.7mil) from Top Layer to Bottom Layer And Via (4752.2mil,4896.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4755.3mil,3973.6mil) from Top Layer to Bottom Layer And Via (4755.3mil,3997.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4755.3mil,3973.6mil) from Top Layer to Bottom Layer And Via (4779.3mil,3973.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4755.3mil,3997.6mil) from Top Layer to Bottom Layer And Via (4755.3mil,4021.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4755.3mil,3997.6mil) from Top Layer to Bottom Layer And Via (4779.3mil,3997.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4755.3mil,4021.6mil) from Top Layer to Bottom Layer And Via (4755.3mil,4045.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4755.3mil,4021.6mil) from Top Layer to Bottom Layer And Via (4779.3mil,4021.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4755.3mil,4045.6mil) from Top Layer to Bottom Layer And Via (4755.3mil,4069.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4755.3mil,4045.6mil) from Top Layer to Bottom Layer And Via (4779.3mil,4045.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4755.3mil,4069.6mil) from Top Layer to Bottom Layer And Via (4755.3mil,4093.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4755.3mil,4069.6mil) from Top Layer to Bottom Layer And Via (4779.3mil,4069.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4755.3mil,4093.6mil) from Top Layer to Bottom Layer And Via (4755.3mil,4117.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4755.3mil,4093.6mil) from Top Layer to Bottom Layer And Via (4779.3mil,4093.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4755.3mil,4117.6mil) from Top Layer to Bottom Layer And Via (4755.3mil,4141.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4755.3mil,4117.6mil) from Top Layer to Bottom Layer And Via (4779.3mil,4117.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4755.3mil,4141.6mil) from Top Layer to Bottom Layer And Via (4779.3mil,4141.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.807mil < 10mil) Between Via (4763.9mil,4648.8mil) from Top Layer to Bottom Layer And Via (4774.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.807mil] / [Bottom Solder] Mask Sliver [0.807mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4763.9mil,4648.8mil) from Top Layer to Bottom Layer And Via (4787.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.923mil < 10mil) Between Via (4767.9mil,4714.1mil) from Top Layer to Bottom Layer And Via (4800.5mil,4715.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.923mil] / [Bottom Solder] Mask Sliver [9.923mil]
Minimum Solder Mask Sliver Constraint: (2.784mil < 10mil) Between Via (4769.3mil,4926.8mil) from Top Layer to Bottom Layer And Via (4794.8mil,4927mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.784mil] / [Bottom Solder] Mask Sliver [2.784mil]
Minimum Solder Mask Sliver Constraint: (0.307mil < 10mil) Between Via (4771.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4774.5mil,4669.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.307mil] / [Bottom Solder] Mask Sliver [0.307mil]
Minimum Solder Mask Sliver Constraint: (5.79mil < 10mil) Between Via (4771.3mil,4692.6mil) from Top Layer to Bottom Layer And Via (4799.8mil,4693.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.79mil] / [Bottom Solder] Mask Sliver [5.79mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4191mil) from Top Layer to Bottom Layer And Via (4771mil,4215mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4191mil) from Top Layer to Bottom Layer And Via (4795mil,4191mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4215mil) from Top Layer to Bottom Layer And Via (4771mil,4239mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4215mil) from Top Layer to Bottom Layer And Via (4795mil,4215mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4239mil) from Top Layer to Bottom Layer And Via (4771mil,4263mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4239mil) from Top Layer to Bottom Layer And Via (4795mil,4239mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4263mil) from Top Layer to Bottom Layer And Via (4771mil,4287mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4263mil) from Top Layer to Bottom Layer And Via (4795mil,4263mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4287mil) from Top Layer to Bottom Layer And Via (4771mil,4311mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4287mil) from Top Layer to Bottom Layer And Via (4795mil,4287mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4311mil) from Top Layer to Bottom Layer And Via (4771mil,4335mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4311mil) from Top Layer to Bottom Layer And Via (4795mil,4311mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4335mil) from Top Layer to Bottom Layer And Via (4771mil,4359mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4335mil) from Top Layer to Bottom Layer And Via (4795mil,4335mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4359mil) from Top Layer to Bottom Layer And Via (4771mil,4383mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4359mil) from Top Layer to Bottom Layer And Via (4795mil,4359mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4383mil) from Top Layer to Bottom Layer And Via (4771mil,4407mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4383mil) from Top Layer to Bottom Layer And Via (4795mil,4383mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4407mil) from Top Layer to Bottom Layer And Via (4771mil,4431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4407mil) from Top Layer to Bottom Layer And Via (4795mil,4407mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4431mil) from Top Layer to Bottom Layer And Via (4771mil,4455mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4431mil) from Top Layer to Bottom Layer And Via (4795mil,4431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4455mil) from Top Layer to Bottom Layer And Via (4771mil,4479mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4455mil) from Top Layer to Bottom Layer And Via (4795mil,4455mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4479mil) from Top Layer to Bottom Layer And Via (4771mil,4503mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4479mil) from Top Layer to Bottom Layer And Via (4795mil,4479mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4503mil) from Top Layer to Bottom Layer And Via (4771mil,4527mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4503mil) from Top Layer to Bottom Layer And Via (4795mil,4503mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4527mil) from Top Layer to Bottom Layer And Via (4771mil,4551mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4527mil) from Top Layer to Bottom Layer And Via (4795mil,4527mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4551mil) from Top Layer to Bottom Layer And Via (4771mil,4575mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4551mil) from Top Layer to Bottom Layer And Via (4795mil,4551mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4771mil,4575mil) from Top Layer to Bottom Layer And Via (4795mil,4575mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.195mil < 10mil) Between Via (4774.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4787.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.195mil] / [Bottom Solder] Mask Sliver [2.195mil]
Minimum Solder Mask Sliver Constraint: (2.6mil < 10mil) Between Via (4774.5mil,4669.8mil) from Top Layer to Bottom Layer And Via (4799.8mil,4670.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.6mil] / [Bottom Solder] Mask Sliver [2.6mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4779.3mil,3973.6mil) from Top Layer to Bottom Layer And Via (4779.3mil,3997.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4779.3mil,3997.6mil) from Top Layer to Bottom Layer And Via (4779.3mil,4021.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4779.3mil,4021.6mil) from Top Layer to Bottom Layer And Via (4779.3mil,4045.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4779.3mil,4045.6mil) from Top Layer to Bottom Layer And Via (4779.3mil,4069.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4779.3mil,4069.6mil) from Top Layer to Bottom Layer And Via (4779.3mil,4093.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4779.3mil,4093.6mil) from Top Layer to Bottom Layer And Via (4779.3mil,4117.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4779.3mil,4117.6mil) from Top Layer to Bottom Layer And Via (4779.3mil,4141.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.705mil < 10mil) Between Via (4779.3mil,4117.6mil) from Top Layer to Bottom Layer And Via (4810.2mil,4123.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.705mil] / [Bottom Solder] Mask Sliver [8.705mil]
Minimum Solder Mask Sliver Constraint: (8.705mil < 10mil) Between Via (4779.3mil,4141.6mil) from Top Layer to Bottom Layer And Via (4810.2mil,4147.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.705mil] / [Bottom Solder] Mask Sliver [8.705mil]
Minimum Solder Mask Sliver Constraint: (2.208mil < 10mil) Between Via (4787.9mil,4648.8mil) from Top Layer to Bottom Layer And Via (4799.8mil,4670.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.208mil] / [Bottom Solder] Mask Sliver [2.208mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4787.9mil,4648.8mil) from Top Layer to Bottom Layer And Via (4811.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4191mil) from Top Layer to Bottom Layer And Via (4795mil,4215mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4191mil) from Top Layer to Bottom Layer And Via (4819mil,4191mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4215mil) from Top Layer to Bottom Layer And Via (4795mil,4239mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4215mil) from Top Layer to Bottom Layer And Via (4819mil,4215mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4239mil) from Top Layer to Bottom Layer And Via (4795mil,4263mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4239mil) from Top Layer to Bottom Layer And Via (4819mil,4239mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4263mil) from Top Layer to Bottom Layer And Via (4795mil,4287mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4263mil) from Top Layer to Bottom Layer And Via (4819mil,4263mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4287mil) from Top Layer to Bottom Layer And Via (4795mil,4311mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4287mil) from Top Layer to Bottom Layer And Via (4819mil,4287mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4311mil) from Top Layer to Bottom Layer And Via (4795mil,4335mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4311mil) from Top Layer to Bottom Layer And Via (4819mil,4311mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4335mil) from Top Layer to Bottom Layer And Via (4795mil,4359mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4335mil) from Top Layer to Bottom Layer And Via (4819mil,4335mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4359mil) from Top Layer to Bottom Layer And Via (4795mil,4383mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4359mil) from Top Layer to Bottom Layer And Via (4819mil,4359mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4383mil) from Top Layer to Bottom Layer And Via (4795mil,4407mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4383mil) from Top Layer to Bottom Layer And Via (4819mil,4383mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4407mil) from Top Layer to Bottom Layer And Via (4795mil,4431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4407mil) from Top Layer to Bottom Layer And Via (4819mil,4407mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4431mil) from Top Layer to Bottom Layer And Via (4795mil,4455mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4431mil) from Top Layer to Bottom Layer And Via (4819mil,4431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4455mil) from Top Layer to Bottom Layer And Via (4795mil,4479mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4455mil) from Top Layer to Bottom Layer And Via (4819mil,4455mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4479mil) from Top Layer to Bottom Layer And Via (4795mil,4503mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4479mil) from Top Layer to Bottom Layer And Via (4819mil,4479mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4503mil) from Top Layer to Bottom Layer And Via (4795mil,4527mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4503mil) from Top Layer to Bottom Layer And Via (4819mil,4503mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4527mil) from Top Layer to Bottom Layer And Via (4795mil,4551mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4527mil) from Top Layer to Bottom Layer And Via (4819mil,4527mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4551mil) from Top Layer to Bottom Layer And Via (4795mil,4575mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4551mil) from Top Layer to Bottom Layer And Via (4819mil,4551mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4795mil,4575mil) from Top Layer to Bottom Layer And Via (4819mil,4575mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.304mil < 10mil) Between Via (4799.8mil,4670.7mil) from Top Layer to Bottom Layer And Via (4811.9mil,4648.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.304mil] / [Bottom Solder] Mask Sliver [2.304mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4799.8mil,4670.7mil) from Top Layer to Bottom Layer And Via (4823.8mil,4670.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4799.8mil,4693.2mil) from Top Layer to Bottom Layer And Via (4823.8mil,4693.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.674mil < 10mil) Between Via (4800.5mil,4715.7mil) from Top Layer to Bottom Layer And Via (4823.8mil,4693.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.674mil] / [Bottom Solder] Mask Sliver [9.674mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4800.5mil,4715.7mil) from Top Layer to Bottom Layer And Via (4824.5mil,4715.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.319mil < 10mil) Between Via (4801.5mil,5721.2mil) from Top Layer to Bottom Layer And Via (4804.2mil,5748.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.319mil] / [Bottom Solder] Mask Sliver [4.319mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4810.2mil,4123.3mil) from Top Layer to Bottom Layer And Via (4810.2mil,4147.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4810.2mil,4123.3mil) from Top Layer to Bottom Layer And Via (4834.2mil,4123.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4810.2mil,4147.3mil) from Top Layer to Bottom Layer And Via (4834.2mil,4147.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.208mil < 10mil) Between Via (4811.9mil,4648.8mil) from Top Layer to Bottom Layer And Via (4823.8mil,4670.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.208mil] / [Bottom Solder] Mask Sliver [2.208mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4191mil) from Top Layer to Bottom Layer And Via (4819mil,4215mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4191mil) from Top Layer to Bottom Layer And Via (4843mil,4191mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4215mil) from Top Layer to Bottom Layer And Via (4819mil,4239mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4215mil) from Top Layer to Bottom Layer And Via (4843mil,4215mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4239mil) from Top Layer to Bottom Layer And Via (4819mil,4263mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4239mil) from Top Layer to Bottom Layer And Via (4843mil,4239mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4263mil) from Top Layer to Bottom Layer And Via (4819mil,4287mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4263mil) from Top Layer to Bottom Layer And Via (4843mil,4263mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4287mil) from Top Layer to Bottom Layer And Via (4819mil,4311mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4287mil) from Top Layer to Bottom Layer And Via (4843mil,4287mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4311mil) from Top Layer to Bottom Layer And Via (4819mil,4335mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4311mil) from Top Layer to Bottom Layer And Via (4843mil,4311mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4335mil) from Top Layer to Bottom Layer And Via (4819mil,4359mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4335mil) from Top Layer to Bottom Layer And Via (4843mil,4335mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4359mil) from Top Layer to Bottom Layer And Via (4819mil,4383mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4359mil) from Top Layer to Bottom Layer And Via (4843mil,4359mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4383mil) from Top Layer to Bottom Layer And Via (4819mil,4407mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4383mil) from Top Layer to Bottom Layer And Via (4843mil,4383mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4407mil) from Top Layer to Bottom Layer And Via (4819mil,4431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4407mil) from Top Layer to Bottom Layer And Via (4843mil,4407mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4431mil) from Top Layer to Bottom Layer And Via (4819mil,4455mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4431mil) from Top Layer to Bottom Layer And Via (4843mil,4431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4455mil) from Top Layer to Bottom Layer And Via (4819mil,4479mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4455mil) from Top Layer to Bottom Layer And Via (4843mil,4455mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4479mil) from Top Layer to Bottom Layer And Via (4819mil,4503mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4479mil) from Top Layer to Bottom Layer And Via (4843mil,4479mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4503mil) from Top Layer to Bottom Layer And Via (4819mil,4527mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4503mil) from Top Layer to Bottom Layer And Via (4843mil,4503mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4527mil) from Top Layer to Bottom Layer And Via (4819mil,4551mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4527mil) from Top Layer to Bottom Layer And Via (4843mil,4527mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4551mil) from Top Layer to Bottom Layer And Via (4819mil,4575mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4551mil) from Top Layer to Bottom Layer And Via (4843mil,4551mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4819mil,4575mil) from Top Layer to Bottom Layer And Via (4843mil,4575mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4834.2mil,4123.3mil) from Top Layer to Bottom Layer And Via (4834.2mil,4147.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4834.2mil,4123.3mil) from Top Layer to Bottom Layer And Via (4858.2mil,4123.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4834.2mil,4147.3mil) from Top Layer to Bottom Layer And Via (4858.2mil,4147.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.178mil < 10mil) Between Via (4837.938mil,5062.162mil) from Top Layer to Bottom Layer And Via (4855mil,5045.434mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.178mil] / [Bottom Solder] Mask Sliver [1.178mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4191mil) from Top Layer to Bottom Layer And Via (4843mil,4215mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4191mil) from Top Layer to Bottom Layer And Via (4867mil,4191mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4215mil) from Top Layer to Bottom Layer And Via (4843mil,4239mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4215mil) from Top Layer to Bottom Layer And Via (4867mil,4215mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4239mil) from Top Layer to Bottom Layer And Via (4843mil,4263mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4239mil) from Top Layer to Bottom Layer And Via (4867mil,4239mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4263mil) from Top Layer to Bottom Layer And Via (4843mil,4287mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4263mil) from Top Layer to Bottom Layer And Via (4867mil,4263mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4287mil) from Top Layer to Bottom Layer And Via (4843mil,4311mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4287mil) from Top Layer to Bottom Layer And Via (4867mil,4287mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4311mil) from Top Layer to Bottom Layer And Via (4843mil,4335mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4311mil) from Top Layer to Bottom Layer And Via (4867mil,4311mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4335mil) from Top Layer to Bottom Layer And Via (4843mil,4359mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4335mil) from Top Layer to Bottom Layer And Via (4867mil,4335mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4359mil) from Top Layer to Bottom Layer And Via (4843mil,4383mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4359mil) from Top Layer to Bottom Layer And Via (4867mil,4359mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4383mil) from Top Layer to Bottom Layer And Via (4843mil,4407mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4383mil) from Top Layer to Bottom Layer And Via (4867mil,4383mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4407mil) from Top Layer to Bottom Layer And Via (4843mil,4431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4407mil) from Top Layer to Bottom Layer And Via (4867mil,4407mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4431mil) from Top Layer to Bottom Layer And Via (4843mil,4455mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4431mil) from Top Layer to Bottom Layer And Via (4867mil,4431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4455mil) from Top Layer to Bottom Layer And Via (4843mil,4479mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4455mil) from Top Layer to Bottom Layer And Via (4867mil,4455mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4479mil) from Top Layer to Bottom Layer And Via (4843mil,4503mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4479mil) from Top Layer to Bottom Layer And Via (4867mil,4479mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4503mil) from Top Layer to Bottom Layer And Via (4843mil,4527mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4503mil) from Top Layer to Bottom Layer And Via (4867mil,4503mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4527mil) from Top Layer to Bottom Layer And Via (4843mil,4551mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4527mil) from Top Layer to Bottom Layer And Via (4867mil,4527mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4551mil) from Top Layer to Bottom Layer And Via (4843mil,4575mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4551mil) from Top Layer to Bottom Layer And Via (4867mil,4551mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4843mil,4575mil) from Top Layer to Bottom Layer And Via (4867mil,4575mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.318mil < 10mil) Between Via (4855mil,5045.434mil) from Top Layer to Bottom Layer And Via (4869.7mil,5027.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.318mil] / [Bottom Solder] Mask Sliver [0.318mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4858.2mil,4123.3mil) from Top Layer to Bottom Layer And Via (4858.2mil,4147.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4191mil) from Top Layer to Bottom Layer And Via (4867mil,4215mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4191mil) from Top Layer to Bottom Layer And Via (4891mil,4191mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4215mil) from Top Layer to Bottom Layer And Via (4867mil,4239mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4215mil) from Top Layer to Bottom Layer And Via (4891mil,4215mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4239mil) from Top Layer to Bottom Layer And Via (4867mil,4263mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4239mil) from Top Layer to Bottom Layer And Via (4891mil,4239mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4263mil) from Top Layer to Bottom Layer And Via (4867mil,4287mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4263mil) from Top Layer to Bottom Layer And Via (4891mil,4263mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4287mil) from Top Layer to Bottom Layer And Via (4867mil,4311mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4287mil) from Top Layer to Bottom Layer And Via (4891mil,4287mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4311mil) from Top Layer to Bottom Layer And Via (4867mil,4335mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4311mil) from Top Layer to Bottom Layer And Via (4891mil,4311mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4335mil) from Top Layer to Bottom Layer And Via (4867mil,4359mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4335mil) from Top Layer to Bottom Layer And Via (4891mil,4335mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4359mil) from Top Layer to Bottom Layer And Via (4867mil,4383mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4359mil) from Top Layer to Bottom Layer And Via (4891mil,4359mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4383mil) from Top Layer to Bottom Layer And Via (4867mil,4407mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4383mil) from Top Layer to Bottom Layer And Via (4891mil,4383mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4407mil) from Top Layer to Bottom Layer And Via (4867mil,4431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4407mil) from Top Layer to Bottom Layer And Via (4891mil,4407mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4431mil) from Top Layer to Bottom Layer And Via (4867mil,4455mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4431mil) from Top Layer to Bottom Layer And Via (4891mil,4431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4455mil) from Top Layer to Bottom Layer And Via (4867mil,4479mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4455mil) from Top Layer to Bottom Layer And Via (4891mil,4455mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4479mil) from Top Layer to Bottom Layer And Via (4867mil,4503mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4479mil) from Top Layer to Bottom Layer And Via (4891mil,4479mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4503mil) from Top Layer to Bottom Layer And Via (4867mil,4527mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4503mil) from Top Layer to Bottom Layer And Via (4891mil,4503mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4527mil) from Top Layer to Bottom Layer And Via (4867mil,4551mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4527mil) from Top Layer to Bottom Layer And Via (4891mil,4527mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4551mil) from Top Layer to Bottom Layer And Via (4867mil,4575mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4551mil) from Top Layer to Bottom Layer And Via (4891mil,4551mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4867mil,4575mil) from Top Layer to Bottom Layer And Via (4891mil,4575mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4191mil) from Top Layer to Bottom Layer And Via (4891mil,4215mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4191mil) from Top Layer to Bottom Layer And Via (4915mil,4191mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4215mil) from Top Layer to Bottom Layer And Via (4891mil,4239mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4215mil) from Top Layer to Bottom Layer And Via (4915mil,4215mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4239mil) from Top Layer to Bottom Layer And Via (4891mil,4263mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4239mil) from Top Layer to Bottom Layer And Via (4915mil,4239mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4263mil) from Top Layer to Bottom Layer And Via (4891mil,4287mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4263mil) from Top Layer to Bottom Layer And Via (4915mil,4263mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4287mil) from Top Layer to Bottom Layer And Via (4891mil,4311mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4287mil) from Top Layer to Bottom Layer And Via (4915mil,4287mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4311mil) from Top Layer to Bottom Layer And Via (4891mil,4335mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4311mil) from Top Layer to Bottom Layer And Via (4915mil,4311mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4335mil) from Top Layer to Bottom Layer And Via (4891mil,4359mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4335mil) from Top Layer to Bottom Layer And Via (4915mil,4335mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4359mil) from Top Layer to Bottom Layer And Via (4891mil,4383mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4359mil) from Top Layer to Bottom Layer And Via (4915mil,4359mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4383mil) from Top Layer to Bottom Layer And Via (4891mil,4407mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4383mil) from Top Layer to Bottom Layer And Via (4915mil,4383mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4407mil) from Top Layer to Bottom Layer And Via (4891mil,4431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4407mil) from Top Layer to Bottom Layer And Via (4915mil,4407mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4431mil) from Top Layer to Bottom Layer And Via (4891mil,4455mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4431mil) from Top Layer to Bottom Layer And Via (4915mil,4431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4455mil) from Top Layer to Bottom Layer And Via (4891mil,4479mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4455mil) from Top Layer to Bottom Layer And Via (4915mil,4455mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4479mil) from Top Layer to Bottom Layer And Via (4891mil,4503mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4479mil) from Top Layer to Bottom Layer And Via (4915mil,4479mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4503mil) from Top Layer to Bottom Layer And Via (4891mil,4527mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4503mil) from Top Layer to Bottom Layer And Via (4915mil,4503mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4527mil) from Top Layer to Bottom Layer And Via (4891mil,4551mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4527mil) from Top Layer to Bottom Layer And Via (4915mil,4527mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4551mil) from Top Layer to Bottom Layer And Via (4891mil,4575mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4551mil) from Top Layer to Bottom Layer And Via (4915mil,4551mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4891mil,4575mil) from Top Layer to Bottom Layer And Via (4915mil,4575mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.325mil < 10mil) Between Via (4895.903mil,5161.458mil) from Top Layer to Bottom Layer And Via (4925.945mil,5161.458mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.325mil] / [Bottom Solder] Mask Sliver [7.325mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4899.4mil,3971.4mil) from Top Layer to Bottom Layer And Via (4899.4mil,3995.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4899.4mil,3971.4mil) from Top Layer to Bottom Layer And Via (4923.4mil,3971.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4899.4mil,3995.4mil) from Top Layer to Bottom Layer And Via (4899.4mil,4019.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4899.4mil,3995.4mil) from Top Layer to Bottom Layer And Via (4923.4mil,3995.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4899.4mil,4019.4mil) from Top Layer to Bottom Layer And Via (4899.4mil,4043.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4899.4mil,4019.4mil) from Top Layer to Bottom Layer And Via (4923.4mil,4019.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4899.4mil,4043.4mil) from Top Layer to Bottom Layer And Via (4899.4mil,4067.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4899.4mil,4043.4mil) from Top Layer to Bottom Layer And Via (4923.4mil,4043.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4899.4mil,4067.4mil) from Top Layer to Bottom Layer And Via (4899.4mil,4091.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4899.4mil,4067.4mil) from Top Layer to Bottom Layer And Via (4923.4mil,4067.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4899.4mil,4091.4mil) from Top Layer to Bottom Layer And Via (4899.4mil,4115.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4899.4mil,4091.4mil) from Top Layer to Bottom Layer And Via (4923.4mil,4091.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4899.4mil,4115.4mil) from Top Layer to Bottom Layer And Via (4899.4mil,4139.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4899.4mil,4115.4mil) from Top Layer to Bottom Layer And Via (4923.4mil,4115.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4899.4mil,4139.4mil) from Top Layer to Bottom Layer And Via (4923.4mil,4139.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.519mil < 10mil) Between Via (4911.3mil,5006.6mil) from Top Layer to Bottom Layer And Via (4933.742mil,4995.058mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.519mil] / [Bottom Solder] Mask Sliver [2.519mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4191mil) from Top Layer to Bottom Layer And Via (4915mil,4215mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4215mil) from Top Layer to Bottom Layer And Via (4915mil,4239mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4239mil) from Top Layer to Bottom Layer And Via (4915mil,4263mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4263mil) from Top Layer to Bottom Layer And Via (4915mil,4287mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4287mil) from Top Layer to Bottom Layer And Via (4915mil,4311mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4311mil) from Top Layer to Bottom Layer And Via (4915mil,4335mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4335mil) from Top Layer to Bottom Layer And Via (4915mil,4359mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4359mil) from Top Layer to Bottom Layer And Via (4915mil,4383mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4383mil) from Top Layer to Bottom Layer And Via (4915mil,4407mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4407mil) from Top Layer to Bottom Layer And Via (4915mil,4431mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4431mil) from Top Layer to Bottom Layer And Via (4915mil,4455mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4455mil) from Top Layer to Bottom Layer And Via (4915mil,4479mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4479mil) from Top Layer to Bottom Layer And Via (4915mil,4503mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4503mil) from Top Layer to Bottom Layer And Via (4915mil,4527mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4527mil) from Top Layer to Bottom Layer And Via (4915mil,4551mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4915mil,4551mil) from Top Layer to Bottom Layer And Via (4915mil,4575mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4923.4mil,3971.4mil) from Top Layer to Bottom Layer And Via (4923.4mil,3995.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4923.4mil,3995.4mil) from Top Layer to Bottom Layer And Via (4923.4mil,4019.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4923.4mil,4019.4mil) from Top Layer to Bottom Layer And Via (4923.4mil,4043.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4923.4mil,4043.4mil) from Top Layer to Bottom Layer And Via (4923.4mil,4067.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4923.4mil,4067.4mil) from Top Layer to Bottom Layer And Via (4923.4mil,4091.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4923.4mil,4091.4mil) from Top Layer to Bottom Layer And Via (4923.4mil,4115.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4923.4mil,4115.4mil) from Top Layer to Bottom Layer And Via (4923.4mil,4139.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.958mil < 10mil) Between Via (4948.7mil,4661.8mil) from Top Layer to Bottom Layer And Via (4969.6mil,4638mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.958mil] / [Bottom Solder] Mask Sliver [8.958mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4948.7mil,4661.8mil) from Top Layer to Bottom Layer And Via (4972.7mil,4661.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4948.7mil,4684.3mil) from Top Layer to Bottom Layer And Via (4972.7mil,4684.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.674mil < 10mil) Between Via (4949.4mil,4706.8mil) from Top Layer to Bottom Layer And Via (4972.7mil,4684.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.674mil] / [Bottom Solder] Mask Sliver [9.674mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4949.4mil,4706.8mil) from Top Layer to Bottom Layer And Via (4973.4mil,4706.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4957.7mil,3970.8mil) from Top Layer to Bottom Layer And Via (4957.7mil,3994.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4957.7mil,3970.8mil) from Top Layer to Bottom Layer And Via (4981.7mil,3970.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4957.7mil,3994.8mil) from Top Layer to Bottom Layer And Via (4957.7mil,4018.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4957.7mil,3994.8mil) from Top Layer to Bottom Layer And Via (4981.7mil,3994.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4957.7mil,4018.8mil) from Top Layer to Bottom Layer And Via (4957.7mil,4042.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4957.7mil,4018.8mil) from Top Layer to Bottom Layer And Via (4981.7mil,4018.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4957.7mil,4042.8mil) from Top Layer to Bottom Layer And Via (4957.7mil,4066.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4957.7mil,4042.8mil) from Top Layer to Bottom Layer And Via (4981.7mil,4042.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4957.7mil,4066.8mil) from Top Layer to Bottom Layer And Via (4957.7mil,4090.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4957.7mil,4066.8mil) from Top Layer to Bottom Layer And Via (4981.7mil,4066.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4957.7mil,4090.8mil) from Top Layer to Bottom Layer And Via (4957.7mil,4114.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4957.7mil,4090.8mil) from Top Layer to Bottom Layer And Via (4981.7mil,4090.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4957.7mil,4114.8mil) from Top Layer to Bottom Layer And Via (4957.7mil,4138.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4957.7mil,4114.8mil) from Top Layer to Bottom Layer And Via (4981.7mil,4114.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4957.7mil,4138.8mil) from Top Layer to Bottom Layer And Via (4981.7mil,4138.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.285mil < 10mil) Between Via (4969.6mil,4638mil) from Top Layer to Bottom Layer And Via (4972.7mil,4661.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.285mil] / [Bottom Solder] Mask Sliver [1.285mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4969.6mil,4638mil) from Top Layer to Bottom Layer And Via (4993.6mil,4638mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.958mil < 10mil) Between Via (4972.7mil,4661.8mil) from Top Layer to Bottom Layer And Via (4993.6mil,4638mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.958mil] / [Bottom Solder] Mask Sliver [8.958mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4972.7mil,4661.8mil) from Top Layer to Bottom Layer And Via (4996.7mil,4661.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4972.7mil,4684.3mil) from Top Layer to Bottom Layer And Via (4996.7mil,4684.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.674mil < 10mil) Between Via (4973.4mil,4706.8mil) from Top Layer to Bottom Layer And Via (4996.7mil,4684.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.674mil] / [Bottom Solder] Mask Sliver [9.674mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4973.4mil,4706.8mil) from Top Layer to Bottom Layer And Via (4997.4mil,4706.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4981.7mil,3970.8mil) from Top Layer to Bottom Layer And Via (4981.7mil,3994.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4981.7mil,3994.8mil) from Top Layer to Bottom Layer And Via (4981.7mil,4018.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4981.7mil,4018.8mil) from Top Layer to Bottom Layer And Via (4981.7mil,4042.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4981.7mil,4042.8mil) from Top Layer to Bottom Layer And Via (4981.7mil,4066.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4981.7mil,4066.8mil) from Top Layer to Bottom Layer And Via (4981.7mil,4090.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4981.7mil,4090.8mil) from Top Layer to Bottom Layer And Via (4981.7mil,4114.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4981.7mil,4114.8mil) from Top Layer to Bottom Layer And Via (4981.7mil,4138.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4981mil,4478mil) from Top Layer to Bottom Layer And Via (4981mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4981mil,4478mil) from Top Layer to Bottom Layer And Via (5005mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4981mil,4502mil) from Top Layer to Bottom Layer And Via (4981mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4981mil,4502mil) from Top Layer to Bottom Layer And Via (5005mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4981mil,4526mil) from Top Layer to Bottom Layer And Via (4981mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4981mil,4526mil) from Top Layer to Bottom Layer And Via (5005mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4981mil,4550mil) from Top Layer to Bottom Layer And Via (5005mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4983.899mil,4245.276mil) from Top Layer to Bottom Layer And Via (4983.899mil,4269.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4983.899mil,4245.276mil) from Top Layer to Bottom Layer And Via (5007.899mil,4245.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4983.899mil,4269.276mil) from Top Layer to Bottom Layer And Via (4983.899mil,4293.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4983.899mil,4269.276mil) from Top Layer to Bottom Layer And Via (5007.899mil,4269.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4983.899mil,4293.276mil) from Top Layer to Bottom Layer And Via (4983.899mil,4317.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4983.899mil,4293.276mil) from Top Layer to Bottom Layer And Via (5007.899mil,4293.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4983.899mil,4317.276mil) from Top Layer to Bottom Layer And Via (4983.899mil,4341.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4983.899mil,4317.276mil) from Top Layer to Bottom Layer And Via (5007.899mil,4317.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4983.899mil,4341.276mil) from Top Layer to Bottom Layer And Via (4983.899mil,4365.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4983.899mil,4341.276mil) from Top Layer to Bottom Layer And Via (5007.899mil,4341.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4983.899mil,4365.276mil) from Top Layer to Bottom Layer And Via (5007.899mil,4365.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4990.8mil,4775.7mil) from Top Layer to Bottom Layer And Via (4990.8mil,4799.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4990.8mil,4775.7mil) from Top Layer to Bottom Layer And Via (5014.8mil,4775.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4990.8mil,4799.7mil) from Top Layer to Bottom Layer And Via (4990.8mil,4823.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4990.8mil,4799.7mil) from Top Layer to Bottom Layer And Via (5014.8mil,4799.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4990.8mil,4823.7mil) from Top Layer to Bottom Layer And Via (4990.8mil,4847.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4990.8mil,4823.7mil) from Top Layer to Bottom Layer And Via (5014.8mil,4823.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4990.8mil,4847.7mil) from Top Layer to Bottom Layer And Via (4990.8mil,4871.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4990.8mil,4847.7mil) from Top Layer to Bottom Layer And Via (5014.8mil,4847.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4990.8mil,4871.7mil) from Top Layer to Bottom Layer And Via (4990.8mil,4895.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4990.8mil,4871.7mil) from Top Layer to Bottom Layer And Via (5014.8mil,4871.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (4990.8mil,4895.7mil) from Top Layer to Bottom Layer And Via (5014.8mil,4895.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.285mil < 10mil) Between Via (4993.6mil,4638mil) from Top Layer to Bottom Layer And Via (4996.7mil,4661.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.285mil] / [Bottom Solder] Mask Sliver [1.285mil]
Minimum Solder Mask Sliver Constraint: (6.754mil < 10mil) Between Via (4996.7mil,4661.8mil) from Top Layer to Bottom Layer And Via (5015mil,4638.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.754mil] / [Bottom Solder] Mask Sliver [6.754mil]
Minimum Solder Mask Sliver Constraint: (0.691mil < 10mil) Between Via (4996.7mil,4661.8mil) from Top Layer to Bottom Layer And Via (5020.1mil,4662.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.691mil] / [Bottom Solder] Mask Sliver [0.691mil]
Minimum Solder Mask Sliver Constraint: (9.333mil < 10mil) Between Via (4996.7mil,4684.3mil) from Top Layer to Bottom Layer And Via (5020.1mil,4662.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.333mil] / [Bottom Solder] Mask Sliver [9.333mil]
Minimum Solder Mask Sliver Constraint: (0.691mil < 10mil) Between Via (4996.7mil,4684.3mil) from Top Layer to Bottom Layer And Via (5020.1mil,4684.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.691mil] / [Bottom Solder] Mask Sliver [0.691mil]
Minimum Solder Mask Sliver Constraint: (8.826mil < 10mil) Between Via (4997.4mil,4706.8mil) from Top Layer to Bottom Layer And Via (5020.1mil,4684.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.826mil] / [Bottom Solder] Mask Sliver [8.826mil]
Minimum Solder Mask Sliver Constraint: (0.691mil < 10mil) Between Via (4997.4mil,4706.8mil) from Top Layer to Bottom Layer And Via (5020.8mil,4707.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.691mil] / [Bottom Solder] Mask Sliver [0.691mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5005mil,4478mil) from Top Layer to Bottom Layer And Via (5005mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.284mil < 10mil) Between Via (5005mil,4478mil) from Top Layer to Bottom Layer And Via (5031mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.284mil] / [Bottom Solder] Mask Sliver [3.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5005mil,4502mil) from Top Layer to Bottom Layer And Via (5005mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.284mil < 10mil) Between Via (5005mil,4502mil) from Top Layer to Bottom Layer And Via (5031mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.284mil] / [Bottom Solder] Mask Sliver [3.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5005mil,4526mil) from Top Layer to Bottom Layer And Via (5005mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.284mil < 10mil) Between Via (5005mil,4526mil) from Top Layer to Bottom Layer And Via (5031mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.284mil] / [Bottom Solder] Mask Sliver [3.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5005mil,4550mil) from Top Layer to Bottom Layer And Via (5005mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.284mil < 10mil) Between Via (5005mil,4550mil) from Top Layer to Bottom Layer And Via (5031mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.284mil] / [Bottom Solder] Mask Sliver [3.284mil]
Minimum Solder Mask Sliver Constraint: (3.284mil < 10mil) Between Via (5005mil,4574mil) from Top Layer to Bottom Layer And Via (5031mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.284mil] / [Bottom Solder] Mask Sliver [3.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5007.899mil,4245.276mil) from Top Layer to Bottom Layer And Via (5007.899mil,4269.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.504mil < 10mil) Between Via (5007.899mil,4245.276mil) from Top Layer to Bottom Layer And Via (5031mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.504mil] / [Bottom Solder] Mask Sliver [1.504mil]
Minimum Solder Mask Sliver Constraint: (5.803mil < 10mil) Between Via (5007.899mil,4245.276mil) from Top Layer to Bottom Layer And Via (5031mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.803mil] / [Bottom Solder] Mask Sliver [5.803mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5007.899mil,4269.276mil) from Top Layer to Bottom Layer And Via (5007.899mil,4293.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.504mil < 10mil) Between Via (5007.899mil,4269.276mil) from Top Layer to Bottom Layer And Via (5031mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.504mil] / [Bottom Solder] Mask Sliver [1.504mil]
Minimum Solder Mask Sliver Constraint: (5.803mil < 10mil) Between Via (5007.899mil,4269.276mil) from Top Layer to Bottom Layer And Via (5031mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.803mil] / [Bottom Solder] Mask Sliver [5.803mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5007.899mil,4293.276mil) from Top Layer to Bottom Layer And Via (5007.899mil,4317.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.504mil < 10mil) Between Via (5007.899mil,4293.276mil) from Top Layer to Bottom Layer And Via (5031mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.504mil] / [Bottom Solder] Mask Sliver [1.504mil]
Minimum Solder Mask Sliver Constraint: (5.803mil < 10mil) Between Via (5007.899mil,4293.276mil) from Top Layer to Bottom Layer And Via (5031mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.803mil] / [Bottom Solder] Mask Sliver [5.803mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5007.899mil,4317.276mil) from Top Layer to Bottom Layer And Via (5007.899mil,4341.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.504mil < 10mil) Between Via (5007.899mil,4317.276mil) from Top Layer to Bottom Layer And Via (5031mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.504mil] / [Bottom Solder] Mask Sliver [1.504mil]
Minimum Solder Mask Sliver Constraint: (5.803mil < 10mil) Between Via (5007.899mil,4317.276mil) from Top Layer to Bottom Layer And Via (5031mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.803mil] / [Bottom Solder] Mask Sliver [5.803mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5007.899mil,4341.276mil) from Top Layer to Bottom Layer And Via (5007.899mil,4365.276mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.504mil < 10mil) Between Via (5007.899mil,4341.276mil) from Top Layer to Bottom Layer And Via (5031mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.504mil] / [Bottom Solder] Mask Sliver [1.504mil]
Minimum Solder Mask Sliver Constraint: (5.803mil < 10mil) Between Via (5007.899mil,4341.276mil) from Top Layer to Bottom Layer And Via (5031mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.803mil] / [Bottom Solder] Mask Sliver [5.803mil]
Minimum Solder Mask Sliver Constraint: (1.504mil < 10mil) Between Via (5007.899mil,4365.276mil) from Top Layer to Bottom Layer And Via (5031mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.504mil] / [Bottom Solder] Mask Sliver [1.504mil]
Minimum Solder Mask Sliver Constraint: (5.803mil < 10mil) Between Via (5007.899mil,4365.276mil) from Top Layer to Bottom Layer And Via (5031mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.803mil] / [Bottom Solder] Mask Sliver [5.803mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5014.8mil,4775.7mil) from Top Layer to Bottom Layer And Via (5014.8mil,4799.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.087mil < 10mil) Between Via (5014.8mil,4775.7mil) from Top Layer to Bottom Layer And Via (5041.6mil,4775.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.087mil] / [Bottom Solder] Mask Sliver [4.087mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5014.8mil,4799.7mil) from Top Layer to Bottom Layer And Via (5014.8mil,4823.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.087mil < 10mil) Between Via (5014.8mil,4799.7mil) from Top Layer to Bottom Layer And Via (5041.6mil,4799.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.087mil] / [Bottom Solder] Mask Sliver [4.087mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5014.8mil,4823.7mil) from Top Layer to Bottom Layer And Via (5014.8mil,4847.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.087mil < 10mil) Between Via (5014.8mil,4823.7mil) from Top Layer to Bottom Layer And Via (5041.6mil,4823.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.087mil] / [Bottom Solder] Mask Sliver [4.087mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5014.8mil,4847.7mil) from Top Layer to Bottom Layer And Via (5014.8mil,4871.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.087mil < 10mil) Between Via (5014.8mil,4847.7mil) from Top Layer to Bottom Layer And Via (5041.6mil,4847.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.087mil] / [Bottom Solder] Mask Sliver [4.087mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5014.8mil,4871.7mil) from Top Layer to Bottom Layer And Via (5014.8mil,4895.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.087mil < 10mil) Between Via (5014.8mil,4871.7mil) from Top Layer to Bottom Layer And Via (5041.6mil,4871.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.087mil] / [Bottom Solder] Mask Sliver [4.087mil]
Minimum Solder Mask Sliver Constraint: (4.087mil < 10mil) Between Via (5014.8mil,4895.7mil) from Top Layer to Bottom Layer And Via (5041.6mil,4895.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.087mil] / [Bottom Solder] Mask Sliver [4.087mil]
Minimum Solder Mask Sliver Constraint: (1.526mil < 10mil) Between Via (5015mil,4638.7mil) from Top Layer to Bottom Layer And Via (5020.1mil,4662.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.526mil] / [Bottom Solder] Mask Sliver [1.526mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5015mil,4638.7mil) from Top Layer to Bottom Layer And Via (5039mil,4638.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5017mil,4130.7mil) from Top Layer to Bottom Layer And Via (5017mil,4154.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5017mil,4130.7mil) from Top Layer to Bottom Layer And Via (5041mil,4130.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5017mil,4154.7mil) from Top Layer to Bottom Layer And Via (5041mil,4154.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.597mil < 10mil) Between Via (5020.1mil,4662.4mil) from Top Layer to Bottom Layer And Via (5039mil,4638.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.597mil] / [Bottom Solder] Mask Sliver [7.597mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5020.1mil,4662.4mil) from Top Layer to Bottom Layer And Via (5044.1mil,4662.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5020.1mil,4684.9mil) from Top Layer to Bottom Layer And Via (5044.1mil,4684.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.674mil < 10mil) Between Via (5020.8mil,4707.4mil) from Top Layer to Bottom Layer And Via (5044.1mil,4684.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.674mil] / [Bottom Solder] Mask Sliver [9.674mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5020.8mil,4707.4mil) from Top Layer to Bottom Layer And Via (5044.8mil,4707.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.669mil < 10mil) Between Via (5029.964mil,5537.654mil) from Top Layer to Bottom Layer And Via (5056.258mil,5535.458mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.669mil] / [Bottom Solder] Mask Sliver [3.669mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4190mil) from Top Layer to Bottom Layer And Via (5031mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4190mil) from Top Layer to Bottom Layer And Via (5055mil,4190mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4214mil) from Top Layer to Bottom Layer And Via (5031mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4214mil) from Top Layer to Bottom Layer And Via (5055mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4238mil) from Top Layer to Bottom Layer And Via (5031mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4238mil) from Top Layer to Bottom Layer And Via (5055mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4262mil) from Top Layer to Bottom Layer And Via (5031mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4262mil) from Top Layer to Bottom Layer And Via (5055mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4286mil) from Top Layer to Bottom Layer And Via (5031mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4286mil) from Top Layer to Bottom Layer And Via (5055mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4310mil) from Top Layer to Bottom Layer And Via (5031mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4310mil) from Top Layer to Bottom Layer And Via (5055mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4334mil) from Top Layer to Bottom Layer And Via (5031mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4334mil) from Top Layer to Bottom Layer And Via (5055mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4358mil) from Top Layer to Bottom Layer And Via (5031mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4358mil) from Top Layer to Bottom Layer And Via (5055mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4382mil) from Top Layer to Bottom Layer And Via (5031mil,4406mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4382mil) from Top Layer to Bottom Layer And Via (5055mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4406mil) from Top Layer to Bottom Layer And Via (5031mil,4430mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4406mil) from Top Layer to Bottom Layer And Via (5055mil,4406mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4430mil) from Top Layer to Bottom Layer And Via (5031mil,4454mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4430mil) from Top Layer to Bottom Layer And Via (5055mil,4430mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4454mil) from Top Layer to Bottom Layer And Via (5031mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4454mil) from Top Layer to Bottom Layer And Via (5055mil,4454mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4478mil) from Top Layer to Bottom Layer And Via (5031mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4478mil) from Top Layer to Bottom Layer And Via (5055mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4502mil) from Top Layer to Bottom Layer And Via (5031mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4502mil) from Top Layer to Bottom Layer And Via (5055mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4526mil) from Top Layer to Bottom Layer And Via (5031mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4526mil) from Top Layer to Bottom Layer And Via (5055mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4550mil) from Top Layer to Bottom Layer And Via (5031mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4550mil) from Top Layer to Bottom Layer And Via (5055mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5031mil,4574mil) from Top Layer to Bottom Layer And Via (5055mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.526mil < 10mil) Between Via (5039mil,4638.7mil) from Top Layer to Bottom Layer And Via (5044.1mil,4662.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.526mil] / [Bottom Solder] Mask Sliver [1.526mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5039mil,4638.7mil) from Top Layer to Bottom Layer And Via (5063mil,4638.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5041.6mil,4775.3mil) from Top Layer to Bottom Layer And Via (5041.6mil,4799.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5041.6mil,4775.3mil) from Top Layer to Bottom Layer And Via (5065.6mil,4775.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5041.6mil,4799.3mil) from Top Layer to Bottom Layer And Via (5041.6mil,4823.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5041.6mil,4799.3mil) from Top Layer to Bottom Layer And Via (5065.6mil,4799.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5041.6mil,4823.3mil) from Top Layer to Bottom Layer And Via (5041.6mil,4847.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5041.6mil,4823.3mil) from Top Layer to Bottom Layer And Via (5065.6mil,4823.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5041.6mil,4847.3mil) from Top Layer to Bottom Layer And Via (5041.6mil,4871.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5041.6mil,4847.3mil) from Top Layer to Bottom Layer And Via (5065.6mil,4847.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5041.6mil,4871.3mil) from Top Layer to Bottom Layer And Via (5041.6mil,4895.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5041.6mil,4871.3mil) from Top Layer to Bottom Layer And Via (5065.6mil,4871.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.978mil < 10mil) Between Via (5041.6mil,4895.3mil) from Top Layer to Bottom Layer And Via (5048.2mil,4926.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.978mil] / [Bottom Solder] Mask Sliver [8.978mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5041.6mil,4895.3mil) from Top Layer to Bottom Layer And Via (5065.6mil,4895.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5041mil,4130.7mil) from Top Layer to Bottom Layer And Via (5041mil,4154.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5041mil,4130.7mil) from Top Layer to Bottom Layer And Via (5065mil,4130.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5041mil,4154.7mil) from Top Layer to Bottom Layer And Via (5065mil,4154.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.597mil < 10mil) Between Via (5044.1mil,4662.4mil) from Top Layer to Bottom Layer And Via (5063mil,4638.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.597mil] / [Bottom Solder] Mask Sliver [7.597mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5044.1mil,4662.4mil) from Top Layer to Bottom Layer And Via (5068.1mil,4662.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5044.1mil,4684.9mil) from Top Layer to Bottom Layer And Via (5068.1mil,4684.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.674mil < 10mil) Between Via (5044.8mil,4707.4mil) from Top Layer to Bottom Layer And Via (5068.1mil,4684.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.674mil] / [Bottom Solder] Mask Sliver [9.674mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5044.8mil,4707.4mil) from Top Layer to Bottom Layer And Via (5068.8mil,4707.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4190mil) from Top Layer to Bottom Layer And Via (5055mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4190mil) from Top Layer to Bottom Layer And Via (5079mil,4190mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4214mil) from Top Layer to Bottom Layer And Via (5055mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4214mil) from Top Layer to Bottom Layer And Via (5079mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4238mil) from Top Layer to Bottom Layer And Via (5055mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4238mil) from Top Layer to Bottom Layer And Via (5079mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4262mil) from Top Layer to Bottom Layer And Via (5055mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4262mil) from Top Layer to Bottom Layer And Via (5079mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4286mil) from Top Layer to Bottom Layer And Via (5055mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4286mil) from Top Layer to Bottom Layer And Via (5079mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4310mil) from Top Layer to Bottom Layer And Via (5055mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4310mil) from Top Layer to Bottom Layer And Via (5079mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4334mil) from Top Layer to Bottom Layer And Via (5055mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4334mil) from Top Layer to Bottom Layer And Via (5079mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4358mil) from Top Layer to Bottom Layer And Via (5055mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4358mil) from Top Layer to Bottom Layer And Via (5079mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4382mil) from Top Layer to Bottom Layer And Via (5055mil,4406mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4382mil) from Top Layer to Bottom Layer And Via (5079mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4406mil) from Top Layer to Bottom Layer And Via (5055mil,4430mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4406mil) from Top Layer to Bottom Layer And Via (5079mil,4406mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4430mil) from Top Layer to Bottom Layer And Via (5055mil,4454mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4430mil) from Top Layer to Bottom Layer And Via (5079mil,4430mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4454mil) from Top Layer to Bottom Layer And Via (5055mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4454mil) from Top Layer to Bottom Layer And Via (5079mil,4454mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4478mil) from Top Layer to Bottom Layer And Via (5055mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4478mil) from Top Layer to Bottom Layer And Via (5079mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4502mil) from Top Layer to Bottom Layer And Via (5055mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4502mil) from Top Layer to Bottom Layer And Via (5079mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4526mil) from Top Layer to Bottom Layer And Via (5055mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4526mil) from Top Layer to Bottom Layer And Via (5079mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4550mil) from Top Layer to Bottom Layer And Via (5055mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4550mil) from Top Layer to Bottom Layer And Via (5079mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5055mil,4574mil) from Top Layer to Bottom Layer And Via (5079mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.526mil < 10mil) Between Via (5063mil,4638.7mil) from Top Layer to Bottom Layer And Via (5068.1mil,4662.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.526mil] / [Bottom Solder] Mask Sliver [1.526mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5063mil,4638.7mil) from Top Layer to Bottom Layer And Via (5087mil,4638.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5065.6mil,4775.3mil) from Top Layer to Bottom Layer And Via (5065.6mil,4799.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.394mil < 10mil) Between Via (5065.6mil,4775.3mil) from Top Layer to Bottom Layer And Via (5088.7mil,4774.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.394mil] / [Bottom Solder] Mask Sliver [0.394mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5065.6mil,4799.3mil) from Top Layer to Bottom Layer And Via (5065.6mil,4823.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.394mil < 10mil) Between Via (5065.6mil,4799.3mil) from Top Layer to Bottom Layer And Via (5088.7mil,4798.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.394mil] / [Bottom Solder] Mask Sliver [0.394mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5065.6mil,4823.3mil) from Top Layer to Bottom Layer And Via (5065.6mil,4847.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.394mil < 10mil) Between Via (5065.6mil,4823.3mil) from Top Layer to Bottom Layer And Via (5088.7mil,4822.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.394mil] / [Bottom Solder] Mask Sliver [0.394mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5065.6mil,4847.3mil) from Top Layer to Bottom Layer And Via (5065.6mil,4871.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.394mil < 10mil) Between Via (5065.6mil,4847.3mil) from Top Layer to Bottom Layer And Via (5088.7mil,4846.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.394mil] / [Bottom Solder] Mask Sliver [0.394mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5065.6mil,4871.3mil) from Top Layer to Bottom Layer And Via (5065.6mil,4895.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.394mil < 10mil) Between Via (5065.6mil,4871.3mil) from Top Layer to Bottom Layer And Via (5088.7mil,4870.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.394mil] / [Bottom Solder] Mask Sliver [0.394mil]
Minimum Solder Mask Sliver Constraint: (0.394mil < 10mil) Between Via (5065.6mil,4895.3mil) from Top Layer to Bottom Layer And Via (5088.7mil,4894.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.394mil] / [Bottom Solder] Mask Sliver [0.394mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5065mil,4130.7mil) from Top Layer to Bottom Layer And Via (5065mil,4154.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.597mil < 10mil) Between Via (5068.1mil,4662.4mil) from Top Layer to Bottom Layer And Via (5087mil,4638.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.597mil] / [Bottom Solder] Mask Sliver [7.597mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5068.1mil,4662.4mil) from Top Layer to Bottom Layer And Via (5092.1mil,4662.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5068.1mil,4684.9mil) from Top Layer to Bottom Layer And Via (5092.1mil,4684.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.674mil < 10mil) Between Via (5068.8mil,4707.4mil) from Top Layer to Bottom Layer And Via (5092.1mil,4684.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.674mil] / [Bottom Solder] Mask Sliver [9.674mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5068.8mil,4707.4mil) from Top Layer to Bottom Layer And Via (5092.8mil,4707.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4190mil) from Top Layer to Bottom Layer And Via (5079mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4190mil) from Top Layer to Bottom Layer And Via (5103mil,4190mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4214mil) from Top Layer to Bottom Layer And Via (5079mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4214mil) from Top Layer to Bottom Layer And Via (5103mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4238mil) from Top Layer to Bottom Layer And Via (5079mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4238mil) from Top Layer to Bottom Layer And Via (5103mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4262mil) from Top Layer to Bottom Layer And Via (5079mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4262mil) from Top Layer to Bottom Layer And Via (5103mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4286mil) from Top Layer to Bottom Layer And Via (5079mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4286mil) from Top Layer to Bottom Layer And Via (5103mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4310mil) from Top Layer to Bottom Layer And Via (5079mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4310mil) from Top Layer to Bottom Layer And Via (5103mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4334mil) from Top Layer to Bottom Layer And Via (5079mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4334mil) from Top Layer to Bottom Layer And Via (5103mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4358mil) from Top Layer to Bottom Layer And Via (5079mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4358mil) from Top Layer to Bottom Layer And Via (5103mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4382mil) from Top Layer to Bottom Layer And Via (5079mil,4406mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4382mil) from Top Layer to Bottom Layer And Via (5103mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4406mil) from Top Layer to Bottom Layer And Via (5079mil,4430mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4406mil) from Top Layer to Bottom Layer And Via (5103mil,4406mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4430mil) from Top Layer to Bottom Layer And Via (5079mil,4454mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4430mil) from Top Layer to Bottom Layer And Via (5103mil,4430mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4454mil) from Top Layer to Bottom Layer And Via (5079mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4454mil) from Top Layer to Bottom Layer And Via (5103mil,4454mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4478mil) from Top Layer to Bottom Layer And Via (5079mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4478mil) from Top Layer to Bottom Layer And Via (5103mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4502mil) from Top Layer to Bottom Layer And Via (5079mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4502mil) from Top Layer to Bottom Layer And Via (5103mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4526mil) from Top Layer to Bottom Layer And Via (5079mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4526mil) from Top Layer to Bottom Layer And Via (5103mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4550mil) from Top Layer to Bottom Layer And Via (5079mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4550mil) from Top Layer to Bottom Layer And Via (5103mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5079mil,4574mil) from Top Layer to Bottom Layer And Via (5103mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.017mil < 10mil) Between Via (5085.829mil,5427.082mil) from Top Layer to Bottom Layer And Via (5106.6mil,5415.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.017mil] / [Bottom Solder] Mask Sliver [1.017mil]
Minimum Solder Mask Sliver Constraint: (1.526mil < 10mil) Between Via (5087mil,4638.7mil) from Top Layer to Bottom Layer And Via (5092.1mil,4662.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.526mil] / [Bottom Solder] Mask Sliver [1.526mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5087mil,4638.7mil) from Top Layer to Bottom Layer And Via (5111mil,4638.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5088.7mil,4774.6mil) from Top Layer to Bottom Layer And Via (5088.7mil,4798.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5088.7mil,4774.6mil) from Top Layer to Bottom Layer And Via (5112.7mil,4774.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5088.7mil,4798.6mil) from Top Layer to Bottom Layer And Via (5088.7mil,4822.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5088.7mil,4798.6mil) from Top Layer to Bottom Layer And Via (5112.7mil,4798.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5088.7mil,4822.6mil) from Top Layer to Bottom Layer And Via (5088.7mil,4846.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5088.7mil,4822.6mil) from Top Layer to Bottom Layer And Via (5112.7mil,4822.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5088.7mil,4846.6mil) from Top Layer to Bottom Layer And Via (5088.7mil,4870.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5088.7mil,4846.6mil) from Top Layer to Bottom Layer And Via (5112.7mil,4846.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5088.7mil,4870.6mil) from Top Layer to Bottom Layer And Via (5088.7mil,4894.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5088.7mil,4870.6mil) from Top Layer to Bottom Layer And Via (5112.7mil,4870.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5088.7mil,4894.6mil) from Top Layer to Bottom Layer And Via (5112.7mil,4894.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.597mil < 10mil) Between Via (5092.1mil,4662.4mil) from Top Layer to Bottom Layer And Via (5111mil,4638.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.597mil] / [Bottom Solder] Mask Sliver [7.597mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5092.1mil,4662.4mil) from Top Layer to Bottom Layer And Via (5116.1mil,4662.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5092.1mil,4684.9mil) from Top Layer to Bottom Layer And Via (5116.1mil,4684.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.674mil < 10mil) Between Via (5092.8mil,4707.4mil) from Top Layer to Bottom Layer And Via (5116.1mil,4684.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.674mil] / [Bottom Solder] Mask Sliver [9.674mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5092.8mil,4707.4mil) from Top Layer to Bottom Layer And Via (5116.8mil,4707.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4190mil) from Top Layer to Bottom Layer And Via (5103mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4190mil) from Top Layer to Bottom Layer And Via (5127mil,4190mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4214mil) from Top Layer to Bottom Layer And Via (5103mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4214mil) from Top Layer to Bottom Layer And Via (5127mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4238mil) from Top Layer to Bottom Layer And Via (5103mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4238mil) from Top Layer to Bottom Layer And Via (5127mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4262mil) from Top Layer to Bottom Layer And Via (5103mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4262mil) from Top Layer to Bottom Layer And Via (5127mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4286mil) from Top Layer to Bottom Layer And Via (5103mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4286mil) from Top Layer to Bottom Layer And Via (5127mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4310mil) from Top Layer to Bottom Layer And Via (5103mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4310mil) from Top Layer to Bottom Layer And Via (5127mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4334mil) from Top Layer to Bottom Layer And Via (5103mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4334mil) from Top Layer to Bottom Layer And Via (5127mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4358mil) from Top Layer to Bottom Layer And Via (5103mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4358mil) from Top Layer to Bottom Layer And Via (5127mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4382mil) from Top Layer to Bottom Layer And Via (5103mil,4406mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4382mil) from Top Layer to Bottom Layer And Via (5127mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4406mil) from Top Layer to Bottom Layer And Via (5103mil,4430mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4406mil) from Top Layer to Bottom Layer And Via (5127mil,4406mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4430mil) from Top Layer to Bottom Layer And Via (5103mil,4454mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4430mil) from Top Layer to Bottom Layer And Via (5127mil,4430mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4454mil) from Top Layer to Bottom Layer And Via (5103mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4454mil) from Top Layer to Bottom Layer And Via (5127mil,4454mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4478mil) from Top Layer to Bottom Layer And Via (5103mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4478mil) from Top Layer to Bottom Layer And Via (5127mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4502mil) from Top Layer to Bottom Layer And Via (5103mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4502mil) from Top Layer to Bottom Layer And Via (5127mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4526mil) from Top Layer to Bottom Layer And Via (5103mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4526mil) from Top Layer to Bottom Layer And Via (5127mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4550mil) from Top Layer to Bottom Layer And Via (5103mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4550mil) from Top Layer to Bottom Layer And Via (5127mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5103mil,4574mil) from Top Layer to Bottom Layer And Via (5127mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5105.5mil,3973mil) from Top Layer to Bottom Layer And Via (5105.5mil,3997mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5105.5mil,3997mil) from Top Layer to Bottom Layer And Via (5105.5mil,4021mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5105.5mil,4021mil) from Top Layer to Bottom Layer And Via (5105.5mil,4045mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5105.5mil,4045mil) from Top Layer to Bottom Layer And Via (5105.5mil,4069mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5105.5mil,4069mil) from Top Layer to Bottom Layer And Via (5105.5mil,4093mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5105.5mil,4093mil) from Top Layer to Bottom Layer And Via (5105.5mil,4117mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5105.5mil,4117mil) from Top Layer to Bottom Layer And Via (5105.5mil,4141mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.768mil < 10mil) Between Via (5106.6mil,5415.6mil) from Top Layer to Bottom Layer And Via (5117.8mil,5439.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.768mil] / [Bottom Solder] Mask Sliver [3.768mil]
Minimum Solder Mask Sliver Constraint: (2.268mil < 10mil) Between Via (5108.314mil,5662.142mil) from Top Layer to Bottom Layer And Via (5133.202mil,5659.943mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.268mil] / [Bottom Solder] Mask Sliver [2.268mil]
Minimum Solder Mask Sliver Constraint: (1.526mil < 10mil) Between Via (5111mil,4638.7mil) from Top Layer to Bottom Layer And Via (5116.1mil,4662.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.526mil] / [Bottom Solder] Mask Sliver [1.526mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5111mil,4638.7mil) from Top Layer to Bottom Layer And Via (5135mil,4638.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5112.7mil,4774.6mil) from Top Layer to Bottom Layer And Via (5112.7mil,4798.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.572mil < 10mil) Between Via (5112.7mil,4774.6mil) from Top Layer to Bottom Layer And Via (5134.3mil,4798.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.572mil] / [Bottom Solder] Mask Sliver [9.572mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5112.7mil,4798.6mil) from Top Layer to Bottom Layer And Via (5112.7mil,4822.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.572mil < 10mil) Between Via (5112.7mil,4798.6mil) from Top Layer to Bottom Layer And Via (5134.3mil,4774.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.572mil] / [Bottom Solder] Mask Sliver [9.572mil]
Minimum Solder Mask Sliver Constraint: (9.572mil < 10mil) Between Via (5112.7mil,4798.6mil) from Top Layer to Bottom Layer And Via (5134.3mil,4822.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.572mil] / [Bottom Solder] Mask Sliver [9.572mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5112.7mil,4822.6mil) from Top Layer to Bottom Layer And Via (5112.7mil,4846.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.572mil < 10mil) Between Via (5112.7mil,4822.6mil) from Top Layer to Bottom Layer And Via (5134.3mil,4798.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.572mil] / [Bottom Solder] Mask Sliver [9.572mil]
Minimum Solder Mask Sliver Constraint: (9.572mil < 10mil) Between Via (5112.7mil,4822.6mil) from Top Layer to Bottom Layer And Via (5134.3mil,4846.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.572mil] / [Bottom Solder] Mask Sliver [9.572mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5112.7mil,4846.6mil) from Top Layer to Bottom Layer And Via (5112.7mil,4870.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.572mil < 10mil) Between Via (5112.7mil,4846.6mil) from Top Layer to Bottom Layer And Via (5134.3mil,4822.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.572mil] / [Bottom Solder] Mask Sliver [9.572mil]
Minimum Solder Mask Sliver Constraint: (9.572mil < 10mil) Between Via (5112.7mil,4846.6mil) from Top Layer to Bottom Layer And Via (5134.3mil,4870.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.572mil] / [Bottom Solder] Mask Sliver [9.572mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5112.7mil,4870.6mil) from Top Layer to Bottom Layer And Via (5112.7mil,4894.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.572mil < 10mil) Between Via (5112.7mil,4870.6mil) from Top Layer to Bottom Layer And Via (5134.3mil,4846.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.572mil] / [Bottom Solder] Mask Sliver [9.572mil]
Minimum Solder Mask Sliver Constraint: (9.572mil < 10mil) Between Via (5112.7mil,4870.6mil) from Top Layer to Bottom Layer And Via (5134.3mil,4894.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.572mil] / [Bottom Solder] Mask Sliver [9.572mil]
Minimum Solder Mask Sliver Constraint: (9.572mil < 10mil) Between Via (5112.7mil,4894.6mil) from Top Layer to Bottom Layer And Via (5134.3mil,4870.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.572mil] / [Bottom Solder] Mask Sliver [9.572mil]
Minimum Solder Mask Sliver Constraint: (7.597mil < 10mil) Between Via (5116.1mil,4662.4mil) from Top Layer to Bottom Layer And Via (5135mil,4638.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.597mil] / [Bottom Solder] Mask Sliver [7.597mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5116.1mil,4662.4mil) from Top Layer to Bottom Layer And Via (5140.1mil,4662.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5116.1mil,4684.9mil) from Top Layer to Bottom Layer And Via (5140.1mil,4684.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.674mil < 10mil) Between Via (5116.8mil,4707.4mil) from Top Layer to Bottom Layer And Via (5140.1mil,4684.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.674mil] / [Bottom Solder] Mask Sliver [9.674mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5116.8mil,4707.4mil) from Top Layer to Bottom Layer And Via (5140.8mil,4707.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4190mil) from Top Layer to Bottom Layer And Via (5127mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4190mil) from Top Layer to Bottom Layer And Via (5151mil,4190mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4214mil) from Top Layer to Bottom Layer And Via (5127mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4214mil) from Top Layer to Bottom Layer And Via (5151mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4238mil) from Top Layer to Bottom Layer And Via (5127mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4238mil) from Top Layer to Bottom Layer And Via (5151mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4262mil) from Top Layer to Bottom Layer And Via (5127mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4262mil) from Top Layer to Bottom Layer And Via (5151mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4286mil) from Top Layer to Bottom Layer And Via (5127mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4286mil) from Top Layer to Bottom Layer And Via (5151mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4310mil) from Top Layer to Bottom Layer And Via (5127mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4310mil) from Top Layer to Bottom Layer And Via (5151mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4334mil) from Top Layer to Bottom Layer And Via (5127mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4334mil) from Top Layer to Bottom Layer And Via (5151mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4358mil) from Top Layer to Bottom Layer And Via (5127mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4358mil) from Top Layer to Bottom Layer And Via (5151mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4382mil) from Top Layer to Bottom Layer And Via (5127mil,4406mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4382mil) from Top Layer to Bottom Layer And Via (5151mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4406mil) from Top Layer to Bottom Layer And Via (5127mil,4430mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4406mil) from Top Layer to Bottom Layer And Via (5151mil,4406mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4430mil) from Top Layer to Bottom Layer And Via (5127mil,4454mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4430mil) from Top Layer to Bottom Layer And Via (5151mil,4430mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4454mil) from Top Layer to Bottom Layer And Via (5127mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4454mil) from Top Layer to Bottom Layer And Via (5151mil,4454mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4478mil) from Top Layer to Bottom Layer And Via (5127mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4478mil) from Top Layer to Bottom Layer And Via (5151mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4502mil) from Top Layer to Bottom Layer And Via (5127mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4502mil) from Top Layer to Bottom Layer And Via (5151mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4526mil) from Top Layer to Bottom Layer And Via (5127mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4526mil) from Top Layer to Bottom Layer And Via (5151mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4550mil) from Top Layer to Bottom Layer And Via (5127mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4550mil) from Top Layer to Bottom Layer And Via (5151mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5127mil,4574mil) from Top Layer to Bottom Layer And Via (5151mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.783mil < 10mil) Between Via (5133.202mil,5659.943mil) from Top Layer to Bottom Layer And Via (5159.071mil,5654.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.783mil] / [Bottom Solder] Mask Sliver [3.783mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5134.3mil,4774.6mil) from Top Layer to Bottom Layer And Via (5134.3mil,4798.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5134.3mil,4774.6mil) from Top Layer to Bottom Layer And Via (5158.3mil,4774.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5134.3mil,4798.6mil) from Top Layer to Bottom Layer And Via (5134.3mil,4822.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5134.3mil,4798.6mil) from Top Layer to Bottom Layer And Via (5158.3mil,4798.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5134.3mil,4822.6mil) from Top Layer to Bottom Layer And Via (5134.3mil,4846.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5134.3mil,4822.6mil) from Top Layer to Bottom Layer And Via (5158.3mil,4822.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5134.3mil,4846.6mil) from Top Layer to Bottom Layer And Via (5134.3mil,4870.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5134.3mil,4846.6mil) from Top Layer to Bottom Layer And Via (5158.3mil,4846.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5134.3mil,4870.6mil) from Top Layer to Bottom Layer And Via (5134.3mil,4894.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5134.3mil,4870.6mil) from Top Layer to Bottom Layer And Via (5158.3mil,4870.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5134.3mil,4894.6mil) from Top Layer to Bottom Layer And Via (5158.3mil,4894.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.526mil < 10mil) Between Via (5135mil,4638.7mil) from Top Layer to Bottom Layer And Via (5140.1mil,4662.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.526mil] / [Bottom Solder] Mask Sliver [1.526mil]
Minimum Solder Mask Sliver Constraint: (2.1mil < 10mil) Between Via (5135mil,4638.7mil) from Top Layer to Bottom Layer And Via (5159.8mil,4639.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.1mil] / [Bottom Solder] Mask Sliver [2.1mil]
Minimum Solder Mask Sliver Constraint: (7.415mil < 10mil) Between Via (5140.1mil,4662.4mil) from Top Layer to Bottom Layer And Via (5159.8mil,4639.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.415mil] / [Bottom Solder] Mask Sliver [7.415mil]
Minimum Solder Mask Sliver Constraint: (2.1mil < 10mil) Between Via (5140.1mil,4662.4mil) from Top Layer to Bottom Layer And Via (5164.9mil,4663.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.1mil] / [Bottom Solder] Mask Sliver [2.1mil]
Minimum Solder Mask Sliver Constraint: (2.1mil < 10mil) Between Via (5140.1mil,4684.9mil) from Top Layer to Bottom Layer And Via (5164.9mil,4685.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.1mil] / [Bottom Solder] Mask Sliver [2.1mil]
Minimum Solder Mask Sliver Constraint: (9.647mil < 10mil) Between Via (5140.8mil,4707.4mil) from Top Layer to Bottom Layer And Via (5164.9mil,4685.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.647mil] / [Bottom Solder] Mask Sliver [9.647mil]
Minimum Solder Mask Sliver Constraint: (2.1mil < 10mil) Between Via (5140.8mil,4707.4mil) from Top Layer to Bottom Layer And Via (5165.6mil,4708.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.1mil] / [Bottom Solder] Mask Sliver [2.1mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4190mil) from Top Layer to Bottom Layer And Via (5151mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4190mil) from Top Layer to Bottom Layer And Via (5175mil,4190mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4214mil) from Top Layer to Bottom Layer And Via (5151mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4214mil) from Top Layer to Bottom Layer And Via (5175mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4238mil) from Top Layer to Bottom Layer And Via (5151mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4238mil) from Top Layer to Bottom Layer And Via (5175mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4262mil) from Top Layer to Bottom Layer And Via (5151mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4262mil) from Top Layer to Bottom Layer And Via (5175mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4286mil) from Top Layer to Bottom Layer And Via (5151mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4286mil) from Top Layer to Bottom Layer And Via (5175mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4310mil) from Top Layer to Bottom Layer And Via (5151mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4310mil) from Top Layer to Bottom Layer And Via (5175mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4334mil) from Top Layer to Bottom Layer And Via (5151mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4334mil) from Top Layer to Bottom Layer And Via (5175mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4358mil) from Top Layer to Bottom Layer And Via (5151mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4358mil) from Top Layer to Bottom Layer And Via (5175mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4382mil) from Top Layer to Bottom Layer And Via (5151mil,4406mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4382mil) from Top Layer to Bottom Layer And Via (5175mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4406mil) from Top Layer to Bottom Layer And Via (5151mil,4430mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4406mil) from Top Layer to Bottom Layer And Via (5175mil,4406mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4430mil) from Top Layer to Bottom Layer And Via (5151mil,4454mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4430mil) from Top Layer to Bottom Layer And Via (5175mil,4430mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4454mil) from Top Layer to Bottom Layer And Via (5151mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4454mil) from Top Layer to Bottom Layer And Via (5175mil,4454mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4478mil) from Top Layer to Bottom Layer And Via (5151mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4478mil) from Top Layer to Bottom Layer And Via (5175mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4502mil) from Top Layer to Bottom Layer And Via (5151mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4502mil) from Top Layer to Bottom Layer And Via (5175mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4526mil) from Top Layer to Bottom Layer And Via (5151mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4526mil) from Top Layer to Bottom Layer And Via (5175mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4550mil) from Top Layer to Bottom Layer And Via (5151mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4550mil) from Top Layer to Bottom Layer And Via (5175mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5151mil,4574mil) from Top Layer to Bottom Layer And Via (5175mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5154.5mil,3974mil) from Top Layer to Bottom Layer And Via (5154.5mil,3998mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5154.5mil,3974mil) from Top Layer to Bottom Layer And Via (5178.5mil,3974mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5154.5mil,3998mil) from Top Layer to Bottom Layer And Via (5154.5mil,4022mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5154.5mil,3998mil) from Top Layer to Bottom Layer And Via (5178.5mil,3998mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5154.5mil,4022mil) from Top Layer to Bottom Layer And Via (5154.5mil,4046mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5154.5mil,4022mil) from Top Layer to Bottom Layer And Via (5178.5mil,4022mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5154.5mil,4046mil) from Top Layer to Bottom Layer And Via (5154.5mil,4070mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5154.5mil,4046mil) from Top Layer to Bottom Layer And Via (5178.5mil,4046mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5154.5mil,4070mil) from Top Layer to Bottom Layer And Via (5154.5mil,4094mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5154.5mil,4070mil) from Top Layer to Bottom Layer And Via (5178.5mil,4070mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5154.5mil,4094mil) from Top Layer to Bottom Layer And Via (5154.5mil,4118mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5154.5mil,4094mil) from Top Layer to Bottom Layer And Via (5178.5mil,4094mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5154.5mil,4118mil) from Top Layer to Bottom Layer And Via (5178.5mil,4118mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.61mil < 10mil) Between Via (5154.7mil,5406.4mil) from Top Layer to Bottom Layer And Via (5169.8mil,5380.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.61mil] / [Bottom Solder] Mask Sliver [7.61mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5158.3mil,4774.6mil) from Top Layer to Bottom Layer And Via (5158.3mil,4798.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.989mil < 10mil) Between Via (5158.3mil,4774.6mil) from Top Layer to Bottom Layer And Via (5180.3mil,4798.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.989mil] / [Bottom Solder] Mask Sliver [9.989mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5158.3mil,4798.6mil) from Top Layer to Bottom Layer And Via (5158.3mil,4822.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.694mil < 10mil) Between Via (5158.3mil,4798.6mil) from Top Layer to Bottom Layer And Via (5180.3mil,4774.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.694mil] / [Bottom Solder] Mask Sliver [9.694mil]
Minimum Solder Mask Sliver Constraint: (9.989mil < 10mil) Between Via (5158.3mil,4798.6mil) from Top Layer to Bottom Layer And Via (5180.3mil,4822.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.989mil] / [Bottom Solder] Mask Sliver [9.989mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5158.3mil,4822.6mil) from Top Layer to Bottom Layer And Via (5158.3mil,4846.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.694mil < 10mil) Between Via (5158.3mil,4822.6mil) from Top Layer to Bottom Layer And Via (5180.3mil,4798.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.694mil] / [Bottom Solder] Mask Sliver [9.694mil]
Minimum Solder Mask Sliver Constraint: (9.989mil < 10mil) Between Via (5158.3mil,4822.6mil) from Top Layer to Bottom Layer And Via (5180.3mil,4846.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.989mil] / [Bottom Solder] Mask Sliver [9.989mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5158.3mil,4846.6mil) from Top Layer to Bottom Layer And Via (5158.3mil,4870.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.694mil < 10mil) Between Via (5158.3mil,4846.6mil) from Top Layer to Bottom Layer And Via (5180.3mil,4822.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.694mil] / [Bottom Solder] Mask Sliver [9.694mil]
Minimum Solder Mask Sliver Constraint: (9.989mil < 10mil) Between Via (5158.3mil,4846.6mil) from Top Layer to Bottom Layer And Via (5180.3mil,4870.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.989mil] / [Bottom Solder] Mask Sliver [9.989mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5158.3mil,4870.6mil) from Top Layer to Bottom Layer And Via (5158.3mil,4894.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.694mil < 10mil) Between Via (5158.3mil,4870.6mil) from Top Layer to Bottom Layer And Via (5180.3mil,4846.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.694mil] / [Bottom Solder] Mask Sliver [9.694mil]
Minimum Solder Mask Sliver Constraint: (9.989mil < 10mil) Between Via (5158.3mil,4870.6mil) from Top Layer to Bottom Layer And Via (5180.3mil,4894.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.989mil] / [Bottom Solder] Mask Sliver [9.989mil]
Minimum Solder Mask Sliver Constraint: (9.694mil < 10mil) Between Via (5158.3mil,4894.6mil) from Top Layer to Bottom Layer And Via (5180.3mil,4870.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.694mil] / [Bottom Solder] Mask Sliver [9.694mil]
Minimum Solder Mask Sliver Constraint: (2.727mil < 10mil) Between Via (5159.071mil,5654.2mil) from Top Layer to Bottom Layer And Via (5183.237mil,5662.16mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.727mil] / [Bottom Solder] Mask Sliver [2.727mil]
Minimum Solder Mask Sliver Constraint: (1.526mil < 10mil) Between Via (5159.8mil,4639.6mil) from Top Layer to Bottom Layer And Via (5164.9mil,4663.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.526mil] / [Bottom Solder] Mask Sliver [1.526mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5159.8mil,4639.6mil) from Top Layer to Bottom Layer And Via (5183.8mil,4639.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.597mil < 10mil) Between Via (5164.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5183.8mil,4639.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.597mil] / [Bottom Solder] Mask Sliver [7.597mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5164.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5188.9mil,4663.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.699mil < 10mil) Between Via (5164.9mil,4685.8mil) from Top Layer to Bottom Layer And Via (5188.187mil,4706.887mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.699mil] / [Bottom Solder] Mask Sliver [8.699mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5164.9mil,4685.8mil) from Top Layer to Bottom Layer And Via (5188.9mil,4685.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.674mil < 10mil) Between Via (5165.6mil,4708.3mil) from Top Layer to Bottom Layer And Via (5188.9mil,4685.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.674mil] / [Bottom Solder] Mask Sliver [9.674mil]
Minimum Solder Mask Sliver Constraint: (1.043mil < 10mil) Between Via (5169.8mil,5380.1mil) from Top Layer to Bottom Layer And Via (5190.7mil,5391.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.043mil] / [Bottom Solder] Mask Sliver [1.043mil]
Minimum Solder Mask Sliver Constraint: (1.961mil < 10mil) Between Via (5170.888mil,5047.056mil) from Top Layer to Bottom Layer And Via (5195.172mil,5051.442mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.961mil] / [Bottom Solder] Mask Sliver [1.961mil]
Minimum Solder Mask Sliver Constraint: (5.912mil < 10mil) Between Via (5174.474mil,5152.619mil) from Top Layer to Bottom Layer And Via (5201.454mil,5143.043mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.912mil] / [Bottom Solder] Mask Sliver [5.912mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4190mil) from Top Layer to Bottom Layer And Via (5175mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4190mil) from Top Layer to Bottom Layer And Via (5199mil,4190mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4214mil) from Top Layer to Bottom Layer And Via (5175mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4214mil) from Top Layer to Bottom Layer And Via (5199mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4238mil) from Top Layer to Bottom Layer And Via (5175mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4238mil) from Top Layer to Bottom Layer And Via (5199mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4262mil) from Top Layer to Bottom Layer And Via (5175mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4262mil) from Top Layer to Bottom Layer And Via (5199mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4286mil) from Top Layer to Bottom Layer And Via (5175mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4286mil) from Top Layer to Bottom Layer And Via (5199mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4310mil) from Top Layer to Bottom Layer And Via (5175mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4310mil) from Top Layer to Bottom Layer And Via (5199mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4334mil) from Top Layer to Bottom Layer And Via (5175mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4334mil) from Top Layer to Bottom Layer And Via (5199mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4358mil) from Top Layer to Bottom Layer And Via (5175mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4358mil) from Top Layer to Bottom Layer And Via (5199mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4382mil) from Top Layer to Bottom Layer And Via (5175mil,4406mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4382mil) from Top Layer to Bottom Layer And Via (5199mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4406mil) from Top Layer to Bottom Layer And Via (5175mil,4430mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4406mil) from Top Layer to Bottom Layer And Via (5199mil,4406mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4430mil) from Top Layer to Bottom Layer And Via (5175mil,4454mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4430mil) from Top Layer to Bottom Layer And Via (5199mil,4430mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4454mil) from Top Layer to Bottom Layer And Via (5175mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4454mil) from Top Layer to Bottom Layer And Via (5199mil,4454mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4478mil) from Top Layer to Bottom Layer And Via (5175mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4478mil) from Top Layer to Bottom Layer And Via (5199mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4502mil) from Top Layer to Bottom Layer And Via (5175mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4502mil) from Top Layer to Bottom Layer And Via (5199mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4526mil) from Top Layer to Bottom Layer And Via (5175mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4526mil) from Top Layer to Bottom Layer And Via (5199mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4550mil) from Top Layer to Bottom Layer And Via (5175mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4550mil) from Top Layer to Bottom Layer And Via (5199mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5175mil,4574mil) from Top Layer to Bottom Layer And Via (5199mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5178.5mil,3974mil) from Top Layer to Bottom Layer And Via (5178.5mil,3998mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5178.5mil,3998mil) from Top Layer to Bottom Layer And Via (5178.5mil,4022mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5178.5mil,4022mil) from Top Layer to Bottom Layer And Via (5178.5mil,4046mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5178.5mil,4046mil) from Top Layer to Bottom Layer And Via (5178.5mil,4070mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5178.5mil,4070mil) from Top Layer to Bottom Layer And Via (5178.5mil,4094mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5178.5mil,4094mil) from Top Layer to Bottom Layer And Via (5178.5mil,4118mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5178.5mil,4118mil) from Top Layer to Bottom Layer And Via (5178.5mil,4142mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5180.3mil,4774.8mil) from Top Layer to Bottom Layer And Via (5180.3mil,4798.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5180.3mil,4774.8mil) from Top Layer to Bottom Layer And Via (5204.3mil,4774.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5180.3mil,4798.8mil) from Top Layer to Bottom Layer And Via (5180.3mil,4822.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5180.3mil,4798.8mil) from Top Layer to Bottom Layer And Via (5204.3mil,4798.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5180.3mil,4822.8mil) from Top Layer to Bottom Layer And Via (5180.3mil,4846.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5180.3mil,4822.8mil) from Top Layer to Bottom Layer And Via (5204.3mil,4822.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5180.3mil,4846.8mil) from Top Layer to Bottom Layer And Via (5180.3mil,4870.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5180.3mil,4846.8mil) from Top Layer to Bottom Layer And Via (5204.3mil,4846.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5180.3mil,4870.8mil) from Top Layer to Bottom Layer And Via (5180.3mil,4894.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5180.3mil,4870.8mil) from Top Layer to Bottom Layer And Via (5204.3mil,4870.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5180.3mil,4894.8mil) from Top Layer to Bottom Layer And Via (5204.3mil,4894.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.776mil < 10mil) Between Via (5183.237mil,5662.16mil) from Top Layer to Bottom Layer And Via (5206.4mil,5654.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.777mil] / [Bottom Solder] Mask Sliver [1.777mil]
Minimum Solder Mask Sliver Constraint: (1.526mil < 10mil) Between Via (5183.8mil,4639.6mil) from Top Layer to Bottom Layer And Via (5188.9mil,4663.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.526mil] / [Bottom Solder] Mask Sliver [1.526mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5183.8mil,4639.6mil) from Top Layer to Bottom Layer And Via (5207.8mil,4639.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.77mil < 10mil) Between Via (5188.187mil,4706.887mil) from Top Layer to Bottom Layer And Via (5212.9mil,4685.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.77mil] / [Bottom Solder] Mask Sliver [9.77mil]
Minimum Solder Mask Sliver Constraint: (2.736mil < 10mil) Between Via (5188.187mil,4706.887mil) from Top Layer to Bottom Layer And Via (5213.6mil,4708.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.736mil] / [Bottom Solder] Mask Sliver [2.736mil]
Minimum Solder Mask Sliver Constraint: (7.597mil < 10mil) Between Via (5188.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5207.8mil,4639.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.597mil] / [Bottom Solder] Mask Sliver [7.597mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5188.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5212.9mil,4663.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5188.9mil,4685.8mil) from Top Layer to Bottom Layer And Via (5212.9mil,4685.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.021mil < 10mil) Between Via (5190.958mil,5117.368mil) from Top Layer to Bottom Layer And Via (5201.454mil,5143.043mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.021mil] / [Bottom Solder] Mask Sliver [5.021mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4190mil) from Top Layer to Bottom Layer And Via (5199mil,4214mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4214mil) from Top Layer to Bottom Layer And Via (5199mil,4238mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4238mil) from Top Layer to Bottom Layer And Via (5199mil,4262mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4262mil) from Top Layer to Bottom Layer And Via (5199mil,4286mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4286mil) from Top Layer to Bottom Layer And Via (5199mil,4310mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4310mil) from Top Layer to Bottom Layer And Via (5199mil,4334mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4334mil) from Top Layer to Bottom Layer And Via (5199mil,4358mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4358mil) from Top Layer to Bottom Layer And Via (5199mil,4382mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4382mil) from Top Layer to Bottom Layer And Via (5199mil,4406mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4406mil) from Top Layer to Bottom Layer And Via (5199mil,4430mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4430mil) from Top Layer to Bottom Layer And Via (5199mil,4454mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4454mil) from Top Layer to Bottom Layer And Via (5199mil,4478mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4478mil) from Top Layer to Bottom Layer And Via (5199mil,4502mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4502mil) from Top Layer to Bottom Layer And Via (5199mil,4526mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4526mil) from Top Layer to Bottom Layer And Via (5199mil,4550mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5199mil,4550mil) from Top Layer to Bottom Layer And Via (5199mil,4574mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5204.3mil,4774.8mil) from Top Layer to Bottom Layer And Via (5204.3mil,4798.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5204.3mil,4798.8mil) from Top Layer to Bottom Layer And Via (5204.3mil,4822.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.543mil < 10mil) Between Via (5204.3mil,4798.8mil) from Top Layer to Bottom Layer And Via (5226.4mil,4775.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.543mil] / [Bottom Solder] Mask Sliver [9.543mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5204.3mil,4822.8mil) from Top Layer to Bottom Layer And Via (5204.3mil,4846.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.543mil < 10mil) Between Via (5204.3mil,4822.8mil) from Top Layer to Bottom Layer And Via (5226.4mil,4799.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.543mil] / [Bottom Solder] Mask Sliver [9.543mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5204.3mil,4846.8mil) from Top Layer to Bottom Layer And Via (5204.3mil,4870.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.543mil < 10mil) Between Via (5204.3mil,4846.8mil) from Top Layer to Bottom Layer And Via (5226.4mil,4823.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.543mil] / [Bottom Solder] Mask Sliver [9.543mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5204.3mil,4870.8mil) from Top Layer to Bottom Layer And Via (5204.3mil,4894.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.543mil < 10mil) Between Via (5204.3mil,4870.8mil) from Top Layer to Bottom Layer And Via (5226.4mil,4847.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.543mil] / [Bottom Solder] Mask Sliver [9.543mil]
Minimum Solder Mask Sliver Constraint: (9.543mil < 10mil) Between Via (5204.3mil,4894.8mil) from Top Layer to Bottom Layer And Via (5226.4mil,4871.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.543mil] / [Bottom Solder] Mask Sliver [9.543mil]
Minimum Solder Mask Sliver Constraint: (1.526mil < 10mil) Between Via (5207.8mil,4639.6mil) from Top Layer to Bottom Layer And Via (5212.9mil,4663.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.526mil] / [Bottom Solder] Mask Sliver [1.526mil]
Minimum Solder Mask Sliver Constraint: (5.847mil < 10mil) Between Via (5207.8mil,4639.6mil) from Top Layer to Bottom Layer And Via (5236.3mil,4641.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.847mil] / [Bottom Solder] Mask Sliver [5.847mil]
Minimum Solder Mask Sliver Constraint: (0.778mil < 10mil) Between Via (5208.558mil,5361.2mil) from Top Layer to Bottom Layer And Via (5231.4mil,5355.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.778mil] / [Bottom Solder] Mask Sliver [0.778mil]
Minimum Solder Mask Sliver Constraint: (9.265mil < 10mil) Between Via (5212.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5236.3mil,4641.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.265mil] / [Bottom Solder] Mask Sliver [9.265mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5212.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5236.9mil,4663.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5212.9mil,4685.8mil) from Top Layer to Bottom Layer And Via (5236.9mil,4685.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.674mil < 10mil) Between Via (5213.6mil,4708.3mil) from Top Layer to Bottom Layer And Via (5236.9mil,4685.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.674mil] / [Bottom Solder] Mask Sliver [9.674mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5213.6mil,4708.3mil) from Top Layer to Bottom Layer And Via (5237.6mil,4708.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5216.8mil,4133mil) from Top Layer to Bottom Layer And Via (5240.8mil,4133mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.182mil < 10mil) Between Via (5219.931mil,5775.542mil) from Top Layer to Bottom Layer And Via (5242.8mil,5776.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.182mil] / [Bottom Solder] Mask Sliver [0.182mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5226.4mil,4775.3mil) from Top Layer to Bottom Layer And Via (5226.4mil,4799.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5226.4mil,4775.3mil) from Top Layer to Bottom Layer And Via (5250.4mil,4775.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5226.4mil,4799.3mil) from Top Layer to Bottom Layer And Via (5226.4mil,4823.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5226.4mil,4799.3mil) from Top Layer to Bottom Layer And Via (5250.4mil,4799.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5226.4mil,4823.3mil) from Top Layer to Bottom Layer And Via (5226.4mil,4847.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5226.4mil,4823.3mil) from Top Layer to Bottom Layer And Via (5250.4mil,4823.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5226.4mil,4847.3mil) from Top Layer to Bottom Layer And Via (5226.4mil,4871.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5226.4mil,4847.3mil) from Top Layer to Bottom Layer And Via (5250.4mil,4847.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5226.4mil,4871.3mil) from Top Layer to Bottom Layer And Via (5226.4mil,4895.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5226.4mil,4871.3mil) from Top Layer to Bottom Layer And Via (5250.4mil,4871.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5226.4mil,4895.3mil) from Top Layer to Bottom Layer And Via (5250.4mil,4895.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.264mil < 10mil) Between Via (5231.4mil,5355.7mil) from Top Layer to Bottom Layer And Via (5258.3mil,5348mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.264mil] / [Bottom Solder] Mask Sliver [5.264mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5236.3mil,4641.5mil) from Top Layer to Bottom Layer And Via (5260.3mil,4641.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.265mil < 10mil) Between Via (5236.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5260.3mil,4641.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.265mil] / [Bottom Solder] Mask Sliver [9.265mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5236.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5260.9mil,4663.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5236.9mil,4685.8mil) from Top Layer to Bottom Layer And Via (5260.9mil,4685.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.674mil < 10mil) Between Via (5237.6mil,4708.3mil) from Top Layer to Bottom Layer And Via (5260.9mil,4685.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.674mil] / [Bottom Solder] Mask Sliver [9.674mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5237.6mil,4708.3mil) from Top Layer to Bottom Layer And Via (5261.6mil,4708.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5240.8mil,4133mil) from Top Layer to Bottom Layer And Via (5264.8mil,4133mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5250.4mil,4775.3mil) from Top Layer to Bottom Layer And Via (5250.4mil,4799.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.01mil < 10mil) Between Via (5250.4mil,4775.3mil) from Top Layer to Bottom Layer And Via (5273.1mil,4776.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.01mil] / [Bottom Solder] Mask Sliver [0.01mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5250.4mil,4799.3mil) from Top Layer to Bottom Layer And Via (5250.4mil,4823.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.528mil < 10mil) Between Via (5250.4mil,4799.3mil) from Top Layer to Bottom Layer And Via (5273.1mil,4776.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.528mil] / [Bottom Solder] Mask Sliver [9.528mil]
Minimum Solder Mask Sliver Constraint: (0.01mil < 10mil) Between Via (5250.4mil,4799.3mil) from Top Layer to Bottom Layer And Via (5273.1mil,4800.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.01mil] / [Bottom Solder] Mask Sliver [0.01mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5250.4mil,4823.3mil) from Top Layer to Bottom Layer And Via (5250.4mil,4847.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.528mil < 10mil) Between Via (5250.4mil,4823.3mil) from Top Layer to Bottom Layer And Via (5273.1mil,4800.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.528mil] / [Bottom Solder] Mask Sliver [9.528mil]
Minimum Solder Mask Sliver Constraint: (0.01mil < 10mil) Between Via (5250.4mil,4823.3mil) from Top Layer to Bottom Layer And Via (5273.1mil,4824.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.01mil] / [Bottom Solder] Mask Sliver [0.01mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5250.4mil,4847.3mil) from Top Layer to Bottom Layer And Via (5250.4mil,4871.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.528mil < 10mil) Between Via (5250.4mil,4847.3mil) from Top Layer to Bottom Layer And Via (5273.1mil,4824.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.528mil] / [Bottom Solder] Mask Sliver [9.528mil]
Minimum Solder Mask Sliver Constraint: (0.01mil < 10mil) Between Via (5250.4mil,4847.3mil) from Top Layer to Bottom Layer And Via (5273.1mil,4848.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.01mil] / [Bottom Solder] Mask Sliver [0.01mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5250.4mil,4871.3mil) from Top Layer to Bottom Layer And Via (5250.4mil,4895.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.528mil < 10mil) Between Via (5250.4mil,4871.3mil) from Top Layer to Bottom Layer And Via (5273.1mil,4848.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.528mil] / [Bottom Solder] Mask Sliver [9.528mil]
Minimum Solder Mask Sliver Constraint: (0.01mil < 10mil) Between Via (5250.4mil,4871.3mil) from Top Layer to Bottom Layer And Via (5273.1mil,4872.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.01mil] / [Bottom Solder] Mask Sliver [0.01mil]
Minimum Solder Mask Sliver Constraint: (9.528mil < 10mil) Between Via (5250.4mil,4895.3mil) from Top Layer to Bottom Layer And Via (5273.1mil,4872.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.528mil] / [Bottom Solder] Mask Sliver [9.528mil]
Minimum Solder Mask Sliver Constraint: (0.01mil < 10mil) Between Via (5250.4mil,4895.3mil) from Top Layer to Bottom Layer And Via (5273.1mil,4896.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.01mil] / [Bottom Solder] Mask Sliver [0.01mil]
Minimum Solder Mask Sliver Constraint: (1.485mil < 10mil) Between Via (5258.3mil,5348mil) from Top Layer to Bottom Layer And Via (5280.2mil,5358.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.485mil] / [Bottom Solder] Mask Sliver [1.485mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5260.3mil,4641.5mil) from Top Layer to Bottom Layer And Via (5284.3mil,4641.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5260.8mil,4470.5mil) from Top Layer to Bottom Layer And Via (5260.8mil,4494.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5260.8mil,4470.5mil) from Top Layer to Bottom Layer And Via (5284.8mil,4470.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5260.8mil,4494.5mil) from Top Layer to Bottom Layer And Via (5260.8mil,4518.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5260.8mil,4494.5mil) from Top Layer to Bottom Layer And Via (5284.8mil,4494.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5260.8mil,4518.5mil) from Top Layer to Bottom Layer And Via (5260.8mil,4542.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5260.8mil,4518.5mil) from Top Layer to Bottom Layer And Via (5284.8mil,4518.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5260.8mil,4542.5mil) from Top Layer to Bottom Layer And Via (5260.8mil,4566.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5260.8mil,4542.5mil) from Top Layer to Bottom Layer And Via (5284.8mil,4542.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5260.8mil,4566.5mil) from Top Layer to Bottom Layer And Via (5284.8mil,4566.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.265mil < 10mil) Between Via (5260.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5284.3mil,4641.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.265mil] / [Bottom Solder] Mask Sliver [9.265mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5260.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5284.9mil,4663.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5260.9mil,4685.8mil) from Top Layer to Bottom Layer And Via (5284.9mil,4685.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.674mil < 10mil) Between Via (5261.6mil,4708.3mil) from Top Layer to Bottom Layer And Via (5284.9mil,4685.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.674mil] / [Bottom Solder] Mask Sliver [9.674mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5262mil,4243mil) from Top Layer to Bottom Layer And Via (5262mil,4267mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5262mil,4243mil) from Top Layer to Bottom Layer And Via (5286mil,4243mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5262mil,4267mil) from Top Layer to Bottom Layer And Via (5262mil,4291mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5262mil,4267mil) from Top Layer to Bottom Layer And Via (5286mil,4267mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5262mil,4291mil) from Top Layer to Bottom Layer And Via (5262mil,4315mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5262mil,4291mil) from Top Layer to Bottom Layer And Via (5286mil,4291mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5262mil,4315mil) from Top Layer to Bottom Layer And Via (5262mil,4339mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5262mil,4315mil) from Top Layer to Bottom Layer And Via (5286mil,4315mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5262mil,4339mil) from Top Layer to Bottom Layer And Via (5262mil,4363mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5262mil,4339mil) from Top Layer to Bottom Layer And Via (5286mil,4339mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5262mil,4363mil) from Top Layer to Bottom Layer And Via (5286mil,4363mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5273.1mil,4776.4mil) from Top Layer to Bottom Layer And Via (5273.1mil,4800.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5273.1mil,4776.4mil) from Top Layer to Bottom Layer And Via (5297.1mil,4776.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5273.1mil,4800.4mil) from Top Layer to Bottom Layer And Via (5273.1mil,4824.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5273.1mil,4800.4mil) from Top Layer to Bottom Layer And Via (5297.1mil,4800.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5273.1mil,4824.4mil) from Top Layer to Bottom Layer And Via (5273.1mil,4848.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5273.1mil,4824.4mil) from Top Layer to Bottom Layer And Via (5297.1mil,4824.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5273.1mil,4848.4mil) from Top Layer to Bottom Layer And Via (5273.1mil,4872.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5273.1mil,4848.4mil) from Top Layer to Bottom Layer And Via (5297.1mil,4848.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5273.1mil,4872.4mil) from Top Layer to Bottom Layer And Via (5273.1mil,4896.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5273.1mil,4872.4mil) from Top Layer to Bottom Layer And Via (5297.1mil,4872.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5273.1mil,4896.4mil) from Top Layer to Bottom Layer And Via (5297.1mil,4896.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.344mil < 10mil) Between Via (5280.2mil,5358.3mil) from Top Layer to Bottom Layer And Via (5301.7mil,5347.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.344mil] / [Bottom Solder] Mask Sliver [1.344mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5284.3mil,4641.5mil) from Top Layer to Bottom Layer And Via (5308.3mil,4641.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5284.8mil,4470.5mil) from Top Layer to Bottom Layer And Via (5284.8mil,4494.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5284.8mil,4494.5mil) from Top Layer to Bottom Layer And Via (5284.8mil,4518.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5284.8mil,4518.5mil) from Top Layer to Bottom Layer And Via (5284.8mil,4542.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5284.8mil,4542.5mil) from Top Layer to Bottom Layer And Via (5284.8mil,4566.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (6.034mil < 10mil) Between Via (5284.8mil,4542.5mil) from Top Layer to Bottom Layer And Via (5313.35mil,4539.11mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.034mil] / [Bottom Solder] Mask Sliver [6.034mil]
Minimum Solder Mask Sliver Constraint: (6.034mil < 10mil) Between Via (5284.8mil,4566.5mil) from Top Layer to Bottom Layer And Via (5313.35mil,4563.11mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.034mil] / [Bottom Solder] Mask Sliver [6.034mil]
Minimum Solder Mask Sliver Constraint: (9.265mil < 10mil) Between Via (5284.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5308.3mil,4641.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.265mil] / [Bottom Solder] Mask Sliver [9.265mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5284.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5308.9mil,4663.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5284.9mil,4685.8mil) from Top Layer to Bottom Layer And Via (5308.9mil,4685.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5286mil,4243mil) from Top Layer to Bottom Layer And Via (5286mil,4267mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5286mil,4267mil) from Top Layer to Bottom Layer And Via (5286mil,4291mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5286mil,4291mil) from Top Layer to Bottom Layer And Via (5286mil,4315mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5286mil,4315mil) from Top Layer to Bottom Layer And Via (5286mil,4339mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5286mil,4339mil) from Top Layer to Bottom Layer And Via (5286mil,4363mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5297.1mil,4776.4mil) from Top Layer to Bottom Layer And Via (5297.1mil,4800.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5297.1mil,4800.4mil) from Top Layer to Bottom Layer And Via (5297.1mil,4824.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5297.1mil,4824.4mil) from Top Layer to Bottom Layer And Via (5297.1mil,4848.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5297.1mil,4848.4mil) from Top Layer to Bottom Layer And Via (5297.1mil,4872.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5297.1mil,4872.4mil) from Top Layer to Bottom Layer And Via (5297.1mil,4896.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.432mil < 10mil) Between Via (5308.3mil,4641.5mil) from Top Layer to Bottom Layer And Via (5325.9mil,4615.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.432mil] / [Bottom Solder] Mask Sliver [8.432mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5308.3mil,4641.5mil) from Top Layer to Bottom Layer And Via (5332.3mil,4641.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.265mil < 10mil) Between Via (5308.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5332.3mil,4641.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.265mil] / [Bottom Solder] Mask Sliver [9.265mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5308.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5332.9mil,4663.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5308.9mil,4685.8mil) from Top Layer to Bottom Layer And Via (5332.9mil,4685.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5309.3mil,3972.9mil) from Top Layer to Bottom Layer And Via (5309.3mil,3996.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5309.3mil,3972.9mil) from Top Layer to Bottom Layer And Via (5333.3mil,3972.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5309.3mil,3996.9mil) from Top Layer to Bottom Layer And Via (5309.3mil,4020.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5309.3mil,3996.9mil) from Top Layer to Bottom Layer And Via (5333.3mil,3996.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5309.3mil,4020.9mil) from Top Layer to Bottom Layer And Via (5333.3mil,4020.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5313.35mil,4539.11mil) from Top Layer to Bottom Layer And Via (5313.35mil,4563.11mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5313.35mil,4539.11mil) from Top Layer to Bottom Layer And Via (5337.35mil,4539.11mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5313.35mil,4563.11mil) from Top Layer to Bottom Layer And Via (5337.35mil,4563.11mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5319.5mil,4776.4mil) from Top Layer to Bottom Layer And Via (5319.5mil,4800.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5319.5mil,4776.4mil) from Top Layer to Bottom Layer And Via (5343.5mil,4776.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5319.5mil,4800.4mil) from Top Layer to Bottom Layer And Via (5319.5mil,4824.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5319.5mil,4800.4mil) from Top Layer to Bottom Layer And Via (5343.5mil,4800.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5319.5mil,4824.4mil) from Top Layer to Bottom Layer And Via (5319.5mil,4848.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5319.5mil,4824.4mil) from Top Layer to Bottom Layer And Via (5343.5mil,4824.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5319.5mil,4848.4mil) from Top Layer to Bottom Layer And Via (5319.5mil,4872.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5319.5mil,4848.4mil) from Top Layer to Bottom Layer And Via (5343.5mil,4848.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5319.5mil,4872.4mil) from Top Layer to Bottom Layer And Via (5319.5mil,4896.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5319.5mil,4872.4mil) from Top Layer to Bottom Layer And Via (5343.5mil,4872.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5319.5mil,4896.4mil) from Top Layer to Bottom Layer And Via (5343.5mil,4896.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.768mil < 10mil) Between Via (5325.9mil,4615.8mil) from Top Layer to Bottom Layer And Via (5332.3mil,4641.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.768mil] / [Bottom Solder] Mask Sliver [3.768mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5325.9mil,4615.8mil) from Top Layer to Bottom Layer And Via (5349.9mil,4615.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.985mil < 10mil) Between Via (5326.3mil,4482.7mil) from Top Layer to Bottom Layer And Via (5326mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.985mil] / [Bottom Solder] Mask Sliver [2.985mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326.3mil,4482.7mil) from Top Layer to Bottom Layer And Via (5350.3mil,4482.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4073mil) from Top Layer to Bottom Layer And Via (5326mil,4097mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4073mil) from Top Layer to Bottom Layer And Via (5350mil,4073mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4097mil) from Top Layer to Bottom Layer And Via (5326mil,4121mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4097mil) from Top Layer to Bottom Layer And Via (5350mil,4097mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4121mil) from Top Layer to Bottom Layer And Via (5326mil,4145mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4121mil) from Top Layer to Bottom Layer And Via (5350mil,4121mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4145mil) from Top Layer to Bottom Layer And Via (5326mil,4169mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4145mil) from Top Layer to Bottom Layer And Via (5350mil,4145mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4169mil) from Top Layer to Bottom Layer And Via (5326mil,4193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4169mil) from Top Layer to Bottom Layer And Via (5350mil,4169mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4193mil) from Top Layer to Bottom Layer And Via (5326mil,4217mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4193mil) from Top Layer to Bottom Layer And Via (5350mil,4193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4217mil) from Top Layer to Bottom Layer And Via (5326mil,4241mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4217mil) from Top Layer to Bottom Layer And Via (5350mil,4217mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4241mil) from Top Layer to Bottom Layer And Via (5326mil,4265mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4241mil) from Top Layer to Bottom Layer And Via (5350mil,4241mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4265mil) from Top Layer to Bottom Layer And Via (5326mil,4289mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4265mil) from Top Layer to Bottom Layer And Via (5350mil,4265mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4289mil) from Top Layer to Bottom Layer And Via (5326mil,4313mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4289mil) from Top Layer to Bottom Layer And Via (5350mil,4289mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4313mil) from Top Layer to Bottom Layer And Via (5326mil,4337mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4313mil) from Top Layer to Bottom Layer And Via (5350mil,4313mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4337mil) from Top Layer to Bottom Layer And Via (5326mil,4361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4337mil) from Top Layer to Bottom Layer And Via (5350mil,4337mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4361mil) from Top Layer to Bottom Layer And Via (5326mil,4385mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4361mil) from Top Layer to Bottom Layer And Via (5350mil,4361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4385mil) from Top Layer to Bottom Layer And Via (5326mil,4409mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4385mil) from Top Layer to Bottom Layer And Via (5350mil,4385mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4409mil) from Top Layer to Bottom Layer And Via (5326mil,4433mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4409mil) from Top Layer to Bottom Layer And Via (5350mil,4409mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4433mil) from Top Layer to Bottom Layer And Via (5326mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4433mil) from Top Layer to Bottom Layer And Via (5350mil,4433mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5326mil,4457mil) from Top Layer to Bottom Layer And Via (5350mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.432mil < 10mil) Between Via (5332.3mil,4641.5mil) from Top Layer to Bottom Layer And Via (5349.9mil,4615.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.432mil] / [Bottom Solder] Mask Sliver [8.432mil]
Minimum Solder Mask Sliver Constraint: (2.8mil < 10mil) Between Via (5332.3mil,4641.5mil) from Top Layer to Bottom Layer And Via (5357.8mil,4642.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.8mil] / [Bottom Solder] Mask Sliver [2.8mil]
Minimum Solder Mask Sliver Constraint: (9.792mil < 10mil) Between Via (5332.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5357.8mil,4642.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.792mil] / [Bottom Solder] Mask Sliver [9.792mil]
Minimum Solder Mask Sliver Constraint: (2.8mil < 10mil) Between Via (5332.9mil,4663.3mil) from Top Layer to Bottom Layer And Via (5358.4mil,4664.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.8mil] / [Bottom Solder] Mask Sliver [2.8mil]
Minimum Solder Mask Sliver Constraint: (2.8mil < 10mil) Between Via (5332.9mil,4685.8mil) from Top Layer to Bottom Layer And Via (5358.4mil,4686.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.8mil] / [Bottom Solder] Mask Sliver [2.8mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5333.3mil,3972.9mil) from Top Layer to Bottom Layer And Via (5333.3mil,3996.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5333.3mil,3972.9mil) from Top Layer to Bottom Layer And Via (5357.3mil,3972.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5333.3mil,3996.9mil) from Top Layer to Bottom Layer And Via (5333.3mil,4020.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5333.3mil,3996.9mil) from Top Layer to Bottom Layer And Via (5357.3mil,3996.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5333.3mil,4020.9mil) from Top Layer to Bottom Layer And Via (5357.3mil,4020.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5337.35mil,4539.11mil) from Top Layer to Bottom Layer And Via (5337.35mil,4563.11mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5337.35mil,4539.11mil) from Top Layer to Bottom Layer And Via (5361.35mil,4539.11mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5337.35mil,4563.11mil) from Top Layer to Bottom Layer And Via (5361.35mil,4563.11mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5343.5mil,4776.4mil) from Top Layer to Bottom Layer And Via (5343.5mil,4800.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5343.5mil,4800.4mil) from Top Layer to Bottom Layer And Via (5343.5mil,4824.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.822mil < 10mil) Between Via (5343.5mil,4800.4mil) from Top Layer to Bottom Layer And Via (5365.9mil,4776.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.822mil] / [Bottom Solder] Mask Sliver [9.822mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5343.5mil,4824.4mil) from Top Layer to Bottom Layer And Via (5343.5mil,4848.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.822mil < 10mil) Between Via (5343.5mil,4824.4mil) from Top Layer to Bottom Layer And Via (5365.9mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.822mil] / [Bottom Solder] Mask Sliver [9.822mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5343.5mil,4848.4mil) from Top Layer to Bottom Layer And Via (5343.5mil,4872.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.822mil < 10mil) Between Via (5343.5mil,4848.4mil) from Top Layer to Bottom Layer And Via (5365.9mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.822mil] / [Bottom Solder] Mask Sliver [9.822mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5343.5mil,4872.4mil) from Top Layer to Bottom Layer And Via (5343.5mil,4896.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.822mil < 10mil) Between Via (5343.5mil,4872.4mil) from Top Layer to Bottom Layer And Via (5365.9mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.822mil] / [Bottom Solder] Mask Sliver [9.822mil]
Minimum Solder Mask Sliver Constraint: (9.822mil < 10mil) Between Via (5343.5mil,4896.4mil) from Top Layer to Bottom Layer And Via (5365.9mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.822mil] / [Bottom Solder] Mask Sliver [9.822mil]
Minimum Solder Mask Sliver Constraint: (5.032mil < 10mil) Between Via (5349.9mil,4615.8mil) from Top Layer to Bottom Layer And Via (5357.8mil,4642.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.032mil] / [Bottom Solder] Mask Sliver [5.032mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5349.9mil,4615.8mil) from Top Layer to Bottom Layer And Via (5373.9mil,4615.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.985mil < 10mil) Between Via (5350.3mil,4482.7mil) from Top Layer to Bottom Layer And Via (5350mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.985mil] / [Bottom Solder] Mask Sliver [2.985mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350.3mil,4482.7mil) from Top Layer to Bottom Layer And Via (5374.3mil,4482.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4073mil) from Top Layer to Bottom Layer And Via (5350mil,4097mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4073mil) from Top Layer to Bottom Layer And Via (5374mil,4073mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4097mil) from Top Layer to Bottom Layer And Via (5350mil,4121mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4097mil) from Top Layer to Bottom Layer And Via (5374mil,4097mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4121mil) from Top Layer to Bottom Layer And Via (5350mil,4145mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4121mil) from Top Layer to Bottom Layer And Via (5374mil,4121mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4145mil) from Top Layer to Bottom Layer And Via (5350mil,4169mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4145mil) from Top Layer to Bottom Layer And Via (5374mil,4145mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4169mil) from Top Layer to Bottom Layer And Via (5350mil,4193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4169mil) from Top Layer to Bottom Layer And Via (5374mil,4169mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4193mil) from Top Layer to Bottom Layer And Via (5350mil,4217mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4193mil) from Top Layer to Bottom Layer And Via (5374mil,4193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4217mil) from Top Layer to Bottom Layer And Via (5350mil,4241mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4217mil) from Top Layer to Bottom Layer And Via (5374mil,4217mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4241mil) from Top Layer to Bottom Layer And Via (5350mil,4265mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4241mil) from Top Layer to Bottom Layer And Via (5374mil,4241mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4265mil) from Top Layer to Bottom Layer And Via (5350mil,4289mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4265mil) from Top Layer to Bottom Layer And Via (5374mil,4265mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4289mil) from Top Layer to Bottom Layer And Via (5350mil,4313mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4289mil) from Top Layer to Bottom Layer And Via (5374mil,4289mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4313mil) from Top Layer to Bottom Layer And Via (5350mil,4337mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4313mil) from Top Layer to Bottom Layer And Via (5374mil,4313mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4337mil) from Top Layer to Bottom Layer And Via (5350mil,4361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4337mil) from Top Layer to Bottom Layer And Via (5374mil,4337mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4361mil) from Top Layer to Bottom Layer And Via (5350mil,4385mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4361mil) from Top Layer to Bottom Layer And Via (5374mil,4361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4385mil) from Top Layer to Bottom Layer And Via (5350mil,4409mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4385mil) from Top Layer to Bottom Layer And Via (5374mil,4385mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4409mil) from Top Layer to Bottom Layer And Via (5350mil,4433mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4409mil) from Top Layer to Bottom Layer And Via (5374mil,4409mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4433mil) from Top Layer to Bottom Layer And Via (5350mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4433mil) from Top Layer to Bottom Layer And Via (5374mil,4433mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5350mil,4457mil) from Top Layer to Bottom Layer And Via (5374mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5357.3mil,3972.9mil) from Top Layer to Bottom Layer And Via (5357.3mil,3996.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5357.3mil,3972.9mil) from Top Layer to Bottom Layer And Via (5381.3mil,3972.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5357.3mil,3996.9mil) from Top Layer to Bottom Layer And Via (5357.3mil,4020.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5357.3mil,3996.9mil) from Top Layer to Bottom Layer And Via (5381.3mil,3996.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5357.3mil,4020.9mil) from Top Layer to Bottom Layer And Via (5381.3mil,4020.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.377mil < 10mil) Between Via (5357.8mil,4642.4mil) from Top Layer to Bottom Layer And Via (5373.9mil,4615.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.377mil] / [Bottom Solder] Mask Sliver [8.377mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5357.8mil,4642.4mil) from Top Layer to Bottom Layer And Via (5381.8mil,4642.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.265mil < 10mil) Between Via (5358.4mil,4664.2mil) from Top Layer to Bottom Layer And Via (5381.8mil,4642.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.265mil] / [Bottom Solder] Mask Sliver [9.265mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5358.4mil,4664.2mil) from Top Layer to Bottom Layer And Via (5382.4mil,4664.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5358.4mil,4686.7mil) from Top Layer to Bottom Layer And Via (5382.4mil,4686.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5361.35mil,4539.11mil) from Top Layer to Bottom Layer And Via (5361.35mil,4563.11mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5361.35mil,4539.11mil) from Top Layer to Bottom Layer And Via (5385.35mil,4539.11mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5361.35mil,4563.11mil) from Top Layer to Bottom Layer And Via (5385.35mil,4563.11mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5365.9mil,4776.8mil) from Top Layer to Bottom Layer And Via (5365.9mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5365.9mil,4776.8mil) from Top Layer to Bottom Layer And Via (5389.9mil,4776.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5365.9mil,4800.8mil) from Top Layer to Bottom Layer And Via (5365.9mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5365.9mil,4800.8mil) from Top Layer to Bottom Layer And Via (5389.9mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5365.9mil,4824.8mil) from Top Layer to Bottom Layer And Via (5365.9mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5365.9mil,4824.8mil) from Top Layer to Bottom Layer And Via (5389.9mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5365.9mil,4848.8mil) from Top Layer to Bottom Layer And Via (5365.9mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5365.9mil,4848.8mil) from Top Layer to Bottom Layer And Via (5389.9mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5365.9mil,4872.8mil) from Top Layer to Bottom Layer And Via (5365.9mil,4896.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5365.9mil,4872.8mil) from Top Layer to Bottom Layer And Via (5389.9mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5365.9mil,4896.8mil) from Top Layer to Bottom Layer And Via (5389.9mil,4896.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.032mil < 10mil) Between Via (5373.9mil,4615.8mil) from Top Layer to Bottom Layer And Via (5381.8mil,4642.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.032mil] / [Bottom Solder] Mask Sliver [5.032mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5373.9mil,4615.8mil) from Top Layer to Bottom Layer And Via (5397.9mil,4615.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.985mil < 10mil) Between Via (5374.3mil,4482.7mil) from Top Layer to Bottom Layer And Via (5374mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.985mil] / [Bottom Solder] Mask Sliver [2.985mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374.3mil,4482.7mil) from Top Layer to Bottom Layer And Via (5398.3mil,4482.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4073mil) from Top Layer to Bottom Layer And Via (5374mil,4097mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4073mil) from Top Layer to Bottom Layer And Via (5398mil,4073mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4097mil) from Top Layer to Bottom Layer And Via (5374mil,4121mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4097mil) from Top Layer to Bottom Layer And Via (5398mil,4097mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4121mil) from Top Layer to Bottom Layer And Via (5374mil,4145mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4121mil) from Top Layer to Bottom Layer And Via (5398mil,4121mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4145mil) from Top Layer to Bottom Layer And Via (5374mil,4169mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4145mil) from Top Layer to Bottom Layer And Via (5398mil,4145mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4169mil) from Top Layer to Bottom Layer And Via (5374mil,4193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4169mil) from Top Layer to Bottom Layer And Via (5398mil,4169mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4193mil) from Top Layer to Bottom Layer And Via (5374mil,4217mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4193mil) from Top Layer to Bottom Layer And Via (5398mil,4193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4217mil) from Top Layer to Bottom Layer And Via (5374mil,4241mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4217mil) from Top Layer to Bottom Layer And Via (5398mil,4217mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4241mil) from Top Layer to Bottom Layer And Via (5374mil,4265mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4241mil) from Top Layer to Bottom Layer And Via (5398mil,4241mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4265mil) from Top Layer to Bottom Layer And Via (5374mil,4289mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4265mil) from Top Layer to Bottom Layer And Via (5398mil,4265mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4289mil) from Top Layer to Bottom Layer And Via (5374mil,4313mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4289mil) from Top Layer to Bottom Layer And Via (5398mil,4289mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4313mil) from Top Layer to Bottom Layer And Via (5374mil,4337mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4313mil) from Top Layer to Bottom Layer And Via (5398mil,4313mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4337mil) from Top Layer to Bottom Layer And Via (5374mil,4361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4337mil) from Top Layer to Bottom Layer And Via (5398mil,4337mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4361mil) from Top Layer to Bottom Layer And Via (5374mil,4385mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4361mil) from Top Layer to Bottom Layer And Via (5398mil,4361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4385mil) from Top Layer to Bottom Layer And Via (5374mil,4409mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4385mil) from Top Layer to Bottom Layer And Via (5398mil,4385mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4409mil) from Top Layer to Bottom Layer And Via (5374mil,4433mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4409mil) from Top Layer to Bottom Layer And Via (5398mil,4409mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4433mil) from Top Layer to Bottom Layer And Via (5374mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4433mil) from Top Layer to Bottom Layer And Via (5398mil,4433mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5374mil,4457mil) from Top Layer to Bottom Layer And Via (5398mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5381.3mil,3972.9mil) from Top Layer to Bottom Layer And Via (5381.3mil,3996.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5381.3mil,3972.9mil) from Top Layer to Bottom Layer And Via (5405.3mil,3972.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5381.3mil,3996.9mil) from Top Layer to Bottom Layer And Via (5381.3mil,4020.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5381.3mil,3996.9mil) from Top Layer to Bottom Layer And Via (5405.3mil,3996.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5381.3mil,4020.9mil) from Top Layer to Bottom Layer And Via (5405.3mil,4020.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.377mil < 10mil) Between Via (5381.8mil,4642.4mil) from Top Layer to Bottom Layer And Via (5397.9mil,4615.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.377mil] / [Bottom Solder] Mask Sliver [8.377mil]
Minimum Solder Mask Sliver Constraint: (2.023mil < 10mil) Between Via (5381.8mil,4642.4mil) from Top Layer to Bottom Layer And Via (5406.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.023mil] / [Bottom Solder] Mask Sliver [2.023mil]
Minimum Solder Mask Sliver Constraint: (1.397mil < 10mil) Between Via (5382.4mil,4664.2mil) from Top Layer to Bottom Layer And Via (5406.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.397mil] / [Bottom Solder] Mask Sliver [1.397mil]
Minimum Solder Mask Sliver Constraint: (9.713mil < 10mil) Between Via (5382.4mil,4686.7mil) from Top Layer to Bottom Layer And Via (5406.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.713mil] / [Bottom Solder] Mask Sliver [9.713mil]
Minimum Solder Mask Sliver Constraint: (1.384mil < 10mil) Between Via (5382.4mil,4686.7mil) from Top Layer to Bottom Layer And Via (5406.5mil,4686.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.384mil] / [Bottom Solder] Mask Sliver [1.384mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5385.35mil,4539.11mil) from Top Layer to Bottom Layer And Via (5385.35mil,4563.11mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5385.35mil,4539.11mil) from Top Layer to Bottom Layer And Via (5409.35mil,4539.11mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5385.35mil,4563.11mil) from Top Layer to Bottom Layer And Via (5409.35mil,4563.11mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5389.9mil,4776.8mil) from Top Layer to Bottom Layer And Via (5389.9mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.784mil < 10mil) Between Via (5389.9mil,4776.8mil) from Top Layer to Bottom Layer And Via (5414.4mil,4776.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.784mil] / [Bottom Solder] Mask Sliver [1.784mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5389.9mil,4800.8mil) from Top Layer to Bottom Layer And Via (5389.9mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.784mil < 10mil) Between Via (5389.9mil,4800.8mil) from Top Layer to Bottom Layer And Via (5414.4mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.784mil] / [Bottom Solder] Mask Sliver [1.784mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5389.9mil,4824.8mil) from Top Layer to Bottom Layer And Via (5389.9mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.784mil < 10mil) Between Via (5389.9mil,4824.8mil) from Top Layer to Bottom Layer And Via (5414.4mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.784mil] / [Bottom Solder] Mask Sliver [1.784mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5389.9mil,4848.8mil) from Top Layer to Bottom Layer And Via (5389.9mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.784mil < 10mil) Between Via (5389.9mil,4848.8mil) from Top Layer to Bottom Layer And Via (5414.4mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.784mil] / [Bottom Solder] Mask Sliver [1.784mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5389.9mil,4872.8mil) from Top Layer to Bottom Layer And Via (5389.9mil,4896.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.784mil < 10mil) Between Via (5389.9mil,4872.8mil) from Top Layer to Bottom Layer And Via (5414.4mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.784mil] / [Bottom Solder] Mask Sliver [1.784mil]
Minimum Solder Mask Sliver Constraint: (1.784mil < 10mil) Between Via (5389.9mil,4896.8mil) from Top Layer to Bottom Layer And Via (5414.4mil,4896.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.784mil] / [Bottom Solder] Mask Sliver [1.784mil]
Minimum Solder Mask Sliver Constraint: (3.911mil < 10mil) Between Via (5397.9mil,4615.8mil) from Top Layer to Bottom Layer And Via (5406.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.911mil] / [Bottom Solder] Mask Sliver [3.911mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5397.9mil,4615.8mil) from Top Layer to Bottom Layer And Via (5421.9mil,4615.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.985mil < 10mil) Between Via (5398.3mil,4482.7mil) from Top Layer to Bottom Layer And Via (5398mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.985mil] / [Bottom Solder] Mask Sliver [2.985mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398.3mil,4482.7mil) from Top Layer to Bottom Layer And Via (5422.3mil,4482.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4073mil) from Top Layer to Bottom Layer And Via (5398mil,4097mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4073mil) from Top Layer to Bottom Layer And Via (5422mil,4073mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4097mil) from Top Layer to Bottom Layer And Via (5398mil,4121mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4097mil) from Top Layer to Bottom Layer And Via (5422mil,4097mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4121mil) from Top Layer to Bottom Layer And Via (5398mil,4145mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4121mil) from Top Layer to Bottom Layer And Via (5422mil,4121mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4145mil) from Top Layer to Bottom Layer And Via (5398mil,4169mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4145mil) from Top Layer to Bottom Layer And Via (5422mil,4145mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4169mil) from Top Layer to Bottom Layer And Via (5398mil,4193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4169mil) from Top Layer to Bottom Layer And Via (5422mil,4169mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4193mil) from Top Layer to Bottom Layer And Via (5398mil,4217mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4193mil) from Top Layer to Bottom Layer And Via (5422mil,4193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4217mil) from Top Layer to Bottom Layer And Via (5398mil,4241mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4217mil) from Top Layer to Bottom Layer And Via (5422mil,4217mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4241mil) from Top Layer to Bottom Layer And Via (5398mil,4265mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4241mil) from Top Layer to Bottom Layer And Via (5422mil,4241mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4265mil) from Top Layer to Bottom Layer And Via (5398mil,4289mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4265mil) from Top Layer to Bottom Layer And Via (5422mil,4265mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4289mil) from Top Layer to Bottom Layer And Via (5398mil,4313mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4289mil) from Top Layer to Bottom Layer And Via (5422mil,4289mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4313mil) from Top Layer to Bottom Layer And Via (5398mil,4337mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4313mil) from Top Layer to Bottom Layer And Via (5422mil,4313mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4337mil) from Top Layer to Bottom Layer And Via (5398mil,4361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4337mil) from Top Layer to Bottom Layer And Via (5422mil,4337mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4361mil) from Top Layer to Bottom Layer And Via (5398mil,4385mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4361mil) from Top Layer to Bottom Layer And Via (5422mil,4361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4385mil) from Top Layer to Bottom Layer And Via (5398mil,4409mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4385mil) from Top Layer to Bottom Layer And Via (5422mil,4385mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4409mil) from Top Layer to Bottom Layer And Via (5398mil,4433mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4409mil) from Top Layer to Bottom Layer And Via (5422mil,4409mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4433mil) from Top Layer to Bottom Layer And Via (5398mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4433mil) from Top Layer to Bottom Layer And Via (5422mil,4433mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5398mil,4457mil) from Top Layer to Bottom Layer And Via (5422mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.237mil < 10mil) Between Via (5404.2mil,5783.8mil) from Top Layer to Bottom Layer And Via (5417.4mil,5812.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.238mil] / [Bottom Solder] Mask Sliver [9.238mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5405.3mil,3972.9mil) from Top Layer to Bottom Layer And Via (5405.3mil,3996.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.208mil < 10mil) Between Via (5405.3mil,3972.9mil) from Top Layer to Bottom Layer And Via (5430.2mil,3971.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.208mil] / [Bottom Solder] Mask Sliver [2.208mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5405.3mil,3996.9mil) from Top Layer to Bottom Layer And Via (5405.3mil,4020.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.208mil < 10mil) Between Via (5405.3mil,3996.9mil) from Top Layer to Bottom Layer And Via (5430.2mil,3995.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.208mil] / [Bottom Solder] Mask Sliver [2.208mil]
Minimum Solder Mask Sliver Constraint: (2.208mil < 10mil) Between Via (5405.3mil,4020.9mil) from Top Layer to Bottom Layer And Via (5430.2mil,4019.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.208mil] / [Bottom Solder] Mask Sliver [2.208mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5406.5mil,4641mil) from Top Layer to Bottom Layer And Via (5406.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (6.817mil < 10mil) Between Via (5406.5mil,4641mil) from Top Layer to Bottom Layer And Via (5421.9mil,4615.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.817mil] / [Bottom Solder] Mask Sliver [6.817mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5406.5mil,4641mil) from Top Layer to Bottom Layer And Via (5430.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5406.5mil,4665mil) from Top Layer to Bottom Layer And Via (5430.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.774mil < 10mil) Between Via (5406.5mil,4665mil) from Top Layer to Bottom Layer And Via (5430.5mil,4686.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.774mil] / [Bottom Solder] Mask Sliver [9.774mil]
Minimum Solder Mask Sliver Constraint: (9.774mil < 10mil) Between Via (5406.5mil,4686.9mil) from Top Layer to Bottom Layer And Via (5430.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.774mil] / [Bottom Solder] Mask Sliver [9.774mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5406.5mil,4686.9mil) from Top Layer to Bottom Layer And Via (5430.5mil,4686.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.128mil < 10mil) Between Via (5407.742mil,5697.871mil) from Top Layer to Bottom Layer And Via (5429.134mil,5681.653mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.128mil] / [Bottom Solder] Mask Sliver [4.128mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5409.35mil,4539.11mil) from Top Layer to Bottom Layer And Via (5409.35mil,4563.11mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5414.4mil,4776.8mil) from Top Layer to Bottom Layer And Via (5414.4mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5414.4mil,4776.8mil) from Top Layer to Bottom Layer And Via (5438.4mil,4776.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5414.4mil,4800.8mil) from Top Layer to Bottom Layer And Via (5414.4mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5414.4mil,4800.8mil) from Top Layer to Bottom Layer And Via (5438.4mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5414.4mil,4824.8mil) from Top Layer to Bottom Layer And Via (5414.4mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5414.4mil,4824.8mil) from Top Layer to Bottom Layer And Via (5438.4mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5414.4mil,4848.8mil) from Top Layer to Bottom Layer And Via (5414.4mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5414.4mil,4848.8mil) from Top Layer to Bottom Layer And Via (5438.4mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5414.4mil,4872.8mil) from Top Layer to Bottom Layer And Via (5414.4mil,4896.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5414.4mil,4872.8mil) from Top Layer to Bottom Layer And Via (5438.4mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5414.4mil,4896.8mil) from Top Layer to Bottom Layer And Via (5438.4mil,4896.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.537mil < 10mil) Between Via (5417.4mil,5812.9mil) from Top Layer to Bottom Layer And Via (5419.6mil,5840.064mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.536mil] / [Bottom Solder] Mask Sliver [4.536mil]
Minimum Solder Mask Sliver Constraint: (4.786mil < 10mil) Between Via (5419.6mil,5840.064mil) from Top Layer to Bottom Layer And Via (5446.677mil,5835.246mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.786mil] / [Bottom Solder] Mask Sliver [4.786mil]
Minimum Solder Mask Sliver Constraint: (3.911mil < 10mil) Between Via (5421.9mil,4615.8mil) from Top Layer to Bottom Layer And Via (5430.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.911mil] / [Bottom Solder] Mask Sliver [3.911mil]
Minimum Solder Mask Sliver Constraint: (2.1mil < 10mil) Between Via (5421.9mil,4615.8mil) from Top Layer to Bottom Layer And Via (5446.7mil,4616.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.1mil] / [Bottom Solder] Mask Sliver [2.1mil]
Minimum Solder Mask Sliver Constraint: (2.985mil < 10mil) Between Via (5422.3mil,4482.7mil) from Top Layer to Bottom Layer And Via (5422mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.985mil] / [Bottom Solder] Mask Sliver [2.985mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422.3mil,4482.7mil) from Top Layer to Bottom Layer And Via (5446.3mil,4482.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4073mil) from Top Layer to Bottom Layer And Via (5422mil,4097mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4073mil) from Top Layer to Bottom Layer And Via (5446mil,4073mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4097mil) from Top Layer to Bottom Layer And Via (5422mil,4121mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4097mil) from Top Layer to Bottom Layer And Via (5446mil,4097mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4121mil) from Top Layer to Bottom Layer And Via (5422mil,4145mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4121mil) from Top Layer to Bottom Layer And Via (5446mil,4121mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4145mil) from Top Layer to Bottom Layer And Via (5422mil,4169mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4145mil) from Top Layer to Bottom Layer And Via (5446mil,4145mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4169mil) from Top Layer to Bottom Layer And Via (5422mil,4193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4169mil) from Top Layer to Bottom Layer And Via (5446mil,4169mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4193mil) from Top Layer to Bottom Layer And Via (5422mil,4217mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4193mil) from Top Layer to Bottom Layer And Via (5446mil,4193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4217mil) from Top Layer to Bottom Layer And Via (5422mil,4241mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4217mil) from Top Layer to Bottom Layer And Via (5446mil,4217mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4241mil) from Top Layer to Bottom Layer And Via (5422mil,4265mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4241mil) from Top Layer to Bottom Layer And Via (5446mil,4241mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4265mil) from Top Layer to Bottom Layer And Via (5422mil,4289mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4265mil) from Top Layer to Bottom Layer And Via (5446mil,4265mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4289mil) from Top Layer to Bottom Layer And Via (5422mil,4313mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4289mil) from Top Layer to Bottom Layer And Via (5446mil,4289mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4313mil) from Top Layer to Bottom Layer And Via (5422mil,4337mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4313mil) from Top Layer to Bottom Layer And Via (5446mil,4313mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4337mil) from Top Layer to Bottom Layer And Via (5422mil,4361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4337mil) from Top Layer to Bottom Layer And Via (5446mil,4337mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4361mil) from Top Layer to Bottom Layer And Via (5422mil,4385mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4361mil) from Top Layer to Bottom Layer And Via (5446mil,4361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4385mil) from Top Layer to Bottom Layer And Via (5422mil,4409mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4385mil) from Top Layer to Bottom Layer And Via (5446mil,4385mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4409mil) from Top Layer to Bottom Layer And Via (5422mil,4433mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4409mil) from Top Layer to Bottom Layer And Via (5446mil,4409mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4433mil) from Top Layer to Bottom Layer And Via (5422mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4433mil) from Top Layer to Bottom Layer And Via (5446mil,4433mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5422mil,4457mil) from Top Layer to Bottom Layer And Via (5446mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5430.2mil,3971.8mil) from Top Layer to Bottom Layer And Via (5430.2mil,3995.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5430.2mil,3971.8mil) from Top Layer to Bottom Layer And Via (5454.2mil,3971.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5430.2mil,3995.8mil) from Top Layer to Bottom Layer And Via (5430.2mil,4019.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5430.2mil,3995.8mil) from Top Layer to Bottom Layer And Via (5454.2mil,3995.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5430.2mil,4019.8mil) from Top Layer to Bottom Layer And Via (5454.2mil,4019.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5430.5mil,4641mil) from Top Layer to Bottom Layer And Via (5430.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (6.489mil < 10mil) Between Via (5430.5mil,4641mil) from Top Layer to Bottom Layer And Via (5446.7mil,4616.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.489mil] / [Bottom Solder] Mask Sliver [6.489mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5430.5mil,4641mil) from Top Layer to Bottom Layer And Via (5454.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5430.5mil,4665mil) from Top Layer to Bottom Layer And Via (5454.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.774mil < 10mil) Between Via (5430.5mil,4665mil) from Top Layer to Bottom Layer And Via (5454.5mil,4686.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.774mil] / [Bottom Solder] Mask Sliver [9.774mil]
Minimum Solder Mask Sliver Constraint: (9.774mil < 10mil) Between Via (5430.5mil,4686.9mil) from Top Layer to Bottom Layer And Via (5454.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.774mil] / [Bottom Solder] Mask Sliver [9.774mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5430.5mil,4686.9mil) from Top Layer to Bottom Layer And Via (5454.5mil,4686.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5438.4mil,4776.8mil) from Top Layer to Bottom Layer And Via (5438.4mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.884mil < 10mil) Between Via (5438.4mil,4776.8mil) from Top Layer to Bottom Layer And Via (5462mil,4776.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.884mil] / [Bottom Solder] Mask Sliver [0.884mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5438.4mil,4800.8mil) from Top Layer to Bottom Layer And Via (5438.4mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.884mil < 10mil) Between Via (5438.4mil,4800.8mil) from Top Layer to Bottom Layer And Via (5462mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.884mil] / [Bottom Solder] Mask Sliver [0.884mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5438.4mil,4824.8mil) from Top Layer to Bottom Layer And Via (5438.4mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.884mil < 10mil) Between Via (5438.4mil,4824.8mil) from Top Layer to Bottom Layer And Via (5462mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.884mil] / [Bottom Solder] Mask Sliver [0.884mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5438.4mil,4848.8mil) from Top Layer to Bottom Layer And Via (5438.4mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.884mil < 10mil) Between Via (5438.4mil,4848.8mil) from Top Layer to Bottom Layer And Via (5462mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.884mil] / [Bottom Solder] Mask Sliver [0.884mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5438.4mil,4872.8mil) from Top Layer to Bottom Layer And Via (5438.4mil,4896.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.884mil < 10mil) Between Via (5438.4mil,4872.8mil) from Top Layer to Bottom Layer And Via (5462mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.884mil] / [Bottom Solder] Mask Sliver [0.884mil]
Minimum Solder Mask Sliver Constraint: (0.884mil < 10mil) Between Via (5438.4mil,4896.8mil) from Top Layer to Bottom Layer And Via (5462mil,4896.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.884mil] / [Bottom Solder] Mask Sliver [0.884mil]
Minimum Solder Mask Sliver Constraint: (2.985mil < 10mil) Between Via (5446.3mil,4482.7mil) from Top Layer to Bottom Layer And Via (5446mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.985mil] / [Bottom Solder] Mask Sliver [2.985mil]
Minimum Solder Mask Sliver Constraint: (2.784mil < 10mil) Between Via (5446.3mil,4482.7mil) from Top Layer to Bottom Layer And Via (5471.8mil,4482.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.784mil] / [Bottom Solder] Mask Sliver [2.784mil]
Minimum Solder Mask Sliver Constraint: (4.552mil < 10mil) Between Via (5446.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (5452.7mil,4590.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.552mil] / [Bottom Solder] Mask Sliver [4.552mil]
Minimum Solder Mask Sliver Constraint: (2.805mil < 10mil) Between Via (5446.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (5454.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.805mil] / [Bottom Solder] Mask Sliver [2.805mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (5470.7mil,4616.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4073mil) from Top Layer to Bottom Layer And Via (5446mil,4097mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4073mil) from Top Layer to Bottom Layer And Via (5470mil,4073mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4097mil) from Top Layer to Bottom Layer And Via (5446mil,4121mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4097mil) from Top Layer to Bottom Layer And Via (5470mil,4097mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4121mil) from Top Layer to Bottom Layer And Via (5446mil,4145mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4121mil) from Top Layer to Bottom Layer And Via (5470mil,4121mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4145mil) from Top Layer to Bottom Layer And Via (5446mil,4169mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4145mil) from Top Layer to Bottom Layer And Via (5470mil,4145mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4169mil) from Top Layer to Bottom Layer And Via (5446mil,4193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4169mil) from Top Layer to Bottom Layer And Via (5470mil,4169mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4193mil) from Top Layer to Bottom Layer And Via (5446mil,4217mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4193mil) from Top Layer to Bottom Layer And Via (5470mil,4193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4217mil) from Top Layer to Bottom Layer And Via (5446mil,4241mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4217mil) from Top Layer to Bottom Layer And Via (5470mil,4217mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4241mil) from Top Layer to Bottom Layer And Via (5446mil,4265mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4241mil) from Top Layer to Bottom Layer And Via (5470mil,4241mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4265mil) from Top Layer to Bottom Layer And Via (5446mil,4289mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4265mil) from Top Layer to Bottom Layer And Via (5470mil,4265mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4289mil) from Top Layer to Bottom Layer And Via (5446mil,4313mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4289mil) from Top Layer to Bottom Layer And Via (5470mil,4289mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4313mil) from Top Layer to Bottom Layer And Via (5446mil,4337mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4313mil) from Top Layer to Bottom Layer And Via (5470mil,4313mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4337mil) from Top Layer to Bottom Layer And Via (5446mil,4361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4337mil) from Top Layer to Bottom Layer And Via (5470mil,4337mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4361mil) from Top Layer to Bottom Layer And Via (5446mil,4385mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4361mil) from Top Layer to Bottom Layer And Via (5470mil,4361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4385mil) from Top Layer to Bottom Layer And Via (5446mil,4409mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4385mil) from Top Layer to Bottom Layer And Via (5470mil,4385mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4409mil) from Top Layer to Bottom Layer And Via (5446mil,4433mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4409mil) from Top Layer to Bottom Layer And Via (5470mil,4409mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4433mil) from Top Layer to Bottom Layer And Via (5446mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4433mil) from Top Layer to Bottom Layer And Via (5470mil,4433mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5446mil,4457mil) from Top Layer to Bottom Layer And Via (5470mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5452.7mil,4566.1mil) from Top Layer to Bottom Layer And Via (5452.7mil,4590.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.186mil < 10mil) Between Via (5452.7mil,4566.1mil) from Top Layer to Bottom Layer And Via (5453mil,4543.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.186mil] / [Bottom Solder] Mask Sliver [0.186mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5452.7mil,4566.1mil) from Top Layer to Bottom Layer And Via (5476.7mil,4566.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.402mil < 10mil) Between Via (5452.7mil,4590.1mil) from Top Layer to Bottom Layer And Via (5470.7mil,4616.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.402mil] / [Bottom Solder] Mask Sliver [9.402mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5452.7mil,4590.1mil) from Top Layer to Bottom Layer And Via (5476.7mil,4590.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5453mil,4519.2mil) from Top Layer to Bottom Layer And Via (5453mil,4543.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5453mil,4519.2mil) from Top Layer to Bottom Layer And Via (5477mil,4519.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5453mil,4543.2mil) from Top Layer to Bottom Layer And Via (5477mil,4543.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5454.2mil,3971.8mil) from Top Layer to Bottom Layer And Via (5454.2mil,3995.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5454.2mil,3971.8mil) from Top Layer to Bottom Layer And Via (5478.2mil,3971.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5454.2mil,3995.8mil) from Top Layer to Bottom Layer And Via (5454.2mil,4019.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5454.2mil,3995.8mil) from Top Layer to Bottom Layer And Via (5478.2mil,3995.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5454.2mil,4019.8mil) from Top Layer to Bottom Layer And Via (5478.2mil,4019.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5454.5mil,4641mil) from Top Layer to Bottom Layer And Via (5454.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (6.489mil < 10mil) Between Via (5454.5mil,4641mil) from Top Layer to Bottom Layer And Via (5470.7mil,4616.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.489mil] / [Bottom Solder] Mask Sliver [6.489mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5454.5mil,4641mil) from Top Layer to Bottom Layer And Via (5478.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5454.5mil,4665mil) from Top Layer to Bottom Layer And Via (5478.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.774mil < 10mil) Between Via (5454.5mil,4665mil) from Top Layer to Bottom Layer And Via (5478.5mil,4686.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.774mil] / [Bottom Solder] Mask Sliver [9.774mil]
Minimum Solder Mask Sliver Constraint: (9.774mil < 10mil) Between Via (5454.5mil,4686.9mil) from Top Layer to Bottom Layer And Via (5478.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.774mil] / [Bottom Solder] Mask Sliver [9.774mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5454.5mil,4686.9mil) from Top Layer to Bottom Layer And Via (5478.5mil,4686.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5462mil,4776.8mil) from Top Layer to Bottom Layer And Via (5462mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5462mil,4776.8mil) from Top Layer to Bottom Layer And Via (5486mil,4776.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5462mil,4800.8mil) from Top Layer to Bottom Layer And Via (5462mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5462mil,4800.8mil) from Top Layer to Bottom Layer And Via (5486mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5462mil,4824.8mil) from Top Layer to Bottom Layer And Via (5462mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5462mil,4824.8mil) from Top Layer to Bottom Layer And Via (5486mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5462mil,4848.8mil) from Top Layer to Bottom Layer And Via (5462mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5462mil,4848.8mil) from Top Layer to Bottom Layer And Via (5486mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5462mil,4872.8mil) from Top Layer to Bottom Layer And Via (5462mil,4896.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5462mil,4872.8mil) from Top Layer to Bottom Layer And Via (5486mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5462mil,4896.8mil) from Top Layer to Bottom Layer And Via (5486mil,4896.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.552mil < 10mil) Between Via (5470.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (5476.7mil,4590.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.552mil] / [Bottom Solder] Mask Sliver [4.552mil]
Minimum Solder Mask Sliver Constraint: (2.805mil < 10mil) Between Via (5470.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (5478.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.805mil] / [Bottom Solder] Mask Sliver [2.805mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (5494.7mil,4616.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4073mil) from Top Layer to Bottom Layer And Via (5470mil,4097mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4073mil) from Top Layer to Bottom Layer And Via (5494mil,4073mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4097mil) from Top Layer to Bottom Layer And Via (5470mil,4121mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4097mil) from Top Layer to Bottom Layer And Via (5494mil,4097mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4121mil) from Top Layer to Bottom Layer And Via (5470mil,4145mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4121mil) from Top Layer to Bottom Layer And Via (5494mil,4121mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4145mil) from Top Layer to Bottom Layer And Via (5470mil,4169mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4145mil) from Top Layer to Bottom Layer And Via (5494mil,4145mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4169mil) from Top Layer to Bottom Layer And Via (5470mil,4193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4169mil) from Top Layer to Bottom Layer And Via (5494mil,4169mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4193mil) from Top Layer to Bottom Layer And Via (5470mil,4217mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4193mil) from Top Layer to Bottom Layer And Via (5494mil,4193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4217mil) from Top Layer to Bottom Layer And Via (5470mil,4241mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4217mil) from Top Layer to Bottom Layer And Via (5494mil,4217mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4241mil) from Top Layer to Bottom Layer And Via (5470mil,4265mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4241mil) from Top Layer to Bottom Layer And Via (5494mil,4241mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4265mil) from Top Layer to Bottom Layer And Via (5470mil,4289mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4265mil) from Top Layer to Bottom Layer And Via (5494mil,4265mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4289mil) from Top Layer to Bottom Layer And Via (5470mil,4313mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4289mil) from Top Layer to Bottom Layer And Via (5494mil,4289mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4313mil) from Top Layer to Bottom Layer And Via (5470mil,4337mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4313mil) from Top Layer to Bottom Layer And Via (5494mil,4313mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4337mil) from Top Layer to Bottom Layer And Via (5470mil,4361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4337mil) from Top Layer to Bottom Layer And Via (5494mil,4337mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4361mil) from Top Layer to Bottom Layer And Via (5470mil,4385mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4361mil) from Top Layer to Bottom Layer And Via (5494mil,4361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4385mil) from Top Layer to Bottom Layer And Via (5470mil,4409mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4385mil) from Top Layer to Bottom Layer And Via (5494mil,4385mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4409mil) from Top Layer to Bottom Layer And Via (5470mil,4433mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4409mil) from Top Layer to Bottom Layer And Via (5494mil,4409mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4433mil) from Top Layer to Bottom Layer And Via (5470mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4433mil) from Top Layer to Bottom Layer And Via (5494mil,4433mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (3.246mil < 10mil) Between Via (5470mil,4457mil) from Top Layer to Bottom Layer And Via (5471.8mil,4482.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.246mil] / [Bottom Solder] Mask Sliver [3.246mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5470mil,4457mil) from Top Layer to Bottom Layer And Via (5494mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.648mil < 10mil) Between Via (5471.725mil,5474.257mil) from Top Layer to Bottom Layer And Via (5494.5mil,5465.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.648mil] / [Bottom Solder] Mask Sliver [1.648mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5476.7mil,4566.1mil) from Top Layer to Bottom Layer And Via (5476.7mil,4590.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.186mil < 10mil) Between Via (5476.7mil,4566.1mil) from Top Layer to Bottom Layer And Via (5477mil,4543.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.186mil] / [Bottom Solder] Mask Sliver [0.186mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5476.7mil,4566.1mil) from Top Layer to Bottom Layer And Via (5500.7mil,4566.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.402mil < 10mil) Between Via (5476.7mil,4590.1mil) from Top Layer to Bottom Layer And Via (5494.7mil,4616.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.402mil] / [Bottom Solder] Mask Sliver [9.402mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5476.7mil,4590.1mil) from Top Layer to Bottom Layer And Via (5500.7mil,4590.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5477mil,4519.2mil) from Top Layer to Bottom Layer And Via (5477mil,4543.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5477mil,4519.2mil) from Top Layer to Bottom Layer And Via (5501mil,4519.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5477mil,4543.2mil) from Top Layer to Bottom Layer And Via (5501mil,4543.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5478.2mil,3971.8mil) from Top Layer to Bottom Layer And Via (5478.2mil,3995.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5478.2mil,3971.8mil) from Top Layer to Bottom Layer And Via (5502.2mil,3971.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5478.2mil,3995.8mil) from Top Layer to Bottom Layer And Via (5478.2mil,4019.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5478.2mil,3995.8mil) from Top Layer to Bottom Layer And Via (5502.2mil,3995.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5478.2mil,4019.8mil) from Top Layer to Bottom Layer And Via (5502.2mil,4019.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5478.5mil,4641mil) from Top Layer to Bottom Layer And Via (5478.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (6.489mil < 10mil) Between Via (5478.5mil,4641mil) from Top Layer to Bottom Layer And Via (5494.7mil,4616.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.489mil] / [Bottom Solder] Mask Sliver [6.489mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5478.5mil,4641mil) from Top Layer to Bottom Layer And Via (5502.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5478.5mil,4665mil) from Top Layer to Bottom Layer And Via (5502.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.774mil < 10mil) Between Via (5478.5mil,4665mil) from Top Layer to Bottom Layer And Via (5502.5mil,4686.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.774mil] / [Bottom Solder] Mask Sliver [9.774mil]
Minimum Solder Mask Sliver Constraint: (9.774mil < 10mil) Between Via (5478.5mil,4686.9mil) from Top Layer to Bottom Layer And Via (5502.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.774mil] / [Bottom Solder] Mask Sliver [9.774mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5478.5mil,4686.9mil) from Top Layer to Bottom Layer And Via (5502.5mil,4686.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5486mil,4776.8mil) from Top Layer to Bottom Layer And Via (5486mil,4800.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.828mil < 10mil) Between Via (5486mil,4776.8mil) from Top Layer to Bottom Layer And Via (5507.932mil,4800.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.828mil] / [Bottom Solder] Mask Sliver [9.828mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5486mil,4800.8mil) from Top Layer to Bottom Layer And Via (5486mil,4824.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.763mil < 10mil) Between Via (5486mil,4800.8mil) from Top Layer to Bottom Layer And Via (5507.932mil,4776.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.763mil] / [Bottom Solder] Mask Sliver [9.763mil]
Minimum Solder Mask Sliver Constraint: (9.828mil < 10mil) Between Via (5486mil,4800.8mil) from Top Layer to Bottom Layer And Via (5507.932mil,4824.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.828mil] / [Bottom Solder] Mask Sliver [9.828mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5486mil,4824.8mil) from Top Layer to Bottom Layer And Via (5486mil,4848.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.763mil < 10mil) Between Via (5486mil,4824.8mil) from Top Layer to Bottom Layer And Via (5507.932mil,4800.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.763mil] / [Bottom Solder] Mask Sliver [9.763mil]
Minimum Solder Mask Sliver Constraint: (9.828mil < 10mil) Between Via (5486mil,4824.8mil) from Top Layer to Bottom Layer And Via (5507.932mil,4848.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.828mil] / [Bottom Solder] Mask Sliver [9.828mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5486mil,4848.8mil) from Top Layer to Bottom Layer And Via (5486mil,4872.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.763mil < 10mil) Between Via (5486mil,4848.8mil) from Top Layer to Bottom Layer And Via (5507.932mil,4824.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.763mil] / [Bottom Solder] Mask Sliver [9.763mil]
Minimum Solder Mask Sliver Constraint: (9.828mil < 10mil) Between Via (5486mil,4848.8mil) from Top Layer to Bottom Layer And Via (5507.932mil,4872.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.828mil] / [Bottom Solder] Mask Sliver [9.828mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5486mil,4872.8mil) from Top Layer to Bottom Layer And Via (5486mil,4896.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.763mil < 10mil) Between Via (5486mil,4872.8mil) from Top Layer to Bottom Layer And Via (5507.932mil,4848.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.763mil] / [Bottom Solder] Mask Sliver [9.763mil]
Minimum Solder Mask Sliver Constraint: (9.828mil < 10mil) Between Via (5486mil,4872.8mil) from Top Layer to Bottom Layer And Via (5507.932mil,4896.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.828mil] / [Bottom Solder] Mask Sliver [9.828mil]
Minimum Solder Mask Sliver Constraint: (9.763mil < 10mil) Between Via (5486mil,4896.8mil) from Top Layer to Bottom Layer And Via (5507.932mil,4872.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.763mil] / [Bottom Solder] Mask Sliver [9.763mil]
Minimum Solder Mask Sliver Constraint: (0.288mil < 10mil) Between Via (5494.5mil,5465.6mil) from Top Layer to Bottom Layer And Via (5497.928mil,5442.852mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.288mil] / [Bottom Solder] Mask Sliver [0.288mil]
Minimum Solder Mask Sliver Constraint: (4.552mil < 10mil) Between Via (5494.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (5500.7mil,4590.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.552mil] / [Bottom Solder] Mask Sliver [4.552mil]
Minimum Solder Mask Sliver Constraint: (2.805mil < 10mil) Between Via (5494.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (5502.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.805mil] / [Bottom Solder] Mask Sliver [2.805mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (5518.7mil,4616.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4073mil) from Top Layer to Bottom Layer And Via (5494mil,4097mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4097mil) from Top Layer to Bottom Layer And Via (5494mil,4121mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4121mil) from Top Layer to Bottom Layer And Via (5494mil,4145mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4145mil) from Top Layer to Bottom Layer And Via (5494mil,4169mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4169mil) from Top Layer to Bottom Layer And Via (5494mil,4193mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4193mil) from Top Layer to Bottom Layer And Via (5494mil,4217mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4217mil) from Top Layer to Bottom Layer And Via (5494mil,4241mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4241mil) from Top Layer to Bottom Layer And Via (5494mil,4265mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4265mil) from Top Layer to Bottom Layer And Via (5494mil,4289mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4289mil) from Top Layer to Bottom Layer And Via (5494mil,4313mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4313mil) from Top Layer to Bottom Layer And Via (5494mil,4337mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4337mil) from Top Layer to Bottom Layer And Via (5494mil,4361mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4361mil) from Top Layer to Bottom Layer And Via (5494mil,4385mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4385mil) from Top Layer to Bottom Layer And Via (5494mil,4409mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4409mil) from Top Layer to Bottom Layer And Via (5494mil,4433mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5494mil,4433mil) from Top Layer to Bottom Layer And Via (5494mil,4457mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.659mil < 10mil) Between Via (5497.928mil,5442.852mil) from Top Layer to Bottom Layer And Via (5525.3mil,5442.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.659mil] / [Bottom Solder] Mask Sliver [4.659mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5500.7mil,4566.1mil) from Top Layer to Bottom Layer And Via (5500.7mil,4590.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.186mil < 10mil) Between Via (5500.7mil,4566.1mil) from Top Layer to Bottom Layer And Via (5501mil,4543.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.186mil] / [Bottom Solder] Mask Sliver [0.186mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5500.7mil,4566.1mil) from Top Layer to Bottom Layer And Via (5524.7mil,4566.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.402mil < 10mil) Between Via (5500.7mil,4590.1mil) from Top Layer to Bottom Layer And Via (5518.7mil,4616.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.402mil] / [Bottom Solder] Mask Sliver [9.402mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5500.7mil,4590.1mil) from Top Layer to Bottom Layer And Via (5524.7mil,4590.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5501mil,4519.2mil) from Top Layer to Bottom Layer And Via (5501mil,4543.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5501mil,4519.2mil) from Top Layer to Bottom Layer And Via (5525mil,4519.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5501mil,4543.2mil) from Top Layer to Bottom Layer And Via (5525mil,4543.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5502.2mil,3971.8mil) from Top Layer to Bottom Layer And Via (5502.2mil,3995.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5502.2mil,3971.8mil) from Top Layer to Bottom Layer And Via (5526.2mil,3971.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5502.2mil,3995.8mil) from Top Layer to Bottom Layer And Via (5502.2mil,4019.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5502.2mil,3995.8mil) from Top Layer to Bottom Layer And Via (5526.2mil,3995.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5502.2mil,4019.8mil) from Top Layer to Bottom Layer And Via (5526.2mil,4019.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5502.5mil,4641mil) from Top Layer to Bottom Layer And Via (5502.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (6.489mil < 10mil) Between Via (5502.5mil,4641mil) from Top Layer to Bottom Layer And Via (5518.7mil,4616.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.489mil] / [Bottom Solder] Mask Sliver [6.489mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5502.5mil,4641mil) from Top Layer to Bottom Layer And Via (5526.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5502.5mil,4665mil) from Top Layer to Bottom Layer And Via (5526.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.4mil < 10mil) Between Via (5502.5mil,4665mil) from Top Layer to Bottom Layer And Via (5526.5mil,4686.342mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.4mil] / [Bottom Solder] Mask Sliver [9.4mil]
Minimum Solder Mask Sliver Constraint: (9.774mil < 10mil) Between Via (5502.5mil,4686.9mil) from Top Layer to Bottom Layer And Via (5526.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.774mil] / [Bottom Solder] Mask Sliver [9.774mil]
Minimum Solder Mask Sliver Constraint: (1.29mil < 10mil) Between Via (5502.5mil,4686.9mil) from Top Layer to Bottom Layer And Via (5526.5mil,4686.342mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.29mil] / [Bottom Solder] Mask Sliver [1.29mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5507.932mil,4776.844mil) from Top Layer to Bottom Layer And Via (5507.932mil,4800.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5507.932mil,4776.844mil) from Top Layer to Bottom Layer And Via (5531.932mil,4776.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5507.932mil,4800.844mil) from Top Layer to Bottom Layer And Via (5507.932mil,4824.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5507.932mil,4800.844mil) from Top Layer to Bottom Layer And Via (5531.932mil,4800.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5507.932mil,4824.844mil) from Top Layer to Bottom Layer And Via (5507.932mil,4848.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5507.932mil,4824.844mil) from Top Layer to Bottom Layer And Via (5531.932mil,4824.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5507.932mil,4848.844mil) from Top Layer to Bottom Layer And Via (5507.932mil,4872.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5507.932mil,4848.844mil) from Top Layer to Bottom Layer And Via (5531.932mil,4848.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5507.932mil,4872.844mil) from Top Layer to Bottom Layer And Via (5507.932mil,4896.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5507.932mil,4872.844mil) from Top Layer to Bottom Layer And Via (5531.932mil,4872.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5507.932mil,4896.844mil) from Top Layer to Bottom Layer And Via (5531.932mil,4896.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.552mil < 10mil) Between Via (5518.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (5524.7mil,4590.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.552mil] / [Bottom Solder] Mask Sliver [4.552mil]
Minimum Solder Mask Sliver Constraint: (2.805mil < 10mil) Between Via (5518.7mil,4616.7mil) from Top Layer to Bottom Layer And Via (5526.5mil,4641mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.805mil] / [Bottom Solder] Mask Sliver [2.805mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5524.7mil,4566.1mil) from Top Layer to Bottom Layer And Via (5524.7mil,4590.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.186mil < 10mil) Between Via (5524.7mil,4566.1mil) from Top Layer to Bottom Layer And Via (5525mil,4543.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.186mil] / [Bottom Solder] Mask Sliver [0.186mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5525mil,4519.2mil) from Top Layer to Bottom Layer And Via (5525mil,4543.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5526.2mil,3971.8mil) from Top Layer to Bottom Layer And Via (5526.2mil,3995.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.089mil < 10mil) Between Via (5526.2mil,3971.8mil) from Top Layer to Bottom Layer And Via (5549mil,3971.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.089mil] / [Bottom Solder] Mask Sliver [0.089mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5526.2mil,3995.8mil) from Top Layer to Bottom Layer And Via (5526.2mil,4019.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.089mil < 10mil) Between Via (5526.2mil,3995.8mil) from Top Layer to Bottom Layer And Via (5549mil,3995.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.089mil] / [Bottom Solder] Mask Sliver [0.089mil]
Minimum Solder Mask Sliver Constraint: (0.089mil < 10mil) Between Via (5526.2mil,4019.8mil) from Top Layer to Bottom Layer And Via (5549mil,4019.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.089mil] / [Bottom Solder] Mask Sliver [0.089mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5526.5mil,4641mil) from Top Layer to Bottom Layer And Via (5526.5mil,4665mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5531.932mil,4776.844mil) from Top Layer to Bottom Layer And Via (5531.932mil,4800.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5531.932mil,4800.844mil) from Top Layer to Bottom Layer And Via (5531.932mil,4824.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5531.932mil,4824.844mil) from Top Layer to Bottom Layer And Via (5531.932mil,4848.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5531.932mil,4848.844mil) from Top Layer to Bottom Layer And Via (5531.932mil,4872.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5531.932mil,4872.844mil) from Top Layer to Bottom Layer And Via (5531.932mil,4896.844mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5549mil,3971.3mil) from Top Layer to Bottom Layer And Via (5549mil,3995.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5549mil,3971.3mil) from Top Layer to Bottom Layer And Via (5573mil,3971.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5549mil,3995.3mil) from Top Layer to Bottom Layer And Via (5549mil,4019.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5549mil,3995.3mil) from Top Layer to Bottom Layer And Via (5573mil,3995.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5549mil,4019.3mil) from Top Layer to Bottom Layer And Via (5573mil,4019.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5554.6mil,4776.5mil) from Top Layer to Bottom Layer And Via (5554.6mil,4800.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5554.6mil,4776.5mil) from Top Layer to Bottom Layer And Via (5578.6mil,4776.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5554.6mil,4800.5mil) from Top Layer to Bottom Layer And Via (5554.6mil,4824.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5554.6mil,4800.5mil) from Top Layer to Bottom Layer And Via (5578.6mil,4800.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5554.6mil,4824.5mil) from Top Layer to Bottom Layer And Via (5554.6mil,4848.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5554.6mil,4824.5mil) from Top Layer to Bottom Layer And Via (5578.6mil,4824.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5554.6mil,4848.5mil) from Top Layer to Bottom Layer And Via (5554.6mil,4872.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5554.6mil,4848.5mil) from Top Layer to Bottom Layer And Via (5578.6mil,4848.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5554.6mil,4872.5mil) from Top Layer to Bottom Layer And Via (5554.6mil,4896.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5554.6mil,4872.5mil) from Top Layer to Bottom Layer And Via (5578.6mil,4872.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5554.6mil,4896.5mil) from Top Layer to Bottom Layer And Via (5578.6mil,4896.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5573mil,3971.3mil) from Top Layer to Bottom Layer And Via (5573mil,3995.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5573mil,3971.3mil) from Top Layer to Bottom Layer And Via (5597mil,3971.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5573mil,3995.3mil) from Top Layer to Bottom Layer And Via (5573mil,4019.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5573mil,3995.3mil) from Top Layer to Bottom Layer And Via (5597mil,3995.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5573mil,4019.3mil) from Top Layer to Bottom Layer And Via (5597mil,4019.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5578.6mil,4776.5mil) from Top Layer to Bottom Layer And Via (5578.6mil,4800.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.197mil < 10mil) Between Via (5578.6mil,4776.5mil) from Top Layer to Bottom Layer And Via (5600.3mil,4753.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.197mil] / [Bottom Solder] Mask Sliver [9.197mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5578.6mil,4800.5mil) from Top Layer to Bottom Layer And Via (5578.6mil,4824.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.197mil < 10mil) Between Via (5578.6mil,4800.5mil) from Top Layer to Bottom Layer And Via (5600.3mil,4777.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.197mil] / [Bottom Solder] Mask Sliver [9.197mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5578.6mil,4824.5mil) from Top Layer to Bottom Layer And Via (5578.6mil,4848.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.197mil < 10mil) Between Via (5578.6mil,4824.5mil) from Top Layer to Bottom Layer And Via (5600.3mil,4801.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.197mil] / [Bottom Solder] Mask Sliver [9.197mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5578.6mil,4848.5mil) from Top Layer to Bottom Layer And Via (5578.6mil,4872.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.197mil < 10mil) Between Via (5578.6mil,4848.5mil) from Top Layer to Bottom Layer And Via (5600.3mil,4825.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.197mil] / [Bottom Solder] Mask Sliver [9.197mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5578.6mil,4872.5mil) from Top Layer to Bottom Layer And Via (5578.6mil,4896.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.197mil < 10mil) Between Via (5578.6mil,4872.5mil) from Top Layer to Bottom Layer And Via (5600.3mil,4849.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.197mil] / [Bottom Solder] Mask Sliver [9.197mil]
Minimum Solder Mask Sliver Constraint: (9.197mil < 10mil) Between Via (5578.6mil,4896.5mil) from Top Layer to Bottom Layer And Via (5600.3mil,4873.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.197mil] / [Bottom Solder] Mask Sliver [9.197mil]
Minimum Solder Mask Sliver Constraint: (1.184mil < 10mil) Between Via (5597.8mil,4559.9mil) from Top Layer to Bottom Layer And Via (5597.9mil,4536mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.184mil] / [Bottom Solder] Mask Sliver [1.184mil]
Minimum Solder Mask Sliver Constraint: (1.73mil < 10mil) Between Via (5597.8mil,4559.9mil) from Top Layer to Bottom Layer And Via (5599.3mil,4584.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.73mil] / [Bottom Solder] Mask Sliver [1.73mil]
Minimum Solder Mask Sliver Constraint: (3.805mil < 10mil) Between Via (5597.8mil,4559.9mil) from Top Layer to Bottom Layer And Via (5622.6mil,4569.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [3.805mil] / [Bottom Solder] Mask Sliver [3.805mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5597.9mil,4512mil) from Top Layer to Bottom Layer And Via (5597.9mil,4536mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5597.9mil,4512mil) from Top Layer to Bottom Layer And Via (5621.9mil,4512mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5597.9mil,4536mil) from Top Layer to Bottom Layer And Via (5621.9mil,4536mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5597mil,3971.3mil) from Top Layer to Bottom Layer And Via (5597mil,3995.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5597mil,3971.3mil) from Top Layer to Bottom Layer And Via (5621mil,3971.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5597mil,3995.3mil) from Top Layer to Bottom Layer And Via (5597mil,4019.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5597mil,3995.3mil) from Top Layer to Bottom Layer And Via (5621mil,3995.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.956mil < 10mil) Between Via (5597mil,4019.3mil) from Top Layer to Bottom Layer And Via (5605.4mil,4048.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.956mil] / [Bottom Solder] Mask Sliver [7.956mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5597mil,4019.3mil) from Top Layer to Bottom Layer And Via (5621mil,4019.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.191mil < 10mil) Between Via (5599.3mil,4584.3mil) from Top Layer to Bottom Layer And Via (5599.9mil,4608.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.191mil] / [Bottom Solder] Mask Sliver [1.191mil]
Minimum Solder Mask Sliver Constraint: (4.994mil < 10mil) Between Via (5599.3mil,4584.3mil) from Top Layer to Bottom Layer And Via (5622.6mil,4569.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.994mil] / [Bottom Solder] Mask Sliver [4.994mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5599.9mil,4608.2mil) from Top Layer to Bottom Layer And Via (5599.9mil,4632.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5599.9mil,4608.2mil) from Top Layer to Bottom Layer And Via (5623.9mil,4608.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5599.9mil,4632.2mil) from Top Layer to Bottom Layer And Via (5599.9mil,4656.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5599.9mil,4632.2mil) from Top Layer to Bottom Layer And Via (5623.9mil,4632.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5599.9mil,4656.2mil) from Top Layer to Bottom Layer And Via (5599.9mil,4680.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5599.9mil,4656.2mil) from Top Layer to Bottom Layer And Via (5623.9mil,4656.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5599.9mil,4680.2mil) from Top Layer to Bottom Layer And Via (5599.9mil,4704.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5599.9mil,4680.2mil) from Top Layer to Bottom Layer And Via (5623.9mil,4680.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5599.9mil,4704.2mil) from Top Layer to Bottom Layer And Via (5599.9mil,4728.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5599.9mil,4704.2mil) from Top Layer to Bottom Layer And Via (5623.9mil,4704.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.187mil < 10mil) Between Via (5599.9mil,4728.2mil) from Top Layer to Bottom Layer And Via (5600.3mil,4753.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.187mil] / [Bottom Solder] Mask Sliver [2.187mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5599.9mil,4728.2mil) from Top Layer to Bottom Layer And Via (5623.9mil,4728.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5600.3mil,4753.1mil) from Top Layer to Bottom Layer And Via (5600.3mil,4777.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5600.3mil,4753.1mil) from Top Layer to Bottom Layer And Via (5624.3mil,4753.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5600.3mil,4777.1mil) from Top Layer to Bottom Layer And Via (5600.3mil,4801.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5600.3mil,4777.1mil) from Top Layer to Bottom Layer And Via (5624.3mil,4777.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5600.3mil,4801.1mil) from Top Layer to Bottom Layer And Via (5600.3mil,4825.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5600.3mil,4801.1mil) from Top Layer to Bottom Layer And Via (5624.3mil,4801.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5600.3mil,4825.1mil) from Top Layer to Bottom Layer And Via (5600.3mil,4849.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5600.3mil,4825.1mil) from Top Layer to Bottom Layer And Via (5624.3mil,4825.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5600.3mil,4849.1mil) from Top Layer to Bottom Layer And Via (5600.3mil,4873.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5600.3mil,4849.1mil) from Top Layer to Bottom Layer And Via (5624.3mil,4849.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5600.3mil,4873.1mil) from Top Layer to Bottom Layer And Via (5624.3mil,4873.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.569mil < 10mil) Between Via (5605.4mil,4048.8mil) from Top Layer to Bottom Layer And Via (5607.6mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.569mil] / [Bottom Solder] Mask Sliver [5.569mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5605.4mil,4048.8mil) from Top Layer to Bottom Layer And Via (5629.4mil,4048.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4077mil) from Top Layer to Bottom Layer And Via (5607.6mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4077mil) from Top Layer to Bottom Layer And Via (5631.6mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4101mil) from Top Layer to Bottom Layer And Via (5607.6mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4101mil) from Top Layer to Bottom Layer And Via (5631.6mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4125mil) from Top Layer to Bottom Layer And Via (5607.6mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4125mil) from Top Layer to Bottom Layer And Via (5631.6mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4149mil) from Top Layer to Bottom Layer And Via (5607.6mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4149mil) from Top Layer to Bottom Layer And Via (5631.6mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4173mil) from Top Layer to Bottom Layer And Via (5607.6mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4173mil) from Top Layer to Bottom Layer And Via (5631.6mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4197mil) from Top Layer to Bottom Layer And Via (5607.6mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4197mil) from Top Layer to Bottom Layer And Via (5631.6mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4221mil) from Top Layer to Bottom Layer And Via (5607.6mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4221mil) from Top Layer to Bottom Layer And Via (5631.6mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4245mil) from Top Layer to Bottom Layer And Via (5607.6mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4245mil) from Top Layer to Bottom Layer And Via (5631.6mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4269mil) from Top Layer to Bottom Layer And Via (5607.6mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4269mil) from Top Layer to Bottom Layer And Via (5631.6mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4293mil) from Top Layer to Bottom Layer And Via (5607.6mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4293mil) from Top Layer to Bottom Layer And Via (5631.6mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4317mil) from Top Layer to Bottom Layer And Via (5607.6mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4317mil) from Top Layer to Bottom Layer And Via (5631.6mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4341mil) from Top Layer to Bottom Layer And Via (5607.6mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4341mil) from Top Layer to Bottom Layer And Via (5631.6mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4365mil) from Top Layer to Bottom Layer And Via (5607.6mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4365mil) from Top Layer to Bottom Layer And Via (5631.6mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4389mil) from Top Layer to Bottom Layer And Via (5607.6mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4389mil) from Top Layer to Bottom Layer And Via (5631.6mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4413mil) from Top Layer to Bottom Layer And Via (5607.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4413mil) from Top Layer to Bottom Layer And Via (5631.6mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4437mil) from Top Layer to Bottom Layer And Via (5607.6mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4437mil) from Top Layer to Bottom Layer And Via (5631.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5607.6mil,4461mil) from Top Layer to Bottom Layer And Via (5631.6mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5621.9mil,4512mil) from Top Layer to Bottom Layer And Via (5621.9mil,4536mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5621.9mil,4512mil) from Top Layer to Bottom Layer And Via (5645.9mil,4512mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5621.9mil,4536mil) from Top Layer to Bottom Layer And Via (5645.9mil,4536mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5621mil,3971.3mil) from Top Layer to Bottom Layer And Via (5621mil,3995.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5621mil,3971.3mil) from Top Layer to Bottom Layer And Via (5645mil,3971.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5621mil,3995.3mil) from Top Layer to Bottom Layer And Via (5621mil,4019.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5621mil,3995.3mil) from Top Layer to Bottom Layer And Via (5645mil,3995.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.956mil < 10mil) Between Via (5621mil,4019.3mil) from Top Layer to Bottom Layer And Via (5629.4mil,4048.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.956mil] / [Bottom Solder] Mask Sliver [7.956mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5621mil,4019.3mil) from Top Layer to Bottom Layer And Via (5645mil,4019.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.668mil < 10mil) Between Via (5622.6mil,4569.3mil) from Top Layer to Bottom Layer And Via (5645.1mil,4559.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.668mil] / [Bottom Solder] Mask Sliver [1.668mil]
Minimum Solder Mask Sliver Constraint: (4.106mil < 10mil) Between Via (5622.6mil,4569.3mil) from Top Layer to Bottom Layer And Via (5645.1mil,4583.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.105mil] / [Bottom Solder] Mask Sliver [4.105mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5623.9mil,4608.2mil) from Top Layer to Bottom Layer And Via (5623.9mil,4632.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.531mil < 10mil) Between Via (5623.9mil,4608.2mil) from Top Layer to Bottom Layer And Via (5645.1mil,4583.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.531mil] / [Bottom Solder] Mask Sliver [9.531mil]
Minimum Solder Mask Sliver Constraint: (9.082mil < 10mil) Between Via (5623.9mil,4608.2mil) from Top Layer to Bottom Layer And Via (5645.1mil,4631.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.082mil] / [Bottom Solder] Mask Sliver [9.082mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5623.9mil,4632.2mil) from Top Layer to Bottom Layer And Via (5623.9mil,4656.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.531mil < 10mil) Between Via (5623.9mil,4632.2mil) from Top Layer to Bottom Layer And Via (5645.1mil,4607.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.531mil] / [Bottom Solder] Mask Sliver [9.531mil]
Minimum Solder Mask Sliver Constraint: (9.082mil < 10mil) Between Via (5623.9mil,4632.2mil) from Top Layer to Bottom Layer And Via (5645.1mil,4655.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.082mil] / [Bottom Solder] Mask Sliver [9.082mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5623.9mil,4656.2mil) from Top Layer to Bottom Layer And Via (5623.9mil,4680.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.531mil < 10mil) Between Via (5623.9mil,4656.2mil) from Top Layer to Bottom Layer And Via (5645.1mil,4631.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.531mil] / [Bottom Solder] Mask Sliver [9.531mil]
Minimum Solder Mask Sliver Constraint: (9.082mil < 10mil) Between Via (5623.9mil,4656.2mil) from Top Layer to Bottom Layer And Via (5645.1mil,4679.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.082mil] / [Bottom Solder] Mask Sliver [9.082mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5623.9mil,4680.2mil) from Top Layer to Bottom Layer And Via (5623.9mil,4704.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.531mil < 10mil) Between Via (5623.9mil,4680.2mil) from Top Layer to Bottom Layer And Via (5645.1mil,4655.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.531mil] / [Bottom Solder] Mask Sliver [9.531mil]
Minimum Solder Mask Sliver Constraint: (9.617mil < 10mil) Between Via (5623.9mil,4680.2mil) from Top Layer to Bottom Layer And Via (5645mil,4704.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.617mil] / [Bottom Solder] Mask Sliver [9.617mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5623.9mil,4704.2mil) from Top Layer to Bottom Layer And Via (5623.9mil,4728.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.531mil < 10mil) Between Via (5623.9mil,4704.2mil) from Top Layer to Bottom Layer And Via (5645.1mil,4679.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.531mil] / [Bottom Solder] Mask Sliver [9.531mil]
Minimum Solder Mask Sliver Constraint: (9.617mil < 10mil) Between Via (5623.9mil,4704.2mil) from Top Layer to Bottom Layer And Via (5645mil,4728.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.617mil] / [Bottom Solder] Mask Sliver [9.617mil]
Minimum Solder Mask Sliver Constraint: (2.187mil < 10mil) Between Via (5623.9mil,4728.2mil) from Top Layer to Bottom Layer And Via (5624.3mil,4753.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.187mil] / [Bottom Solder] Mask Sliver [2.187mil]
Minimum Solder Mask Sliver Constraint: (8.866mil < 10mil) Between Via (5623.9mil,4728.2mil) from Top Layer to Bottom Layer And Via (5645mil,4704.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.866mil] / [Bottom Solder] Mask Sliver [8.866mil]
Minimum Solder Mask Sliver Constraint: (9.617mil < 10mil) Between Via (5623.9mil,4728.2mil) from Top Layer to Bottom Layer And Via (5645mil,4752.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.617mil] / [Bottom Solder] Mask Sliver [9.617mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5624.3mil,4753.1mil) from Top Layer to Bottom Layer And Via (5624.3mil,4777.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.281mil < 10mil) Between Via (5624.3mil,4753.1mil) from Top Layer to Bottom Layer And Via (5645mil,4728.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.281mil] / [Bottom Solder] Mask Sliver [9.281mil]
Minimum Solder Mask Sliver Constraint: (8.675mil < 10mil) Between Via (5624.3mil,4753.1mil) from Top Layer to Bottom Layer And Via (5645mil,4776.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.675mil] / [Bottom Solder] Mask Sliver [8.675mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5624.3mil,4777.1mil) from Top Layer to Bottom Layer And Via (5624.3mil,4801.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.281mil < 10mil) Between Via (5624.3mil,4777.1mil) from Top Layer to Bottom Layer And Via (5645mil,4752.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.281mil] / [Bottom Solder] Mask Sliver [9.281mil]
Minimum Solder Mask Sliver Constraint: (8.675mil < 10mil) Between Via (5624.3mil,4777.1mil) from Top Layer to Bottom Layer And Via (5645mil,4800.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.675mil] / [Bottom Solder] Mask Sliver [8.675mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5624.3mil,4801.1mil) from Top Layer to Bottom Layer And Via (5624.3mil,4825.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.281mil < 10mil) Between Via (5624.3mil,4801.1mil) from Top Layer to Bottom Layer And Via (5645mil,4776.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.281mil] / [Bottom Solder] Mask Sliver [9.281mil]
Minimum Solder Mask Sliver Constraint: (8.675mil < 10mil) Between Via (5624.3mil,4801.1mil) from Top Layer to Bottom Layer And Via (5645mil,4824.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.675mil] / [Bottom Solder] Mask Sliver [8.675mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5624.3mil,4825.1mil) from Top Layer to Bottom Layer And Via (5624.3mil,4849.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.281mil < 10mil) Between Via (5624.3mil,4825.1mil) from Top Layer to Bottom Layer And Via (5645mil,4800.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.281mil] / [Bottom Solder] Mask Sliver [9.281mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5624.3mil,4849.1mil) from Top Layer to Bottom Layer And Via (5624.3mil,4873.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.281mil < 10mil) Between Via (5624.3mil,4849.1mil) from Top Layer to Bottom Layer And Via (5645mil,4824.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.281mil] / [Bottom Solder] Mask Sliver [9.281mil]
Minimum Solder Mask Sliver Constraint: (5.569mil < 10mil) Between Via (5629.4mil,4048.8mil) from Top Layer to Bottom Layer And Via (5631.6mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.569mil] / [Bottom Solder] Mask Sliver [5.569mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5629.4mil,4048.8mil) from Top Layer to Bottom Layer And Via (5653.4mil,4048.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4077mil) from Top Layer to Bottom Layer And Via (5631.6mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4077mil) from Top Layer to Bottom Layer And Via (5655.6mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4101mil) from Top Layer to Bottom Layer And Via (5631.6mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4101mil) from Top Layer to Bottom Layer And Via (5655.6mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4125mil) from Top Layer to Bottom Layer And Via (5631.6mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4125mil) from Top Layer to Bottom Layer And Via (5655.6mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4149mil) from Top Layer to Bottom Layer And Via (5631.6mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4149mil) from Top Layer to Bottom Layer And Via (5655.6mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4173mil) from Top Layer to Bottom Layer And Via (5631.6mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4173mil) from Top Layer to Bottom Layer And Via (5655.6mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4197mil) from Top Layer to Bottom Layer And Via (5631.6mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4197mil) from Top Layer to Bottom Layer And Via (5655.6mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4221mil) from Top Layer to Bottom Layer And Via (5631.6mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4221mil) from Top Layer to Bottom Layer And Via (5655.6mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4245mil) from Top Layer to Bottom Layer And Via (5631.6mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4245mil) from Top Layer to Bottom Layer And Via (5655.6mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4269mil) from Top Layer to Bottom Layer And Via (5631.6mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4269mil) from Top Layer to Bottom Layer And Via (5655.6mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4293mil) from Top Layer to Bottom Layer And Via (5631.6mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4293mil) from Top Layer to Bottom Layer And Via (5655.6mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4317mil) from Top Layer to Bottom Layer And Via (5631.6mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4317mil) from Top Layer to Bottom Layer And Via (5655.6mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4341mil) from Top Layer to Bottom Layer And Via (5631.6mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4341mil) from Top Layer to Bottom Layer And Via (5655.6mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4365mil) from Top Layer to Bottom Layer And Via (5631.6mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4365mil) from Top Layer to Bottom Layer And Via (5655.6mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4389mil) from Top Layer to Bottom Layer And Via (5631.6mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4389mil) from Top Layer to Bottom Layer And Via (5655.6mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4413mil) from Top Layer to Bottom Layer And Via (5631.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4413mil) from Top Layer to Bottom Layer And Via (5655.6mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4437mil) from Top Layer to Bottom Layer And Via (5631.6mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4437mil) from Top Layer to Bottom Layer And Via (5655.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5631.6mil,4461mil) from Top Layer to Bottom Layer And Via (5655.6mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645.1mil,4559.9mil) from Top Layer to Bottom Layer And Via (5645.1mil,4583.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.197mil < 10mil) Between Via (5645.1mil,4559.9mil) from Top Layer to Bottom Layer And Via (5645.9mil,4536mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.197mil] / [Bottom Solder] Mask Sliver [1.197mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645.1mil,4559.9mil) from Top Layer to Bottom Layer And Via (5669.1mil,4559.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645.1mil,4583.9mil) from Top Layer to Bottom Layer And Via (5645.1mil,4607.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645.1mil,4583.9mil) from Top Layer to Bottom Layer And Via (5669.1mil,4583.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645.1mil,4607.9mil) from Top Layer to Bottom Layer And Via (5645.1mil,4631.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645.1mil,4607.9mil) from Top Layer to Bottom Layer And Via (5669.1mil,4607.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645.1mil,4631.9mil) from Top Layer to Bottom Layer And Via (5645.1mil,4655.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645.1mil,4631.9mil) from Top Layer to Bottom Layer And Via (5669.1mil,4631.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645.1mil,4655.9mil) from Top Layer to Bottom Layer And Via (5645.1mil,4679.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645.1mil,4655.9mil) from Top Layer to Bottom Layer And Via (5669.1mil,4655.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.084mil < 10mil) Between Via (5645.1mil,4679.9mil) from Top Layer to Bottom Layer And Via (5645mil,4704.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.084mil] / [Bottom Solder] Mask Sliver [2.084mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645.1mil,4679.9mil) from Top Layer to Bottom Layer And Via (5669.1mil,4679.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645.9mil,4512mil) from Top Layer to Bottom Layer And Via (5645.9mil,4536mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645.9mil,4512mil) from Top Layer to Bottom Layer And Via (5669.9mil,4512mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645.9mil,4536mil) from Top Layer to Bottom Layer And Via (5669.9mil,4536mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645mil,3971.3mil) from Top Layer to Bottom Layer And Via (5645mil,3995.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.089mil < 10mil) Between Via (5645mil,3971.3mil) from Top Layer to Bottom Layer And Via (5668.8mil,3970.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.089mil] / [Bottom Solder] Mask Sliver [1.089mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645mil,3995.3mil) from Top Layer to Bottom Layer And Via (5645mil,4019.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.089mil < 10mil) Between Via (5645mil,3995.3mil) from Top Layer to Bottom Layer And Via (5668.8mil,3994.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.089mil] / [Bottom Solder] Mask Sliver [1.089mil]
Minimum Solder Mask Sliver Constraint: (7.956mil < 10mil) Between Via (5645mil,4019.3mil) from Top Layer to Bottom Layer And Via (5653.4mil,4048.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.956mil] / [Bottom Solder] Mask Sliver [7.956mil]
Minimum Solder Mask Sliver Constraint: (1.089mil < 10mil) Between Via (5645mil,4019.3mil) from Top Layer to Bottom Layer And Via (5668.8mil,4018.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.089mil] / [Bottom Solder] Mask Sliver [1.089mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645mil,4704.7mil) from Top Layer to Bottom Layer And Via (5645mil,4728.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645mil,4704.7mil) from Top Layer to Bottom Layer And Via (5669mil,4704.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645mil,4728.7mil) from Top Layer to Bottom Layer And Via (5645mil,4752.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645mil,4728.7mil) from Top Layer to Bottom Layer And Via (5669mil,4728.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645mil,4752.7mil) from Top Layer to Bottom Layer And Via (5645mil,4776.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645mil,4752.7mil) from Top Layer to Bottom Layer And Via (5669mil,4752.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645mil,4776.7mil) from Top Layer to Bottom Layer And Via (5645mil,4800.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645mil,4776.7mil) from Top Layer to Bottom Layer And Via (5669mil,4776.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645mil,4800.7mil) from Top Layer to Bottom Layer And Via (5645mil,4824.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645mil,4800.7mil) from Top Layer to Bottom Layer And Via (5669mil,4800.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5645mil,4824.7mil) from Top Layer to Bottom Layer And Via (5669mil,4824.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.425mil < 10mil) Between Via (5650.1mil,4893.7mil) from Top Layer to Bottom Layer And Via (5674.3mil,4874.1mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.425mil] / [Bottom Solder] Mask Sliver [8.425mil]
Minimum Solder Mask Sliver Constraint: (5.569mil < 10mil) Between Via (5653.4mil,4048.8mil) from Top Layer to Bottom Layer And Via (5655.6mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.569mil] / [Bottom Solder] Mask Sliver [5.569mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5653.4mil,4048.8mil) from Top Layer to Bottom Layer And Via (5677.4mil,4048.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4077mil) from Top Layer to Bottom Layer And Via (5655.6mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4077mil) from Top Layer to Bottom Layer And Via (5679.6mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4101mil) from Top Layer to Bottom Layer And Via (5655.6mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4101mil) from Top Layer to Bottom Layer And Via (5679.6mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4125mil) from Top Layer to Bottom Layer And Via (5655.6mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4125mil) from Top Layer to Bottom Layer And Via (5679.6mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4149mil) from Top Layer to Bottom Layer And Via (5655.6mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4149mil) from Top Layer to Bottom Layer And Via (5679.6mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4173mil) from Top Layer to Bottom Layer And Via (5655.6mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4173mil) from Top Layer to Bottom Layer And Via (5679.6mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4197mil) from Top Layer to Bottom Layer And Via (5655.6mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4197mil) from Top Layer to Bottom Layer And Via (5679.6mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4221mil) from Top Layer to Bottom Layer And Via (5655.6mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4221mil) from Top Layer to Bottom Layer And Via (5679.6mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4245mil) from Top Layer to Bottom Layer And Via (5655.6mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4245mil) from Top Layer to Bottom Layer And Via (5679.6mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4269mil) from Top Layer to Bottom Layer And Via (5655.6mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4269mil) from Top Layer to Bottom Layer And Via (5679.6mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4293mil) from Top Layer to Bottom Layer And Via (5655.6mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4293mil) from Top Layer to Bottom Layer And Via (5679.6mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4317mil) from Top Layer to Bottom Layer And Via (5655.6mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4317mil) from Top Layer to Bottom Layer And Via (5679.6mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4341mil) from Top Layer to Bottom Layer And Via (5655.6mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4341mil) from Top Layer to Bottom Layer And Via (5679.6mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4365mil) from Top Layer to Bottom Layer And Via (5655.6mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4365mil) from Top Layer to Bottom Layer And Via (5679.6mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4389mil) from Top Layer to Bottom Layer And Via (5655.6mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4389mil) from Top Layer to Bottom Layer And Via (5679.6mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4413mil) from Top Layer to Bottom Layer And Via (5655.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4413mil) from Top Layer to Bottom Layer And Via (5679.6mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4437mil) from Top Layer to Bottom Layer And Via (5655.6mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4437mil) from Top Layer to Bottom Layer And Via (5679.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5655.6mil,4461mil) from Top Layer to Bottom Layer And Via (5679.6mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5668.8mil,3970.8mil) from Top Layer to Bottom Layer And Via (5668.8mil,3994.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5668.8mil,3970.8mil) from Top Layer to Bottom Layer And Via (5692.8mil,3970.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5668.8mil,3994.8mil) from Top Layer to Bottom Layer And Via (5668.8mil,4018.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5668.8mil,3994.8mil) from Top Layer to Bottom Layer And Via (5692.8mil,3994.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.492mil < 10mil) Between Via (5668.8mil,4018.8mil) from Top Layer to Bottom Layer And Via (5677.4mil,4048.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.492mil] / [Bottom Solder] Mask Sliver [8.492mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5668.8mil,4018.8mil) from Top Layer to Bottom Layer And Via (5692.8mil,4018.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5669.1mil,4559.9mil) from Top Layer to Bottom Layer And Via (5669.1mil,4583.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.197mil < 10mil) Between Via (5669.1mil,4559.9mil) from Top Layer to Bottom Layer And Via (5669.9mil,4536mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.197mil] / [Bottom Solder] Mask Sliver [1.197mil]
Minimum Solder Mask Sliver Constraint: (1.419mil < 10mil) Between Via (5669.1mil,4559.9mil) from Top Layer to Bottom Layer And Via (5693.2mil,4558.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.419mil] / [Bottom Solder] Mask Sliver [1.419mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5669.1mil,4583.9mil) from Top Layer to Bottom Layer And Via (5669.1mil,4607.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5669.1mil,4607.9mil) from Top Layer to Bottom Layer And Via (5669.1mil,4631.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5669.1mil,4631.9mil) from Top Layer to Bottom Layer And Via (5669.1mil,4655.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5669.1mil,4655.9mil) from Top Layer to Bottom Layer And Via (5669.1mil,4679.9mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (2.084mil < 10mil) Between Via (5669.1mil,4679.9mil) from Top Layer to Bottom Layer And Via (5669mil,4704.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.084mil] / [Bottom Solder] Mask Sliver [2.084mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5669.9mil,4512mil) from Top Layer to Bottom Layer And Via (5669.9mil,4536mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5669.9mil,4512mil) from Top Layer to Bottom Layer And Via (5693.9mil,4512mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.743mil < 10mil) Between Via (5669.9mil,4536mil) from Top Layer to Bottom Layer And Via (5693.2mil,4558.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.744mil] / [Bottom Solder] Mask Sliver [9.744mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5669.9mil,4536mil) from Top Layer to Bottom Layer And Via (5693.9mil,4536mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5669mil,4704.7mil) from Top Layer to Bottom Layer And Via (5669mil,4728.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5669mil,4728.7mil) from Top Layer to Bottom Layer And Via (5669mil,4752.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5669mil,4752.7mil) from Top Layer to Bottom Layer And Via (5669mil,4776.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5669mil,4776.7mil) from Top Layer to Bottom Layer And Via (5669mil,4800.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5669mil,4800.7mil) from Top Layer to Bottom Layer And Via (5669mil,4824.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.569mil < 10mil) Between Via (5677.4mil,4048.8mil) from Top Layer to Bottom Layer And Via (5679.6mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.569mil] / [Bottom Solder] Mask Sliver [5.569mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5677.4mil,4048.8mil) from Top Layer to Bottom Layer And Via (5701.4mil,4048.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4077mil) from Top Layer to Bottom Layer And Via (5679.6mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4077mil) from Top Layer to Bottom Layer And Via (5703.6mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4101mil) from Top Layer to Bottom Layer And Via (5679.6mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4101mil) from Top Layer to Bottom Layer And Via (5703.6mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4125mil) from Top Layer to Bottom Layer And Via (5679.6mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4125mil) from Top Layer to Bottom Layer And Via (5703.6mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4149mil) from Top Layer to Bottom Layer And Via (5679.6mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4149mil) from Top Layer to Bottom Layer And Via (5703.6mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4173mil) from Top Layer to Bottom Layer And Via (5679.6mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4173mil) from Top Layer to Bottom Layer And Via (5703.6mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4197mil) from Top Layer to Bottom Layer And Via (5679.6mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4197mil) from Top Layer to Bottom Layer And Via (5703.6mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4221mil) from Top Layer to Bottom Layer And Via (5679.6mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4221mil) from Top Layer to Bottom Layer And Via (5703.6mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4245mil) from Top Layer to Bottom Layer And Via (5679.6mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4245mil) from Top Layer to Bottom Layer And Via (5703.6mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4269mil) from Top Layer to Bottom Layer And Via (5679.6mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4269mil) from Top Layer to Bottom Layer And Via (5703.6mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4293mil) from Top Layer to Bottom Layer And Via (5679.6mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4293mil) from Top Layer to Bottom Layer And Via (5703.6mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4317mil) from Top Layer to Bottom Layer And Via (5679.6mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4317mil) from Top Layer to Bottom Layer And Via (5703.6mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4341mil) from Top Layer to Bottom Layer And Via (5679.6mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4341mil) from Top Layer to Bottom Layer And Via (5703.6mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4365mil) from Top Layer to Bottom Layer And Via (5679.6mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4365mil) from Top Layer to Bottom Layer And Via (5703.6mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4389mil) from Top Layer to Bottom Layer And Via (5679.6mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4389mil) from Top Layer to Bottom Layer And Via (5703.6mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4413mil) from Top Layer to Bottom Layer And Via (5679.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4413mil) from Top Layer to Bottom Layer And Via (5703.6mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4437mil) from Top Layer to Bottom Layer And Via (5679.6mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4437mil) from Top Layer to Bottom Layer And Via (5703.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5679.6mil,4461mil) from Top Layer to Bottom Layer And Via (5703.6mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5692.8mil,3970.8mil) from Top Layer to Bottom Layer And Via (5692.8mil,3994.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5692.8mil,3970.8mil) from Top Layer to Bottom Layer And Via (5716.8mil,3970.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5692.8mil,3994.8mil) from Top Layer to Bottom Layer And Via (5692.8mil,4018.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5692.8mil,3994.8mil) from Top Layer to Bottom Layer And Via (5716.8mil,3994.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.492mil < 10mil) Between Via (5692.8mil,4018.8mil) from Top Layer to Bottom Layer And Via (5701.4mil,4048.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.492mil] / [Bottom Solder] Mask Sliver [8.492mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5692.8mil,4018.8mil) from Top Layer to Bottom Layer And Via (5716.8mil,4018.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5693.2mil,4558.6mil) from Top Layer to Bottom Layer And Via (5717.2mil,4558.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5693.9mil,4512mil) from Top Layer to Bottom Layer And Via (5693.9mil,4536mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5693.9mil,4512mil) from Top Layer to Bottom Layer And Via (5717.9mil,4512mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (9.743mil < 10mil) Between Via (5693.9mil,4536mil) from Top Layer to Bottom Layer And Via (5717.2mil,4558.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.744mil] / [Bottom Solder] Mask Sliver [9.744mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5693.9mil,4536mil) from Top Layer to Bottom Layer And Via (5717.9mil,4536mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.569mil < 10mil) Between Via (5701.4mil,4048.8mil) from Top Layer to Bottom Layer And Via (5703.6mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.569mil] / [Bottom Solder] Mask Sliver [5.569mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5701.4mil,4048.8mil) from Top Layer to Bottom Layer And Via (5725.4mil,4048.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4077mil) from Top Layer to Bottom Layer And Via (5703.6mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4077mil) from Top Layer to Bottom Layer And Via (5727.6mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4101mil) from Top Layer to Bottom Layer And Via (5703.6mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4101mil) from Top Layer to Bottom Layer And Via (5727.6mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4125mil) from Top Layer to Bottom Layer And Via (5703.6mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4125mil) from Top Layer to Bottom Layer And Via (5727.6mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4149mil) from Top Layer to Bottom Layer And Via (5703.6mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4149mil) from Top Layer to Bottom Layer And Via (5727.6mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4173mil) from Top Layer to Bottom Layer And Via (5703.6mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4173mil) from Top Layer to Bottom Layer And Via (5727.6mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4197mil) from Top Layer to Bottom Layer And Via (5703.6mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4197mil) from Top Layer to Bottom Layer And Via (5727.6mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4221mil) from Top Layer to Bottom Layer And Via (5703.6mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4221mil) from Top Layer to Bottom Layer And Via (5727.6mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4245mil) from Top Layer to Bottom Layer And Via (5703.6mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4245mil) from Top Layer to Bottom Layer And Via (5727.6mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4269mil) from Top Layer to Bottom Layer And Via (5703.6mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4269mil) from Top Layer to Bottom Layer And Via (5727.6mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4293mil) from Top Layer to Bottom Layer And Via (5703.6mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4293mil) from Top Layer to Bottom Layer And Via (5727.6mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4317mil) from Top Layer to Bottom Layer And Via (5703.6mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4317mil) from Top Layer to Bottom Layer And Via (5727.6mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4341mil) from Top Layer to Bottom Layer And Via (5703.6mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4341mil) from Top Layer to Bottom Layer And Via (5727.6mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4365mil) from Top Layer to Bottom Layer And Via (5703.6mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4365mil) from Top Layer to Bottom Layer And Via (5727.6mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4389mil) from Top Layer to Bottom Layer And Via (5703.6mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4389mil) from Top Layer to Bottom Layer And Via (5727.6mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4413mil) from Top Layer to Bottom Layer And Via (5703.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4413mil) from Top Layer to Bottom Layer And Via (5727.6mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4437mil) from Top Layer to Bottom Layer And Via (5703.6mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4437mil) from Top Layer to Bottom Layer And Via (5727.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5703.6mil,4461mil) from Top Layer to Bottom Layer And Via (5727.6mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5716.8mil,3970.8mil) from Top Layer to Bottom Layer And Via (5716.8mil,3994.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5716.8mil,3970.8mil) from Top Layer to Bottom Layer And Via (5740.8mil,3970.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5716.8mil,3994.8mil) from Top Layer to Bottom Layer And Via (5716.8mil,4018.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5716.8mil,3994.8mil) from Top Layer to Bottom Layer And Via (5740.8mil,3994.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.492mil < 10mil) Between Via (5716.8mil,4018.8mil) from Top Layer to Bottom Layer And Via (5725.4mil,4048.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.492mil] / [Bottom Solder] Mask Sliver [8.492mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5716.8mil,4018.8mil) from Top Layer to Bottom Layer And Via (5740.8mil,4018.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5717.2mil,4558.6mil) from Top Layer to Bottom Layer And Via (5741.2mil,4558.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5717.9mil,4512mil) from Top Layer to Bottom Layer And Via (5717.9mil,4536mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.829mil < 10mil) Between Via (5717.9mil,4512mil) from Top Layer to Bottom Layer And Via (5742.4mil,4513.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.829mil] / [Bottom Solder] Mask Sliver [1.829mil]
Minimum Solder Mask Sliver Constraint: (9.743mil < 10mil) Between Via (5717.9mil,4536mil) from Top Layer to Bottom Layer And Via (5741.2mil,4558.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [9.744mil] / [Bottom Solder] Mask Sliver [9.744mil]
Minimum Solder Mask Sliver Constraint: (1.829mil < 10mil) Between Via (5717.9mil,4536mil) from Top Layer to Bottom Layer And Via (5742.4mil,4537.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.829mil] / [Bottom Solder] Mask Sliver [1.829mil]
Minimum Solder Mask Sliver Constraint: (5.569mil < 10mil) Between Via (5725.4mil,4048.8mil) from Top Layer to Bottom Layer And Via (5727.6mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.569mil] / [Bottom Solder] Mask Sliver [5.569mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5725.4mil,4048.8mil) from Top Layer to Bottom Layer And Via (5749.4mil,4048.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4077mil) from Top Layer to Bottom Layer And Via (5727.6mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4077mil) from Top Layer to Bottom Layer And Via (5751.6mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4101mil) from Top Layer to Bottom Layer And Via (5727.6mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4101mil) from Top Layer to Bottom Layer And Via (5751.6mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4125mil) from Top Layer to Bottom Layer And Via (5727.6mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4125mil) from Top Layer to Bottom Layer And Via (5751.6mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4149mil) from Top Layer to Bottom Layer And Via (5727.6mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4149mil) from Top Layer to Bottom Layer And Via (5751.6mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4173mil) from Top Layer to Bottom Layer And Via (5727.6mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4173mil) from Top Layer to Bottom Layer And Via (5751.6mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4197mil) from Top Layer to Bottom Layer And Via (5727.6mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4197mil) from Top Layer to Bottom Layer And Via (5751.6mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4221mil) from Top Layer to Bottom Layer And Via (5727.6mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4221mil) from Top Layer to Bottom Layer And Via (5751.6mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4245mil) from Top Layer to Bottom Layer And Via (5727.6mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4245mil) from Top Layer to Bottom Layer And Via (5751.6mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4269mil) from Top Layer to Bottom Layer And Via (5727.6mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4269mil) from Top Layer to Bottom Layer And Via (5751.6mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4293mil) from Top Layer to Bottom Layer And Via (5727.6mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4293mil) from Top Layer to Bottom Layer And Via (5751.6mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4317mil) from Top Layer to Bottom Layer And Via (5727.6mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4317mil) from Top Layer to Bottom Layer And Via (5751.6mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4341mil) from Top Layer to Bottom Layer And Via (5727.6mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4341mil) from Top Layer to Bottom Layer And Via (5751.6mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4365mil) from Top Layer to Bottom Layer And Via (5727.6mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4365mil) from Top Layer to Bottom Layer And Via (5751.6mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4389mil) from Top Layer to Bottom Layer And Via (5727.6mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4389mil) from Top Layer to Bottom Layer And Via (5751.6mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4413mil) from Top Layer to Bottom Layer And Via (5727.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4413mil) from Top Layer to Bottom Layer And Via (5751.6mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4437mil) from Top Layer to Bottom Layer And Via (5727.6mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4437mil) from Top Layer to Bottom Layer And Via (5751.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5727.6mil,4461mil) from Top Layer to Bottom Layer And Via (5751.6mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5740.8mil,3970.8mil) from Top Layer to Bottom Layer And Via (5740.8mil,3994.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5740.8mil,3970.8mil) from Top Layer to Bottom Layer And Via (5764.8mil,3970.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5740.8mil,3994.8mil) from Top Layer to Bottom Layer And Via (5740.8mil,4018.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5740.8mil,3994.8mil) from Top Layer to Bottom Layer And Via (5764.8mil,3994.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.492mil < 10mil) Between Via (5740.8mil,4018.8mil) from Top Layer to Bottom Layer And Via (5749.4mil,4048.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.492mil] / [Bottom Solder] Mask Sliver [8.492mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5740.8mil,4018.8mil) from Top Layer to Bottom Layer And Via (5764.8mil,4018.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5741.2mil,4558.6mil) from Top Layer to Bottom Layer And Via (5765.2mil,4558.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5742.4mil,4513.5mil) from Top Layer to Bottom Layer And Via (5742.4mil,4537.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5742.4mil,4513.5mil) from Top Layer to Bottom Layer And Via (5766.4mil,4513.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.349mil < 10mil) Between Via (5742.4mil,4537.5mil) from Top Layer to Bottom Layer And Via (5765.2mil,4558.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.349mil] / [Bottom Solder] Mask Sliver [8.349mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5742.4mil,4537.5mil) from Top Layer to Bottom Layer And Via (5766.4mil,4537.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.569mil < 10mil) Between Via (5749.4mil,4048.8mil) from Top Layer to Bottom Layer And Via (5751.6mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.569mil] / [Bottom Solder] Mask Sliver [5.569mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5749.4mil,4048.8mil) from Top Layer to Bottom Layer And Via (5773.4mil,4048.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4077mil) from Top Layer to Bottom Layer And Via (5751.6mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4077mil) from Top Layer to Bottom Layer And Via (5775.6mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4101mil) from Top Layer to Bottom Layer And Via (5751.6mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4101mil) from Top Layer to Bottom Layer And Via (5775.6mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4125mil) from Top Layer to Bottom Layer And Via (5751.6mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4125mil) from Top Layer to Bottom Layer And Via (5775.6mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4149mil) from Top Layer to Bottom Layer And Via (5751.6mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4149mil) from Top Layer to Bottom Layer And Via (5775.6mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4173mil) from Top Layer to Bottom Layer And Via (5751.6mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4173mil) from Top Layer to Bottom Layer And Via (5775.6mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4197mil) from Top Layer to Bottom Layer And Via (5751.6mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4197mil) from Top Layer to Bottom Layer And Via (5775.6mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4221mil) from Top Layer to Bottom Layer And Via (5751.6mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4221mil) from Top Layer to Bottom Layer And Via (5775.6mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4245mil) from Top Layer to Bottom Layer And Via (5751.6mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4245mil) from Top Layer to Bottom Layer And Via (5775.6mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4269mil) from Top Layer to Bottom Layer And Via (5751.6mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4269mil) from Top Layer to Bottom Layer And Via (5775.6mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4293mil) from Top Layer to Bottom Layer And Via (5751.6mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4293mil) from Top Layer to Bottom Layer And Via (5775.6mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4317mil) from Top Layer to Bottom Layer And Via (5751.6mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4317mil) from Top Layer to Bottom Layer And Via (5775.6mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4341mil) from Top Layer to Bottom Layer And Via (5751.6mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4341mil) from Top Layer to Bottom Layer And Via (5775.6mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4365mil) from Top Layer to Bottom Layer And Via (5751.6mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4365mil) from Top Layer to Bottom Layer And Via (5775.6mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4389mil) from Top Layer to Bottom Layer And Via (5751.6mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4389mil) from Top Layer to Bottom Layer And Via (5775.6mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4413mil) from Top Layer to Bottom Layer And Via (5751.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4413mil) from Top Layer to Bottom Layer And Via (5775.6mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4437mil) from Top Layer to Bottom Layer And Via (5751.6mil,4461mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5751.6mil,4437mil) from Top Layer to Bottom Layer And Via (5775.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5764.8mil,3970.8mil) from Top Layer to Bottom Layer And Via (5764.8mil,3994.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5764.8mil,3994.8mil) from Top Layer to Bottom Layer And Via (5764.8mil,4018.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.492mil < 10mil) Between Via (5764.8mil,4018.8mil) from Top Layer to Bottom Layer And Via (5773.4mil,4048.8mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.492mil] / [Bottom Solder] Mask Sliver [8.492mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5765.2mil,4558.6mil) from Top Layer to Bottom Layer And Via (5765.2mil,4582.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5765.2mil,4558.6mil) from Top Layer to Bottom Layer And Via (5789.2mil,4558.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.293mil < 10mil) Between Via (5765.2mil,4582.6mil) from Top Layer to Bottom Layer And Via (5780.8mil,4609.4mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.293mil] / [Bottom Solder] Mask Sliver [8.293mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5765.2mil,4582.6mil) from Top Layer to Bottom Layer And Via (5789.2mil,4582.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5766.4mil,4513.5mil) from Top Layer to Bottom Layer And Via (5766.4mil,4537.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5766.4mil,4513.5mil) from Top Layer to Bottom Layer And Via (5790.4mil,4513.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.349mil < 10mil) Between Via (5766.4mil,4537.5mil) from Top Layer to Bottom Layer And Via (5789.2mil,4558.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.349mil] / [Bottom Solder] Mask Sliver [8.349mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5766.4mil,4537.5mil) from Top Layer to Bottom Layer And Via (5790.4mil,4537.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.569mil < 10mil) Between Via (5773.4mil,4048.8mil) from Top Layer to Bottom Layer And Via (5775.6mil,4077mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.569mil] / [Bottom Solder] Mask Sliver [5.569mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5775.6mil,4077mil) from Top Layer to Bottom Layer And Via (5775.6mil,4101mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5775.6mil,4101mil) from Top Layer to Bottom Layer And Via (5775.6mil,4125mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5775.6mil,4125mil) from Top Layer to Bottom Layer And Via (5775.6mil,4149mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5775.6mil,4149mil) from Top Layer to Bottom Layer And Via (5775.6mil,4173mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5775.6mil,4173mil) from Top Layer to Bottom Layer And Via (5775.6mil,4197mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5775.6mil,4197mil) from Top Layer to Bottom Layer And Via (5775.6mil,4221mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5775.6mil,4221mil) from Top Layer to Bottom Layer And Via (5775.6mil,4245mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5775.6mil,4245mil) from Top Layer to Bottom Layer And Via (5775.6mil,4269mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5775.6mil,4269mil) from Top Layer to Bottom Layer And Via (5775.6mil,4293mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5775.6mil,4293mil) from Top Layer to Bottom Layer And Via (5775.6mil,4317mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5775.6mil,4317mil) from Top Layer to Bottom Layer And Via (5775.6mil,4341mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5775.6mil,4341mil) from Top Layer to Bottom Layer And Via (5775.6mil,4365mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5775.6mil,4365mil) from Top Layer to Bottom Layer And Via (5775.6mil,4389mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5775.6mil,4389mil) from Top Layer to Bottom Layer And Via (5775.6mil,4413mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5775.6mil,4413mil) from Top Layer to Bottom Layer And Via (5775.6mil,4437mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (5.369mil < 10mil) Between Via (5780.8mil,4609.4mil) from Top Layer to Bottom Layer And Via (5789.2mil,4582.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [5.369mil] / [Bottom Solder] Mask Sliver [5.369mil]
Minimum Solder Mask Sliver Constraint: (6.417mil < 10mil) Between Via (5780.8mil,4609.4mil) from Top Layer to Bottom Layer And Via (5809.9mil,4608mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [6.417mil] / [Bottom Solder] Mask Sliver [6.417mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5789.2mil,4558.6mil) from Top Layer to Bottom Layer And Via (5789.2mil,4582.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5789.2mil,4558.6mil) from Top Layer to Bottom Layer And Via (5813.2mil,4558.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5789.2mil,4582.6mil) from Top Layer to Bottom Layer And Via (5813.2mil,4582.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5790.4mil,4513.5mil) from Top Layer to Bottom Layer And Via (5790.4mil,4537.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5790.4mil,4513.5mil) from Top Layer to Bottom Layer And Via (5814.4mil,4513.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.349mil < 10mil) Between Via (5790.4mil,4537.5mil) from Top Layer to Bottom Layer And Via (5813.2mil,4558.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.349mil] / [Bottom Solder] Mask Sliver [8.349mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5790.4mil,4537.5mil) from Top Layer to Bottom Layer And Via (5814.4mil,4537.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.19mil < 10mil) Between Via (5800.28mil,4767.58mil) from Top Layer to Bottom Layer And Via (5823.047mil,4765.051mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.19mil] / [Bottom Solder] Mask Sliver [0.19mil]
Minimum Solder Mask Sliver Constraint: (2.897mil < 10mil) Between Via (5809.9mil,4608mil) from Top Layer to Bottom Layer And Via (5813.2mil,4582.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.897mil] / [Bottom Solder] Mask Sliver [2.897mil]
Minimum Solder Mask Sliver Constraint: (2.284mil < 10mil) Between Via (5809.9mil,4608mil) from Top Layer to Bottom Layer And Via (5834.9mil,4608.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [2.284mil] / [Bottom Solder] Mask Sliver [2.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5813.2mil,4558.6mil) from Top Layer to Bottom Layer And Via (5813.2mil,4582.6mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (8.471mil < 10mil) Between Via (5813.2mil,4582.6mil) from Top Layer to Bottom Layer And Via (5834.9mil,4560.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [8.471mil] / [Bottom Solder] Mask Sliver [8.471mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5814.4mil,4513.5mil) from Top Layer to Bottom Layer And Via (5814.4mil,4537.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5814.4mil,4513.5mil) from Top Layer to Bottom Layer And Via (5838.4mil,4513.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.87mil < 10mil) Between Via (5814.4mil,4537.5mil) from Top Layer to Bottom Layer And Via (5834.9mil,4560.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.87mil] / [Bottom Solder] Mask Sliver [7.87mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5814.4mil,4537.5mil) from Top Layer to Bottom Layer And Via (5838.4mil,4537.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5833.5mil,4132.3mil) from Top Layer to Bottom Layer And Via (5833.5mil,4156.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5833.5mil,4132.3mil) from Top Layer to Bottom Layer And Via (5857.5mil,4132.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5833.5mil,4156.3mil) from Top Layer to Bottom Layer And Via (5833.5mil,4180.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5833.5mil,4156.3mil) from Top Layer to Bottom Layer And Via (5857.5mil,4156.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5833.5mil,4180.3mil) from Top Layer to Bottom Layer And Via (5833.5mil,4204.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5833.5mil,4180.3mil) from Top Layer to Bottom Layer And Via (5857.5mil,4180.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5833.5mil,4204.3mil) from Top Layer to Bottom Layer And Via (5833.5mil,4228.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5833.5mil,4204.3mil) from Top Layer to Bottom Layer And Via (5857.5mil,4204.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5833.5mil,4228.3mil) from Top Layer to Bottom Layer And Via (5833.5mil,4252.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5833.5mil,4228.3mil) from Top Layer to Bottom Layer And Via (5857.5mil,4228.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5833.5mil,4252.3mil) from Top Layer to Bottom Layer And Via (5857.5mil,4252.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5834.9mil,4560.2mil) from Top Layer to Bottom Layer And Via (5834.9mil,4584.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (0.252mil < 10mil) Between Via (5834.9mil,4560.2mil) from Top Layer to Bottom Layer And Via (5838.4mil,4537.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [0.252mil] / [Bottom Solder] Mask Sliver [0.252mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5834.9mil,4560.2mil) from Top Layer to Bottom Layer And Via (5858.9mil,4560.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5834.9mil,4584.2mil) from Top Layer to Bottom Layer And Via (5834.9mil,4608.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5834.9mil,4584.2mil) from Top Layer to Bottom Layer And Via (5858.9mil,4584.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5834.9mil,4608.2mil) from Top Layer to Bottom Layer And Via (5858.9mil,4608.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5835.6mil,4353mil) from Top Layer to Bottom Layer And Via (5835.6mil,4377mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5835.6mil,4353mil) from Top Layer to Bottom Layer And Via (5859.6mil,4353mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5835.6mil,4377mil) from Top Layer to Bottom Layer And Via (5835.6mil,4401mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5835.6mil,4377mil) from Top Layer to Bottom Layer And Via (5859.6mil,4377mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5835.6mil,4401mil) from Top Layer to Bottom Layer And Via (5835.6mil,4425mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5835.6mil,4401mil) from Top Layer to Bottom Layer And Via (5859.6mil,4401mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5835.6mil,4425mil) from Top Layer to Bottom Layer And Via (5835.6mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5835.6mil,4425mil) from Top Layer to Bottom Layer And Via (5859.6mil,4425mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5835.6mil,4449mil) from Top Layer to Bottom Layer And Via (5835.6mil,4473mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5835.6mil,4449mil) from Top Layer to Bottom Layer And Via (5859.6mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5835.6mil,4473mil) from Top Layer to Bottom Layer And Via (5859.6mil,4473mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5838.4mil,4513.5mil) from Top Layer to Bottom Layer And Via (5838.4mil,4537.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5838.4mil,4513.5mil) from Top Layer to Bottom Layer And Via (5862.4mil,4513.5mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (7.87mil < 10mil) Between Via (5838.4mil,4537.5mil) from Top Layer to Bottom Layer And Via (5858.9mil,4560.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [7.87mil] / [Bottom Solder] Mask Sliver [7.87mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5857.5mil,4132.3mil) from Top Layer to Bottom Layer And Via (5857.5mil,4156.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5857.5mil,4132.3mil) from Top Layer to Bottom Layer And Via (5881.5mil,4132.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5857.5mil,4156.3mil) from Top Layer to Bottom Layer And Via (5857.5mil,4180.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5857.5mil,4156.3mil) from Top Layer to Bottom Layer And Via (5881.5mil,4156.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5857.5mil,4180.3mil) from Top Layer to Bottom Layer And Via (5857.5mil,4204.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5857.5mil,4180.3mil) from Top Layer to Bottom Layer And Via (5881.5mil,4180.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5857.5mil,4204.3mil) from Top Layer to Bottom Layer And Via (5857.5mil,4228.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5857.5mil,4204.3mil) from Top Layer to Bottom Layer And Via (5881.5mil,4204.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5857.5mil,4228.3mil) from Top Layer to Bottom Layer And Via (5857.5mil,4252.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5857.5mil,4228.3mil) from Top Layer to Bottom Layer And Via (5881.5mil,4228.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5857.5mil,4252.3mil) from Top Layer to Bottom Layer And Via (5881.5mil,4252.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5858.9mil,4560.2mil) from Top Layer to Bottom Layer And Via (5858.9mil,4584.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5858.9mil,4560.2mil) from Top Layer to Bottom Layer And Via (5882.9mil,4560.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5858.9mil,4584.2mil) from Top Layer to Bottom Layer And Via (5858.9mil,4608.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5858.9mil,4584.2mil) from Top Layer to Bottom Layer And Via (5882.9mil,4584.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5858.9mil,4608.2mil) from Top Layer to Bottom Layer And Via (5882.9mil,4608.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5859.6mil,4353mil) from Top Layer to Bottom Layer And Via (5859.6mil,4377mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5859.6mil,4353mil) from Top Layer to Bottom Layer And Via (5883.6mil,4353mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5859.6mil,4377mil) from Top Layer to Bottom Layer And Via (5859.6mil,4401mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5859.6mil,4377mil) from Top Layer to Bottom Layer And Via (5883.6mil,4377mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5859.6mil,4401mil) from Top Layer to Bottom Layer And Via (5859.6mil,4425mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5859.6mil,4401mil) from Top Layer to Bottom Layer And Via (5883.6mil,4401mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5859.6mil,4425mil) from Top Layer to Bottom Layer And Via (5859.6mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5859.6mil,4425mil) from Top Layer to Bottom Layer And Via (5883.6mil,4425mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5859.6mil,4449mil) from Top Layer to Bottom Layer And Via (5859.6mil,4473mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5859.6mil,4449mil) from Top Layer to Bottom Layer And Via (5883.6mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5859.6mil,4473mil) from Top Layer to Bottom Layer And Via (5883.6mil,4473mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.452mil < 10mil) Between Via (5862.4mil,4513.5mil) from Top Layer to Bottom Layer And Via (5882.9mil,4500.7mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.452mil] / [Bottom Solder] Mask Sliver [1.452mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5881.5mil,4132.3mil) from Top Layer to Bottom Layer And Via (5881.5mil,4156.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5881.5mil,4156.3mil) from Top Layer to Bottom Layer And Via (5881.5mil,4180.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5881.5mil,4180.3mil) from Top Layer to Bottom Layer And Via (5881.5mil,4204.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5881.5mil,4204.3mil) from Top Layer to Bottom Layer And Via (5881.5mil,4228.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5881.5mil,4228.3mil) from Top Layer to Bottom Layer And Via (5881.5mil,4252.3mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (4.992mil < 10mil) Between Via (5882.9mil,4500.7mil) from Top Layer to Bottom Layer And Via (5883.6mil,4473mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [4.992mil] / [Bottom Solder] Mask Sliver [4.992mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5882.9mil,4560.2mil) from Top Layer to Bottom Layer And Via (5882.9mil,4584.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5882.9mil,4584.2mil) from Top Layer to Bottom Layer And Via (5882.9mil,4608.2mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5883.6mil,4353mil) from Top Layer to Bottom Layer And Via (5883.6mil,4377mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5883.6mil,4377mil) from Top Layer to Bottom Layer And Via (5883.6mil,4401mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5883.6mil,4401mil) from Top Layer to Bottom Layer And Via (5883.6mil,4425mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5883.6mil,4425mil) from Top Layer to Bottom Layer And Via (5883.6mil,4449mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]
Minimum Solder Mask Sliver Constraint: (1.284mil < 10mil) Between Via (5883.6mil,4449mil) from Top Layer to Bottom Layer And Via (5883.6mil,4473mil) from Top Layer to Bottom Layer [Top Solder] Mask Sliver [1.284mil] / [Bottom Solder] Mask Sliver [1.284mil]

Silk To Solder Mask (Clearance=10mil) (IsPad),(All)
Silk To Solder Mask Clearance Constraint: (2.856mil < 10mil) Between Arc (4071.2mil,5649.2mil) on Top Overlay And Pad C45-1(4091.7mil,5648.516mil) on Top Layer [Top Overlay] to [Top Solder] clearance [2.856mil]
Silk To Solder Mask Clearance Constraint: (6.709mil < 10mil) Between Arc (4071.2mil,5649.2mil) on Top Overlay And Pad U10-1(4038.743mil,5627.2mil) on Top Layer [Top Overlay] to [Top Solder] clearance [6.709mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Arc (5094.107mil,5398.906mil) on Top Overlay And Pad R40-2(5109.049mil,5386.003mil) on Top Layer [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (7.428mil < 10mil) Between Arc (5231.2mil,5088.4mil) on Top Overlay And Pad C22-1(5204.2mil,5112.117mil) on Top Layer [Top Overlay] to [Top Solder] clearance [7.428mil]
Silk To Solder Mask Clearance Constraint: (1.66mil < 10mil) Between Arc (5231.2mil,5088.4mil) on Top Overlay And Pad C22-2(5204.197mil,5076.687mil) on Top Layer [Top Overlay] to [Top Solder] clearance [1.66mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Arc (5231.2mil,5088.4mil) on Top Overlay And Pad R21-1(5237.503mil,5076.149mil) on Top Layer [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.577mil < 10mil) Between Arc (5231.2mil,5088.4mil) on Top Overlay And Pad R21-2(5237.503mil,5109.613mil) on Top Layer [Top Overlay] to [Top Solder] clearance [4.577mil]
Silk To Solder Mask Clearance Constraint: (9.236mil < 10mil) Between Arc (5444.4mil,5088.8mil) on Top Overlay And Pad IC3-4(5426.2mil,5085.053mil) on Top Layer [Top Overlay] to [Top Solder] clearance [9.236mil]
Silk To Solder Mask Clearance Constraint: (6.323mil < 10mil) Between Arc (5684.4mil,5088.8mil) on Bottom Overlay And Pad JP4-4(5728.913mil,5122.591mil) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [6.323mil]
Silk To Solder Mask Clearance Constraint: (7.795mil < 10mil) Between Pad 2-1(4662.7mil,4777.442mil) on Bottom Layer And Track (4583.96mil,4822.717mil)(4741.44mil,4822.717mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.795mil]
Silk To Solder Mask Clearance Constraint: (9.559mil < 10mil) Between Pad 2-2(4662.7mil,4543.19mil) on Bottom Layer And Text "Q12" (4680mil,4501mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.559mil]
Silk To Solder Mask Clearance Constraint: (9.764mil < 10mil) Between Pad 2-2(4662.7mil,4543.19mil) on Bottom Layer And Track (4583.96mil,4495.946mil)(4741.44mil,4495.946mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.764mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C10-1(4745mil,5739.316mil) on Bottom Layer And Track (4727.287mil,5731.6mil)(4727.287mil,5755.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C10-1(4745mil,5739.316mil) on Bottom Layer And Track (4727.287mil,5755.061mil)(4762.713mil,5755.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.854mil < 10mil) Between Pad C10-1(4745mil,5739.316mil) on Bottom Layer And Track (4728.339mil,5756.887mil)(4728.339mil,5792.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.854mil]
Silk To Solder Mask Clearance Constraint: (6.696mil < 10mil) Between Pad C10-1(4745mil,5739.316mil) on Bottom Layer And Track (4728.339mil,5756.887mil)(4751.8mil,5756.887mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.696mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C10-1(4745mil,5739.316mil) on Bottom Layer And Track (4739mil,5721.6mil)(4751mil,5721.6mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C10-1(4745mil,5739.316mil) on Bottom Layer And Track (4762.713mil,5731.6mil)(4762.713mil,5755.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C10-1(4745mil,5739.316mil) on Bottom Layer And Track (4762.713mil,5755.061mil)(4762.72mil,5755.055mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (5.244mil < 10mil) Between Pad C10-1(4745mil,5739.316mil) on Bottom Layer And Track (4763.087mil,5732.2mil)(4763.087mil,5755.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.244mil]
Silk To Solder Mask Clearance Constraint: (8.82mil < 10mil) Between Pad C10-1(4745mil,5739.316mil) on Bottom Layer And Track (4763.087mil,5755.661mil)(4798.513mil,5755.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.82mil]
Silk To Solder Mask Clearance Constraint: (4.876mil < 10mil) Between Pad C10-2(4745.003mil,5703.887mil) on Bottom Layer And Track (4727.287mil,5688.139mil)(4727.287mil,5711.6mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.876mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C10-2(4745.003mil,5703.887mil) on Bottom Layer And Track (4727.287mil,5688.139mil)(4762.72mil,5688.139mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C10-2(4745.003mil,5703.887mil) on Bottom Layer And Track (4739mil,5721.6mil)(4751mil,5721.6mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C10-2(4745.003mil,5703.887mil) on Bottom Layer And Track (4762.713mil,5688.139mil)(4762.713mil,5711.6mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (5.241mil < 10mil) Between Pad C10-2(4745.003mil,5703.887mil) on Bottom Layer And Track (4763.087mil,5688.739mil)(4763.087mil,5712.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.241mil]
Silk To Solder Mask Clearance Constraint: (7.992mil < 10mil) Between Pad C10-2(4745.003mil,5703.887mil) on Bottom Layer And Track (4763.087mil,5688.739mil)(4798.52mil,5688.739mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.992mil]
Silk To Solder Mask Clearance Constraint: (5.284mil < 10mil) Between Pad C1-1(4578.783mil,5380.2mil) on Bottom Layer And Track (4545.052mil,5362.427mil)(4568.513mil,5362.427mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.284mil]
Silk To Solder Mask Clearance Constraint: (5.171mil < 10mil) Between Pad C1-1(4578.783mil,5380.2mil) on Bottom Layer And Track (4545.052mil,5397.854mil)(4568.513mil,5397.854mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.171mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C1-1(4578.783mil,5380.2mil) on Bottom Layer And Track (4563.039mil,5362.487mil)(4563.039mil,5397.913mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C1-1(4578.783mil,5380.2mil) on Bottom Layer And Track (4563.039mil,5362.487mil)(4586.5mil,5362.487mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C1-1(4578.783mil,5380.2mil) on Bottom Layer And Track (4563.039mil,5397.913mil)(4563.045mil,5397.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C1-1(4578.783mil,5380.2mil) on Bottom Layer And Track (4563.039mil,5397.913mil)(4586.5mil,5397.913mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (5.284mil < 10mil) Between Pad C1-1(4578.783mil,5380.2mil) on Bottom Layer And Track (4568.507mil,5362.421mil)(4568.513mil,5362.427mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.284mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C1-1(4578.783mil,5380.2mil) on Bottom Layer And Track (4568.513mil,5362.427mil)(4568.513mil,5397.854mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C1-1(4578.783mil,5380.2mil) on Bottom Layer And Track (4596.5mil,5374.2mil)(4596.5mil,5386.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (4.617mil < 10mil) Between Pad C11-1(5563.2mil,5821.583mil) on Bottom Layer And Text "C13" (5578mil,5819mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.617mil]
Silk To Solder Mask Clearance Constraint: (9.973mil < 10mil) Between Pad C11-1(5563.2mil,5821.583mil) on Bottom Layer And Track (5507.187mil,5806.439mil)(5542.613mil,5806.439mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.973mil]
Silk To Solder Mask Clearance Constraint: (7.744mil < 10mil) Between Pad C11-1(5563.2mil,5821.583mil) on Bottom Layer And Track (5542.613mil,5806.439mil)(5542.613mil,5829.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.744mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C11-1(5563.2mil,5821.583mil) on Bottom Layer And Track (5545.487mil,5805.839mil)(5545.487mil,5829.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C11-1(5563.2mil,5821.583mil) on Bottom Layer And Track (5545.487mil,5805.839mil)(5580.913mil,5805.839mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C11-1(5563.2mil,5821.583mil) on Bottom Layer And Track (5545.48mil,5805.845mil)(5545.487mil,5805.839mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C11-1(5563.2mil,5821.583mil) on Bottom Layer And Track (5557.2mil,5839.3mil)(5569.2mil,5839.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C11-1(5563.2mil,5821.583mil) on Bottom Layer And Track (5580.913mil,5805.839mil)(5580.913mil,5829.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (7.741mil < 10mil) Between Pad C11-2(5563.197mil,5857.013mil) on Bottom Layer And Track (5542.613mil,5849.9mil)(5542.613mil,5873.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.741mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C11-2(5563.197mil,5857.013mil) on Bottom Layer And Track (5545.487mil,5849.3mil)(5545.487mil,5872.761mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C11-2(5563.197mil,5857.013mil) on Bottom Layer And Track (5545.48mil,5872.761mil)(5580.913mil,5872.761mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C11-2(5563.197mil,5857.013mil) on Bottom Layer And Track (5557.2mil,5839.3mil)(5569.2mil,5839.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C11-2(5563.197mil,5857.013mil) on Bottom Layer And Track (5580.913mil,5849.3mil)(5580.913mil,5872.761mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.621mil < 10mil) Between Pad C1-2(4614.213mil,5380.203mil) on Bottom Layer And Text "C56" (4613mil,5368mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.621mil]
Silk To Solder Mask Clearance Constraint: (7.564mil < 10mil) Between Pad C1-2(4614.213mil,5380.203mil) on Bottom Layer And Track (4596.5mil,5374.2mil)(4596.5mil,5386.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.564mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C1-2(4614.213mil,5380.203mil) on Bottom Layer And Track (4606.5mil,5362.487mil)(4629.961mil,5362.487mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C1-2(4614.213mil,5380.203mil) on Bottom Layer And Track (4606.5mil,5397.913mil)(4629.961mil,5397.913mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C1-2(4614.213mil,5380.203mil) on Bottom Layer And Track (4629.961mil,5362.487mil)(4629.961mil,5397.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C12-1(5524.9mil,5822.184mil) on Bottom Layer And Track (5507.187mil,5806.439mil)(5507.187mil,5829.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C12-1(5524.9mil,5822.184mil) on Bottom Layer And Track (5507.187mil,5806.439mil)(5542.613mil,5806.439mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C12-1(5524.9mil,5822.184mil) on Bottom Layer And Track (5507.18mil,5806.445mil)(5507.187mil,5806.439mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C12-1(5524.9mil,5822.184mil) on Bottom Layer And Track (5518.9mil,5839.9mil)(5530.9mil,5839.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C12-1(5524.9mil,5822.184mil) on Bottom Layer And Track (5542.613mil,5806.439mil)(5542.613mil,5829.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (7.744mil < 10mil) Between Pad C12-1(5524.9mil,5822.184mil) on Bottom Layer And Track (5545.487mil,5805.839mil)(5545.487mil,5829.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.744mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C12-2(5524.897mil,5857.613mil) on Bottom Layer And Track (5507.187mil,5849.9mil)(5507.187mil,5873.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C12-2(5524.897mil,5857.613mil) on Bottom Layer And Track (5507.18mil,5873.361mil)(5542.613mil,5873.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C12-2(5524.897mil,5857.613mil) on Bottom Layer And Track (5518.9mil,5839.9mil)(5530.9mil,5839.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C12-2(5524.897mil,5857.613mil) on Bottom Layer And Track (5542.613mil,5849.9mil)(5542.613mil,5873.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.747mil < 10mil) Between Pad C12-2(5524.897mil,5857.613mil) on Bottom Layer And Track (5545.487mil,5849.3mil)(5545.487mil,5872.761mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.747mil]
Silk To Solder Mask Clearance Constraint: (9.972mil < 10mil) Between Pad C12-2(5524.897mil,5857.613mil) on Bottom Layer And Track (5545.48mil,5872.761mil)(5580.913mil,5872.761mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.972mil]
Silk To Solder Mask Clearance Constraint: (9.72mil < 10mil) Between Pad C13-1(5559.217mil,5778.4mil) on Bottom Layer And Text "R9" (5577mil,5783mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.72mil]
Silk To Solder Mask Clearance Constraint: (5.538mil < 10mil) Between Pad C13-1(5559.217mil,5778.4mil) on Bottom Layer And Track (5508.601mil,5760.02mil)(5573.561mil,5760.02mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.538mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C13-1(5559.217mil,5778.4mil) on Bottom Layer And Track (5541.5mil,5772.4mil)(5541.5mil,5784.4mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C13-1(5559.217mil,5778.4mil) on Bottom Layer And Track (5551.5mil,5760.687mil)(5574.961mil,5760.687mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C13-1(5559.217mil,5778.4mil) on Bottom Layer And Track (5551.5mil,5796.113mil)(5574.961mil,5796.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (7.713mil < 10mil) Between Pad C13-1(5559.217mil,5778.4mil) on Bottom Layer And Track (5573.561mil,5724.587mil)(5573.561mil,5760.02mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.713mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C13-1(5559.217mil,5778.4mil) on Bottom Layer And Track (5574.955mil,5760.68mil)(5574.961mil,5760.687mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C13-1(5559.217mil,5778.4mil) on Bottom Layer And Track (5574.961mil,5760.687mil)(5574.961mil,5796.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.869mil < 10mil) Between Pad C13-2(5523.787mil,5778.397mil) on Bottom Layer And Track (5508.039mil,5760.687mil)(5531.5mil,5760.687mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.869mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C13-2(5523.787mil,5778.397mil) on Bottom Layer And Track (5508.039mil,5760.68mil)(5508.039mil,5796.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C13-2(5523.787mil,5778.397mil) on Bottom Layer And Track (5508.039mil,5796.113mil)(5531.5mil,5796.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.239mil < 10mil) Between Pad C13-2(5523.787mil,5778.397mil) on Bottom Layer And Track (5508.601mil,5724.587mil)(5508.601mil,5760.02mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.239mil]
Silk To Solder Mask Clearance Constraint: (5.535mil < 10mil) Between Pad C13-2(5523.787mil,5778.397mil) on Bottom Layer And Track (5508.601mil,5760.02mil)(5573.561mil,5760.02mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.535mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C13-2(5523.787mil,5778.397mil) on Bottom Layer And Track (5541.5mil,5772.4mil)(5541.5mil,5784.4mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (7.992mil < 10mil) Between Pad C14-1(4780.8mil,5739.917mil) on Bottom Layer And Track (4727.287mil,5755.061mil)(4762.713mil,5755.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.992mil]
Silk To Solder Mask Clearance Constraint: (5.244mil < 10mil) Between Pad C14-1(4780.8mil,5739.917mil) on Bottom Layer And Track (4762.713mil,5731.6mil)(4762.713mil,5755.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.244mil]
Silk To Solder Mask Clearance Constraint: (7.983mil < 10mil) Between Pad C14-1(4780.8mil,5739.917mil) on Bottom Layer And Track (4762.713mil,5755.061mil)(4762.72mil,5755.055mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.983mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C14-1(4780.8mil,5739.917mil) on Bottom Layer And Track (4763.087mil,5732.2mil)(4763.087mil,5755.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C14-1(4780.8mil,5739.917mil) on Bottom Layer And Track (4763.087mil,5755.661mil)(4798.513mil,5755.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.096mil < 10mil) Between Pad C14-1(4780.8mil,5739.917mil) on Bottom Layer And Track (4771.8mil,5756.887mil)(4795.261mil,5756.887mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.096mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C14-1(4780.8mil,5739.917mil) on Bottom Layer And Track (4774.8mil,5722.2mil)(4786.8mil,5722.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (7.202mil < 10mil) Between Pad C14-1(4780.8mil,5739.917mil) on Bottom Layer And Track (4795.261mil,5756.887mil)(4795.261mil,5792.32mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.202mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C14-1(4780.8mil,5739.917mil) on Bottom Layer And Track (4798.513mil,5732.2mil)(4798.513mil,5755.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C14-1(4780.8mil,5739.917mil) on Bottom Layer And Track (4798.513mil,5755.661mil)(4798.52mil,5755.655mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (8.82mil < 10mil) Between Pad C14-2(4780.803mil,5704.487mil) on Bottom Layer And Track (4727.287mil,5688.139mil)(4762.72mil,5688.139mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.82mil]
Silk To Solder Mask Clearance Constraint: (5.282mil < 10mil) Between Pad C14-2(4780.803mil,5704.487mil) on Bottom Layer And Track (4762.713mil,5688.139mil)(4762.713mil,5711.6mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.282mil]
Silk To Solder Mask Clearance Constraint: (4.876mil < 10mil) Between Pad C14-2(4780.803mil,5704.487mil) on Bottom Layer And Track (4763.087mil,5688.739mil)(4763.087mil,5712.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.876mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C14-2(4780.803mil,5704.487mil) on Bottom Layer And Track (4763.087mil,5688.739mil)(4798.52mil,5688.739mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C14-2(4780.803mil,5704.487mil) on Bottom Layer And Track (4774.8mil,5722.2mil)(4786.8mil,5722.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C14-2(4780.803mil,5704.487mil) on Bottom Layer And Track (4798.513mil,5688.739mil)(4798.513mil,5712.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (9.906mil < 10mil) Between Pad C14-2(4780.803mil,5704.487mil) on Bottom Layer And Track (4803.552mil,5683.684mil)(4803.552mil,5719.117mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.906mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C15-1(5235.7mil,5010.117mil) on Bottom Layer And Track (5217.987mil,5002.4mil)(5217.987mil,5025.861mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C15-1(5235.7mil,5010.117mil) on Bottom Layer And Track (5217.987mil,5025.861mil)(5253.413mil,5025.861mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C15-1(5235.7mil,5010.117mil) on Bottom Layer And Track (5229.7mil,4992.4mil)(5241.7mil,4992.4mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C15-1(5235.7mil,5010.117mil) on Bottom Layer And Track (5253.413mil,5002.4mil)(5253.413mil,5025.861mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C15-1(5235.7mil,5010.117mil) on Bottom Layer And Track (5253.413mil,5025.861mil)(5253.42mil,5025.855mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.876mil < 10mil) Between Pad C15-2(5235.703mil,4974.687mil) on Bottom Layer And Track (5217.987mil,4958.939mil)(5217.987mil,4982.4mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.876mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C15-2(5235.703mil,4974.687mil) on Bottom Layer And Track (5217.987mil,4958.939mil)(5253.42mil,4958.939mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C15-2(5235.703mil,4974.687mil) on Bottom Layer And Track (5229.7mil,4992.4mil)(5241.7mil,4992.4mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C15-2(5235.703mil,4974.687mil) on Bottom Layer And Track (5253.413mil,4958.939mil)(5253.413mil,4982.4mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.258mil < 10mil) Between Pad C16-1(5511.316mil,5560.4mil) on Bottom Layer And Track (5473.4mil,5542.8mil)(5533.4mil,5542.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.258mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C16-1(5511.316mil,5560.4mil) on Bottom Layer And Track (5493.6mil,5554.4mil)(5493.6mil,5566.4mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C16-1(5511.316mil,5560.4mil) on Bottom Layer And Track (5503.6mil,5542.687mil)(5527.061mil,5542.687mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C16-1(5511.316mil,5560.4mil) on Bottom Layer And Track (5503.6mil,5578.113mil)(5527.061mil,5578.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.038mil < 10mil) Between Pad C16-1(5511.316mil,5560.4mil) on Bottom Layer And Track (5512.639mil,5581.28mil)(5512.639mil,5616.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.038mil]
Silk To Solder Mask Clearance Constraint: (8.038mil < 10mil) Between Pad C16-1(5511.316mil,5560.4mil) on Bottom Layer And Track (5512.639mil,5581.28mil)(5577.599mil,5581.28mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.038mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C16-1(5511.316mil,5560.4mil) on Bottom Layer And Track (5527.055mil,5542.68mil)(5527.061mil,5542.687mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C16-1(5511.316mil,5560.4mil) on Bottom Layer And Track (5527.061mil,5542.687mil)(5527.061mil,5578.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.869mil < 10mil) Between Pad C16-2(5475.887mil,5560.397mil) on Bottom Layer And Track (5460.139mil,5542.687mil)(5483.6mil,5542.687mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.869mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C16-2(5475.887mil,5560.397mil) on Bottom Layer And Track (5460.139mil,5542.68mil)(5460.139mil,5578.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C16-2(5475.887mil,5560.397mil) on Bottom Layer And Track (5460.139mil,5578.113mil)(5483.6mil,5578.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.434mil < 10mil) Between Pad C16-2(5475.887mil,5560.397mil) on Bottom Layer And Track (5473.4mil,5490.8mil)(5473.4mil,5542.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.434mil]
Silk To Solder Mask Clearance Constraint: (4.254mil < 10mil) Between Pad C16-2(5475.887mil,5560.397mil) on Bottom Layer And Track (5473.4mil,5542.8mil)(5533.4mil,5542.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.254mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C16-2(5475.887mil,5560.397mil) on Bottom Layer And Track (5493.6mil,5554.4mil)(5493.6mil,5566.4mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C17-1(5412.5mil,5285.083mil) on Bottom Layer And Track (5394.787mil,5269.339mil)(5394.787mil,5292.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C17-1(5412.5mil,5285.083mil) on Bottom Layer And Track (5394.787mil,5269.339mil)(5430.213mil,5269.339mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C17-1(5412.5mil,5285.083mil) on Bottom Layer And Track (5394.78mil,5269.345mil)(5394.787mil,5269.339mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C17-1(5412.5mil,5285.083mil) on Bottom Layer And Track (5406.5mil,5302.8mil)(5418.5mil,5302.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C17-1(5412.5mil,5285.083mil) on Bottom Layer And Track (5430.213mil,5269.339mil)(5430.213mil,5292.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C17-2(5412.497mil,5320.513mil) on Bottom Layer And Track (5394.787mil,5312.8mil)(5394.787mil,5336.261mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C17-2(5412.497mil,5320.513mil) on Bottom Layer And Track (5394.78mil,5336.261mil)(5430.213mil,5336.261mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C17-2(5412.497mil,5320.513mil) on Bottom Layer And Track (5406.5mil,5302.8mil)(5418.5mil,5302.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C17-2(5412.497mil,5320.513mil) on Bottom Layer And Track (5430.213mil,5312.8mil)(5430.213mil,5336.261mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C18-1(5475.717mil,5755.3mil) on Bottom Layer And Track (5458mil,5749.3mil)(5458mil,5761.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C18-1(5475.717mil,5755.3mil) on Bottom Layer And Track (5468mil,5737.587mil)(5491.461mil,5737.587mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C18-1(5475.717mil,5755.3mil) on Bottom Layer And Track (5468mil,5773.013mil)(5491.461mil,5773.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C18-1(5475.717mil,5755.3mil) on Bottom Layer And Track (5491.455mil,5737.58mil)(5491.461mil,5737.587mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C18-1(5475.717mil,5755.3mil) on Bottom Layer And Track (5491.461mil,5737.587mil)(5491.461mil,5773.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.151mil < 10mil) Between Pad C18-2(5440.287mil,5755.297mil) on Bottom Layer And Track (5421.261mil,5737.787mil)(5421.261mil,5773.213mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.151mil]
Silk To Solder Mask Clearance Constraint: (4.869mil < 10mil) Between Pad C18-2(5440.287mil,5755.297mil) on Bottom Layer And Track (5424.539mil,5737.587mil)(5448mil,5737.587mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.869mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C18-2(5440.287mil,5755.297mil) on Bottom Layer And Track (5424.539mil,5737.58mil)(5424.539mil,5773.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C18-2(5440.287mil,5755.297mil) on Bottom Layer And Track (5424.539mil,5773.013mil)(5448mil,5773.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C18-2(5440.287mil,5755.297mil) on Bottom Layer And Track (5458mil,5749.3mil)(5458mil,5761.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C20-1(4580.7mil,5645.883mil) on Top Layer And Track (4562.987mil,5630.139mil)(4562.987mil,5653.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C20-1(4580.7mil,5645.883mil) on Top Layer And Track (4562.987mil,5630.139mil)(4598.413mil,5630.139mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C20-1(4580.7mil,5645.883mil) on Top Layer And Track (4574.7mil,5663.6mil)(4586.7mil,5663.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (0.844mil < 10mil) Between Pad C20-1(4580.7mil,5645.883mil) on Top Layer And Track (4594.387mil,5631.139mil)(4594.387mil,5654.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.844mil]
Silk To Solder Mask Clearance Constraint: (4.873mil < 10mil) Between Pad C20-1(4580.7mil,5645.883mil) on Top Layer And Track (4594.387mil,5631.139mil)(4629.813mil,5631.139mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.873mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C20-1(4580.7mil,5645.883mil) on Top Layer And Track (4598.413mil,5630.139mil)(4598.413mil,5653.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C20-1(4580.7mil,5645.883mil) on Top Layer And Track (4598.413mil,5630.139mil)(4598.42mil,5630.145mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C20-2(4580.703mil,5681.313mil) on Top Layer And Track (4562.987mil,5673.6mil)(4562.987mil,5697.061mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C20-2(4580.703mil,5681.313mil) on Top Layer And Track (4562.987mil,5697.061mil)(4598.42mil,5697.061mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.564mil < 10mil) Between Pad C20-2(4580.703mil,5681.313mil) on Top Layer And Track (4574.7mil,5663.6mil)(4586.7mil,5663.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.564mil]
Silk To Solder Mask Clearance Constraint: (0.841mil < 10mil) Between Pad C20-2(4580.703mil,5681.313mil) on Top Layer And Track (4594.387mil,5674.6mil)(4594.387mil,5698.061mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.841mil]
Silk To Solder Mask Clearance Constraint: (6.67mil < 10mil) Between Pad C20-2(4580.703mil,5681.313mil) on Top Layer And Track (4594.387mil,5698.061mil)(4629.82mil,5698.061mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.67mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C20-2(4580.703mil,5681.313mil) on Top Layer And Track (4598.413mil,5673.6mil)(4598.413mil,5697.061mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (7.92mil < 10mil) Between Pad C2-1(5553.6mil,5478.117mil) on Bottom Layer And Track (5533.4mil,5490.8mil)(5533.4mil,5542.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.92mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C2-1(5553.6mil,5478.117mil) on Bottom Layer And Track (5535.887mil,5470.4mil)(5535.887mil,5493.861mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.351mil < 10mil) Between Pad C2-1(5553.6mil,5478.117mil) on Bottom Layer And Track (5535.887mil,5491.039mil)(5535.887mil,5514.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.351mil]
Silk To Solder Mask Clearance Constraint: (2.048mil < 10mil) Between Pad C2-1(5553.6mil,5478.117mil) on Bottom Layer And Track (5535.887mil,5491.039mil)(5571.313mil,5491.039mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.048mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C2-1(5553.6mil,5478.117mil) on Bottom Layer And Track (5535.887mil,5493.861mil)(5571.313mil,5493.861mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.351mil < 10mil) Between Pad C2-1(5553.6mil,5478.117mil) on Bottom Layer And Track (5535.88mil,5491.045mil)(5535.887mil,5491.039mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.351mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C2-1(5553.6mil,5478.117mil) on Bottom Layer And Track (5547.6mil,5460.4mil)(5559.6mil,5460.4mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C2-1(5553.6mil,5478.117mil) on Bottom Layer And Track (5571.313mil,5470.4mil)(5571.313mil,5493.861mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.351mil < 10mil) Between Pad C2-1(5553.6mil,5478.117mil) on Bottom Layer And Track (5571.313mil,5491.039mil)(5571.313mil,5514.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.351mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C2-1(5553.6mil,5478.117mil) on Bottom Layer And Track (5571.313mil,5493.861mil)(5571.32mil,5493.855mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (6.668mil < 10mil) Between Pad C21-1(4612.1mil,5646.883mil) on Top Layer And Track (4562.987mil,5630.139mil)(4598.413mil,5630.139mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.668mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C21-1(4612.1mil,5646.883mil) on Top Layer And Track (4594.387mil,5631.139mil)(4594.387mil,5654.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C21-1(4612.1mil,5646.883mil) on Top Layer And Track (4594.387mil,5631.139mil)(4629.813mil,5631.139mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (1.015mil < 10mil) Between Pad C21-1(4612.1mil,5646.883mil) on Top Layer And Track (4598.413mil,5630.139mil)(4598.413mil,5653.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [1.015mil]
Silk To Solder Mask Clearance Constraint: (6.66mil < 10mil) Between Pad C21-1(4612.1mil,5646.883mil) on Top Layer And Track (4598.413mil,5630.139mil)(4598.42mil,5630.145mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.66mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C21-1(4612.1mil,5646.883mil) on Top Layer And Track (4606.1mil,5664.6mil)(4618.1mil,5664.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C21-1(4612.1mil,5646.883mil) on Top Layer And Track (4629.813mil,5631.139mil)(4629.813mil,5654.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C21-1(4612.1mil,5646.883mil) on Top Layer And Track (4629.813mil,5631.139mil)(4629.82mil,5631.145mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C21-2(4612.103mil,5682.313mil) on Top Layer And Track (4562.987mil,5697.061mil)(4598.42mil,5697.061mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C21-2(4612.103mil,5682.313mil) on Top Layer And Track (4594.387mil,5674.6mil)(4594.387mil,5698.061mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C21-2(4612.103mil,5682.313mil) on Top Layer And Track (4594.387mil,5698.061mil)(4629.82mil,5698.061mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (0.847mil < 10mil) Between Pad C21-2(4612.103mil,5682.313mil) on Top Layer And Track (4598.413mil,5673.6mil)(4598.413mil,5697.061mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.847mil]
Silk To Solder Mask Clearance Constraint: (7.564mil < 10mil) Between Pad C21-2(4612.103mil,5682.313mil) on Top Layer And Track (4606.1mil,5664.6mil)(4618.1mil,5664.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.564mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C21-2(4612.103mil,5682.313mil) on Top Layer And Track (4629.813mil,5674.6mil)(4629.813mil,5698.061mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (0.841mil < 10mil) Between Pad C2-2(5553.603mil,5442.687mil) on Bottom Layer And Text "C42" (5543mil,5438mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0.841mil]
Silk To Solder Mask Clearance Constraint: (4.876mil < 10mil) Between Pad C2-2(5553.603mil,5442.687mil) on Bottom Layer And Track (5535.887mil,5426.939mil)(5535.887mil,5450.4mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.876mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C2-2(5553.603mil,5442.687mil) on Bottom Layer And Track (5535.887mil,5426.939mil)(5571.32mil,5426.939mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C2-2(5553.603mil,5442.687mil) on Bottom Layer And Track (5547.6mil,5460.4mil)(5559.6mil,5460.4mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C2-2(5553.603mil,5442.687mil) on Bottom Layer And Track (5571.313mil,5426.939mil)(5571.313mil,5450.4mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C22-1(5204.2mil,5112.117mil) on Top Layer And Track (5186.487mil,5104.4mil)(5186.487mil,5127.861mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C22-1(5204.2mil,5112.117mil) on Top Layer And Track (5186.487mil,5127.861mil)(5221.913mil,5127.861mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C22-1(5204.2mil,5112.117mil) on Top Layer And Track (5186.48mil,5127.855mil)(5186.487mil,5127.861mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C22-1(5204.2mil,5112.117mil) on Top Layer And Track (5198.2mil,5094.4mil)(5210.2mil,5094.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (2.744mil < 10mil) Between Pad C22-1(5204.2mil,5112.117mil) on Top Layer And Track (5219.787mil,5060.401mil)(5219.787mil,5125.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.744mil]
Silk To Solder Mask Clearance Constraint: (4.864mil < 10mil) Between Pad C22-1(5204.2mil,5112.117mil) on Top Layer And Track (5219.787mil,5125.361mil)(5255.22mil,5125.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.864mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C22-1(5204.2mil,5112.117mil) on Top Layer And Track (5221.913mil,5104.4mil)(5221.913mil,5127.861mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.869mil < 10mil) Between Pad C22-2(5204.197mil,5076.687mil) on Top Layer And Track (5186.487mil,5060.939mil)(5186.487mil,5084.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.869mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C22-2(5204.197mil,5076.687mil) on Top Layer And Track (5186.48mil,5060.939mil)(5221.913mil,5060.939mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C22-2(5204.197mil,5076.687mil) on Top Layer And Track (5198.2mil,5094.4mil)(5210.2mil,5094.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (2.747mil < 10mil) Between Pad C22-2(5204.197mil,5076.687mil) on Top Layer And Track (5219.787mil,5060.401mil)(5219.787mil,5125.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.747mil]
Silk To Solder Mask Clearance Constraint: (7.188mil < 10mil) Between Pad C22-2(5204.197mil,5076.687mil) on Top Layer And Track (5219.787mil,5060.401mil)(5255.22mil,5060.401mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.188mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C22-2(5204.197mil,5076.687mil) on Top Layer And Track (5221.913mil,5060.939mil)(5221.913mil,5084.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.771mil < 10mil) Between Pad C23-1(5176.383mil,5281.8mil) on Top Layer And Track (5093.301mil,5266.167mil)(5158.261mil,5266.167mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.771mil]
Silk To Solder Mask Clearance Constraint: (8.152mil < 10mil) Between Pad C23-1(5176.383mil,5281.8mil) on Top Layer And Track (5093.301mil,5267.56mil)(5158.261mil,5267.56mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.152mil]
Silk To Solder Mask Clearance Constraint: (8.152mil < 10mil) Between Pad C23-1(5176.383mil,5281.8mil) on Top Layer And Track (5158.261mil,5232.127mil)(5158.261mil,5267.56mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.152mil]
Silk To Solder Mask Clearance Constraint: (7.248mil < 10mil) Between Pad C23-1(5176.383mil,5281.8mil) on Top Layer And Track (5158.261mil,5266.167mil)(5158.261mil,5301.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.248mil]
Silk To Solder Mask Clearance Constraint: (8.262mil < 10mil) Between Pad C23-1(5176.383mil,5281.8mil) on Top Layer And Track (5160.239mil,5299.287mil)(5160.239mil,5334.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.262mil]
Silk To Solder Mask Clearance Constraint: (8.253mil < 10mil) Between Pad C23-1(5176.383mil,5281.8mil) on Top Layer And Track (5160.239mil,5299.287mil)(5160.245mil,5299.28mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.253mil]
Silk To Solder Mask Clearance Constraint: (4.644mil < 10mil) Between Pad C23-1(5176.383mil,5281.8mil) on Top Layer And Track (5160.239mil,5299.287mil)(5183.7mil,5299.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.644mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C23-1(5176.383mil,5281.8mil) on Top Layer And Track (5160.639mil,5264.087mil)(5160.639mil,5299.513mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C23-1(5176.383mil,5281.8mil) on Top Layer And Track (5160.639mil,5264.087mil)(5160.645mil,5264.08mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C23-1(5176.383mil,5281.8mil) on Top Layer And Track (5160.639mil,5264.087mil)(5184.1mil,5264.087mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C23-1(5176.383mil,5281.8mil) on Top Layer And Track (5160.639mil,5299.513mil)(5184.1mil,5299.513mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C23-1(5176.383mil,5281.8mil) on Top Layer And Track (5194.1mil,5275.8mil)(5194.1mil,5287.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C23-2(5211.813mil,5281.797mil) on Top Layer And Track (5194.1mil,5275.8mil)(5194.1mil,5287.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.647mil < 10mil) Between Pad C23-2(5211.813mil,5281.797mil) on Top Layer And Track (5203.7mil,5299.287mil)(5227.161mil,5299.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.647mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C23-2(5211.813mil,5281.797mil) on Top Layer And Track (5204.1mil,5264.087mil)(5227.561mil,5264.087mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C23-2(5211.813mil,5281.797mil) on Top Layer And Track (5204.1mil,5299.513mil)(5227.561mil,5299.513mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.689mil < 10mil) Between Pad C23-2(5211.813mil,5281.797mil) on Top Layer And Track (5227.161mil,5299.28mil)(5227.161mil,5334.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.689mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C23-2(5211.813mil,5281.797mil) on Top Layer And Track (5227.561mil,5264.08mil)(5227.561mil,5299.513mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (2.581mil < 10mil) Between Pad C24-1(5377.297mil,5008.68mil) on Top Layer And Track (5328.687mil,5020.261mil)(5364.12mil,5020.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.581mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C24-1(5377.297mil,5008.68mil) on Top Layer And Track (5361.552mil,4990.967mil)(5361.552mil,5026.394mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C24-1(5377.297mil,5008.68mil) on Top Layer And Track (5361.552mil,4990.967mil)(5361.558mil,4990.961mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C24-1(5377.297mil,5008.68mil) on Top Layer And Track (5361.552mil,4990.967mil)(5385.013mil,4990.967mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C24-1(5377.297mil,5008.68mil) on Top Layer And Track (5361.552mil,5026.394mil)(5385.013mil,5026.394mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (7.805mil < 10mil) Between Pad C24-1(5377.297mil,5008.68mil) on Top Layer And Track (5363.352mil,4954.467mil)(5363.352mil,4989.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.805mil]
Silk To Solder Mask Clearance Constraint: (5.938mil < 10mil) Between Pad C24-1(5377.297mil,5008.68mil) on Top Layer And Track (5363.352mil,4989.9mil)(5428.313mil,4989.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.938mil]
Silk To Solder Mask Clearance Constraint: (2.303mil < 10mil) Between Pad C24-1(5377.297mil,5008.68mil) on Top Layer And Track (5364.12mil,4955.301mil)(5364.12mil,5020.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.303mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C24-1(5377.297mil,5008.68mil) on Top Layer And Track (5395.013mil,5002.68mil)(5395.013mil,5014.68mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (5.935mil < 10mil) Between Pad C24-2(5412.727mil,5008.677mil) on Top Layer And Track (5363.352mil,4989.9mil)(5428.313mil,4989.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.935mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C24-2(5412.727mil,5008.677mil) on Top Layer And Track (5395.013mil,5002.68mil)(5395.013mil,5014.68mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C24-2(5412.727mil,5008.677mil) on Top Layer And Track (5405.013mil,4990.967mil)(5428.475mil,4990.967mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C24-2(5412.727mil,5008.677mil) on Top Layer And Track (5405.013mil,5026.394mil)(5428.475mil,5026.394mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.803mil < 10mil) Between Pad C24-2(5412.727mil,5008.677mil) on Top Layer And Track (5428.313mil,4954.467mil)(5428.313mil,4989.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.803mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C24-2(5412.727mil,5008.677mil) on Top Layer And Track (5428.475mil,4990.961mil)(5428.475mil,5026.394mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C25-1(5539.6mil,4986.984mil) on Bottom Layer And Track (5521.887mil,4971.239mil)(5521.887mil,4994.7mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C25-1(5539.6mil,4986.984mil) on Bottom Layer And Track (5521.887mil,4971.239mil)(5557.313mil,4971.239mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C25-1(5539.6mil,4986.984mil) on Bottom Layer And Track (5521.88mil,4971.245mil)(5521.887mil,4971.239mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C25-1(5539.6mil,4986.984mil) on Bottom Layer And Track (5533.6mil,5004.7mil)(5545.6mil,5004.7mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C25-1(5539.6mil,4986.984mil) on Bottom Layer And Track (5557.313mil,4971.239mil)(5557.313mil,4994.7mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C25-2(5539.597mil,5022.413mil) on Bottom Layer And Track (5521.887mil,5014.7mil)(5521.887mil,5038.161mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C25-2(5539.597mil,5022.413mil) on Bottom Layer And Track (5521.88mil,5038.161mil)(5557.313mil,5038.161mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C25-2(5539.597mil,5022.413mil) on Bottom Layer And Track (5533.6mil,5004.7mil)(5545.6mil,5004.7mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C25-2(5539.597mil,5022.413mil) on Bottom Layer And Track (5557.313mil,5014.7mil)(5557.313mil,5038.161mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C26-1(5674.617mil,5367.7mil) on Bottom Layer And Track (5656.9mil,5361.7mil)(5656.9mil,5373.7mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C26-1(5674.617mil,5367.7mil) on Bottom Layer And Track (5666.9mil,5349.987mil)(5690.361mil,5349.987mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C26-1(5674.617mil,5367.7mil) on Bottom Layer And Track (5666.9mil,5385.413mil)(5690.361mil,5385.413mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (2.048mil < 10mil) Between Pad C26-1(5674.617mil,5367.7mil) on Bottom Layer And Track (5687.539mil,5351.287mil)(5687.539mil,5386.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.048mil]
Silk To Solder Mask Clearance Constraint: (5.286mil < 10mil) Between Pad C26-1(5674.617mil,5367.7mil) on Bottom Layer And Track (5687.539mil,5351.287mil)(5711mil,5351.287mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.286mil]
Silk To Solder Mask Clearance Constraint: (7.468mil < 10mil) Between Pad C26-1(5674.617mil,5367.7mil) on Bottom Layer And Track (5687.539mil,5386.713mil)(5687.545mil,5386.72mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.468mil]
Silk To Solder Mask Clearance Constraint: (7.468mil < 10mil) Between Pad C26-1(5674.617mil,5367.7mil) on Bottom Layer And Track (5687.539mil,5386.713mil)(5711mil,5386.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.468mil]
Silk To Solder Mask Clearance Constraint: (8.35mil < 10mil) Between Pad C26-1(5674.617mil,5367.7mil) on Bottom Layer And Track (5687.961mil,5387.487mil)(5687.961mil,5422.913mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.35mil]
Silk To Solder Mask Clearance Constraint: (8.35mil < 10mil) Between Pad C26-1(5674.617mil,5367.7mil) on Bottom Layer And Track (5687.961mil,5387.487mil)(5711.423mil,5387.487mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.35mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C26-1(5674.617mil,5367.7mil) on Bottom Layer And Track (5690.355mil,5349.98mil)(5690.361mil,5349.987mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C26-1(5674.617mil,5367.7mil) on Bottom Layer And Track (5690.361mil,5349.987mil)(5690.361mil,5385.413mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.869mil < 10mil) Between Pad C26-2(5639.187mil,5367.697mil) on Bottom Layer And Track (5623.439mil,5349.987mil)(5646.9mil,5349.987mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.869mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C26-2(5639.187mil,5367.697mil) on Bottom Layer And Track (5623.439mil,5349.98mil)(5623.439mil,5385.413mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C26-2(5639.187mil,5367.697mil) on Bottom Layer And Track (5623.439mil,5385.413mil)(5646.9mil,5385.413mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C26-2(5639.187mil,5367.697mil) on Bottom Layer And Track (5656.9mil,5361.7mil)(5656.9mil,5373.7mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C27-1(5405.516mil,5755.5mil) on Bottom Layer And Track (5387.8mil,5749.5mil)(5387.8mil,5761.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C27-1(5405.516mil,5755.5mil) on Bottom Layer And Track (5397.8mil,5737.787mil)(5421.261mil,5737.787mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C27-1(5405.516mil,5755.5mil) on Bottom Layer And Track (5397.8mil,5773.213mil)(5421.261mil,5773.213mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C27-1(5405.516mil,5755.5mil) on Bottom Layer And Track (5421.255mil,5737.78mil)(5421.261mil,5737.787mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C27-1(5405.516mil,5755.5mil) on Bottom Layer And Track (5421.261mil,5737.787mil)(5421.261mil,5773.213mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.148mil < 10mil) Between Pad C27-1(5405.516mil,5755.5mil) on Bottom Layer And Track (5424.539mil,5737.58mil)(5424.539mil,5773.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.148mil]
Silk To Solder Mask Clearance Constraint: (4.869mil < 10mil) Between Pad C27-2(5370.087mil,5755.497mil) on Bottom Layer And Track (5354.339mil,5737.787mil)(5377.8mil,5737.787mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.869mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C27-2(5370.087mil,5755.497mil) on Bottom Layer And Track (5354.339mil,5737.78mil)(5354.339mil,5773.213mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C27-2(5370.087mil,5755.497mil) on Bottom Layer And Track (5354.339mil,5773.213mil)(5377.8mil,5773.213mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C27-2(5370.087mil,5755.497mil) on Bottom Layer And Track (5387.8mil,5749.5mil)(5387.8mil,5761.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (7.526mil < 10mil) Between Pad C28-1(4916.383mil,5736.4mil) on Bottom Layer And Track (4836.452mil,5718.783mil)(4901.413mil,5718.783mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.526mil]
Silk To Solder Mask Clearance Constraint: (7.675mil < 10mil) Between Pad C28-1(4916.383mil,5736.4mil) on Bottom Layer And Track (4836.452mil,5754.217mil)(4901.413mil,5754.217mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.675mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C28-1(4916.383mil,5736.4mil) on Bottom Layer And Track (4900.639mil,5718.687mil)(4900.639mil,5754.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C28-1(4916.383mil,5736.4mil) on Bottom Layer And Track (4900.639mil,5718.687mil)(4924.1mil,5718.687mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C28-1(4916.383mil,5736.4mil) on Bottom Layer And Track (4900.639mil,5754.113mil)(4900.645mil,5754.12mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C28-1(4916.383mil,5736.4mil) on Bottom Layer And Track (4900.639mil,5754.113mil)(4924.1mil,5754.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.097mil < 10mil) Between Pad C28-1(4916.383mil,5736.4mil) on Bottom Layer And Track (4901.413mil,5718.783mil)(4901.413mil,5754.217mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.097mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C28-1(4916.383mil,5736.4mil) on Bottom Layer And Track (4934.1mil,5730.4mil)(4934.1mil,5742.4mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (7.564mil < 10mil) Between Pad C28-2(4951.813mil,5736.403mil) on Bottom Layer And Track (4934.1mil,5730.4mil)(4934.1mil,5742.4mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.564mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C28-2(4951.813mil,5736.403mil) on Bottom Layer And Track (4944.1mil,5718.687mil)(4967.561mil,5718.687mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C28-2(4951.813mil,5736.403mil) on Bottom Layer And Track (4944.1mil,5754.113mil)(4967.561mil,5754.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C28-2(4951.813mil,5736.403mil) on Bottom Layer And Track (4967.561mil,5718.687mil)(4967.561mil,5754.12mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.157mil < 10mil) Between Pad C29-1(5522.316mil,5359.3mil) on Bottom Layer And Track (5491.4mil,5376.8mil)(5516.4mil,5376.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.157mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C29-1(5522.316mil,5359.3mil) on Bottom Layer And Track (5504.6mil,5353.3mil)(5504.6mil,5365.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C29-1(5522.316mil,5359.3mil) on Bottom Layer And Track (5514.6mil,5341.587mil)(5538.061mil,5341.587mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C29-1(5522.316mil,5359.3mil) on Bottom Layer And Track (5514.6mil,5377.013mil)(5538.061mil,5377.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.157mil < 10mil) Between Pad C29-1(5522.316mil,5359.3mil) on Bottom Layer And Track (5516.4mil,5376.8mil)(5533.4mil,5393.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.157mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C29-1(5522.316mil,5359.3mil) on Bottom Layer And Track (5538.055mil,5341.58mil)(5538.061mil,5341.587mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C29-1(5522.316mil,5359.3mil) on Bottom Layer And Track (5538.061mil,5341.587mil)(5538.061mil,5377.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.869mil < 10mil) Between Pad C29-2(5486.887mil,5359.297mil) on Bottom Layer And Track (5471.139mil,5341.587mil)(5494.6mil,5341.587mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.869mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C29-2(5486.887mil,5359.297mil) on Bottom Layer And Track (5471.139mil,5341.58mil)(5471.139mil,5377.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C29-2(5486.887mil,5359.297mil) on Bottom Layer And Track (5471.139mil,5377.013mil)(5494.6mil,5377.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.161mil < 10mil) Between Pad C29-2(5486.887mil,5359.297mil) on Bottom Layer And Track (5473.4mil,5394.8mil)(5491.4mil,5376.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.161mil]
Silk To Solder Mask Clearance Constraint: (4.161mil < 10mil) Between Pad C29-2(5486.887mil,5359.297mil) on Bottom Layer And Track (5491.4mil,5376.8mil)(5516.4mil,5376.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.161mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C29-2(5486.887mil,5359.297mil) on Bottom Layer And Track (5504.6mil,5353.3mil)(5504.6mil,5365.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C30-1(5051.7mil,5191.484mil) on Bottom Layer And Track (5033.987mil,5175.739mil)(5033.987mil,5199.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C30-1(5051.7mil,5191.484mil) on Bottom Layer And Track (5033.987mil,5175.739mil)(5069.413mil,5175.739mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C30-1(5051.7mil,5191.484mil) on Bottom Layer And Track (5033.98mil,5175.745mil)(5033.987mil,5175.739mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C30-1(5051.7mil,5191.484mil) on Bottom Layer And Track (5045.7mil,5209.2mil)(5057.7mil,5209.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C30-1(5051.7mil,5191.484mil) on Bottom Layer And Track (5069.413mil,5175.739mil)(5069.413mil,5199.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C30-2(5051.697mil,5226.913mil) on Bottom Layer And Track (5033.987mil,5219.2mil)(5033.987mil,5242.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C30-2(5051.697mil,5226.913mil) on Bottom Layer And Track (5033.98mil,5242.661mil)(5069.413mil,5242.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C30-2(5051.697mil,5226.913mil) on Bottom Layer And Track (5045.7mil,5209.2mil)(5057.7mil,5209.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C30-2(5051.697mil,5226.913mil) on Bottom Layer And Track (5069.413mil,5219.2mil)(5069.413mil,5242.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C3-1(4552.768mil,5380.141mil) on Bottom Layer And Track (4535.052mil,5374.141mil)(4535.052mil,5386.141mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C3-1(4552.768mil,5380.141mil) on Bottom Layer And Track (4545.052mil,5362.427mil)(4568.513mil,5362.427mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C3-1(4552.768mil,5380.141mil) on Bottom Layer And Track (4545.052mil,5397.854mil)(4568.513mil,5397.854mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C3-1(4552.768mil,5380.141mil) on Bottom Layer And Track (4563.039mil,5362.487mil)(4563.039mil,5397.913mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (5.171mil < 10mil) Between Pad C3-1(4552.768mil,5380.141mil) on Bottom Layer And Track (4563.039mil,5362.487mil)(4586.5mil,5362.487mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.171mil]
Silk To Solder Mask Clearance Constraint: (5.284mil < 10mil) Between Pad C3-1(4552.768mil,5380.141mil) on Bottom Layer And Track (4563.039mil,5397.913mil)(4563.045mil,5397.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.284mil]
Silk To Solder Mask Clearance Constraint: (5.284mil < 10mil) Between Pad C3-1(4552.768mil,5380.141mil) on Bottom Layer And Track (4563.039mil,5397.913mil)(4586.5mil,5397.913mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.284mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C3-1(4552.768mil,5380.141mil) on Bottom Layer And Track (4568.507mil,5362.421mil)(4568.513mil,5362.427mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C3-1(4552.768mil,5380.141mil) on Bottom Layer And Track (4568.513mil,5362.427mil)(4568.513mil,5397.854mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.597mil < 10mil) Between Pad C31-1(4305.684mil,5391.4mil) on Top Layer And Track (4289.839mil,5406.587mil)(4289.839mil,5442.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.597mil]
Silk To Solder Mask Clearance Constraint: (6.588mil < 10mil) Between Pad C31-1(4305.684mil,5391.4mil) on Top Layer And Track (4289.839mil,5406.587mil)(4289.845mil,5406.58mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.588mil]
Silk To Solder Mask Clearance Constraint: (2.344mil < 10mil) Between Pad C31-1(4305.684mil,5391.4mil) on Top Layer And Track (4289.839mil,5406.587mil)(4313.3mil,5406.587mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.344mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C31-1(4305.684mil,5391.4mil) on Top Layer And Track (4289.939mil,5373.687mil)(4289.939mil,5409.113mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C31-1(4305.684mil,5391.4mil) on Top Layer And Track (4289.939mil,5373.687mil)(4289.945mil,5373.68mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C31-1(4305.684mil,5391.4mil) on Top Layer And Track (4289.939mil,5373.687mil)(4313.4mil,5373.687mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C31-1(4305.684mil,5391.4mil) on Top Layer And Track (4289.939mil,5409.113mil)(4313.4mil,5409.113mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C31-1(4305.684mil,5391.4mil) on Top Layer And Track (4323.4mil,5385.4mil)(4323.4mil,5397.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C31-2(4341.113mil,5391.397mil) on Top Layer And Track (4323.4mil,5385.4mil)(4323.4mil,5397.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (2.347mil < 10mil) Between Pad C31-2(4341.113mil,5391.397mil) on Top Layer And Track (4333.3mil,5406.587mil)(4356.761mil,5406.587mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.347mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C31-2(4341.113mil,5391.397mil) on Top Layer And Track (4333.4mil,5373.687mil)(4356.861mil,5373.687mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C31-2(4341.113mil,5391.397mil) on Top Layer And Track (4333.4mil,5409.113mil)(4356.861mil,5409.113mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.432mil < 10mil) Between Pad C31-2(4341.113mil,5391.397mil) on Top Layer And Track (4356.761mil,5406.58mil)(4356.761mil,5442.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.432mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C31-2(4341.113mil,5391.397mil) on Top Layer And Track (4356.861mil,5373.68mil)(4356.861mil,5409.113mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C3-2(4517.339mil,5380.137mil) on Bottom Layer And Track (4501.591mil,5362.421mil)(4501.591mil,5397.854mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.869mil < 10mil) Between Pad C3-2(4517.339mil,5380.137mil) on Bottom Layer And Track (4501.591mil,5362.427mil)(4525.052mil,5362.427mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.869mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C3-2(4517.339mil,5380.137mil) on Bottom Layer And Track (4501.591mil,5397.854mil)(4525.052mil,5397.854mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C3-2(4517.339mil,5380.137mil) on Bottom Layer And Track (4535.052mil,5374.141mil)(4535.052mil,5386.141mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C32-1(4305.583mil,5424.3mil) on Top Layer And Track (4289.839mil,5406.587mil)(4289.839mil,5442.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C32-1(4305.583mil,5424.3mil) on Top Layer And Track (4289.839mil,5406.587mil)(4289.845mil,5406.58mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C32-1(4305.583mil,5424.3mil) on Top Layer And Track (4289.839mil,5406.587mil)(4313.3mil,5406.587mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C32-1(4305.583mil,5424.3mil) on Top Layer And Track (4289.839mil,5442.013mil)(4313.3mil,5442.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.431mil < 10mil) Between Pad C32-1(4305.583mil,5424.3mil) on Top Layer And Track (4289.939mil,5373.687mil)(4289.939mil,5409.113mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.431mil]
Silk To Solder Mask Clearance Constraint: (2.344mil < 10mil) Between Pad C32-1(4305.583mil,5424.3mil) on Top Layer And Track (4289.939mil,5409.113mil)(4313.4mil,5409.113mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.344mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C32-1(4305.583mil,5424.3mil) on Top Layer And Track (4323.3mil,5418.3mil)(4323.3mil,5430.3mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C32-2(4341.013mil,5424.297mil) on Top Layer And Track (4323.3mil,5418.3mil)(4323.3mil,5430.3mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C32-2(4341.013mil,5424.297mil) on Top Layer And Track (4333.3mil,5406.587mil)(4356.761mil,5406.587mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C32-2(4341.013mil,5424.297mil) on Top Layer And Track (4333.3mil,5442.013mil)(4356.761mil,5442.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (2.341mil < 10mil) Between Pad C32-2(4341.013mil,5424.297mil) on Top Layer And Track (4333.4mil,5409.113mil)(4356.861mil,5409.113mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.341mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C32-2(4341.013mil,5424.297mil) on Top Layer And Track (4356.761mil,5406.58mil)(4356.761mil,5442.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.598mil < 10mil) Between Pad C32-2(4341.013mil,5424.297mil) on Top Layer And Track (4356.861mil,5373.68mil)(4356.861mil,5409.113mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.598mil]
Silk To Solder Mask Clearance Constraint: (7.822mil < 10mil) Between Pad C35-1(4880.984mil,5591.2mil) on Bottom Layer And Text "C62" (4897mil,5599mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.822mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C35-1(4880.984mil,5591.2mil) on Bottom Layer And Track (4865.239mil,5573.487mil)(4865.239mil,5608.913mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C35-1(4880.984mil,5591.2mil) on Bottom Layer And Track (4865.239mil,5573.487mil)(4888.7mil,5573.487mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C35-1(4880.984mil,5591.2mil) on Bottom Layer And Track (4865.239mil,5608.913mil)(4865.245mil,5608.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C35-1(4880.984mil,5591.2mil) on Bottom Layer And Track (4865.239mil,5608.913mil)(4888.7mil,5608.913mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C35-1(4880.984mil,5591.2mil) on Bottom Layer And Track (4898.7mil,5585.2mil)(4898.7mil,5597.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (9.637mil < 10mil) Between Pad C35-1(4880.984mil,5591.2mil) on Bottom Layer And Track (4900.087mil,5552.1mil)(4900.087mil,5575.561mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.637mil]
Silk To Solder Mask Clearance Constraint: (9.631mil < 10mil) Between Pad C35-1(4880.984mil,5591.2mil) on Bottom Layer And Track (4900.08mil,5575.561mil)(4935.513mil,5575.561mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.631mil]
Silk To Solder Mask Clearance Constraint: (7.564mil < 10mil) Between Pad C35-2(4916.413mil,5591.203mil) on Bottom Layer And Track (4898.7mil,5585.2mil)(4898.7mil,5597.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.564mil]
Silk To Solder Mask Clearance Constraint: (7.251mil < 10mil) Between Pad C35-2(4916.413mil,5591.203mil) on Bottom Layer And Track (4900.087mil,5552.1mil)(4900.087mil,5575.561mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.251mil]
Silk To Solder Mask Clearance Constraint: (2.799mil < 10mil) Between Pad C35-2(4916.413mil,5591.203mil) on Bottom Layer And Track (4900.08mil,5575.561mil)(4935.513mil,5575.561mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.799mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C35-2(4916.413mil,5591.203mil) on Bottom Layer And Track (4908.7mil,5573.487mil)(4932.161mil,5573.487mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C35-2(4916.413mil,5591.203mil) on Bottom Layer And Track (4908.7mil,5608.913mil)(4932.161mil,5608.913mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C35-2(4916.413mil,5591.203mil) on Bottom Layer And Track (4932.161mil,5573.487mil)(4932.161mil,5608.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.635mil < 10mil) Between Pad C35-2(4916.413mil,5591.203mil) on Bottom Layer And Track (4935.513mil,5552.1mil)(4935.513mil,5575.561mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.636mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C36-1(5283.3mil,4972.383mil) on Top Layer And Track (5265.587mil,4956.639mil)(5265.587mil,4980.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C36-1(5283.3mil,4972.383mil) on Top Layer And Track (5265.587mil,4956.639mil)(5301.013mil,4956.639mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C36-1(5283.3mil,4972.383mil) on Top Layer And Track (5277.3mil,4990.1mil)(5289.3mil,4990.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C36-1(5283.3mil,4972.383mil) on Top Layer And Track (5301.013mil,4956.639mil)(5301.013mil,4980.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C36-1(5283.3mil,4972.383mil) on Top Layer And Track (5301.013mil,4956.639mil)(5301.02mil,4956.645mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C36-2(5283.303mil,5007.813mil) on Top Layer And Track (5265.587mil,5000.1mil)(5265.587mil,5023.561mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C36-2(5283.303mil,5007.813mil) on Top Layer And Track (5265.587mil,5023.561mil)(5301.02mil,5023.561mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.564mil < 10mil) Between Pad C36-2(5283.303mil,5007.813mil) on Top Layer And Track (5277.3mil,4990.1mil)(5289.3mil,4990.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.564mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C36-2(5283.303mil,5007.813mil) on Top Layer And Track (5301.013mil,5000.1mil)(5301.013mil,5023.561mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C39-1(5310.484mil,5420.3mil) on Top Layer And Track (5294.739mil,5402.587mil)(5294.739mil,5438.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C39-1(5310.484mil,5420.3mil) on Top Layer And Track (5294.739mil,5402.587mil)(5294.745mil,5402.58mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C39-1(5310.484mil,5420.3mil) on Top Layer And Track (5294.739mil,5402.587mil)(5318.2mil,5402.587mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C39-1(5310.484mil,5420.3mil) on Top Layer And Track (5294.739mil,5438.013mil)(5318.2mil,5438.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (3.241mil < 10mil) Between Pad C39-1(5310.484mil,5420.3mil) on Top Layer And Track (5314.487mil,5340.601mil)(5314.487mil,5405.561mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.241mil]
Silk To Solder Mask Clearance Constraint: (1.896mil < 10mil) Between Pad C39-1(5310.484mil,5420.3mil) on Top Layer And Track (5314.487mil,5405.561mil)(5349.92mil,5405.561mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [1.896mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C39-1(5310.484mil,5420.3mil) on Top Layer And Track (5328.2mil,5414.3mil)(5328.2mil,5426.3mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (3.237mil < 10mil) Between Pad C39-2(5345.913mil,5420.297mil) on Top Layer And Track (5314.487mil,5405.561mil)(5349.92mil,5405.561mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.237mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C39-2(5345.913mil,5420.297mil) on Top Layer And Track (5328.2mil,5414.3mil)(5328.2mil,5426.3mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C39-2(5345.913mil,5420.297mil) on Top Layer And Track (5338.2mil,5402.587mil)(5361.661mil,5402.587mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C39-2(5345.913mil,5420.297mil) on Top Layer And Track (5338.2mil,5438.013mil)(5361.661mil,5438.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (5.852mil < 10mil) Between Pad C39-2(5345.913mil,5420.297mil) on Top Layer And Track (5344.639mil,5372.287mil)(5344.639mil,5407.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.852mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C39-2(5345.913mil,5420.297mil) on Top Layer And Track (5344.639mil,5407.72mil)(5409.599mil,5407.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (3.237mil < 10mil) Between Pad C39-2(5345.913mil,5420.297mil) on Top Layer And Track (5349.92mil,5340.601mil)(5349.92mil,5405.561mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.237mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C39-2(5345.913mil,5420.297mil) on Top Layer And Track (5361.661mil,5402.58mil)(5361.661mil,5438.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.336mil < 10mil) Between Pad C40-1(5425.684mil,5358mil) on Top Layer And Track (5344.639mil,5372.287mil)(5409.599mil,5372.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.336mil]
Silk To Solder Mask Clearance Constraint: (6.336mil < 10mil) Between Pad C40-1(5425.684mil,5358mil) on Top Layer And Track (5409.599mil,5372.287mil)(5409.599mil,5407.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.336mil]
Silk To Solder Mask Clearance Constraint: (6.541mil < 10mil) Between Pad C40-1(5425.684mil,5358mil) on Top Layer And Track (5409.839mil,5373.087mil)(5409.839mil,5408.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.541mil]
Silk To Solder Mask Clearance Constraint: (2.244mil < 10mil) Between Pad C40-1(5425.684mil,5358mil) on Top Layer And Track (5409.839mil,5373.087mil)(5474.799mil,5373.087mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.244mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C40-1(5425.684mil,5358mil) on Top Layer And Track (5409.939mil,5340.287mil)(5409.939mil,5375.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C40-1(5425.684mil,5358mil) on Top Layer And Track (5409.939mil,5340.287mil)(5409.945mil,5340.28mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C40-1(5425.684mil,5358mil) on Top Layer And Track (5409.939mil,5340.287mil)(5433.4mil,5340.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C40-1(5425.684mil,5358mil) on Top Layer And Track (5409.939mil,5375.713mil)(5433.4mil,5375.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C40-1(5425.684mil,5358mil) on Top Layer And Track (5443.4mil,5352mil)(5443.4mil,5364mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (2.247mil < 10mil) Between Pad C40-2(5461.113mil,5357.997mil) on Top Layer And Track (5409.839mil,5373.087mil)(5474.799mil,5373.087mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.247mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C40-2(5461.113mil,5357.997mil) on Top Layer And Track (5443.4mil,5352mil)(5443.4mil,5364mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C40-2(5461.113mil,5357.997mil) on Top Layer And Track (5453.4mil,5340.287mil)(5476.861mil,5340.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C40-2(5461.113mil,5357.997mil) on Top Layer And Track (5453.4mil,5375.713mil)(5476.861mil,5375.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.83mil < 10mil) Between Pad C40-2(5461.113mil,5357.997mil) on Top Layer And Track (5474.799mil,5373.087mil)(5474.799mil,5408.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.83mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C40-2(5461.113mil,5357.997mil) on Top Layer And Track (5476.861mil,5340.28mil)(5476.861mil,5375.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.151mil < 10mil) Between Pad C40-2(5461.113mil,5357.997mil) on Top Layer And Track (5481.139mil,5340.487mil)(5481.139mil,5375.92mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.151mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C4-1(5532.316mil,5358.2mil) on Top Layer And Track (5514.6mil,5352.2mil)(5514.6mil,5364.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C4-1(5532.316mil,5358.2mil) on Top Layer And Track (5524.6mil,5340.487mil)(5548.061mil,5340.487mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C4-1(5532.316mil,5358.2mil) on Top Layer And Track (5524.6mil,5375.913mil)(5548.061mil,5375.913mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C4-1(5532.316mil,5358.2mil) on Top Layer And Track (5548.055mil,5375.92mil)(5548.061mil,5375.913mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C4-1(5532.316mil,5358.2mil) on Top Layer And Track (5548.061mil,5340.487mil)(5548.061mil,5375.913mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C41-1(4743.583mil,5874.6mil) on Bottom Layer And Track (4727.839mil,5856.887mil)(4727.839mil,5892.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C41-1(4743.583mil,5874.6mil) on Bottom Layer And Track (4727.839mil,5856.887mil)(4751.3mil,5856.887mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C41-1(4743.583mil,5874.6mil) on Bottom Layer And Track (4727.839mil,5892.313mil)(4727.845mil,5892.32mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C41-1(4743.583mil,5874.6mil) on Bottom Layer And Track (4727.839mil,5892.313mil)(4751.3mil,5892.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.181mil < 10mil) Between Pad C41-1(4743.583mil,5874.6mil) on Bottom Layer And Track (4728.101mil,5824.187mil)(4728.101mil,5859.62mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.181mil]
Silk To Solder Mask Clearance Constraint: (2.138mil < 10mil) Between Pad C41-1(4743.583mil,5874.6mil) on Bottom Layer And Track (4728.101mil,5859.62mil)(4793.061mil,5859.62mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.138mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C41-1(4743.583mil,5874.6mil) on Bottom Layer And Track (4761.3mil,5868.6mil)(4761.3mil,5880.6mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (8.783mil < 10mil) Between Pad C41-2(4779.013mil,5874.603mil) on Bottom Layer And Text "R33" (4796mil,5883mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.783mil]
Silk To Solder Mask Clearance Constraint: (2.141mil < 10mil) Between Pad C41-2(4779.013mil,5874.603mil) on Bottom Layer And Track (4728.101mil,5859.62mil)(4793.061mil,5859.62mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.141mil]
Silk To Solder Mask Clearance Constraint: (7.564mil < 10mil) Between Pad C41-2(4779.013mil,5874.603mil) on Bottom Layer And Track (4761.3mil,5868.6mil)(4761.3mil,5880.6mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.564mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C41-2(4779.013mil,5874.603mil) on Bottom Layer And Track (4771.3mil,5856.887mil)(4794.761mil,5856.887mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C41-2(4779.013mil,5874.603mil) on Bottom Layer And Track (4771.3mil,5892.313mil)(4794.761mil,5892.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (5.034mil < 10mil) Between Pad C41-2(4779.013mil,5874.603mil) on Bottom Layer And Track (4793.061mil,5824.187mil)(4793.061mil,5859.62mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.034mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C41-2(4779.013mil,5874.603mil) on Bottom Layer And Track (4794.761mil,5856.887mil)(4794.761mil,5892.32mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.151mil < 10mil) Between Pad C4-2(5496.887mil,5358.203mil) on Top Layer And Track (5476.861mil,5340.28mil)(5476.861mil,5375.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.151mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C4-2(5496.887mil,5358.203mil) on Top Layer And Track (5481.139mil,5340.487mil)(5481.139mil,5375.92mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.876mil < 10mil) Between Pad C4-2(5496.887mil,5358.203mil) on Top Layer And Track (5481.139mil,5340.487mil)(5504.6mil,5340.487mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.876mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C4-2(5496.887mil,5358.203mil) on Top Layer And Track (5481.139mil,5375.913mil)(5504.6mil,5375.913mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C4-2(5496.887mil,5358.203mil) on Top Layer And Track (5514.6mil,5352.2mil)(5514.6mil,5364.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C42-1(5563.4mil,5399.516mil) on Bottom Layer And Track (5545.687mil,5391.8mil)(5545.687mil,5415.261mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C42-1(5563.4mil,5399.516mil) on Bottom Layer And Track (5545.687mil,5415.261mil)(5581.113mil,5415.261mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C42-1(5563.4mil,5399.516mil) on Bottom Layer And Track (5557.4mil,5381.8mil)(5569.4mil,5381.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C42-1(5563.4mil,5399.516mil) on Bottom Layer And Track (5581.113mil,5391.8mil)(5581.113mil,5415.261mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C42-1(5563.4mil,5399.516mil) on Bottom Layer And Track (5581.113mil,5415.261mil)(5581.12mil,5415.255mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (5.538mil < 10mil) Between Pad C42-1(5563.4mil,5399.516mil) on Bottom Layer And Track (5581.78mil,5350.101mil)(5581.78mil,5415.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.538mil]
Silk To Solder Mask Clearance Constraint: (8.478mil < 10mil) Between Pad C42-1(5563.4mil,5399.516mil) on Bottom Layer And Track (5581.78mil,5415.061mil)(5617.213mil,5415.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.478mil]
Silk To Solder Mask Clearance Constraint: (4.876mil < 10mil) Between Pad C42-2(5563.403mil,5364.087mil) on Bottom Layer And Track (5545.687mil,5348.339mil)(5545.687mil,5371.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.876mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C42-2(5563.403mil,5364.087mil) on Bottom Layer And Track (5545.687mil,5348.339mil)(5581.12mil,5348.339mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C42-2(5563.403mil,5364.087mil) on Bottom Layer And Track (5557.4mil,5381.8mil)(5569.4mil,5381.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C42-2(5563.403mil,5364.087mil) on Bottom Layer And Track (5581.113mil,5348.339mil)(5581.113mil,5371.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (5.535mil < 10mil) Between Pad C42-2(5563.403mil,5364.087mil) on Bottom Layer And Track (5581.78mil,5350.101mil)(5581.78mil,5415.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.535mil]
Silk To Solder Mask Clearance Constraint: (7.497mil < 10mil) Between Pad C42-2(5563.403mil,5364.087mil) on Bottom Layer And Track (5581.78mil,5350.101mil)(5617.213mil,5350.101mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.497mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C45-1(4091.7mil,5648.516mil) on Top Layer And Track (4073.987mil,5640.8mil)(4073.987mil,5664.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C45-1(4091.7mil,5648.516mil) on Top Layer And Track (4073.987mil,5664.261mil)(4109.413mil,5664.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C45-1(4091.7mil,5648.516mil) on Top Layer And Track (4073.98mil,5664.255mil)(4073.987mil,5664.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C45-1(4091.7mil,5648.516mil) on Top Layer And Track (4085.7mil,5630.8mil)(4097.7mil,5630.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C45-1(4091.7mil,5648.516mil) on Top Layer And Track (4109.413mil,5640.8mil)(4109.413mil,5664.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.869mil < 10mil) Between Pad C45-2(4091.697mil,5613.087mil) on Top Layer And Track (4073.987mil,5597.339mil)(4073.987mil,5620.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.869mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C45-2(4091.697mil,5613.087mil) on Top Layer And Track (4073.98mil,5597.339mil)(4109.413mil,5597.339mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C45-2(4091.697mil,5613.087mil) on Top Layer And Track (4085.7mil,5630.8mil)(4097.7mil,5630.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C45-2(4091.697mil,5613.087mil) on Top Layer And Track (4109.413mil,5597.339mil)(4109.413mil,5620.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.198mil < 10mil) Between Pad C46-1(5109.046mil,5351.966mil) on Top Layer And Track (5093.301mil,5300.207mil)(5093.301mil,5335.64mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.198mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C46-1(5109.046mil,5351.966mil) on Top Layer And Track (5093.301mil,5334.253mil)(5093.301mil,5369.68mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C46-1(5109.046mil,5351.966mil) on Top Layer And Track (5093.301mil,5334.253mil)(5093.307mil,5334.247mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C46-1(5109.046mil,5351.966mil) on Top Layer And Track (5093.301mil,5334.253mil)(5116.762mil,5334.253mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (3.484mil < 10mil) Between Pad C46-1(5109.046mil,5351.966mil) on Top Layer And Track (5093.301mil,5335.64mil)(5158.261mil,5335.64mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.484mil]
Silk To Solder Mask Clearance Constraint: (7.194mil < 10mil) Between Pad C46-1(5109.046mil,5351.966mil) on Top Layer And Track (5093.301mil,5368.287mil)(5093.301mil,5403.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.194mil]
Silk To Solder Mask Clearance Constraint: (3.478mil < 10mil) Between Pad C46-1(5109.046mil,5351.966mil) on Top Layer And Track (5093.301mil,5368.287mil)(5158.261mil,5368.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.478mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C46-1(5109.046mil,5351.966mil) on Top Layer And Track (5093.301mil,5369.68mil)(5116.762mil,5369.68mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C46-1(5109.046mil,5351.966mil) on Top Layer And Track (5126.762mil,5345.966mil)(5126.762mil,5357.966mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (3.481mil < 10mil) Between Pad C46-2(5144.475mil,5351.963mil) on Top Layer And Track (5093.301mil,5335.64mil)(5158.261mil,5335.64mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.481mil]
Silk To Solder Mask Clearance Constraint: (3.481mil < 10mil) Between Pad C46-2(5144.475mil,5351.963mil) on Top Layer And Track (5093.301mil,5368.287mil)(5158.261mil,5368.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.481mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C46-2(5144.475mil,5351.963mil) on Top Layer And Track (5126.762mil,5345.966mil)(5126.762mil,5357.966mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C46-2(5144.475mil,5351.963mil) on Top Layer And Track (5136.762mil,5334.253mil)(5160.224mil,5334.253mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C46-2(5144.475mil,5351.963mil) on Top Layer And Track (5136.762mil,5369.68mil)(5160.224mil,5369.68mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (5.772mil < 10mil) Between Pad C46-2(5144.475mil,5351.963mil) on Top Layer And Track (5158.261mil,5300.207mil)(5158.261mil,5335.64mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.772mil]
Silk To Solder Mask Clearance Constraint: (5.772mil < 10mil) Between Pad C46-2(5144.475mil,5351.963mil) on Top Layer And Track (5158.261mil,5368.287mil)(5158.261mil,5403.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.772mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C46-2(5144.475mil,5351.963mil) on Top Layer And Track (5160.224mil,5334.247mil)(5160.224mil,5369.68mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.822mil < 10mil) Between Pad C46-2(5144.475mil,5351.963mil) on Top Layer And Track (5160.239mil,5299.287mil)(5160.239mil,5334.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.822mil]
Silk To Solder Mask Clearance Constraint: (7.822mil < 10mil) Between Pad C46-2(5144.475mil,5351.963mil) on Top Layer And Track (5160.239mil,5334.713mil)(5183.7mil,5334.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.822mil]
Silk To Solder Mask Clearance Constraint: (9.054mil < 10mil) Between Pad C47-1(5175.984mil,5317mil) on Top Layer And Track (5093.301mil,5300.207mil)(5158.261mil,5300.207mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.054mil]
Silk To Solder Mask Clearance Constraint: (8.308mil < 10mil) Between Pad C47-1(5175.984mil,5317mil) on Top Layer And Track (5093.301mil,5301.6mil)(5158.261mil,5301.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.308mil]
Silk To Solder Mask Clearance Constraint: (7.822mil < 10mil) Between Pad C47-1(5175.984mil,5317mil) on Top Layer And Track (5136.762mil,5334.253mil)(5160.224mil,5334.253mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.822mil]
Silk To Solder Mask Clearance Constraint: (8.308mil < 10mil) Between Pad C47-1(5175.984mil,5317mil) on Top Layer And Track (5158.261mil,5266.167mil)(5158.261mil,5301.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.308mil]
Silk To Solder Mask Clearance Constraint: (6.848mil < 10mil) Between Pad C47-1(5175.984mil,5317mil) on Top Layer And Track (5158.261mil,5300.207mil)(5158.261mil,5335.64mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.848mil]
Silk To Solder Mask Clearance Constraint: (7.817mil < 10mil) Between Pad C47-1(5175.984mil,5317mil) on Top Layer And Track (5160.224mil,5334.247mil)(5160.224mil,5369.68mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.817mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C47-1(5175.984mil,5317mil) on Top Layer And Track (5160.239mil,5299.287mil)(5160.239mil,5334.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C47-1(5175.984mil,5317mil) on Top Layer And Track (5160.239mil,5299.287mil)(5160.245mil,5299.28mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C47-1(5175.984mil,5317mil) on Top Layer And Track (5160.239mil,5299.287mil)(5183.7mil,5299.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C47-1(5175.984mil,5317mil) on Top Layer And Track (5160.239mil,5334.713mil)(5183.7mil,5334.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (7.689mil < 10mil) Between Pad C47-1(5175.984mil,5317mil) on Top Layer And Track (5160.639mil,5264.087mil)(5160.639mil,5299.513mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.689mil]
Silk To Solder Mask Clearance Constraint: (4.644mil < 10mil) Between Pad C47-1(5175.984mil,5317mil) on Top Layer And Track (5160.639mil,5299.513mil)(5184.1mil,5299.513mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.644mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C47-1(5175.984mil,5317mil) on Top Layer And Track (5193.7mil,5311mil)(5193.7mil,5323mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C47-2(5211.413mil,5316.997mil) on Top Layer And Track (5193.7mil,5311mil)(5193.7mil,5323mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C47-2(5211.413mil,5316.997mil) on Top Layer And Track (5203.7mil,5299.287mil)(5227.161mil,5299.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C47-2(5211.413mil,5316.997mil) on Top Layer And Track (5203.7mil,5334.713mil)(5227.161mil,5334.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.641mil < 10mil) Between Pad C47-2(5211.413mil,5316.997mil) on Top Layer And Track (5204.1mil,5299.513mil)(5227.561mil,5299.513mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.641mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C47-2(5211.413mil,5316.997mil) on Top Layer And Track (5227.161mil,5299.28mil)(5227.161mil,5334.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.263mil < 10mil) Between Pad C47-2(5211.413mil,5316.997mil) on Top Layer And Track (5227.561mil,5264.08mil)(5227.561mil,5299.513mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.263mil]
Silk To Solder Mask Clearance Constraint: (3.757mil < 10mil) Between Pad C48-1(4465.4mil,5106.617mil) on Top Layer And Track (4446.8mil,5037.1mil)(4446.8mil,5237.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.757mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C48-1(4465.4mil,5106.617mil) on Top Layer And Track (4447.687mil,5098.9mil)(4447.687mil,5122.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C48-1(4465.4mil,5106.617mil) on Top Layer And Track (4447.687mil,5122.361mil)(4483.113mil,5122.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C48-1(4465.4mil,5106.617mil) on Top Layer And Track (4447.68mil,5122.355mil)(4447.687mil,5122.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C48-1(4465.4mil,5106.617mil) on Top Layer And Track (4459.4mil,5088.9mil)(4471.4mil,5088.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (0.044mil < 10mil) Between Pad C48-1(4465.4mil,5106.617mil) on Top Layer And Track (4478.287mil,5098.356mil)(4478.287mil,5121.818mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.044mil]
Silk To Solder Mask Clearance Constraint: (4.934mil < 10mil) Between Pad C48-1(4465.4mil,5106.617mil) on Top Layer And Track (4478.287mil,5121.818mil)(4513.713mil,5121.818mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.934mil]
Silk To Solder Mask Clearance Constraint: (4.926mil < 10mil) Between Pad C48-1(4465.4mil,5106.617mil) on Top Layer And Track (4478.28mil,5121.811mil)(4478.287mil,5121.818mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.926mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C48-1(4465.4mil,5106.617mil) on Top Layer And Track (4483.113mil,5098.9mil)(4483.113mil,5122.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (3.754mil < 10mil) Between Pad C48-2(4465.397mil,5071.187mil) on Top Layer And Track (4446.8mil,5037.1mil)(4446.8mil,5237.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.754mil]
Silk To Solder Mask Clearance Constraint: (4.869mil < 10mil) Between Pad C48-2(4465.397mil,5071.187mil) on Top Layer And Track (4447.687mil,5055.439mil)(4447.687mil,5078.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.869mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C48-2(4465.397mil,5071.187mil) on Top Layer And Track (4447.68mil,5055.439mil)(4483.113mil,5055.439mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C48-2(4465.397mil,5071.187mil) on Top Layer And Track (4459.4mil,5088.9mil)(4471.4mil,5088.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (0.047mil < 10mil) Between Pad C48-2(4465.397mil,5071.187mil) on Top Layer And Track (4478.287mil,5054.895mil)(4478.287mil,5078.356mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.047mil]
Silk To Solder Mask Clearance Constraint: (5.95mil < 10mil) Between Pad C48-2(4465.397mil,5071.187mil) on Top Layer And Track (4478.28mil,5054.895mil)(4513.713mil,5054.895mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.95mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C48-2(4465.397mil,5071.187mil) on Top Layer And Track (4483.113mil,5055.439mil)(4483.113mil,5078.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (5.949mil < 10mil) Between Pad C49-1(4496mil,5106.073mil) on Top Layer And Track (4447.687mil,5122.361mil)(4483.113mil,5122.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.949mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C49-1(4496mil,5106.073mil) on Top Layer And Track (4478.287mil,5098.356mil)(4478.287mil,5121.818mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C49-1(4496mil,5106.073mil) on Top Layer And Track (4478.287mil,5121.818mil)(4513.713mil,5121.818mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C49-1(4496mil,5106.073mil) on Top Layer And Track (4478.28mil,5121.811mil)(4478.287mil,5121.818mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (0.044mil < 10mil) Between Pad C49-1(4496mil,5106.073mil) on Top Layer And Track (4483.113mil,5098.9mil)(4483.113mil,5122.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.044mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C49-1(4496mil,5106.073mil) on Top Layer And Track (4490mil,5088.356mil)(4502mil,5088.356mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C49-1(4496mil,5106.073mil) on Top Layer And Track (4513.713mil,5098.356mil)(4513.713mil,5121.818mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.936mil < 10mil) Between Pad C49-2(4495.997mil,5070.643mil) on Top Layer And Track (4447.68mil,5055.439mil)(4483.113mil,5055.439mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.936mil]
Silk To Solder Mask Clearance Constraint: (4.869mil < 10mil) Between Pad C49-2(4495.997mil,5070.643mil) on Top Layer And Track (4478.287mil,5054.895mil)(4478.287mil,5078.356mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.869mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C49-2(4495.997mil,5070.643mil) on Top Layer And Track (4478.28mil,5054.895mil)(4513.713mil,5054.895mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (0.041mil < 10mil) Between Pad C49-2(4495.997mil,5070.643mil) on Top Layer And Track (4483.113mil,5055.439mil)(4483.113mil,5078.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.041mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C49-2(4495.997mil,5070.643mil) on Top Layer And Track (4490mil,5088.356mil)(4502mil,5088.356mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C49-2(4495.997mil,5070.643mil) on Top Layer And Track (4513.713mil,5054.895mil)(4513.713mil,5078.356mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.441mil < 10mil) Between Pad C50-1(4542.897mil,4934.03mil) on Bottom Layer And Track (4520.613mil,4925.5mil)(4520.613mil,4948.961mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.441mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C50-1(4542.897mil,4934.03mil) on Bottom Layer And Track (4525.184mil,4926.313mil)(4525.184mil,4949.775mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C50-1(4542.897mil,4934.03mil) on Bottom Layer And Track (4525.184mil,4949.775mil)(4560.61mil,4949.775mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C50-1(4542.897mil,4934.03mil) on Bottom Layer And Track (4536.897mil,4916.313mil)(4548.897mil,4916.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C50-1(4542.897mil,4934.03mil) on Bottom Layer And Track (4560.61mil,4926.313mil)(4560.61mil,4949.775mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C50-1(4542.897mil,4934.03mil) on Bottom Layer And Track (4560.61mil,4949.775mil)(4560.617mil,4949.768mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (9.482mil < 10mil) Between Pad C50-2(4542.9mil,4898.6mil) on Bottom Layer And Track (4520.613mil,4882.039mil)(4520.613mil,4905.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.482mil]
Silk To Solder Mask Clearance Constraint: (4.876mil < 10mil) Between Pad C50-2(4542.9mil,4898.6mil) on Bottom Layer And Track (4525.184mil,4882.852mil)(4525.184mil,4906.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.876mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C50-2(4542.9mil,4898.6mil) on Bottom Layer And Track (4525.184mil,4882.852mil)(4560.617mil,4882.852mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C50-2(4542.9mil,4898.6mil) on Bottom Layer And Track (4536.897mil,4916.313mil)(4548.897mil,4916.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C50-2(4542.9mil,4898.6mil) on Bottom Layer And Track (4560.61mil,4882.852mil)(4560.61mil,4906.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (6.857mil < 10mil) Between Pad C5-1(5553.6mil,5506.783mil) on Bottom Layer And Track (5533.4mil,5490.8mil)(5533.4mil,5542.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.857mil]
Silk To Solder Mask Clearance Constraint: (6.351mil < 10mil) Between Pad C5-1(5553.6mil,5506.783mil) on Bottom Layer And Track (5535.887mil,5470.4mil)(5535.887mil,5493.861mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.351mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C5-1(5553.6mil,5506.783mil) on Bottom Layer And Track (5535.887mil,5491.039mil)(5535.887mil,5514.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C5-1(5553.6mil,5506.783mil) on Bottom Layer And Track (5535.887mil,5491.039mil)(5571.313mil,5491.039mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (2.048mil < 10mil) Between Pad C5-1(5553.6mil,5506.783mil) on Bottom Layer And Track (5535.887mil,5493.861mil)(5571.313mil,5493.861mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.048mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C5-1(5553.6mil,5506.783mil) on Bottom Layer And Track (5535.88mil,5491.045mil)(5535.887mil,5491.039mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C5-1(5553.6mil,5506.783mil) on Bottom Layer And Track (5547.6mil,5524.5mil)(5559.6mil,5524.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (6.351mil < 10mil) Between Pad C5-1(5553.6mil,5506.783mil) on Bottom Layer And Track (5571.313mil,5470.4mil)(5571.313mil,5493.861mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.351mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C5-1(5553.6mil,5506.783mil) on Bottom Layer And Track (5571.313mil,5491.039mil)(5571.313mil,5514.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.351mil < 10mil) Between Pad C5-1(5553.6mil,5506.783mil) on Bottom Layer And Track (5571.313mil,5493.861mil)(5571.32mil,5493.855mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.351mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C51-1(4991.417mil,5157.3mil) on Bottom Layer And Track (4973.7mil,5151.3mil)(4973.7mil,5163.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C51-1(4991.417mil,5157.3mil) on Bottom Layer And Track (4983.7mil,5139.587mil)(5007.162mil,5139.587mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C51-1(4991.417mil,5157.3mil) on Bottom Layer And Track (4983.7mil,5175.013mil)(5007.162mil,5175.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C51-1(4991.417mil,5157.3mil) on Bottom Layer And Track (5007.155mil,5139.58mil)(5007.162mil,5139.587mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C51-1(4991.417mil,5157.3mil) on Bottom Layer And Track (5007.162mil,5139.587mil)(5007.162mil,5175.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.869mil < 10mil) Between Pad C51-2(4955.987mil,5157.297mil) on Bottom Layer And Track (4940.239mil,5139.587mil)(4963.7mil,5139.587mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.869mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C51-2(4955.987mil,5157.297mil) on Bottom Layer And Track (4940.239mil,5139.58mil)(4940.239mil,5175.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C51-2(4955.987mil,5157.297mil) on Bottom Layer And Track (4940.239mil,5175.013mil)(4963.7mil,5175.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C51-2(4955.987mil,5157.297mil) on Bottom Layer And Track (4973.7mil,5151.3mil)(4973.7mil,5163.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (9.162mil < 10mil) Between Pad C5-2(5553.597mil,5542.213mil) on Bottom Layer And Track (5473.4mil,5542.8mil)(5533.4mil,5542.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.162mil]
Silk To Solder Mask Clearance Constraint: (9.162mil < 10mil) Between Pad C5-2(5553.597mil,5542.213mil) on Bottom Layer And Track (5533.4mil,5490.8mil)(5533.4mil,5542.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.162mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C5-2(5553.597mil,5542.213mil) on Bottom Layer And Track (5535.887mil,5534.5mil)(5535.887mil,5557.961mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C5-2(5553.597mil,5542.213mil) on Bottom Layer And Track (5535.88mil,5557.961mil)(5571.313mil,5557.961mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C5-2(5553.597mil,5542.213mil) on Bottom Layer And Track (5547.6mil,5524.5mil)(5559.6mil,5524.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C5-2(5553.597mil,5542.213mil) on Bottom Layer And Track (5571.313mil,5534.5mil)(5571.313mil,5557.961mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C52-1(4912.217mil,5052.1mil) on Top Layer And Track (4894.5mil,5046.1mil)(4894.5mil,5058.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C52-1(4912.217mil,5052.1mil) on Top Layer And Track (4904.5mil,5034.387mil)(4927.961mil,5034.387mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C52-1(4912.217mil,5052.1mil) on Top Layer And Track (4904.5mil,5069.813mil)(4927.961mil,5069.813mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C52-1(4912.217mil,5052.1mil) on Top Layer And Track (4927.955mil,5069.82mil)(4927.961mil,5069.813mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C52-1(4912.217mil,5052.1mil) on Top Layer And Track (4927.961mil,5034.387mil)(4927.961mil,5069.813mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C52-2(4876.787mil,5052.103mil) on Top Layer And Track (4861.039mil,5034.387mil)(4861.039mil,5069.82mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.876mil < 10mil) Between Pad C52-2(4876.787mil,5052.103mil) on Top Layer And Track (4861.039mil,5034.387mil)(4884.5mil,5034.387mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.876mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C52-2(4876.787mil,5052.103mil) on Top Layer And Track (4861.039mil,5069.813mil)(4884.5mil,5069.813mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C52-2(4876.787mil,5052.103mil) on Top Layer And Track (4894.5mil,5046.1mil)(4894.5mil,5058.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C53-1(4813.018mil,5041.108mil) on Top Layer And Track (4795.298mil,5056.846mil)(4795.305mil,5056.853mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C53-1(4813.018mil,5041.108mil) on Top Layer And Track (4795.305mil,5033.391mil)(4795.305mil,5056.853mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C53-1(4813.018mil,5041.108mil) on Top Layer And Track (4795.305mil,5056.853mil)(4830.731mil,5056.853mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C53-1(4813.018mil,5041.108mil) on Top Layer And Track (4807.018mil,5023.391mil)(4819.018mil,5023.391mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C53-1(4813.018mil,5041.108mil) on Top Layer And Track (4830.731mil,5033.391mil)(4830.731mil,5056.853mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C53-2(4813.015mil,5005.678mil) on Top Layer And Track (4795.298mil,4989.93mil)(4830.731mil,4989.93mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.869mil < 10mil) Between Pad C53-2(4813.015mil,5005.678mil) on Top Layer And Track (4795.305mil,4989.93mil)(4795.305mil,5013.391mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.869mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C53-2(4813.015mil,5005.678mil) on Top Layer And Track (4807.018mil,5023.391mil)(4819.018mil,5023.391mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C53-2(4813.015mil,5005.678mil) on Top Layer And Track (4830.731mil,4989.93mil)(4830.731mil,5013.391mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C54-1(4818.516mil,5355.599mil) on Bottom Layer And Track (4800.8mil,5349.599mil)(4800.8mil,5361.599mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C54-1(4818.516mil,5355.599mil) on Bottom Layer And Track (4810.8mil,5337.886mil)(4834.261mil,5337.886mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C54-1(4818.516mil,5355.599mil) on Bottom Layer And Track (4810.8mil,5373.312mil)(4834.261mil,5373.312mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C54-1(4818.516mil,5355.599mil) on Bottom Layer And Track (4834.255mil,5337.88mil)(4834.261mil,5337.886mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C54-1(4818.516mil,5355.599mil) on Bottom Layer And Track (4834.261mil,5337.886mil)(4834.261mil,5373.312mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.869mil < 10mil) Between Pad C54-2(4783.087mil,5355.596mil) on Bottom Layer And Track (4767.339mil,5337.886mil)(4790.8mil,5337.886mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.869mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C54-2(4783.087mil,5355.596mil) on Bottom Layer And Track (4767.339mil,5337.88mil)(4767.339mil,5373.312mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C54-2(4783.087mil,5355.596mil) on Bottom Layer And Track (4767.339mil,5373.312mil)(4790.8mil,5373.312mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C54-2(4783.087mil,5355.596mil) on Bottom Layer And Track (4800.8mil,5349.599mil)(4800.8mil,5361.599mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C55-1(4711.217mil,5045mil) on Top Layer And Track (4693.5mil,5039mil)(4693.5mil,5051mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C55-1(4711.217mil,5045mil) on Top Layer And Track (4703.5mil,5027.287mil)(4726.961mil,5027.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C55-1(4711.217mil,5045mil) on Top Layer And Track (4703.5mil,5062.713mil)(4726.961mil,5062.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C55-1(4711.217mil,5045mil) on Top Layer And Track (4726.955mil,5062.72mil)(4726.961mil,5062.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C55-1(4711.217mil,5045mil) on Top Layer And Track (4726.961mil,5027.287mil)(4726.961mil,5062.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C55-2(4675.787mil,5045.003mil) on Top Layer And Track (4660.039mil,5027.287mil)(4660.039mil,5062.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.876mil < 10mil) Between Pad C55-2(4675.787mil,5045.003mil) on Top Layer And Track (4660.039mil,5027.287mil)(4683.5mil,5027.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.876mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C55-2(4675.787mil,5045.003mil) on Top Layer And Track (4660.039mil,5062.713mil)(4683.5mil,5062.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C55-2(4675.787mil,5045.003mil) on Top Layer And Track (4693.5mil,5039mil)(4693.5mil,5051mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C56-1(4633.1mil,5293.583mil) on Bottom Layer And Track (4615.387mil,5277.839mil)(4615.387mil,5301.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C56-1(4633.1mil,5293.583mil) on Bottom Layer And Track (4615.387mil,5277.839mil)(4650.813mil,5277.839mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C56-1(4633.1mil,5293.583mil) on Bottom Layer And Track (4615.38mil,5277.845mil)(4615.387mil,5277.839mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C56-1(4633.1mil,5293.583mil) on Bottom Layer And Track (4627.1mil,5311.3mil)(4639.1mil,5311.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C56-1(4633.1mil,5293.583mil) on Bottom Layer And Track (4650.813mil,5277.839mil)(4650.813mil,5301.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C56-2(4633.097mil,5329.013mil) on Bottom Layer And Track (4615.387mil,5321.3mil)(4615.387mil,5344.761mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C56-2(4633.097mil,5329.013mil) on Bottom Layer And Track (4615.38mil,5344.761mil)(4650.813mil,5344.761mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C56-2(4633.097mil,5329.013mil) on Bottom Layer And Track (4627.1mil,5311.3mil)(4639.1mil,5311.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C56-2(4633.097mil,5329.013mil) on Bottom Layer And Track (4650.813mil,5321.3mil)(4650.813mil,5344.761mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.058mil < 10mil) Between Pad C57-1(4594.816mil,5031.3mil) on Top Layer And Track (4567.38mil,5011.399mil)(4602.813mil,5011.399mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.058mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C57-1(4594.816mil,5031.3mil) on Top Layer And Track (4577.1mil,5025.3mil)(4577.1mil,5037.3mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C57-1(4594.816mil,5031.3mil) on Top Layer And Track (4587.1mil,5013.587mil)(4610.561mil,5013.587mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C57-1(4594.816mil,5031.3mil) on Top Layer And Track (4587.1mil,5049.013mil)(4610.561mil,5049.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (7.059mil < 10mil) Between Pad C57-1(4594.816mil,5031.3mil) on Top Layer And Track (4602.813mil,4946.439mil)(4602.813mil,5011.399mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.059mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C57-1(4594.816mil,5031.3mil) on Top Layer And Track (4610.555mil,5049.02mil)(4610.561mil,5049.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C57-1(4594.816mil,5031.3mil) on Top Layer And Track (4610.561mil,5013.587mil)(4610.561mil,5049.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (5.143mil < 10mil) Between Pad C57-2(4559.387mil,5031.303mil) on Top Layer And Track (4526.4mil,5013.487mil)(4549.861mil,5013.487mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.143mil]
Silk To Solder Mask Clearance Constraint: (4.941mil < 10mil) Between Pad C57-2(4559.387mil,5031.303mil) on Top Layer And Track (4526.4mil,5048.913mil)(4549.861mil,5048.913mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.941mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C57-2(4559.387mil,5031.303mil) on Top Layer And Track (4543.639mil,5013.587mil)(4543.639mil,5049.02mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.876mil < 10mil) Between Pad C57-2(4559.387mil,5031.303mil) on Top Layer And Track (4543.639mil,5013.587mil)(4567.1mil,5013.587mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.876mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C57-2(4559.387mil,5031.303mil) on Top Layer And Track (4543.639mil,5049.013mil)(4567.1mil,5049.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.941mil < 10mil) Between Pad C57-2(4559.387mil,5031.303mil) on Top Layer And Track (4549.855mil,5048.92mil)(4549.861mil,5048.913mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.941mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C57-2(4559.387mil,5031.303mil) on Top Layer And Track (4549.861mil,5013.487mil)(4549.861mil,5048.913mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (7.062mil < 10mil) Between Pad C57-2(4559.387mil,5031.303mil) on Top Layer And Track (4567.38mil,4946.439mil)(4567.38mil,5011.399mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.062mil]
Silk To Solder Mask Clearance Constraint: (7.062mil < 10mil) Between Pad C57-2(4559.387mil,5031.303mil) on Top Layer And Track (4567.38mil,5011.399mil)(4602.813mil,5011.399mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.062mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C57-2(4559.387mil,5031.303mil) on Top Layer And Track (4577.1mil,5025.3mil)(4577.1mil,5037.3mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C58-1(4525.783mil,5304.5mil) on Bottom Layer And Track (4510.039mil,5286.787mil)(4510.039mil,5322.213mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C58-1(4525.783mil,5304.5mil) on Bottom Layer And Track (4510.039mil,5286.787mil)(4533.5mil,5286.787mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C58-1(4525.783mil,5304.5mil) on Bottom Layer And Track (4510.039mil,5322.213mil)(4510.045mil,5322.22mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C58-1(4525.783mil,5304.5mil) on Bottom Layer And Track (4510.039mil,5322.213mil)(4533.5mil,5322.213mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C58-1(4525.783mil,5304.5mil) on Bottom Layer And Track (4543.5mil,5298.5mil)(4543.5mil,5310.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (7.564mil < 10mil) Between Pad C58-2(4561.213mil,5304.503mil) on Bottom Layer And Track (4543.5mil,5298.5mil)(4543.5mil,5310.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.564mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C58-2(4561.213mil,5304.503mil) on Bottom Layer And Track (4553.5mil,5286.787mil)(4576.961mil,5286.787mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C58-2(4561.213mil,5304.503mil) on Bottom Layer And Track (4553.5mil,5322.213mil)(4576.961mil,5322.213mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C58-2(4561.213mil,5304.503mil) on Bottom Layer And Track (4576.961mil,5286.787mil)(4576.961mil,5322.22mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C59-1(4502.9mil,4897.783mil) on Bottom Layer And Track (4485.187mil,4882.039mil)(4485.187mil,4905.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C59-1(4502.9mil,4897.783mil) on Bottom Layer And Track (4485.187mil,4882.039mil)(4520.613mil,4882.039mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C59-1(4502.9mil,4897.783mil) on Bottom Layer And Track (4485.18mil,4882.045mil)(4485.187mil,4882.039mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C59-1(4502.9mil,4897.783mil) on Bottom Layer And Track (4496.9mil,4915.5mil)(4508.9mil,4915.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C59-1(4502.9mil,4897.783mil) on Bottom Layer And Track (4520.613mil,4882.039mil)(4520.613mil,4905.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (9.441mil < 10mil) Between Pad C59-1(4502.9mil,4897.783mil) on Bottom Layer And Track (4525.184mil,4882.852mil)(4525.184mil,4906.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.441mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C59-2(4502.897mil,4933.213mil) on Bottom Layer And Track (4485.187mil,4925.5mil)(4485.187mil,4948.961mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C59-2(4502.897mil,4933.213mil) on Bottom Layer And Track (4485.18mil,4948.961mil)(4520.613mil,4948.961mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C59-2(4502.897mil,4933.213mil) on Bottom Layer And Track (4496.9mil,4915.5mil)(4508.9mil,4915.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C59-2(4502.897mil,4933.213mil) on Bottom Layer And Track (4520.613mil,4925.5mil)(4520.613mil,4948.961mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.444mil < 10mil) Between Pad C59-2(4502.897mil,4933.213mil) on Bottom Layer And Track (4525.184mil,4926.313mil)(4525.184mil,4949.775mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.444mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C60-1(4490.083mil,5003.3mil) on Bottom Layer And Track (4474.339mil,4985.587mil)(4474.339mil,5021.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C60-1(4490.083mil,5003.3mil) on Bottom Layer And Track (4474.339mil,4985.587mil)(4497.8mil,4985.587mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C60-1(4490.083mil,5003.3mil) on Bottom Layer And Track (4474.339mil,5021.013mil)(4474.345mil,5021.02mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C60-1(4490.083mil,5003.3mil) on Bottom Layer And Track (4474.339mil,5021.013mil)(4497.8mil,5021.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C60-1(4490.083mil,5003.3mil) on Bottom Layer And Track (4507.8mil,4997.3mil)(4507.8mil,5009.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (7.564mil < 10mil) Between Pad C60-2(4525.513mil,5003.303mil) on Bottom Layer And Track (4507.8mil,4997.3mil)(4507.8mil,5009.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.564mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C60-2(4525.513mil,5003.303mil) on Bottom Layer And Track (4517.8mil,4985.587mil)(4541.261mil,4985.587mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C60-2(4525.513mil,5003.303mil) on Bottom Layer And Track (4517.8mil,5021.013mil)(4541.261mil,5021.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C60-2(4525.513mil,5003.303mil) on Bottom Layer And Track (4541.261mil,4985.587mil)(4541.261mil,5021.02mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.696mil < 10mil) Between Pad C6-1(4744.083mil,5774.6mil) on Bottom Layer And Track (4727.287mil,5755.061mil)(4762.713mil,5755.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.696mil]
Silk To Solder Mask Clearance Constraint: (7.572mil < 10mil) Between Pad C6-1(4744.083mil,5774.6mil) on Bottom Layer And Track (4728.239mil,5791.387mil)(4728.239mil,5826.813mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.572mil]
Silk To Solder Mask Clearance Constraint: (3.944mil < 10mil) Between Pad C6-1(4744.083mil,5774.6mil) on Bottom Layer And Track (4728.239mil,5791.387mil)(4751.7mil,5791.387mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [3.944mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C6-1(4744.083mil,5774.6mil) on Bottom Layer And Track (4728.339mil,5756.887mil)(4728.339mil,5792.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C6-1(4744.083mil,5774.6mil) on Bottom Layer And Track (4728.339mil,5756.887mil)(4751.8mil,5756.887mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C6-1(4744.083mil,5774.6mil) on Bottom Layer And Track (4728.339mil,5792.313mil)(4728.345mil,5792.32mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C6-1(4744.083mil,5774.6mil) on Bottom Layer And Track (4728.339mil,5792.313mil)(4751.8mil,5792.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C6-1(4744.083mil,5774.6mil) on Bottom Layer And Track (4761.8mil,5768.6mil)(4761.8mil,5780.6mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C61-1(4876.8mil,5509.883mil) on Bottom Layer And Track (4859.087mil,5494.139mil)(4859.087mil,5517.6mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C61-1(4876.8mil,5509.883mil) on Bottom Layer And Track (4859.087mil,5494.139mil)(4894.513mil,5494.139mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C61-1(4876.8mil,5509.883mil) on Bottom Layer And Track (4859.08mil,5494.145mil)(4859.087mil,5494.139mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C61-1(4876.8mil,5509.883mil) on Bottom Layer And Track (4870.8mil,5527.6mil)(4882.8mil,5527.6mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C61-1(4876.8mil,5509.883mil) on Bottom Layer And Track (4894.513mil,5494.139mil)(4894.513mil,5517.6mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C61-2(4876.797mil,5545.313mil) on Bottom Layer And Track (4859.087mil,5537.6mil)(4859.087mil,5561.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C61-2(4876.797mil,5545.313mil) on Bottom Layer And Track (4859.08mil,5561.061mil)(4894.513mil,5561.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C61-2(4876.797mil,5545.313mil) on Bottom Layer And Track (4870.8mil,5527.6mil)(4882.8mil,5527.6mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C61-2(4876.797mil,5545.313mil) on Bottom Layer And Track (4894.513mil,5537.6mil)(4894.513mil,5561.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.477mil < 10mil) Between Pad C6-2(4779.513mil,5774.603mil) on Bottom Layer And Text "C10" (4766mil,5778mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.477mil]
Silk To Solder Mask Clearance Constraint: (7.564mil < 10mil) Between Pad C6-2(4779.513mil,5774.603mil) on Bottom Layer And Track (4761.8mil,5768.6mil)(4761.8mil,5780.6mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.564mil]
Silk To Solder Mask Clearance Constraint: (9.488mil < 10mil) Between Pad C6-2(4779.513mil,5774.603mil) on Bottom Layer And Track (4763.087mil,5732.2mil)(4763.087mil,5755.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.488mil]
Silk To Solder Mask Clearance Constraint: (6.099mil < 10mil) Between Pad C6-2(4779.513mil,5774.603mil) on Bottom Layer And Track (4763.087mil,5755.661mil)(4798.513mil,5755.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.099mil]
Silk To Solder Mask Clearance Constraint: (3.941mil < 10mil) Between Pad C6-2(4779.513mil,5774.603mil) on Bottom Layer And Track (4771.7mil,5791.387mil)(4795.161mil,5791.387mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [3.941mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C6-2(4779.513mil,5774.603mil) on Bottom Layer And Track (4771.8mil,5756.887mil)(4795.261mil,5756.887mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C6-2(4779.513mil,5774.603mil) on Bottom Layer And Track (4771.8mil,5792.313mil)(4795.261mil,5792.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (7.422mil < 10mil) Between Pad C6-2(4779.513mil,5774.603mil) on Bottom Layer And Track (4795.161mil,5791.387mil)(4795.161mil,5826.82mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.422mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C6-2(4779.513mil,5774.603mil) on Bottom Layer And Track (4795.261mil,5756.887mil)(4795.261mil,5792.32mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C62-1(4917.8mil,5524.383mil) on Bottom Layer And Track (4900.087mil,5508.639mil)(4900.087mil,5532.1mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C62-1(4917.8mil,5524.383mil) on Bottom Layer And Track (4900.087mil,5508.639mil)(4935.513mil,5508.639mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C62-1(4917.8mil,5524.383mil) on Bottom Layer And Track (4900.08mil,5508.645mil)(4900.087mil,5508.639mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C62-1(4917.8mil,5524.383mil) on Bottom Layer And Track (4911.8mil,5542.1mil)(4923.8mil,5542.1mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C62-1(4917.8mil,5524.383mil) on Bottom Layer And Track (4935.513mil,5508.639mil)(4935.513mil,5532.1mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C62-2(4917.797mil,5559.813mil) on Bottom Layer And Track (4900.087mil,5552.1mil)(4900.087mil,5575.561mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C62-2(4917.797mil,5559.813mil) on Bottom Layer And Track (4900.08mil,5575.561mil)(4935.513mil,5575.561mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (2.799mil < 10mil) Between Pad C62-2(4917.797mil,5559.813mil) on Bottom Layer And Track (4908.7mil,5573.487mil)(4932.161mil,5573.487mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.799mil]
Silk To Solder Mask Clearance Constraint: (7.562mil < 10mil) Between Pad C62-2(4917.797mil,5559.813mil) on Bottom Layer And Track (4911.8mil,5542.1mil)(4923.8mil,5542.1mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.562mil]
Silk To Solder Mask Clearance Constraint: (4.354mil < 10mil) Between Pad C62-2(4917.797mil,5559.813mil) on Bottom Layer And Track (4932.161mil,5573.487mil)(4932.161mil,5608.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.354mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C62-2(4917.797mil,5559.813mil) on Bottom Layer And Track (4935.513mil,5552.1mil)(4935.513mil,5575.561mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.522mil < 10mil) Between Pad C63-1(4534.117mil,5031.2mil) on Top Layer And Track (4503.18mil,5009.299mil)(4538.613mil,5009.299mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.522mil]
Silk To Solder Mask Clearance Constraint: (7.566mil < 10mil) Between Pad C63-1(4534.117mil,5031.2mil) on Top Layer And Track (4516.4mil,5025.2mil)(4516.4mil,5037.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.566mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C63-1(4534.117mil,5031.2mil) on Top Layer And Track (4526.4mil,5013.487mil)(4549.861mil,5013.487mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C63-1(4534.117mil,5031.2mil) on Top Layer And Track (4526.4mil,5048.913mil)(4549.861mil,5048.913mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (9.522mil < 10mil) Between Pad C63-1(4534.117mil,5031.2mil) on Top Layer And Track (4538.613mil,4944.339mil)(4538.613mil,5009.299mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.522mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C63-1(4534.117mil,5031.2mil) on Top Layer And Track (4543.639mil,5013.587mil)(4543.639mil,5049.02mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.944mil < 10mil) Between Pad C63-1(4534.117mil,5031.2mil) on Top Layer And Track (4543.639mil,5013.587mil)(4567.1mil,5013.587mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.944mil]
Silk To Solder Mask Clearance Constraint: (5.139mil < 10mil) Between Pad C63-1(4534.117mil,5031.2mil) on Top Layer And Track (4543.639mil,5049.013mil)(4567.1mil,5049.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.139mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C63-1(4534.117mil,5031.2mil) on Top Layer And Track (4549.855mil,5048.92mil)(4549.861mil,5048.913mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C63-1(4534.117mil,5031.2mil) on Top Layer And Track (4549.861mil,5013.487mil)(4549.861mil,5048.913mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C63-2(4498.687mil,5031.203mil) on Top Layer And Track (4482.939mil,5013.487mil)(4482.939mil,5048.92mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.876mil < 10mil) Between Pad C63-2(4498.687mil,5031.203mil) on Top Layer And Track (4482.939mil,5013.487mil)(4506.4mil,5013.487mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.876mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C63-2(4498.687mil,5031.203mil) on Top Layer And Track (4482.939mil,5048.913mil)(4506.4mil,5048.913mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (9.526mil < 10mil) Between Pad C63-2(4498.687mil,5031.203mil) on Top Layer And Track (4503.18mil,4944.339mil)(4503.18mil,5009.299mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.526mil]
Silk To Solder Mask Clearance Constraint: (9.061mil < 10mil) Between Pad C63-2(4498.687mil,5031.203mil) on Top Layer And Track (4503.18mil,5009.299mil)(4538.613mil,5009.299mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.061mil]
Silk To Solder Mask Clearance Constraint: (6.839mil < 10mil) Between Pad C63-2(4498.687mil,5031.203mil) on Top Layer And Track (4516.4mil,5025.2mil)(4516.4mil,5037.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.839mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Track (5072.485mil,4839.094mil)(5198.485mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Track (5183.941mil,4763.7mil)(5183.941mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Track (5183.941mil,4839.094mil)(5309.941mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Track (5198.491mil,4763.7mil)(5198.491mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Track (5246.944mil,4743.7mil)(5246.944mil,4758.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Track (5295.397mil,4763.7mil)(5295.397mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Track (5295.397mil,4839.094mil)(5421.397mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C64-1(5246.944mil,4795.787mil) on Top Layer And Track (5309.947mil,4763.7mil)(5309.947mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C64-2(5246.944mil,4681.613mil) on Top Layer And Track (5072.485mil,4638.306mil)(5198.485mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C64-2(5246.944mil,4681.613mil) on Top Layer And Track (5183.941mil,4638.306mil)(5183.941mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C64-2(5246.944mil,4681.613mil) on Top Layer And Track (5183.941mil,4638.306mil)(5309.941mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C64-2(5246.944mil,4681.613mil) on Top Layer And Track (5198.491mil,4638.306mil)(5198.491mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C64-2(5246.944mil,4681.613mil) on Top Layer And Track (5246.944mil,4718.7mil)(5246.944mil,4733.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C64-2(5246.944mil,4681.613mil) on Top Layer And Track (5295.397mil,4638.306mil)(5295.397mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C64-2(5246.944mil,4681.613mil) on Top Layer And Track (5295.397mil,4638.306mil)(5421.397mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C64-2(5246.944mil,4681.613mil) on Top Layer And Track (5309.947mil,4638.306mil)(5309.947mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C65-1(4912.576mil,4795.787mil) on Top Layer And Track (4738.117mil,4839.094mil)(4864.117mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C65-1(4912.576mil,4795.787mil) on Top Layer And Track (4849.573mil,4763.7mil)(4849.573mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C65-1(4912.576mil,4795.787mil) on Top Layer And Track (4849.573mil,4839.094mil)(4975.573mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C65-1(4912.576mil,4795.787mil) on Top Layer And Track (4864.123mil,4763.7mil)(4864.123mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C65-1(4912.576mil,4795.787mil) on Top Layer And Track (4912.576mil,4743.7mil)(4912.576mil,4758.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C65-1(4912.576mil,4795.787mil) on Top Layer And Track (4961.029mil,4763.7mil)(4961.029mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C65-1(4912.576mil,4795.787mil) on Top Layer And Track (4961.029mil,4839.094mil)(5087.029mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C65-1(4912.576mil,4795.787mil) on Top Layer And Track (4975.579mil,4763.7mil)(4975.579mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C65-2(4912.576mil,4681.613mil) on Top Layer And Track (4738.117mil,4638.306mil)(4864.117mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C65-2(4912.576mil,4681.613mil) on Top Layer And Track (4849.573mil,4638.306mil)(4849.573mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C65-2(4912.576mil,4681.613mil) on Top Layer And Track (4849.573mil,4638.306mil)(4975.573mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C65-2(4912.576mil,4681.613mil) on Top Layer And Track (4864.123mil,4638.306mil)(4864.123mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C65-2(4912.576mil,4681.613mil) on Top Layer And Track (4912.576mil,4718.7mil)(4912.576mil,4733.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C65-2(4912.576mil,4681.613mil) on Top Layer And Track (4961.029mil,4638.306mil)(4961.029mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C65-2(4912.576mil,4681.613mil) on Top Layer And Track (4961.029mil,4638.306mil)(5087.029mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C65-2(4912.576mil,4681.613mil) on Top Layer And Track (4975.579mil,4638.306mil)(4975.579mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C66-1(4465.5mil,4775.087mil) on Top Layer And Track (4402.497mil,4743mil)(4402.497mil,4818.394mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C66-1(4465.5mil,4775.087mil) on Top Layer And Track (4402.497mil,4818.394mil)(4528.497mil,4818.394mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C66-1(4465.5mil,4775.087mil) on Top Layer And Track (4465.5mil,4723mil)(4465.5mil,4738mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C66-1(4465.5mil,4775.087mil) on Top Layer And Track (4515.205mil,4763.7mil)(4515.205mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C66-1(4465.5mil,4775.087mil) on Top Layer And Track (4528.503mil,4743mil)(4528.503mil,4818.394mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C66-2(4465.5mil,4660.913mil) on Top Layer And Track (4402.497mil,4617.606mil)(4402.497mil,4693mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C66-2(4465.5mil,4660.913mil) on Top Layer And Track (4402.497mil,4617.606mil)(4528.497mil,4617.606mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C66-2(4465.5mil,4660.913mil) on Top Layer And Track (4465.5mil,4698mil)(4465.5mil,4713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C66-2(4465.5mil,4660.913mil) on Top Layer And Track (4515.205mil,4638.306mil)(4515.205mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C66-2(4465.5mil,4660.913mil) on Top Layer And Track (4515.205mil,4638.306mil)(4641.205mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C66-2(4465.5mil,4660.913mil) on Top Layer And Track (4528.503mil,4617.606mil)(4528.503mil,4693mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Track (4961.029mil,4839.094mil)(5087.029mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Track (5072.485mil,4763.7mil)(5072.485mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Track (5072.485mil,4839.094mil)(5198.485mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Track (5087.035mil,4763.7mil)(5087.035mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Track (5135.488mil,4743.7mil)(5135.488mil,4758.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Track (5183.941mil,4763.7mil)(5183.941mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Track (5183.941mil,4839.094mil)(5309.941mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C67-1(5135.488mil,4795.787mil) on Top Layer And Track (5198.491mil,4763.7mil)(5198.491mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C67-2(5135.488mil,4681.613mil) on Top Layer And Track (4961.029mil,4638.306mil)(5087.029mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C67-2(5135.488mil,4681.613mil) on Top Layer And Track (5072.485mil,4638.306mil)(5072.485mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C67-2(5135.488mil,4681.613mil) on Top Layer And Track (5072.485mil,4638.306mil)(5198.485mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C67-2(5135.488mil,4681.613mil) on Top Layer And Track (5087.035mil,4638.306mil)(5087.035mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C67-2(5135.488mil,4681.613mil) on Top Layer And Track (5135.488mil,4718.7mil)(5135.488mil,4733.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C67-2(5135.488mil,4681.613mil) on Top Layer And Track (5183.941mil,4638.306mil)(5183.941mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C67-2(5135.488mil,4681.613mil) on Top Layer And Track (5183.941mil,4638.306mil)(5309.941mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C67-2(5135.488mil,4681.613mil) on Top Layer And Track (5198.491mil,4638.306mil)(5198.491mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C68-1(5024.032mil,4795.787mil) on Top Layer And Track (4849.573mil,4839.094mil)(4975.573mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C68-1(5024.032mil,4795.787mil) on Top Layer And Track (4961.029mil,4763.7mil)(4961.029mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C68-1(5024.032mil,4795.787mil) on Top Layer And Track (4961.029mil,4839.094mil)(5087.029mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C68-1(5024.032mil,4795.787mil) on Top Layer And Track (4975.579mil,4763.7mil)(4975.579mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C68-1(5024.032mil,4795.787mil) on Top Layer And Track (5024.032mil,4743.7mil)(5024.032mil,4758.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C68-1(5024.032mil,4795.787mil) on Top Layer And Track (5072.485mil,4763.7mil)(5072.485mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C68-1(5024.032mil,4795.787mil) on Top Layer And Track (5072.485mil,4839.094mil)(5198.485mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C68-1(5024.032mil,4795.787mil) on Top Layer And Track (5087.035mil,4763.7mil)(5087.035mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C68-2(5024.032mil,4681.613mil) on Top Layer And Track (4849.573mil,4638.306mil)(4975.573mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C68-2(5024.032mil,4681.613mil) on Top Layer And Track (4961.029mil,4638.306mil)(4961.029mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C68-2(5024.032mil,4681.613mil) on Top Layer And Track (4961.029mil,4638.306mil)(5087.029mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C68-2(5024.032mil,4681.613mil) on Top Layer And Track (4975.579mil,4638.306mil)(4975.579mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C68-2(5024.032mil,4681.613mil) on Top Layer And Track (5024.032mil,4718.7mil)(5024.032mil,4733.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C68-2(5024.032mil,4681.613mil) on Top Layer And Track (5072.485mil,4638.306mil)(5072.485mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C68-2(5024.032mil,4681.613mil) on Top Layer And Track (5072.485mil,4638.306mil)(5198.485mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C68-2(5024.032mil,4681.613mil) on Top Layer And Track (5087.035mil,4638.306mil)(5087.035mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C69-1(4801.12mil,4795.787mil) on Top Layer And Track (4626.661mil,4839.094mil)(4752.661mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C69-1(4801.12mil,4795.787mil) on Top Layer And Track (4738.117mil,4763.7mil)(4738.117mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C69-1(4801.12mil,4795.787mil) on Top Layer And Track (4738.117mil,4839.094mil)(4864.117mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C69-1(4801.12mil,4795.787mil) on Top Layer And Track (4752.667mil,4763.7mil)(4752.667mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C69-1(4801.12mil,4795.787mil) on Top Layer And Track (4801.12mil,4743.7mil)(4801.12mil,4758.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C69-1(4801.12mil,4795.787mil) on Top Layer And Track (4849.573mil,4763.7mil)(4849.573mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C69-1(4801.12mil,4795.787mil) on Top Layer And Track (4849.573mil,4839.094mil)(4975.573mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C69-1(4801.12mil,4795.787mil) on Top Layer And Track (4864.123mil,4763.7mil)(4864.123mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C69-2(4801.12mil,4681.613mil) on Top Layer And Track (4626.661mil,4638.306mil)(4752.661mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C69-2(4801.12mil,4681.613mil) on Top Layer And Track (4738.117mil,4638.306mil)(4738.117mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C69-2(4801.12mil,4681.613mil) on Top Layer And Track (4738.117mil,4638.306mil)(4864.117mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C69-2(4801.12mil,4681.613mil) on Top Layer And Track (4752.667mil,4638.306mil)(4752.667mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C69-2(4801.12mil,4681.613mil) on Top Layer And Track (4801.12mil,4718.7mil)(4801.12mil,4733.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C69-2(4801.12mil,4681.613mil) on Top Layer And Track (4849.573mil,4638.306mil)(4849.573mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C69-2(4801.12mil,4681.613mil) on Top Layer And Track (4849.573mil,4638.306mil)(4975.573mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C69-2(4801.12mil,4681.613mil) on Top Layer And Track (4864.123mil,4638.306mil)(4864.123mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C70-1(4689.664mil,4795.787mil) on Top Layer And Track (4515.205mil,4839.094mil)(4641.205mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C70-1(4689.664mil,4795.787mil) on Top Layer And Track (4626.661mil,4763.7mil)(4626.661mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C70-1(4689.664mil,4795.787mil) on Top Layer And Track (4626.661mil,4839.094mil)(4752.661mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C70-1(4689.664mil,4795.787mil) on Top Layer And Track (4641.211mil,4763.7mil)(4641.211mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C70-1(4689.664mil,4795.787mil) on Top Layer And Track (4689.664mil,4743.7mil)(4689.664mil,4758.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C70-1(4689.664mil,4795.787mil) on Top Layer And Track (4738.117mil,4763.7mil)(4738.117mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C70-1(4689.664mil,4795.787mil) on Top Layer And Track (4738.117mil,4839.094mil)(4864.117mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C70-1(4689.664mil,4795.787mil) on Top Layer And Track (4752.667mil,4763.7mil)(4752.667mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C70-2(4689.664mil,4681.613mil) on Top Layer And Track (4515.205mil,4638.306mil)(4641.205mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C70-2(4689.664mil,4681.613mil) on Top Layer And Track (4626.661mil,4638.306mil)(4626.661mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C70-2(4689.664mil,4681.613mil) on Top Layer And Track (4626.661mil,4638.306mil)(4752.661mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C70-2(4689.664mil,4681.613mil) on Top Layer And Track (4641.211mil,4638.306mil)(4641.211mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C70-2(4689.664mil,4681.613mil) on Top Layer And Track (4689.664mil,4718.7mil)(4689.664mil,4733.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C70-2(4689.664mil,4681.613mil) on Top Layer And Track (4738.117mil,4638.306mil)(4738.117mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C70-2(4689.664mil,4681.613mil) on Top Layer And Track (4738.117mil,4638.306mil)(4864.117mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C70-2(4689.664mil,4681.613mil) on Top Layer And Track (4752.667mil,4638.306mil)(4752.667mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.35mil < 10mil) Between Pad C7-1(5703.706mil,5405.2mil) on Bottom Layer And Track (5666.9mil,5385.413mil)(5690.361mil,5385.413mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.35mil]
Silk To Solder Mask Clearance Constraint: (8.979mil < 10mil) Between Pad C7-1(5703.706mil,5405.2mil) on Bottom Layer And Track (5687.539mil,5351.287mil)(5687.539mil,5386.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.979mil]
Silk To Solder Mask Clearance Constraint: (8.97mil < 10mil) Between Pad C7-1(5703.706mil,5405.2mil) on Bottom Layer And Track (5687.539mil,5386.713mil)(5687.545mil,5386.72mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.97mil]
Silk To Solder Mask Clearance Constraint: (5.664mil < 10mil) Between Pad C7-1(5703.706mil,5405.2mil) on Bottom Layer And Track (5687.539mil,5386.713mil)(5711mil,5386.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.664mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C7-1(5703.706mil,5405.2mil) on Bottom Layer And Track (5687.961mil,5387.487mil)(5687.961mil,5422.913mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C7-1(5703.706mil,5405.2mil) on Bottom Layer And Track (5687.961mil,5387.487mil)(5711.423mil,5387.487mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C7-1(5703.706mil,5405.2mil) on Bottom Layer And Track (5687.961mil,5422.913mil)(5687.968mil,5422.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C7-1(5703.706mil,5405.2mil) on Bottom Layer And Track (5687.961mil,5422.913mil)(5711.423mil,5422.913mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.35mil < 10mil) Between Pad C7-1(5703.706mil,5405.2mil) on Bottom Layer And Track (5690.361mil,5349.987mil)(5690.361mil,5385.413mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.35mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C7-1(5703.706mil,5405.2mil) on Bottom Layer And Track (5721.423mil,5399.2mil)(5721.423mil,5411.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (1.191mil < 10mil) Between Pad C71-1(4578.208mil,4795.787mil) on Top Layer And Track (4402.497mil,4818.394mil)(4528.497mil,4818.394mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [1.191mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C71-1(4578.208mil,4795.787mil) on Top Layer And Track (4515.205mil,4763.7mil)(4515.205mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C71-1(4578.208mil,4795.787mil) on Top Layer And Track (4515.205mil,4839.094mil)(4641.205mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (1.187mil < 10mil) Between Pad C71-1(4578.208mil,4795.787mil) on Top Layer And Track (4528.503mil,4743mil)(4528.503mil,4818.394mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [1.187mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C71-1(4578.208mil,4795.787mil) on Top Layer And Track (4578.208mil,4743.7mil)(4578.208mil,4758.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C71-1(4578.208mil,4795.787mil) on Top Layer And Track (4626.661mil,4763.7mil)(4626.661mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C71-1(4578.208mil,4795.787mil) on Top Layer And Track (4626.661mil,4839.094mil)(4752.661mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C71-1(4578.208mil,4795.787mil) on Top Layer And Track (4641.211mil,4763.7mil)(4641.211mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C71-2(4578.208mil,4681.613mil) on Top Layer And Track (4515.205mil,4638.306mil)(4515.205mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C71-2(4578.208mil,4681.613mil) on Top Layer And Track (4515.205mil,4638.306mil)(4641.205mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C71-2(4578.208mil,4681.613mil) on Top Layer And Track (4528.503mil,4617.606mil)(4528.503mil,4693mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C71-2(4578.208mil,4681.613mil) on Top Layer And Track (4578.208mil,4718.7mil)(4578.208mil,4733.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C71-2(4578.208mil,4681.613mil) on Top Layer And Track (4626.661mil,4638.306mil)(4626.661mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C71-2(4578.208mil,4681.613mil) on Top Layer And Track (4626.661mil,4638.306mil)(4752.661mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C71-2(4578.208mil,4681.613mil) on Top Layer And Track (4641.211mil,4638.306mil)(4641.211mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (9.76mil < 10mil) Between Pad C7-2(5739.136mil,5405.203mil) on Bottom Layer And Text "C8" (5757mil,5410mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.76mil]
Silk To Solder Mask Clearance Constraint: (7.564mil < 10mil) Between Pad C7-2(5739.136mil,5405.203mil) on Bottom Layer And Track (5721.423mil,5399.2mil)(5721.423mil,5411.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.564mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C7-2(5739.136mil,5405.203mil) on Bottom Layer And Track (5731.423mil,5387.487mil)(5754.884mil,5387.487mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C7-2(5739.136mil,5405.203mil) on Bottom Layer And Track (5731.423mil,5422.913mil)(5754.884mil,5422.913mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (5.647mil < 10mil) Between Pad C7-2(5739.136mil,5405.203mil) on Bottom Layer And Track (5731mil,5386.713mil)(5754.461mil,5386.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.647mil]
Silk To Solder Mask Clearance Constraint: (8.41mil < 10mil) Between Pad C7-2(5739.136mil,5405.203mil) on Bottom Layer And Track (5754.461mil,5351.287mil)(5754.461mil,5386.72mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.41mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C7-2(5739.136mil,5405.203mil) on Bottom Layer And Track (5754.884mil,5387.487mil)(5754.884mil,5422.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (3.557mil < 10mil) Between Pad C7-2(5739.136mil,5405.203mil) on Bottom Layer And Track (5755.567mil,5296.898mil)(5755.567mil,5401.898mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [3.557mil]
Silk To Solder Mask Clearance Constraint: (3.557mil < 10mil) Between Pad C7-2(5739.136mil,5405.203mil) on Bottom Layer And Track (5755.567mil,5401.898mil)(5769.567mil,5401.898mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [3.557mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C72-1(4320.9mil,4698.087mil) on Top Layer And Track (4257.897mil,4666mil)(4257.897mil,4741.394mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C72-1(4320.9mil,4698.087mil) on Top Layer And Track (4257.897mil,4741.394mil)(4383.897mil,4741.394mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C72-1(4320.9mil,4698.087mil) on Top Layer And Track (4320.9mil,4646mil)(4320.9mil,4661mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C72-1(4320.9mil,4698.087mil) on Top Layer And Track (4383.903mil,4666mil)(4383.903mil,4741.394mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (0.536mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Track (4193.651mil,4457.74mil)(4281.178mil,4548.377mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.536mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Track (4226.949mil,4600.754mil)(4281.183mil,4548.381mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Track (4257.897mil,4540.606mil)(4257.897mil,4616mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Track (4257.897mil,4540.606mil)(4383.897mil,4540.606mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Track (4320.9mil,4621mil)(4320.9mil,4636mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C72-2(4320.9mil,4583.913mil) on Top Layer And Track (4383.903mil,4540.606mil)(4383.903mil,4616mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C73-1(4124.135mil,4612.456mil) on Top Layer And Track (4049.217mil,4597.219mil)(4103.451mil,4544.846mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C73-1(4124.135mil,4612.456mil) on Top Layer And Track (4049.217mil,4597.219mil)(4136.744mil,4687.855mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C73-1(4124.135mil,4612.456mil) on Top Layer And Track (4136.748mil,4687.86mil)(4190.983mil,4635.487mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C73-1(4124.135mil,4612.456mil) on Top Layer And Track (4150.813mil,4586.693mil)(4161.603mil,4576.273mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C73-2(4206.265mil,4533.144mil) on Top Layer And Track (3821mil,4480mil)(4235mil,4480mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C73-2(4206.265mil,4533.144mil) on Top Layer And Track (4139.417mil,4510.113mil)(4193.651mil,4457.74mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C73-2(4206.265mil,4533.144mil) on Top Layer And Track (4168.797mil,4569.327mil)(4179.587mil,4558.907mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C73-2(4206.265mil,4533.144mil) on Top Layer And Track (4193.651mil,4457.74mil)(4281.178mil,4548.377mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C73-2(4206.265mil,4533.144mil) on Top Layer And Track (4226.949mil,4600.754mil)(4281.183mil,4548.381mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C73-2(4206.265mil,4533.144mil) on Top Layer And Track (4257.897mil,4540.606mil)(4257.897mil,4616mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C73-2(4206.265mil,4533.144mil) on Top Layer And Track (4257.897mil,4540.606mil)(4383.897mil,4540.606mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C74-1(5358.4mil,4795.787mil) on Top Layer And Track (5183.941mil,4839.094mil)(5309.941mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C74-1(5358.4mil,4795.787mil) on Top Layer And Track (5295.397mil,4763.7mil)(5295.397mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C74-1(5358.4mil,4795.787mil) on Top Layer And Track (5295.397mil,4839.094mil)(5421.397mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C74-1(5358.4mil,4795.787mil) on Top Layer And Track (5309.947mil,4763.7mil)(5309.947mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C74-1(5358.4mil,4795.787mil) on Top Layer And Track (5358.4mil,4743.7mil)(5358.4mil,4758.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C74-1(5358.4mil,4795.787mil) on Top Layer And Track (5406.853mil,4763.7mil)(5406.853mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C74-1(5358.4mil,4795.787mil) on Top Layer And Track (5406.853mil,4839.094mil)(5532.853mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C74-1(5358.4mil,4795.787mil) on Top Layer And Track (5421.403mil,4763.7mil)(5421.403mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C74-2(5358.4mil,4681.613mil) on Top Layer And Track (5183.941mil,4638.306mil)(5309.941mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C74-2(5358.4mil,4681.613mil) on Top Layer And Track (5295.397mil,4638.306mil)(5295.397mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C74-2(5358.4mil,4681.613mil) on Top Layer And Track (5295.397mil,4638.306mil)(5421.397mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C74-2(5358.4mil,4681.613mil) on Top Layer And Track (5309.947mil,4638.306mil)(5309.947mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C74-2(5358.4mil,4681.613mil) on Top Layer And Track (5358.4mil,4718.7mil)(5358.4mil,4733.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C74-2(5358.4mil,4681.613mil) on Top Layer And Track (5406.853mil,4638.306mil)(5406.853mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C74-2(5358.4mil,4681.613mil) on Top Layer And Track (5406.853mil,4638.306mil)(5532.853mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C74-2(5358.4mil,4681.613mil) on Top Layer And Track (5421.403mil,4638.306mil)(5421.403mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C75-1(5469.856mil,4795.787mil) on Top Layer And Track (5295.397mil,4839.094mil)(5421.397mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C75-1(5469.856mil,4795.787mil) on Top Layer And Track (5406.853mil,4763.7mil)(5406.853mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C75-1(5469.856mil,4795.787mil) on Top Layer And Track (5406.853mil,4839.094mil)(5532.853mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C75-1(5469.856mil,4795.787mil) on Top Layer And Track (5421.403mil,4763.7mil)(5421.403mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C75-1(5469.856mil,4795.787mil) on Top Layer And Track (5469.856mil,4743.7mil)(5469.856mil,4758.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C75-1(5469.856mil,4795.787mil) on Top Layer And Track (5532.859mil,4763.7mil)(5532.859mil,4839.094mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C75-2(5469.856mil,4681.613mil) on Top Layer And Text "C76" (5465mil,4658mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C75-2(5469.856mil,4681.613mil) on Top Layer And Track (5295.397mil,4638.306mil)(5421.397mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C75-2(5469.856mil,4681.613mil) on Top Layer And Track (5406.853mil,4638.306mil)(5406.853mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C75-2(5469.856mil,4681.613mil) on Top Layer And Track (5406.853mil,4638.306mil)(5532.853mil,4638.306mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad C75-2(5469.856mil,4681.613mil) on Top Layer And Track (5421.403mil,4638.306mil)(5421.403mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C75-2(5469.856mil,4681.613mil) on Top Layer And Track (5469.856mil,4718.7mil)(5469.856mil,4733.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C75-2(5469.856mil,4681.613mil) on Top Layer And Track (5532.859mil,4638.306mil)(5532.859mil,4713.7mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C76-1(5627.086mil,4570mil) on Top Layer And Track (5575mil,4570mil)(5590mil,4570mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C76-1(5627.086mil,4570mil) on Top Layer And Track (5595mil,4506.997mil)(5670.394mil,4506.997mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C76-1(5627.086mil,4570mil) on Top Layer And Track (5595mil,4633.003mil)(5670.394mil,4633.003mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C76-1(5627.086mil,4570mil) on Top Layer And Track (5670.394mil,4507.003mil)(5670.394mil,4633.003mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C76-2(5512.913mil,4570mil) on Top Layer And Track (5469.606mil,4506.997mil)(5545mil,4506.997mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (8.307mil < 10mil) Between Pad C76-2(5512.913mil,4570mil) on Top Layer And Track (5469.606mil,4507.003mil)(5469.606mil,4633.003mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.307mil]
Silk To Solder Mask Clearance Constraint: (8.003mil < 10mil) Between Pad C76-2(5512.913mil,4570mil) on Top Layer And Track (5469.606mil,4633.003mil)(5545mil,4633.003mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.003mil]
Silk To Solder Mask Clearance Constraint: (4.087mil < 10mil) Between Pad C76-2(5512.913mil,4570mil) on Top Layer And Track (5550mil,4570mil)(5565mil,4570mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.087mil]
Silk To Solder Mask Clearance Constraint: (7.468mil < 10mil) Between Pad C8-1(5703.283mil,5369mil) on Bottom Layer And Track (5666.9mil,5349.987mil)(5690.361mil,5349.987mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.468mil]
Silk To Solder Mask Clearance Constraint: (5.286mil < 10mil) Between Pad C8-1(5703.283mil,5369mil) on Bottom Layer And Track (5666.9mil,5385.413mil)(5690.361mil,5385.413mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.286mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C8-1(5703.283mil,5369mil) on Bottom Layer And Track (5687.539mil,5351.287mil)(5687.539mil,5386.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C8-1(5703.283mil,5369mil) on Bottom Layer And Track (5687.539mil,5351.287mil)(5711mil,5351.287mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C8-1(5703.283mil,5369mil) on Bottom Layer And Track (5687.539mil,5386.713mil)(5687.545mil,5386.72mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C8-1(5703.283mil,5369mil) on Bottom Layer And Track (5687.539mil,5386.713mil)(5711mil,5386.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (8.41mil < 10mil) Between Pad C8-1(5703.283mil,5369mil) on Bottom Layer And Track (5687.961mil,5387.487mil)(5687.961mil,5422.913mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.41mil]
Silk To Solder Mask Clearance Constraint: (5.644mil < 10mil) Between Pad C8-1(5703.283mil,5369mil) on Bottom Layer And Track (5687.961mil,5387.487mil)(5711.423mil,5387.487mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.644mil]
Silk To Solder Mask Clearance Constraint: (7.468mil < 10mil) Between Pad C8-1(5703.283mil,5369mil) on Bottom Layer And Track (5690.355mil,5349.98mil)(5690.361mil,5349.987mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.468mil]
Silk To Solder Mask Clearance Constraint: (2.048mil < 10mil) Between Pad C8-1(5703.283mil,5369mil) on Bottom Layer And Track (5690.361mil,5349.987mil)(5690.361mil,5385.413mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.048mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C8-1(5703.283mil,5369mil) on Bottom Layer And Track (5721mil,5363mil)(5721mil,5375mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (7.564mil < 10mil) Between Pad C8-2(5738.713mil,5369.003mil) on Bottom Layer And Track (5721mil,5363mil)(5721mil,5375mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.564mil]
Silk To Solder Mask Clearance Constraint: (5.641mil < 10mil) Between Pad C8-2(5738.713mil,5369.003mil) on Bottom Layer And Track (5731.423mil,5387.487mil)(5754.884mil,5387.487mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.641mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C8-2(5738.713mil,5369.003mil) on Bottom Layer And Track (5731mil,5351.287mil)(5754.461mil,5351.287mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C8-2(5738.713mil,5369.003mil) on Bottom Layer And Track (5731mil,5386.713mil)(5754.461mil,5386.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C8-2(5738.713mil,5369.003mil) on Bottom Layer And Track (5754.461mil,5351.287mil)(5754.461mil,5386.72mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.979mil < 10mil) Between Pad C8-2(5738.713mil,5369.003mil) on Bottom Layer And Track (5754.884mil,5387.487mil)(5754.884mil,5422.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.979mil]
Silk To Solder Mask Clearance Constraint: (3.98mil < 10mil) Between Pad C8-2(5738.713mil,5369.003mil) on Bottom Layer And Track (5755.567mil,5296.898mil)(5755.567mil,5401.898mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [3.98mil]
Silk To Solder Mask Clearance Constraint: (6.573mil < 10mil) Between Pad C9-1(4743.984mil,5809.1mil) on Bottom Layer And Track (4728.101mil,5824.187mil)(4728.101mil,5859.62mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.573mil]
Silk To Solder Mask Clearance Constraint: (2.244mil < 10mil) Between Pad C9-1(4743.984mil,5809.1mil) on Bottom Layer And Track (4728.101mil,5824.187mil)(4793.061mil,5824.187mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.244mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C9-1(4743.984mil,5809.1mil) on Bottom Layer And Track (4728.239mil,5791.387mil)(4728.239mil,5826.813mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (4.872mil < 10mil) Between Pad C9-1(4743.984mil,5809.1mil) on Bottom Layer And Track (4728.239mil,5791.387mil)(4751.7mil,5791.387mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.872mil]
Silk To Solder Mask Clearance Constraint: (8.131mil < 10mil) Between Pad C9-1(4743.984mil,5809.1mil) on Bottom Layer And Track (4728.239mil,5826.813mil)(4728.245mil,5826.82mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.131mil]
Silk To Solder Mask Clearance Constraint: (4.871mil < 10mil) Between Pad C9-1(4743.984mil,5809.1mil) on Bottom Layer And Track (4728.239mil,5826.813mil)(4751.7mil,5826.813mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.871mil]
Silk To Solder Mask Clearance Constraint: (7.422mil < 10mil) Between Pad C9-1(4743.984mil,5809.1mil) on Bottom Layer And Track (4728.339mil,5756.887mil)(4728.339mil,5792.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.422mil]
Silk To Solder Mask Clearance Constraint: (7.412mil < 10mil) Between Pad C9-1(4743.984mil,5809.1mil) on Bottom Layer And Track (4728.339mil,5792.313mil)(4728.345mil,5792.32mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.412mil]
Silk To Solder Mask Clearance Constraint: (3.944mil < 10mil) Between Pad C9-1(4743.984mil,5809.1mil) on Bottom Layer And Track (4728.339mil,5792.313mil)(4751.8mil,5792.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [3.944mil]
Silk To Solder Mask Clearance Constraint: (6.843mil < 10mil) Between Pad C9-1(4743.984mil,5809.1mil) on Bottom Layer And Track (4761.7mil,5803.1mil)(4761.7mil,5815.1mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.843mil]
Silk To Solder Mask Clearance Constraint: (2.241mil < 10mil) Between Pad C9-2(4779.413mil,5809.103mil) on Bottom Layer And Track (4728.101mil,5824.187mil)(4793.061mil,5824.187mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.241mil]
Silk To Solder Mask Clearance Constraint: (7.564mil < 10mil) Between Pad C9-2(4779.413mil,5809.103mil) on Bottom Layer And Track (4761.7mil,5803.1mil)(4761.7mil,5815.1mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.564mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C9-2(4779.413mil,5809.103mil) on Bottom Layer And Track (4771.7mil,5791.387mil)(4795.161mil,5791.387mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.868mil < 10mil) Between Pad C9-2(4779.413mil,5809.103mil) on Bottom Layer And Track (4771.7mil,5826.813mil)(4795.161mil,5826.813mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.868mil]
Silk To Solder Mask Clearance Constraint: (3.947mil < 10mil) Between Pad C9-2(4779.413mil,5809.103mil) on Bottom Layer And Track (4771.8mil,5792.313mil)(4795.261mil,5792.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [3.947mil]
Silk To Solder Mask Clearance Constraint: (4.798mil < 10mil) Between Pad C9-2(4779.413mil,5809.103mil) on Bottom Layer And Track (4793.061mil,5824.187mil)(4793.061mil,5859.62mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.798mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad C9-2(4779.413mil,5809.103mil) on Bottom Layer And Track (4795.161mil,5791.387mil)(4795.161mil,5826.82mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.572mil < 10mil) Between Pad C9-2(4779.413mil,5809.103mil) on Bottom Layer And Track (4795.261mil,5756.887mil)(4795.261mil,5792.32mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.572mil]
Silk To Solder Mask Clearance Constraint: (6.042mil < 10mil) Between Pad D1-1(5503.4mil,5514.918mil) on Bottom Layer And Track (5460.139mil,5542.687mil)(5483.6mil,5542.687mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.042mil]
Silk To Solder Mask Clearance Constraint: (4.697mil < 10mil) Between Pad D1-1(5503.4mil,5514.918mil) on Bottom Layer And Track (5473.4mil,5542.8mil)(5533.4mil,5542.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.697mil]
Silk To Solder Mask Clearance Constraint: (5.084mil < 10mil) Between Pad D1-1(5503.4mil,5514.918mil) on Bottom Layer And Track (5503.6mil,5542.687mil)(5527.061mil,5542.687mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.084mil]
Silk To Solder Mask Clearance Constraint: (8.303mil < 10mil) Between Pad D1-1(5503.4mil,5514.918mil) on Bottom Layer And Track (5527.055mil,5542.68mil)(5527.061mil,5542.687mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.303mil]
Silk To Solder Mask Clearance Constraint: (8.312mil < 10mil) Between Pad D1-1(5503.4mil,5514.918mil) on Bottom Layer And Track (5527.061mil,5542.687mil)(5527.061mil,5578.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.312mil]
Silk To Solder Mask Clearance Constraint: (5.037mil < 10mil) Between Pad D1-2(5503.4mil,5404.682mil) on Bottom Layer And Track (5471.139mil,5377.013mil)(5494.6mil,5377.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.037mil]
Silk To Solder Mask Clearance Constraint: (5.214mil < 10mil) Between Pad D1-2(5503.4mil,5404.682mil) on Bottom Layer And Track (5473.4mil,5394.8mil)(5491.4mil,5376.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.214mil]
Silk To Solder Mask Clearance Constraint: (4.697mil < 10mil) Between Pad D1-2(5503.4mil,5404.682mil) on Bottom Layer And Track (5491.4mil,5376.8mil)(5516.4mil,5376.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.697mil]
Silk To Solder Mask Clearance Constraint: (5.649mil < 10mil) Between Pad D1-2(5503.4mil,5404.682mil) on Bottom Layer And Track (5514.6mil,5377.013mil)(5538.061mil,5377.013mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.649mil]
Silk To Solder Mask Clearance Constraint: (5.921mil < 10mil) Between Pad D1-2(5503.4mil,5404.682mil) on Bottom Layer And Track (5516.4mil,5376.8mil)(5533.4mil,5393.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.921mil]
Silk To Solder Mask Clearance Constraint: (6.811mil < 10mil) Between Pad D6-1(4432.814mil,4969.7mil) on Top Layer And Track (4432.814mil,4916.55mil)(4432.814mil,4926.393mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.811mil]
Silk To Solder Mask Clearance Constraint: (6.811mil < 10mil) Between Pad D6-1(4432.814mil,4969.7mil) on Top Layer And Track (4432.814mil,5013.007mil)(4432.814mil,5022.85mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.811mil]
Silk To Solder Mask Clearance Constraint: (6.811mil < 10mil) Between Pad D6-2(4259.586mil,4969.7mil) on Top Layer And Track (4259.586mil,4916.55mil)(4259.586mil,4926.393mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.811mil]
Silk To Solder Mask Clearance Constraint: (6.811mil < 10mil) Between Pad D6-2(4259.586mil,4969.7mil) on Top Layer And Track (4259.586mil,5013.007mil)(4259.586mil,5022.85mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.811mil]
Silk To Solder Mask Clearance Constraint: (6.109mil < 10mil) Between Pad E1-2(4457.61mil,5307.8mil) on Top Layer And Track (4441.013mil,5361.216mil)(4441.013mil,5463.578mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.109mil]
Silk To Solder Mask Clearance Constraint: (6.109mil < 10mil) Between Pad E1-2(4457.61mil,5307.8mil) on Top Layer And Track (4441.013mil,5361.216mil)(4492.194mil,5361.216mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.109mil]
Silk To Solder Mask Clearance Constraint: (6.109mil < 10mil) Between Pad E1-2(4457.61mil,5307.8mil) on Top Layer And Track (4492.194mil,5361.216mil)(4492.194mil,5463.578mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.109mil]
Silk To Solder Mask Clearance Constraint: (8.583mil < 10mil) Between Pad E1-2(4457.61mil,5307.8mil) on Top Layer And Track (4514.5mil,5237.8mil)(4514.5mil,5377.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.583mil]
Silk To Solder Mask Clearance Constraint: (3.977mil < 10mil) Between Pad IC1-1(5489.4mil,5085.453mil) on Top Layer And Track (5465.975mil,5128.8mil)(5662.825mil,5128.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.977mil]
Silk To Solder Mask Clearance Constraint: (6.696mil < 10mil) Between Pad IC1-2(5539.4mil,5085.453mil) on Top Layer And Track (5465.975mil,5128.8mil)(5662.825mil,5128.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.696mil]
Silk To Solder Mask Clearance Constraint: (6.696mil < 10mil) Between Pad IC1-3(5589.4mil,5085.453mil) on Top Layer And Track (5465.975mil,5128.8mil)(5662.825mil,5128.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.696mil]
Silk To Solder Mask Clearance Constraint: (6.696mil < 10mil) Between Pad IC1-4(5639.4mil,5085.453mil) on Top Layer And Track (5465.975mil,5128.8mil)(5662.825mil,5128.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.696mil]
Silk To Solder Mask Clearance Constraint: (6.277mil < 10mil) Between Pad IC1-5(5639.4mil,5292.146mil) on Top Layer And Track (5465.975mil,5248.8mil)(5662.825mil,5248.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.277mil]
Silk To Solder Mask Clearance Constraint: (6.277mil < 10mil) Between Pad IC1-6(5589.4mil,5292.146mil) on Top Layer And Track (5465.975mil,5248.8mil)(5662.825mil,5248.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.277mil]
Silk To Solder Mask Clearance Constraint: (6.277mil < 10mil) Between Pad IC1-7(5539.4mil,5292.146mil) on Top Layer And Track (5465.975mil,5248.8mil)(5662.825mil,5248.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.277mil]
Silk To Solder Mask Clearance Constraint: (9.981mil < 10mil) Between Pad IC1-7(5539.4mil,5292.146mil) on Top Layer And Track (5524.6mil,5340.487mil)(5548.061mil,5340.487mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.981mil]
Silk To Solder Mask Clearance Constraint: (6.277mil < 10mil) Between Pad IC1-8(5489.4mil,5292.146mil) on Top Layer And Track (5465.975mil,5248.8mil)(5662.825mil,5248.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.277mil]
Silk To Solder Mask Clearance Constraint: (9.981mil < 10mil) Between Pad IC1-8(5489.4mil,5292.146mil) on Top Layer And Track (5481.139mil,5340.487mil)(5504.6mil,5340.487mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.981mil]
Silk To Solder Mask Clearance Constraint: (4.961mil < 10mil) Between Pad IC2-1(5281.5mil,5195.925mil) on Bottom Layer And Track (5258.075mil,5157.5mil)(5454.925mil,5157.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.961mil]
Silk To Solder Mask Clearance Constraint: (7.052mil < 10mil) Between Pad IC2-2(5331.5mil,5195.925mil) on Bottom Layer And Track (5258.075mil,5157.5mil)(5454.925mil,5157.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.052mil]
Silk To Solder Mask Clearance Constraint: (7.052mil < 10mil) Between Pad IC2-3(5381.5mil,5195.925mil) on Bottom Layer And Track (5258.075mil,5157.5mil)(5454.925mil,5157.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.052mil]
Silk To Solder Mask Clearance Constraint: (7.052mil < 10mil) Between Pad IC2-4(5431.5mil,5195.925mil) on Bottom Layer And Track (5258.075mil,5157.5mil)(5454.925mil,5157.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.052mil]
Silk To Solder Mask Clearance Constraint: (7.433mil < 10mil) Between Pad IC2-5(5431.5mil,4999.075mil) on Bottom Layer And Track (5258.075mil,5037.5mil)(5454.925mil,5037.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.433mil]
Silk To Solder Mask Clearance Constraint: (7.433mil < 10mil) Between Pad IC2-6(5381.5mil,4999.075mil) on Bottom Layer And Track (5258.075mil,5037.5mil)(5454.925mil,5037.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.433mil]
Silk To Solder Mask Clearance Constraint: (7.433mil < 10mil) Between Pad IC2-7(5331.5mil,4999.075mil) on Bottom Layer And Track (5258.075mil,5037.5mil)(5454.925mil,5037.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.433mil]
Silk To Solder Mask Clearance Constraint: (7.433mil < 10mil) Between Pad IC2-8(5281.5mil,4999.075mil) on Bottom Layer And Track (5258.075mil,5037.5mil)(5454.925mil,5037.5mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.433mil]
Silk To Solder Mask Clearance Constraint: (7.955mil < 10mil) Between Pad IC3-1(5276.2mil,5085.053mil) on Top Layer And Text "C36" (5276.03mil,5041.545mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.955mil]
Silk To Solder Mask Clearance Constraint: (7.154mil < 10mil) Between Pad IC3-1(5276.2mil,5085.053mil) on Top Layer And Track (5219.787mil,5060.401mil)(5255.22mil,5060.401mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.154mil]
Silk To Solder Mask Clearance Constraint: (8.263mil < 10mil) Between Pad IC3-1(5276.2mil,5085.053mil) on Top Layer And Track (5219.787mil,5125.361mil)(5255.22mil,5125.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.263mil]
Silk To Solder Mask Clearance Constraint: (3.977mil < 10mil) Between Pad IC3-1(5276.2mil,5085.053mil) on Top Layer And Track (5252.775mil,5128.4mil)(5449.625mil,5128.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.977mil]
Silk To Solder Mask Clearance Constraint: (7.154mil < 10mil) Between Pad IC3-1(5276.2mil,5085.053mil) on Top Layer And Track (5255.22mil,5060.401mil)(5255.22mil,5125.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.154mil]
Silk To Solder Mask Clearance Constraint: (6.696mil < 10mil) Between Pad IC3-2(5326.2mil,5085.053mil) on Top Layer And Track (5252.775mil,5128.4mil)(5449.625mil,5128.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.696mil]
Silk To Solder Mask Clearance Constraint: (6.696mil < 10mil) Between Pad IC3-3(5376.2mil,5085.053mil) on Top Layer And Track (5252.775mil,5128.4mil)(5449.625mil,5128.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.696mil]
Silk To Solder Mask Clearance Constraint: (6.696mil < 10mil) Between Pad IC3-4(5426.2mil,5085.053mil) on Top Layer And Track (5252.775mil,5128.4mil)(5449.625mil,5128.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.696mil]
Silk To Solder Mask Clearance Constraint: (6.277mil < 10mil) Between Pad IC3-5(5426.2mil,5291.747mil) on Top Layer And Track (5252.775mil,5248.4mil)(5449.625mil,5248.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.277mil]
Silk To Solder Mask Clearance Constraint: (6.277mil < 10mil) Between Pad IC3-6(5376.2mil,5291.747mil) on Top Layer And Track (5252.775mil,5248.4mil)(5449.625mil,5248.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.277mil]
Silk To Solder Mask Clearance Constraint: (6.277mil < 10mil) Between Pad IC3-7(5326.2mil,5291.747mil) on Top Layer And Track (5252.775mil,5248.4mil)(5449.625mil,5248.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.277mil]
Silk To Solder Mask Clearance Constraint: (6.277mil < 10mil) Between Pad IC3-8(5276.2mil,5291.747mil) on Top Layer And Track (5252.775mil,5248.4mil)(5449.625mil,5248.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.277mil]
Silk To Solder Mask Clearance Constraint: (3.977mil < 10mil) Between Pad IC4-1(5639.4mil,5085.453mil) on Bottom Layer And Track (5465.975mil,5128.8mil)(5662.825mil,5128.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [3.977mil]
Silk To Solder Mask Clearance Constraint: (8.65mil < 10mil) Between Pad IC4-2(5589.4mil,5085.453mil) on Bottom Layer And Text "R22" (5570mil,5060mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.65mil]
Silk To Solder Mask Clearance Constraint: (6.696mil < 10mil) Between Pad IC4-2(5589.4mil,5085.453mil) on Bottom Layer And Track (5465.975mil,5128.8mil)(5662.825mil,5128.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.696mil]
Silk To Solder Mask Clearance Constraint: (9.895mil < 10mil) Between Pad IC4-2(5589.4mil,5085.453mil) on Bottom Layer And Track (5572.387mil,5037.199mil)(5607.82mil,5037.199mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.895mil]
Silk To Solder Mask Clearance Constraint: (9.668mil < 10mil) Between Pad IC4-3(5539.4mil,5085.453mil) on Bottom Layer And Text "C25" (5519mil,5061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.668mil]
Silk To Solder Mask Clearance Constraint: (6.696mil < 10mil) Between Pad IC4-3(5539.4mil,5085.453mil) on Bottom Layer And Track (5465.975mil,5128.8mil)(5662.825mil,5128.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.696mil]
Silk To Solder Mask Clearance Constraint: (9.558mil < 10mil) Between Pad IC4-3(5539.4mil,5085.453mil) on Bottom Layer And Track (5521.88mil,5038.161mil)(5557.313mil,5038.161mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.558mil]
Silk To Solder Mask Clearance Constraint: (6.696mil < 10mil) Between Pad IC4-4(5489.4mil,5085.453mil) on Bottom Layer And Track (5465.975mil,5128.8mil)(5662.825mil,5128.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.696mil]
Silk To Solder Mask Clearance Constraint: (4.379mil < 10mil) Between Pad IC4-5(5489.4mil,5292.146mil) on Bottom Layer And Text "D1" (5486.684mil,5313.385mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.379mil]
Silk To Solder Mask Clearance Constraint: (6.277mil < 10mil) Between Pad IC4-5(5489.4mil,5292.146mil) on Bottom Layer And Track (5465.975mil,5248.8mil)(5662.825mil,5248.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.277mil]
Silk To Solder Mask Clearance Constraint: (6.277mil < 10mil) Between Pad IC4-6(5539.4mil,5292.146mil) on Bottom Layer And Track (5465.975mil,5248.8mil)(5662.825mil,5248.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.277mil]
Silk To Solder Mask Clearance Constraint: (6.277mil < 10mil) Between Pad IC4-7(5589.4mil,5292.146mil) on Bottom Layer And Track (5465.975mil,5248.8mil)(5662.825mil,5248.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.277mil]
Silk To Solder Mask Clearance Constraint: (6.277mil < 10mil) Between Pad IC4-8(5639.4mil,5292.146mil) on Bottom Layer And Track (5465.975mil,5248.8mil)(5662.825mil,5248.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.277mil]
Silk To Solder Mask Clearance Constraint: (5.945mil < 10mil) Between Pad JP1-0(5832.6mil,5039.838mil) on Top Layer And Track (5748.6mil,5016.168mil)(5762.6mil,5016.168mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.945mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad JP1-0(5832.6mil,5404.562mil) on Top Layer And Track (4742.653mil,5447.24mil)(5923.765mil,5447.24mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.112mil < 10mil) Between Pad JP1-0(5832.6mil,5404.562mil) on Top Layer And Track (5748.6mil,5436.712mil)(5762.6mil,5436.712mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.112mil]
Silk To Solder Mask Clearance Constraint: (7.221mil < 10mil) Between Pad JP10-1(4085mil,5820mil) on Top Layer And Text "GND" (4056.7mil,5792.082mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.221mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP10-1(4085mil,5820mil) on Top Layer And Track (4035mil,5900mil)(4055mil,5900mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP10-1(4085mil,5820mil) on Top Layer And Track (4055mil,5900mil)(4055mil,5920mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP10-1(4085mil,5820mil) on Top Layer And Track (4115mil,5900mil)(4115mil,5920mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP10-1(4085mil,5820mil) on Top Layer And Track (4115mil,5900mil)(4135mil,5900mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (7.204mil < 10mil) Between Pad JP10-3(4285mil,5820mil) on Top Layer And Text "IO 4" (4256.745mil,5792.082mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.204mil]
Silk To Solder Mask Clearance Constraint: (6.947mil < 10mil) Between Pad JP1-1(5721.947mil,5147.838mil) on Top Layer And Track (5748.6mil,5016.168mil)(5748.6mil,5121.168mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.947mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP11-1(4485mil,5820mil) on Bottom Layer And Track (4435mil,5900mil)(4455mil,5900mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP11-1(4485mil,5820mil) on Bottom Layer And Track (4455mil,5900mil)(4455mil,5920mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP11-1(4485mil,5820mil) on Bottom Layer And Track (4515mil,5900mil)(4515mil,5920mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP11-1(4485mil,5820mil) on Bottom Layer And Track (4515mil,5900mil)(4535mil,5900mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (6.649mil < 10mil) Between Pad JP11-3(4285mil,5820mil) on Bottom Layer And Text "IO 5" (4256.8mil,5855.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.649mil]
Silk To Solder Mask Clearance Constraint: (6.549mil < 10mil) Between Pad JP11-5(4085mil,5820mil) on Bottom Layer And Text "IO 9" (4056.9mil,5855.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.549mil]
Silk To Solder Mask Clearance Constraint: (2.383mil < 10mil) Between Pad JP1-4(5721.947mil,5295.476mil) on Top Layer And Text "DAC2" (5666.877mil,5315.106mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.383mil]
Silk To Solder Mask Clearance Constraint: (5.945mil < 10mil) Between Pad JP2-0(5828.74mil,4490.866mil) on Top Layer And Track (5744.74mil,4467.197mil)(5758.74mil,4467.197mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.945mil]
Silk To Solder Mask Clearance Constraint: (5.945mil < 10mil) Between Pad JP2-0(5828.74mil,4954.016mil) on Top Layer And Track (5744.74mil,4976.165mil)(5758.74mil,4976.165mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.945mil]
Silk To Solder Mask Clearance Constraint: (6.947mil < 10mil) Between Pad JP2-1(5718.087mil,4598.866mil) on Top Layer And Track (5744.74mil,4467.197mil)(5744.74mil,4572.197mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.947mil]
Silk To Solder Mask Clearance Constraint: (5.488mil < 10mil) Between Pad JP2-6(5718.087mil,4844.929mil) on Top Layer And Track (5744.74mil,4871.165mil)(5744.74mil,4976.165mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.488mil]
Silk To Solder Mask Clearance Constraint: (5.945mil < 10mil) Between Pad JP3-0(5839.567mil,4564.685mil) on Bottom Layer And Track (5755.567mil,4532.535mil)(5769.567mil,4532.535mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.945mil]
Silk To Solder Mask Clearance Constraint: (5.945mil < 10mil) Between Pad JP3-0(5839.567mil,4929.409mil) on Bottom Layer And Track (5755.567mil,4953.079mil)(5769.567mil,4953.079mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.945mil]
Silk To Solder Mask Clearance Constraint: (5.921mil < 10mil) Between Pad JP3-1(5728.913mil,4821.409mil) on Bottom Layer And Track (5755.567mil,4848.079mil)(5755.567mil,4953.079mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.921mil]
Silk To Solder Mask Clearance Constraint: (5.945mil < 10mil) Between Pad JP4-0(5839.567mil,5013.504mil) on Bottom Layer And Track (5755.567mil,4981.354mil)(5769.567mil,4981.354mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.945mil]
Silk To Solder Mask Clearance Constraint: (5.945mil < 10mil) Between Pad JP4-0(5839.567mil,5378.228mil) on Bottom Layer And Track (5755.567mil,5401.898mil)(5769.567mil,5401.898mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.945mil]
Silk To Solder Mask Clearance Constraint: (5.921mil < 10mil) Between Pad JP4-1(5728.913mil,5270.228mil) on Bottom Layer And Track (5755.567mil,5296.898mil)(5755.567mil,5401.898mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.921mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP5-1(4055mil,5210mil) on Bottom Layer And Track (3955mil,5180mil)(3975mil,5180mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP5-1(4055mil,5210mil) on Bottom Layer And Track (3955mil,5240mil)(3975mil,5240mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP5-1(4055mil,5210mil) on Bottom Layer And Track (3975mil,5160mil)(3975mil,5180mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP5-1(4055mil,5210mil) on Bottom Layer And Track (3975mil,5240mil)(3975mil,5260mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP6-1(4056.9mil,4810.4mil) on Top Layer And Track (3956.9mil,4780.4mil)(3976.9mil,4780.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP6-1(4056.9mil,4810.4mil) on Top Layer And Track (3956.9mil,4840.4mil)(3976.9mil,4840.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP6-1(4056.9mil,4810.4mil) on Top Layer And Track (3976.9mil,4760.4mil)(3976.9mil,4780.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (9.889mil < 10mil) Between Pad JP6-1(4056.9mil,4810.4mil) on Top Layer And Track (3976.9mil,4840.4mil)(3976.9mil,4860.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.889mil]
Silk To Solder Mask Clearance Constraint: (9.526mil < 10mil) Between Pad JP6-2(4056.9mil,4910.4mil) on Top Layer And Track (4138.187mil,4898.001mil)(4138.187mil,4962.961mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.526mil]
Silk To Solder Mask Clearance Constraint: (9.026mil < 10mil) Between Pad JP6-3(4056.9mil,5010.4mil) on Top Layer And Track (4137.687mil,4994.301mil)(4137.687mil,5059.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.026mil]
Silk To Solder Mask Clearance Constraint: (9.026mil < 10mil) Between Pad JP6-4(4056.9mil,5110.4mil) on Top Layer And Track (4137.687mil,5097.701mil)(4137.687mil,5162.661mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.026mil]
Silk To Solder Mask Clearance Constraint: (1.712mil < 10mil) Between Pad JP6-5(4056.9mil,5210.4mil) on Top Layer And Text "GND" (3999.1mil,5233.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [1.712mil]
Silk To Solder Mask Clearance Constraint: (9.87mil < 10mil) Between Pad L1-1(4400.776mil,5137.1mil) on Top Layer And Track (4316.8mil,5037.1mil)(4356.8mil,5037.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.87mil]
Silk To Solder Mask Clearance Constraint: (9.87mil < 10mil) Between Pad L1-1(4400.776mil,5137.1mil) on Top Layer And Track (4316.8mil,5237.1mil)(4356.8mil,5237.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.87mil]
Silk To Solder Mask Clearance Constraint: (6.417mil < 10mil) Between Pad L1-1(4400.776mil,5137.1mil) on Top Layer And Track (4386.8mil,5037.1mil)(4446.8mil,5037.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.417mil]
Silk To Solder Mask Clearance Constraint: (6.417mil < 10mil) Between Pad L1-1(4400.776mil,5137.1mil) on Top Layer And Track (4386.8mil,5237.1mil)(4446.8mil,5237.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.417mil]
Silk To Solder Mask Clearance Constraint: (7.117mil < 10mil) Between Pad L1-1(4400.776mil,5137.1mil) on Top Layer And Track (4404.5mil,5237.8mil)(4514.5mil,5237.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.117mil]
Silk To Solder Mask Clearance Constraint: (6.575mil < 10mil) Between Pad L1-1(4400.776mil,5137.1mil) on Top Layer And Track (4446.8mil,5037.1mil)(4446.8mil,5237.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.575mil]
Silk To Solder Mask Clearance Constraint: (9.461mil < 10mil) Between Pad L1-1(4400.776mil,5137.1mil) on Top Layer And Track (4447.687mil,5055.439mil)(4447.687mil,5078.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.461mil]
Silk To Solder Mask Clearance Constraint: (9.461mil < 10mil) Between Pad L1-1(4400.776mil,5137.1mil) on Top Layer And Track (4447.687mil,5098.9mil)(4447.687mil,5122.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.461mil]
Silk To Solder Mask Clearance Constraint: (9.461mil < 10mil) Between Pad L1-1(4400.776mil,5137.1mil) on Top Layer And Track (4447.687mil,5122.361mil)(4483.113mil,5122.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.461mil]
Silk To Solder Mask Clearance Constraint: (9.455mil < 10mil) Between Pad L1-1(4400.776mil,5137.1mil) on Top Layer And Track (4447.68mil,5055.439mil)(4483.113mil,5055.439mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.455mil]
Silk To Solder Mask Clearance Constraint: (9.455mil < 10mil) Between Pad L1-1(4400.776mil,5137.1mil) on Top Layer And Track (4447.68mil,5122.355mil)(4447.687mil,5122.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.455mil]
Silk To Solder Mask Clearance Constraint: (7.117mil < 10mil) Between Pad L1-2(4272.824mil,5137.1mil) on Top Layer And Track (4179.5mil,5237.8mil)(4279.5mil,5237.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.117mil]
Silk To Solder Mask Clearance Constraint: (6.575mil < 10mil) Between Pad L1-2(4272.824mil,5137.1mil) on Top Layer And Track (4226.8mil,5037.1mil)(4226.8mil,5237.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.575mil]
Silk To Solder Mask Clearance Constraint: (6.417mil < 10mil) Between Pad L1-2(4272.824mil,5137.1mil) on Top Layer And Track (4226.8mil,5037.1mil)(4286.8mil,5037.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.417mil]
Silk To Solder Mask Clearance Constraint: (6.417mil < 10mil) Between Pad L1-2(4272.824mil,5137.1mil) on Top Layer And Track (4226.8mil,5237.1mil)(4286.8mil,5237.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.417mil]
Silk To Solder Mask Clearance Constraint: (9.87mil < 10mil) Between Pad L1-2(4272.824mil,5137.1mil) on Top Layer And Track (4316.8mil,5037.1mil)(4356.8mil,5037.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.87mil]
Silk To Solder Mask Clearance Constraint: (9.87mil < 10mil) Between Pad L1-2(4272.824mil,5137.1mil) on Top Layer And Track (4316.8mil,5237.1mil)(4356.8mil,5237.1mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.87mil]
Silk To Solder Mask Clearance Constraint: (9.763mil < 10mil) Between Pad LED1-A(4004.8mil,5869.165mil) on Top Layer And Track (3978.225mil,5853.417mil)(3978.225mil,5896.724mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.763mil]
Silk To Solder Mask Clearance Constraint: (9.971mil < 10mil) Between Pad LED1-A(4004.8mil,5869.165mil) on Top Layer And Track (3978.225mil,5896.724mil)(4031.375mil,5896.724mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.971mil]
Silk To Solder Mask Clearance Constraint: (9.763mil < 10mil) Between Pad LED1-A(4004.8mil,5869.165mil) on Top Layer And Track (4031.375mil,5853.417mil)(4031.375mil,5896.724mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.763mil]
Silk To Solder Mask Clearance Constraint: (9.763mil < 10mil) Between Pad LED1-K(4004.8mil,5802.235mil) on Top Layer And Track (3978.225mil,5782.55mil)(3978.225mil,5817.984mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.763mil]
Silk To Solder Mask Clearance Constraint: (9.641mil < 10mil) Between Pad LED1-K(4004.8mil,5802.235mil) on Top Layer And Track (3978.225mil,5782.55mil)(3986.099mil,5774.676mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.641mil]
Silk To Solder Mask Clearance Constraint: (9.772mil < 10mil) Between Pad LED1-K(4004.8mil,5802.235mil) on Top Layer And Track (3986.099mil,5774.676mil)(4023.501mil,5774.676mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.772mil]
Silk To Solder Mask Clearance Constraint: (9.94mil < 10mil) Between Pad LED1-K(4004.8mil,5802.235mil) on Top Layer And Track (4018.579mil,5769.755mil)(4025.469mil,5776.645mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.94mil]
Silk To Solder Mask Clearance Constraint: (9.866mil < 10mil) Between Pad LED1-K(4004.8mil,5802.235mil) on Top Layer And Track (4023.501mil,5774.676mil)(4031.375mil,5782.55mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.866mil]
Silk To Solder Mask Clearance Constraint: (9.763mil < 10mil) Between Pad LED1-K(4004.8mil,5802.235mil) on Top Layer And Track (4031.375mil,5782.55mil)(4031.375mil,5817.984mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.763mil]
Silk To Solder Mask Clearance Constraint: (8.294mil < 10mil) Between Pad NT2-1(4552.2mil,4951.8mil) on Top Layer And Track (4503.18mil,4944.339mil)(4538.613mil,4944.339mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.294mil]
Silk To Solder Mask Clearance Constraint: (7.761mil < 10mil) Between Pad NT2-1(4552.2mil,4951.8mil) on Top Layer And Track (4538.613mil,4944.339mil)(4538.613mil,5009.299mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.761mil]
Silk To Solder Mask Clearance Constraint: (9.355mil < 10mil) Between Pad NT2-1(4552.2mil,4951.8mil) on Top Layer And Track (4567.38mil,4946.439mil)(4567.38mil,5011.399mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.355mil]
Silk To Solder Mask Clearance Constraint: (9.426mil < 10mil) Between Pad NT2-1(4552.2mil,4951.8mil) on Top Layer And Track (4567.38mil,4946.439mil)(4602.813mil,4946.439mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.426mil]
Silk To Solder Mask Clearance Constraint: (7.761mil < 10mil) Between Pad NT2-2(4552.2mil,4971.485mil) on Top Layer And Track (4538.613mil,4944.339mil)(4538.613mil,5009.299mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.761mil]
Silk To Solder Mask Clearance Constraint: (9.355mil < 10mil) Between Pad NT2-2(4552.2mil,4971.485mil) on Top Layer And Track (4567.38mil,4946.439mil)(4567.38mil,5011.399mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.355mil]
Silk To Solder Mask Clearance Constraint: (9.504mil < 10mil) Between Pad NT3-1(5281.4mil,4940.1mil) on Top Layer And Track (5265.587mil,4956.639mil)(5301.013mil,4956.639mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.504mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad Q10-S(5269.371mil,4520.552mil) on Bottom Layer And Track (5280.51mil,4503.156mil)(5280.51mil,4829.927mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad Q10-S(5269.371mil,4520.552mil) on Bottom Layer And Track (5280.51mil,4503.156mil)(5437.99mil,4503.156mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad Q10-S(5269.371mil,4570.552mil) on Bottom Layer And Track (5280.51mil,4503.156mil)(5280.51mil,4829.927mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad Q4-D(4770.078mil,4495.276mil) on Bottom Layer And Text "2" (4796.748mil,4530.984mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad Q4-D(4770.078mil,4495.276mil) on Bottom Layer And Track (4583.96mil,4495.946mil)(4741.44mil,4495.946mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad Q4-D(4770.078mil,4495.276mil) on Bottom Layer And Track (4741.44mil,4495.946mil)(4741.44mil,4822.717mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.664mil < 10mil) Between Pad Q4-D(4825.196mil,4495.276mil) on Bottom Layer And Text "2" (4796.748mil,4530.984mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.664mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R10-1(4155.403mil,5149.951mil) on Bottom Layer And Track (4137.687mil,5100.739mil)(4137.687mil,5165.699mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R10-1(4155.403mil,5149.951mil) on Bottom Layer And Track (4137.687mil,5165.699mil)(4173.12mil,5165.699mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R10-1(4155.403mil,5149.951mil) on Bottom Layer And Track (4173.12mil,5100.739mil)(4173.12mil,5165.699mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R10-2(4155.403mil,5116.487mil) on Bottom Layer And Track (4137.687mil,5100.739mil)(4137.687mil,5165.699mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R10-2(4155.403mil,5116.487mil) on Bottom Layer And Track (4137.687mil,5100.739mil)(4173.12mil,5100.739mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R10-2(4155.403mil,5116.487mil) on Bottom Layer And Track (4173.12mil,5100.739mil)(4173.12mil,5165.699mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R1-1(4087.697mil,5426.751mil) on Top Layer And Track (4069.98mil,5377.539mil)(4069.98mil,5442.499mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R1-1(4087.697mil,5426.751mil) on Top Layer And Track (4069.98mil,5442.499mil)(4105.413mil,5442.499mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R1-1(4087.697mil,5426.751mil) on Top Layer And Track (4105.413mil,5377.539mil)(4105.413mil,5442.499mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R11-1(5145.003mil,5115.451mil) on Bottom Layer And Track (5127.287mil,5066.239mil)(5127.287mil,5131.199mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R11-1(5145.003mil,5115.451mil) on Bottom Layer And Track (5127.287mil,5131.199mil)(5162.72mil,5131.199mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R11-1(5145.003mil,5115.451mil) on Bottom Layer And Track (5162.72mil,5066.239mil)(5162.72mil,5131.199mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.221mil < 10mil) Between Pad R11-2(5145.003mil,5081.987mil) on Bottom Layer And Text "R13" (5126mil,5083mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.221mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R11-2(5145.003mil,5081.987mil) on Bottom Layer And Track (5127.287mil,5066.239mil)(5127.287mil,5131.199mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R11-2(5145.003mil,5081.987mil) on Bottom Layer And Track (5127.287mil,5066.239mil)(5162.72mil,5066.239mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R11-2(5145.003mil,5081.987mil) on Bottom Layer And Track (5162.72mil,5066.239mil)(5162.72mil,5131.199mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R1-2(4087.697mil,5393.287mil) on Top Layer And Track (4069.98mil,5377.539mil)(4069.98mil,5442.499mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R1-2(4087.697mil,5393.287mil) on Top Layer And Track (4069.98mil,5377.539mil)(4105.413mil,5377.539mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R1-2(4087.697mil,5393.287mil) on Top Layer And Track (4105.413mil,5377.539mil)(4105.413mil,5442.499mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R12-1(4155.903mil,4950.251mil) on Bottom Layer And Track (4138.187mil,4901.039mil)(4138.187mil,4965.999mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R12-1(4155.903mil,4950.251mil) on Bottom Layer And Track (4138.187mil,4965.999mil)(4173.62mil,4965.999mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R12-1(4155.903mil,4950.251mil) on Bottom Layer And Track (4173.62mil,4901.039mil)(4173.62mil,4965.999mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R12-2(4155.903mil,4916.787mil) on Bottom Layer And Track (4138.187mil,4901.039mil)(4138.187mil,4965.999mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R12-2(4155.903mil,4916.787mil) on Bottom Layer And Track (4138.187mil,4901.039mil)(4173.62mil,4901.039mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R12-2(4155.903mil,4916.787mil) on Bottom Layer And Track (4173.62mil,4901.039mil)(4173.62mil,4965.999mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R13-1(5145.897mil,5011.049mil) on Bottom Layer And Track (5128.18mil,4995.301mil)(5128.18mil,5060.261mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R13-1(5145.897mil,5011.049mil) on Bottom Layer And Track (5128.18mil,4995.301mil)(5163.613mil,4995.301mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R13-1(5145.897mil,5011.049mil) on Bottom Layer And Track (5163.613mil,4995.301mil)(5163.613mil,5060.261mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R13-2(5145.897mil,5044.513mil) on Bottom Layer And Track (5128.18mil,4995.301mil)(5128.18mil,5060.261mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R13-2(5145.897mil,5044.513mil) on Bottom Layer And Track (5128.18mil,5060.261mil)(5163.613mil,5060.261mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R13-2(5145.897mil,5044.513mil) on Bottom Layer And Track (5163.613mil,4995.301mil)(5163.613mil,5060.261mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R14-1(5118.197mil,5191.149mil) on Bottom Layer And Track (5100.48mil,5175.401mil)(5100.48mil,5240.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R14-1(5118.197mil,5191.149mil) on Bottom Layer And Track (5100.48mil,5175.401mil)(5135.913mil,5175.401mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R14-1(5118.197mil,5191.149mil) on Bottom Layer And Track (5135.913mil,5175.401mil)(5135.913mil,5240.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R14-2(5118.197mil,5224.613mil) on Bottom Layer And Track (5100.48mil,5175.401mil)(5100.48mil,5240.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R14-2(5118.197mil,5224.613mil) on Bottom Layer And Track (5100.48mil,5240.361mil)(5135.913mil,5240.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R14-2(5118.197mil,5224.613mil) on Bottom Layer And Track (5135.913mil,5175.401mil)(5135.913mil,5240.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R15-1(5346.403mil,4971.049mil) on Top Layer And Track (5328.687mil,4955.301mil)(5328.687mil,5020.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R15-1(5346.403mil,4971.049mil) on Top Layer And Track (5328.687mil,4955.301mil)(5364.12mil,4955.301mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.106mil < 10mil) Between Pad R15-1(5346.403mil,4971.049mil) on Top Layer And Track (5363.352mil,4954.467mil)(5363.352mil,4989.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.106mil]
Silk To Solder Mask Clearance Constraint: (8.239mil < 10mil) Between Pad R15-1(5346.403mil,4971.049mil) on Top Layer And Track (5363.352mil,4954.467mil)(5428.313mil,4954.467mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.239mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R15-1(5346.403mil,4971.049mil) on Top Layer And Track (5364.12mil,4955.301mil)(5364.12mil,5020.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R15-2(5346.403mil,5004.513mil) on Top Layer And Track (5328.687mil,4955.301mil)(5328.687mil,5020.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R15-2(5346.403mil,5004.513mil) on Top Layer And Track (5328.687mil,5020.261mil)(5364.12mil,5020.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (2.306mil < 10mil) Between Pad R15-2(5346.403mil,5004.513mil) on Top Layer And Track (5361.552mil,4990.967mil)(5361.552mil,5026.394mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.306mil]
Silk To Solder Mask Clearance Constraint: (4.767mil < 10mil) Between Pad R15-2(5346.403mil,5004.513mil) on Top Layer And Track (5361.552mil,4990.967mil)(5361.558mil,4990.961mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.767mil]
Silk To Solder Mask Clearance Constraint: (4.767mil < 10mil) Between Pad R15-2(5346.403mil,5004.513mil) on Top Layer And Track (5361.552mil,4990.967mil)(5385.013mil,4990.967mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.767mil]
Silk To Solder Mask Clearance Constraint: (6.794mil < 10mil) Between Pad R15-2(5346.403mil,5004.513mil) on Top Layer And Track (5363.352mil,4954.467mil)(5363.352mil,4989.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.794mil]
Silk To Solder Mask Clearance Constraint: (6.794mil < 10mil) Between Pad R15-2(5346.403mil,5004.513mil) on Top Layer And Track (5363.352mil,4989.9mil)(5428.313mil,4989.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.794mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R15-2(5346.403mil,5004.513mil) on Top Layer And Track (5364.12mil,4955.301mil)(5364.12mil,5020.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R17-1(3975.897mil,5751.351mil) on Top Layer And Track (3958.18mil,5702.139mil)(3958.18mil,5767.099mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R17-1(3975.897mil,5751.351mil) on Top Layer And Track (3958.18mil,5767.099mil)(3993.613mil,5767.099mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.28mil < 10mil) Between Pad R17-1(3975.897mil,5751.351mil) on Top Layer And Track (3985.115mil,5775.661mil)(3991.021mil,5769.755mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.28mil]
Silk To Solder Mask Clearance Constraint: (9.28mil < 10mil) Between Pad R17-1(3975.897mil,5751.351mil) on Top Layer And Track (3991.021mil,5769.755mil)(4018.579mil,5769.755mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.28mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R17-1(3975.897mil,5751.351mil) on Top Layer And Track (3993.613mil,5702.139mil)(3993.613mil,5767.099mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R17-2(3975.897mil,5717.887mil) on Top Layer And Track (3958.18mil,5702.139mil)(3958.18mil,5767.099mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R17-2(3975.897mil,5717.887mil) on Top Layer And Track (3958.18mil,5702.139mil)(3993.613mil,5702.139mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R17-2(3975.897mil,5717.887mil) on Top Layer And Track (3993.613mil,5702.139mil)(3993.613mil,5767.099mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R18-1(4155.903mil,4913.749mil) on Top Layer And Track (4138.187mil,4898.001mil)(4138.187mil,4962.961mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R18-1(4155.903mil,4913.749mil) on Top Layer And Track (4138.187mil,4898.001mil)(4173.62mil,4898.001mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R18-1(4155.903mil,4913.749mil) on Top Layer And Track (4173.62mil,4898.001mil)(4173.62mil,4962.961mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R18-2(4155.903mil,4947.213mil) on Top Layer And Track (4138.187mil,4898.001mil)(4138.187mil,4962.961mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R18-2(4155.903mil,4947.213mil) on Top Layer And Track (4138.187mil,4962.961mil)(4173.62mil,4962.961mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R18-2(4155.903mil,4947.213mil) on Top Layer And Track (4173.62mil,4898.001mil)(4173.62mil,4962.961mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R19-1(4155.403mil,5010.049mil) on Top Layer And Track (4137.687mil,4994.301mil)(4137.687mil,5059.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R19-1(4155.403mil,5010.049mil) on Top Layer And Track (4137.687mil,4994.301mil)(4173.12mil,4994.301mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R19-1(4155.403mil,5010.049mil) on Top Layer And Track (4173.12mil,4994.301mil)(4173.12mil,5059.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R19-2(4155.403mil,5043.513mil) on Top Layer And Track (4137.687mil,4994.301mil)(4137.687mil,5059.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R19-2(4155.403mil,5043.513mil) on Top Layer And Track (4137.687mil,5059.261mil)(4173.12mil,5059.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R19-2(4155.403mil,5043.513mil) on Top Layer And Track (4173.12mil,4994.301mil)(4173.12mil,5059.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R20-1(4155.403mil,5113.449mil) on Top Layer And Track (4137.687mil,5097.701mil)(4137.687mil,5162.661mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R20-1(4155.403mil,5113.449mil) on Top Layer And Track (4137.687mil,5097.701mil)(4173.12mil,5097.701mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R20-1(4155.403mil,5113.449mil) on Top Layer And Track (4173.12mil,5097.701mil)(4173.12mil,5162.661mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R20-2(4155.403mil,5146.913mil) on Top Layer And Track (4137.687mil,5097.701mil)(4137.687mil,5162.661mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R20-2(4155.403mil,5146.913mil) on Top Layer And Track (4137.687mil,5162.661mil)(4173.12mil,5162.661mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R20-2(4155.403mil,5146.913mil) on Top Layer And Track (4173.12mil,5097.701mil)(4173.12mil,5162.661mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.041mil < 10mil) Between Pad R2-1(5671.349mil,4970.703mil) on Bottom Layer And Track (5655.301mil,4948.82mil)(5720.261mil,4948.82mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.041mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R2-1(5671.349mil,4970.703mil) on Bottom Layer And Track (5655.601mil,4952.987mil)(5655.601mil,4988.42mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R2-1(5671.349mil,4970.703mil) on Bottom Layer And Track (5655.601mil,4952.987mil)(5720.561mil,4952.987mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R2-1(5671.349mil,4970.703mil) on Bottom Layer And Track (5655.601mil,4988.42mil)(5720.561mil,4988.42mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.319mil < 10mil) Between Pad R21-1(5237.503mil,5076.149mil) on Top Layer And Track (5186.48mil,5060.939mil)(5221.913mil,5060.939mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.319mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R21-1(5237.503mil,5076.149mil) on Top Layer And Track (5219.787mil,5060.401mil)(5219.787mil,5125.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R21-1(5237.503mil,5076.149mil) on Top Layer And Track (5219.787mil,5060.401mil)(5255.22mil,5060.401mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (2.747mil < 10mil) Between Pad R21-1(5237.503mil,5076.149mil) on Top Layer And Track (5221.913mil,5060.939mil)(5221.913mil,5084.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.747mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R21-1(5237.503mil,5076.149mil) on Top Layer And Track (5255.22mil,5060.401mil)(5255.22mil,5125.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.86mil < 10mil) Between Pad R21-2(5237.503mil,5109.613mil) on Top Layer And Track (5186.487mil,5127.861mil)(5221.913mil,5127.861mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.86mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R21-2(5237.503mil,5109.613mil) on Top Layer And Track (5219.787mil,5060.401mil)(5219.787mil,5125.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R21-2(5237.503mil,5109.613mil) on Top Layer And Track (5219.787mil,5125.361mil)(5255.22mil,5125.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (2.747mil < 10mil) Between Pad R21-2(5237.503mil,5109.613mil) on Top Layer And Track (5221.913mil,5104.4mil)(5221.913mil,5127.861mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.747mil]
Silk To Solder Mask Clearance Constraint: (8.189mil < 10mil) Between Pad R21-2(5237.503mil,5109.613mil) on Top Layer And Track (5252.775mil,5128.4mil)(5252.775mil,5168.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.189mil]
Silk To Solder Mask Clearance Constraint: (8.252mil < 10mil) Between Pad R21-2(5237.503mil,5109.613mil) on Top Layer And Track (5252.775mil,5128.4mil)(5449.625mil,5128.4mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.252mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R21-2(5237.503mil,5109.613mil) on Top Layer And Track (5255.22mil,5060.401mil)(5255.22mil,5125.361mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.041mil < 10mil) Between Pad R2-2(5704.813mil,4970.703mil) on Bottom Layer And Track (5655.301mil,4948.82mil)(5720.261mil,4948.82mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.041mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R2-2(5704.813mil,4970.703mil) on Bottom Layer And Track (5655.601mil,4952.987mil)(5720.561mil,4952.987mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R2-2(5704.813mil,4970.703mil) on Bottom Layer And Track (5655.601mil,4988.42mil)(5720.561mil,4988.42mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R2-2(5704.813mil,4970.703mil) on Bottom Layer And Track (5720.561mil,4952.987mil)(5720.561mil,4988.42mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R22-1(5590.103mil,5021.451mil) on Bottom Layer And Track (5572.387mil,4972.239mil)(5572.387mil,5037.199mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R22-1(5590.103mil,5021.451mil) on Bottom Layer And Track (5572.387mil,5037.199mil)(5607.82mil,5037.199mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R22-1(5590.103mil,5021.451mil) on Bottom Layer And Track (5607.82mil,4972.239mil)(5607.82mil,5037.199mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R22-2(5590.103mil,4987.987mil) on Bottom Layer And Track (5572.387mil,4972.239mil)(5572.387mil,5037.199mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R22-2(5590.103mil,4987.987mil) on Bottom Layer And Track (5572.387mil,4972.239mil)(5607.82mil,4972.239mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R22-2(5590.103mil,4987.987mil) on Bottom Layer And Track (5607.82mil,4972.239mil)(5607.82mil,5037.199mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R23-1(5412.565mil,4972.184mil) on Top Layer And Track (5363.352mil,4954.467mil)(5428.313mil,4954.467mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R23-1(5412.565mil,4972.184mil) on Top Layer And Track (5363.352mil,4989.9mil)(5428.313mil,4989.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (5.941mil < 10mil) Between Pad R23-1(5412.565mil,4972.184mil) on Top Layer And Track (5405.013mil,4990.967mil)(5428.475mil,4990.967mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.941mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R23-1(5412.565mil,4972.184mil) on Top Layer And Track (5428.313mil,4954.467mil)(5428.313mil,4989.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.017mil < 10mil) Between Pad R23-1(5412.565mil,4972.184mil) on Top Layer And Track (5428.475mil,4990.961mil)(5428.475mil,5026.394mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.017mil]
Silk To Solder Mask Clearance Constraint: (7.003mil < 10mil) Between Pad R23-2(5379.1mil,4972.184mil) on Top Layer And Track (5328.687mil,4955.301mil)(5364.12mil,4955.301mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.003mil]
Silk To Solder Mask Clearance Constraint: (5.941mil < 10mil) Between Pad R23-2(5379.1mil,4972.184mil) on Top Layer And Track (5361.552mil,4990.967mil)(5385.013mil,4990.967mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.941mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R23-2(5379.1mil,4972.184mil) on Top Layer And Track (5363.352mil,4954.467mil)(5363.352mil,4989.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R23-2(5379.1mil,4972.184mil) on Top Layer And Track (5363.352mil,4954.467mil)(5428.313mil,4954.467mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R23-2(5379.1mil,4972.184mil) on Top Layer And Track (5363.352mil,4989.9mil)(5428.313mil,4989.9mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.106mil < 10mil) Between Pad R23-2(5379.1mil,4972.184mil) on Top Layer And Track (5364.12mil,4955.301mil)(5364.12mil,5020.261mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.106mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R24-1(5393.851mil,5390.003mil) on Top Layer And Track (5344.639mil,5372.287mil)(5409.599mil,5372.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R24-1(5393.851mil,5390.003mil) on Top Layer And Track (5344.639mil,5407.72mil)(5409.599mil,5407.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R24-1(5393.851mil,5390.003mil) on Top Layer And Track (5409.599mil,5372.287mil)(5409.599mil,5407.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (5.113mil < 10mil) Between Pad R24-1(5393.851mil,5390.003mil) on Top Layer And Track (5409.839mil,5373.087mil)(5409.839mil,5408.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.113mil]
Silk To Solder Mask Clearance Constraint: (7.764mil < 10mil) Between Pad R24-1(5393.851mil,5390.003mil) on Top Layer And Track (5409.839mil,5373.087mil)(5474.799mil,5373.087mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.764mil]
Silk To Solder Mask Clearance Constraint: (8.877mil < 10mil) Between Pad R24-1(5393.851mil,5390.003mil) on Top Layer And Track (5409.839mil,5408.52mil)(5474.799mil,5408.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.877mil]
Silk To Solder Mask Clearance Constraint: (6.34mil < 10mil) Between Pad R24-1(5393.851mil,5390.003mil) on Top Layer And Track (5409.939mil,5340.287mil)(5409.939mil,5375.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.34mil]
Silk To Solder Mask Clearance Constraint: (6.34mil < 10mil) Between Pad R24-1(5393.851mil,5390.003mil) on Top Layer And Track (5409.939mil,5375.713mil)(5433.4mil,5375.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.34mil]
Silk To Solder Mask Clearance Constraint: (3.276mil < 10mil) Between Pad R24-2(5360.387mil,5390.003mil) on Top Layer And Track (5314.487mil,5405.561mil)(5349.92mil,5405.561mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.276mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad R24-2(5360.387mil,5390.003mil) on Top Layer And Track (5338.2mil,5402.587mil)(5361.661mil,5402.587mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R24-2(5360.387mil,5390.003mil) on Top Layer And Track (5344.639mil,5372.287mil)(5344.639mil,5407.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R24-2(5360.387mil,5390.003mil) on Top Layer And Track (5344.639mil,5372.287mil)(5409.599mil,5372.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R24-2(5360.387mil,5390.003mil) on Top Layer And Track (5344.639mil,5407.72mil)(5409.599mil,5407.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad R24-2(5360.387mil,5390.003mil) on Top Layer And Track (5349.92mil,5340.601mil)(5349.92mil,5405.561mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad R24-2(5360.387mil,5390.003mil) on Top Layer And Track (5361.661mil,5402.58mil)(5361.661mil,5438.013mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R26-1(5332.203mil,5356.349mil) on Top Layer And Track (5314.487mil,5340.601mil)(5314.487mil,5405.561mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R26-1(5332.203mil,5356.349mil) on Top Layer And Track (5314.487mil,5340.601mil)(5349.92mil,5340.601mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (5.471mil < 10mil) Between Pad R26-1(5332.203mil,5356.349mil) on Top Layer And Track (5344.639mil,5372.287mil)(5344.639mil,5407.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.471mil]
Silk To Solder Mask Clearance Constraint: (5.471mil < 10mil) Between Pad R26-1(5332.203mil,5356.349mil) on Top Layer And Track (5344.639mil,5372.287mil)(5409.599mil,5372.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.471mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R26-1(5332.203mil,5356.349mil) on Top Layer And Track (5349.92mil,5340.601mil)(5349.92mil,5405.561mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (3.428mil < 10mil) Between Pad R26-2(5332.203mil,5389.813mil) on Top Layer And Track (5294.739mil,5402.587mil)(5318.2mil,5402.587mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.428mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R26-2(5332.203mil,5389.813mil) on Top Layer And Track (5314.487mil,5340.601mil)(5314.487mil,5405.561mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R26-2(5332.203mil,5389.813mil) on Top Layer And Track (5314.487mil,5405.561mil)(5349.92mil,5405.561mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (1.899mil < 10mil) Between Pad R26-2(5332.203mil,5389.813mil) on Top Layer And Track (5338.2mil,5402.587mil)(5361.661mil,5402.587mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [1.899mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad R26-2(5332.203mil,5389.813mil) on Top Layer And Track (5344.639mil,5372.287mil)(5344.639mil,5407.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (6.995mil < 10mil) Between Pad R26-2(5332.203mil,5389.813mil) on Top Layer And Track (5344.639mil,5372.287mil)(5409.599mil,5372.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.995mil]
Silk To Solder Mask Clearance Constraint: (7.362mil < 10mil) Between Pad R26-2(5332.203mil,5389.813mil) on Top Layer And Track (5344.639mil,5407.72mil)(5409.599mil,5407.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.362mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R26-2(5332.203mil,5389.813mil) on Top Layer And Track (5349.92mil,5340.601mil)(5349.92mil,5405.561mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.872mil < 10mil) Between Pad R27-1(5599.497mil,5365.849mil) on Bottom Layer And Track (5545.687mil,5348.339mil)(5581.12mil,5348.339mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.872mil]
Silk To Solder Mask Clearance Constraint: (5.755mil < 10mil) Between Pad R27-1(5599.497mil,5365.849mil) on Bottom Layer And Track (5581.113mil,5348.339mil)(5581.113mil,5371.8mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.755mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R27-1(5599.497mil,5365.849mil) on Bottom Layer And Track (5581.78mil,5350.101mil)(5581.78mil,5415.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R27-1(5599.497mil,5365.849mil) on Bottom Layer And Track (5581.78mil,5350.101mil)(5617.213mil,5350.101mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R27-1(5599.497mil,5365.849mil) on Bottom Layer And Track (5617.213mil,5350.101mil)(5617.213mil,5415.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.753mil < 10mil) Between Pad R27-2(5599.497mil,5399.313mil) on Bottom Layer And Track (5545.687mil,5415.261mil)(5581.113mil,5415.261mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.753mil]
Silk To Solder Mask Clearance Constraint: (5.541mil < 10mil) Between Pad R27-2(5599.497mil,5399.313mil) on Bottom Layer And Track (5581.113mil,5391.8mil)(5581.113mil,5415.261mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.541mil]
Silk To Solder Mask Clearance Constraint: (8.744mil < 10mil) Between Pad R27-2(5599.497mil,5399.313mil) on Bottom Layer And Track (5581.113mil,5415.261mil)(5581.12mil,5415.255mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.744mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R27-2(5599.497mil,5399.313mil) on Bottom Layer And Track (5581.78mil,5350.101mil)(5581.78mil,5415.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R27-2(5599.497mil,5399.313mil) on Bottom Layer And Track (5581.78mil,5415.061mil)(5617.213mil,5415.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R27-2(5599.497mil,5399.313mil) on Bottom Layer And Track (5617.213mil,5350.101mil)(5617.213mil,5415.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R28-1(5459.051mil,5390.803mil) on Top Layer And Track (5409.839mil,5373.087mil)(5474.799mil,5373.087mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R28-1(5459.051mil,5390.803mil) on Top Layer And Track (5409.839mil,5408.52mil)(5474.799mil,5408.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (2.247mil < 10mil) Between Pad R28-1(5459.051mil,5390.803mil) on Top Layer And Track (5453.4mil,5375.713mil)(5476.861mil,5375.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.247mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R28-1(5459.051mil,5390.803mil) on Top Layer And Track (5474.799mil,5373.087mil)(5474.799mil,5408.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.237mil < 10mil) Between Pad R28-1(5459.051mil,5390.803mil) on Top Layer And Track (5476.861mil,5340.28mil)(5476.861mil,5375.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.237mil]
Silk To Solder Mask Clearance Constraint: (8.877mil < 10mil) Between Pad R28-2(5425.587mil,5390.803mil) on Top Layer And Track (5344.639mil,5372.287mil)(5409.599mil,5372.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.877mil]
Silk To Solder Mask Clearance Constraint: (7.764mil < 10mil) Between Pad R28-2(5425.587mil,5390.803mil) on Top Layer And Track (5344.639mil,5407.72mil)(5409.599mil,5407.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.764mil]
Silk To Solder Mask Clearance Constraint: (5.113mil < 10mil) Between Pad R28-2(5425.587mil,5390.803mil) on Top Layer And Track (5409.599mil,5372.287mil)(5409.599mil,5407.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.113mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R28-2(5425.587mil,5390.803mil) on Top Layer And Track (5409.839mil,5373.087mil)(5409.839mil,5408.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R28-2(5425.587mil,5390.803mil) on Top Layer And Track (5409.839mil,5373.087mil)(5474.799mil,5373.087mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R28-2(5425.587mil,5390.803mil) on Top Layer And Track (5409.839mil,5408.52mil)(5474.799mil,5408.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.379mil < 10mil) Between Pad R28-2(5425.587mil,5390.803mil) on Top Layer And Track (5409.939mil,5340.287mil)(5409.939mil,5375.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.379mil]
Silk To Solder Mask Clearance Constraint: (2.248mil < 10mil) Between Pad R28-2(5425.587mil,5390.803mil) on Top Layer And Track (5409.939mil,5375.713mil)(5433.4mil,5375.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [2.248mil]
Silk To Solder Mask Clearance Constraint: (6.591mil < 10mil) Between Pad R30-1(4202.4mil,4817.805mil) on Top Layer And Track (4130.019mil,4853.995mil)(4202.4mil,4781.614mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.591mil]
Silk To Solder Mask Clearance Constraint: (6.591mil < 10mil) Between Pad R30-1(4202.4mil,4817.805mil) on Top Layer And Track (4166.209mil,4890.186mil)(4238.59mil,4817.805mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.591mil]
Silk To Solder Mask Clearance Constraint: (6.59mil < 10mil) Between Pad R30-1(4202.4mil,4817.805mil) on Top Layer And Track (4202.4mil,4781.614mil)(4238.59mil,4817.805mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.59mil]
Silk To Solder Mask Clearance Constraint: (6.59mil < 10mil) Between Pad R30-2(4166.209mil,4853.995mil) on Top Layer And Track (4130.019mil,4853.995mil)(4166.209mil,4890.186mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.59mil]
Silk To Solder Mask Clearance Constraint: (6.591mil < 10mil) Between Pad R30-2(4166.209mil,4853.995mil) on Top Layer And Track (4130.019mil,4853.995mil)(4202.4mil,4781.614mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.591mil]
Silk To Solder Mask Clearance Constraint: (6.591mil < 10mil) Between Pad R30-2(4166.209mil,4853.995mil) on Top Layer And Track (4166.209mil,4890.186mil)(4238.59mil,4817.805mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.591mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R3-1(5671.049mil,4931.103mil) on Bottom Layer And Track (5655.301mil,4913.387mil)(5655.301mil,4948.82mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R3-1(5671.049mil,4931.103mil) on Bottom Layer And Track (5655.301mil,4913.387mil)(5720.261mil,4913.387mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R3-1(5671.049mil,4931.103mil) on Bottom Layer And Track (5655.301mil,4948.82mil)(5720.261mil,4948.82mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.041mil < 10mil) Between Pad R3-1(5671.049mil,4931.103mil) on Bottom Layer And Track (5655.601mil,4952.987mil)(5720.561mil,4952.987mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.041mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad R31-1(4466.603mil,5386.806mil) on Top Layer And Track (4404.5mil,5377.8mil)(4514.5mil,5377.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (6.591mil < 10mil) Between Pad R31-1(4466.603mil,5386.806mil) on Top Layer And Track (4441.013mil,5361.216mil)(4441.013mil,5463.578mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.591mil]
Silk To Solder Mask Clearance Constraint: (6.59mil < 10mil) Between Pad R31-1(4466.603mil,5386.806mil) on Top Layer And Track (4441.013mil,5361.216mil)(4492.194mil,5361.216mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.59mil]
Silk To Solder Mask Clearance Constraint: (6.591mil < 10mil) Between Pad R31-1(4466.603mil,5386.806mil) on Top Layer And Track (4492.194mil,5361.216mil)(4492.194mil,5463.578mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.591mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad R31-2(4466.603mil,5437.987mil) on Top Layer And Track (4312.865mil,5452.91mil)(4458.535mil,5452.91mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (6.591mil < 10mil) Between Pad R31-2(4466.603mil,5437.987mil) on Top Layer And Track (4441.013mil,5361.216mil)(4441.013mil,5463.578mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.591mil]
Silk To Solder Mask Clearance Constraint: (6.59mil < 10mil) Between Pad R31-2(4466.603mil,5437.987mil) on Top Layer And Track (4441.013mil,5463.578mil)(4492.194mil,5463.578mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.59mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad R31-2(4466.603mil,5437.987mil) on Top Layer And Track (4458.535mil,5452.91mil)(4458.535mil,5716.69mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (6.591mil < 10mil) Between Pad R31-2(4466.603mil,5437.987mil) on Top Layer And Track (4492.194mil,5361.216mil)(4492.194mil,5463.578mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.591mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R3-2(5704.513mil,4931.103mil) on Bottom Layer And Track (5655.301mil,4913.387mil)(5720.261mil,4913.387mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R3-2(5704.513mil,4931.103mil) on Bottom Layer And Track (5655.301mil,4948.82mil)(5720.261mil,4948.82mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.041mil < 10mil) Between Pad R3-2(5704.513mil,4931.103mil) on Bottom Layer And Track (5655.601mil,4952.987mil)(5720.561mil,4952.987mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.041mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R3-2(5704.513mil,4931.103mil) on Bottom Layer And Track (5720.261mil,4913.387mil)(5720.261mil,4948.82mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.59mil < 10mil) Between Pad R32-1(5019.8mil,4963.5mil) on Top Layer And Track (4994.209mil,4937.909mil)(4994.209mil,4989.091mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.59mil]
Silk To Solder Mask Clearance Constraint: (6.591mil < 10mil) Between Pad R32-1(5019.8mil,4963.5mil) on Top Layer And Track (4994.209mil,4937.909mil)(5096.572mil,4937.909mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.591mil]
Silk To Solder Mask Clearance Constraint: (6.591mil < 10mil) Between Pad R32-1(5019.8mil,4963.5mil) on Top Layer And Track (4994.209mil,4989.091mil)(5096.572mil,4989.091mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.591mil]
Silk To Solder Mask Clearance Constraint: (6.591mil < 10mil) Between Pad R32-2(5070.981mil,4963.5mil) on Top Layer And Track (4994.209mil,4937.909mil)(5096.572mil,4937.909mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.591mil]
Silk To Solder Mask Clearance Constraint: (6.591mil < 10mil) Between Pad R32-2(5070.981mil,4963.5mil) on Top Layer And Track (4994.209mil,4989.091mil)(5096.572mil,4989.091mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.591mil]
Silk To Solder Mask Clearance Constraint: (6.59mil < 10mil) Between Pad R32-2(5070.981mil,4963.5mil) on Top Layer And Track (5096.572mil,4937.909mil)(5096.572mil,4989.091mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.59mil]
Silk To Solder Mask Clearance Constraint: (6.624mil < 10mil) Between Pad R33-1(4743.849mil,5841.903mil) on Bottom Layer And Track (4727.839mil,5856.887mil)(4727.839mil,5892.313mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.624mil]
Silk To Solder Mask Clearance Constraint: (2.141mil < 10mil) Between Pad R33-1(4743.849mil,5841.903mil) on Bottom Layer And Track (4727.839mil,5856.887mil)(4751.3mil,5856.887mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.141mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R33-1(4743.849mil,5841.903mil) on Bottom Layer And Track (4728.101mil,5824.187mil)(4728.101mil,5859.62mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R33-1(4743.849mil,5841.903mil) on Bottom Layer And Track (4728.101mil,5824.187mil)(4793.061mil,5824.187mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R33-1(4743.849mil,5841.903mil) on Bottom Layer And Track (4728.101mil,5859.62mil)(4793.061mil,5859.62mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.348mil < 10mil) Between Pad R33-1(4743.849mil,5841.903mil) on Bottom Layer And Track (4728.239mil,5791.387mil)(4728.239mil,5826.813mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.348mil]
Silk To Solder Mask Clearance Constraint: (6.339mil < 10mil) Between Pad R33-1(4743.849mil,5841.903mil) on Bottom Layer And Track (4728.239mil,5826.813mil)(4728.245mil,5826.82mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.339mil]
Silk To Solder Mask Clearance Constraint: (2.247mil < 10mil) Between Pad R33-1(4743.849mil,5841.903mil) on Bottom Layer And Track (4728.239mil,5826.813mil)(4751.7mil,5826.813mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.247mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R33-2(4777.313mil,5841.903mil) on Bottom Layer And Track (4728.101mil,5824.187mil)(4793.061mil,5824.187mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R33-2(4777.313mil,5841.903mil) on Bottom Layer And Track (4728.101mil,5859.62mil)(4793.061mil,5859.62mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (2.141mil < 10mil) Between Pad R33-2(4777.313mil,5841.903mil) on Bottom Layer And Track (4771.3mil,5856.887mil)(4794.761mil,5856.887mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.141mil]
Silk To Solder Mask Clearance Constraint: (2.247mil < 10mil) Between Pad R33-2(4777.313mil,5841.903mil) on Bottom Layer And Track (4771.7mil,5826.813mil)(4795.161mil,5826.813mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.247mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R33-2(4777.313mil,5841.903mil) on Bottom Layer And Track (4793.061mil,5824.187mil)(4793.061mil,5859.62mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.867mil < 10mil) Between Pad R33-2(4777.313mil,5841.903mil) on Bottom Layer And Track (4794.761mil,5856.887mil)(4794.761mil,5892.32mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.867mil]
Silk To Solder Mask Clearance Constraint: (8.267mil < 10mil) Between Pad R33-2(4777.313mil,5841.903mil) on Bottom Layer And Track (4795.161mil,5791.387mil)(4795.161mil,5826.82mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.267mil]
Silk To Solder Mask Clearance Constraint: (7.198mil < 10mil) Between Pad R35-1(5109.049mil,5317.923mil) on Top Layer And Track (5093.301mil,5266.167mil)(5093.301mil,5301.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.198mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R35-1(5109.049mil,5317.923mil) on Top Layer And Track (5093.301mil,5300.207mil)(5093.301mil,5335.64mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R35-1(5109.049mil,5317.923mil) on Top Layer And Track (5093.301mil,5300.207mil)(5158.261mil,5300.207mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (3.481mil < 10mil) Between Pad R35-1(5109.049mil,5317.923mil) on Top Layer And Track (5093.301mil,5301.6mil)(5158.261mil,5301.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.481mil]
Silk To Solder Mask Clearance Constraint: (7.202mil < 10mil) Between Pad R35-1(5109.049mil,5317.923mil) on Top Layer And Track (5093.301mil,5334.253mil)(5093.301mil,5369.68mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.202mil]
Silk To Solder Mask Clearance Constraint: (7.193mil < 10mil) Between Pad R35-1(5109.049mil,5317.923mil) on Top Layer And Track (5093.301mil,5334.253mil)(5093.307mil,5334.247mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.193mil]
Silk To Solder Mask Clearance Constraint: (3.487mil < 10mil) Between Pad R35-1(5109.049mil,5317.923mil) on Top Layer And Track (5093.301mil,5334.253mil)(5116.762mil,5334.253mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.487mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R35-1(5109.049mil,5317.923mil) on Top Layer And Track (5093.301mil,5335.64mil)(5158.261mil,5335.64mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R35-2(5142.513mil,5317.923mil) on Top Layer And Track (5093.301mil,5300.207mil)(5158.261mil,5300.207mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (3.481mil < 10mil) Between Pad R35-2(5142.513mil,5317.923mil) on Top Layer And Track (5093.301mil,5301.6mil)(5158.261mil,5301.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.481mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R35-2(5142.513mil,5317.923mil) on Top Layer And Track (5093.301mil,5335.64mil)(5158.261mil,5335.64mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (3.487mil < 10mil) Between Pad R35-2(5142.513mil,5317.923mil) on Top Layer And Track (5136.762mil,5334.253mil)(5160.224mil,5334.253mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.487mil]
Silk To Solder Mask Clearance Constraint: (7.198mil < 10mil) Between Pad R35-2(5142.513mil,5317.923mil) on Top Layer And Track (5158.261mil,5266.167mil)(5158.261mil,5301.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.198mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R35-2(5142.513mil,5317.923mil) on Top Layer And Track (5158.261mil,5300.207mil)(5158.261mil,5335.64mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.779mil < 10mil) Between Pad R35-2(5142.513mil,5317.923mil) on Top Layer And Track (5160.224mil,5334.247mil)(5160.224mil,5369.68mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.779mil]
Silk To Solder Mask Clearance Constraint: (6.851mil < 10mil) Between Pad R35-2(5142.513mil,5317.923mil) on Top Layer And Track (5160.239mil,5299.287mil)(5160.239mil,5334.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.851mil]
Silk To Solder Mask Clearance Constraint: (9.055mil < 10mil) Between Pad R35-2(5142.513mil,5317.923mil) on Top Layer And Track (5160.239mil,5334.713mil)(5183.7mil,5334.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.055mil]
Silk To Solder Mask Clearance Constraint: (9.913mil < 10mil) Between Pad R36-1(4819.3mil,5701.4mil) on Bottom Layer And Track (4798.513mil,5688.739mil)(4798.513mil,5712.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.913mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R36-1(4819.3mil,5701.4mil) on Bottom Layer And Track (4803.552mil,5683.684mil)(4803.552mil,5719.117mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R36-1(4819.3mil,5701.4mil) on Bottom Layer And Track (4803.552mil,5683.684mil)(4868.513mil,5683.684mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R36-1(4819.3mil,5701.4mil) on Bottom Layer And Track (4803.552mil,5719.117mil)(4868.513mil,5719.117mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.956mil < 10mil) Between Pad R36-1(4819.3mil,5701.4mil) on Bottom Layer And Track (4836.452mil,5718.783mil)(4836.452mil,5754.217mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.956mil]
Silk To Solder Mask Clearance Constraint: (8.956mil < 10mil) Between Pad R36-1(4819.3mil,5701.4mil) on Bottom Layer And Track (4836.452mil,5718.783mil)(4901.413mil,5718.783mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.956mil]
Silk To Solder Mask Clearance Constraint: (2.428mil < 10mil) Between Pad R36-2(4852.765mil,5701.4mil) on Bottom Layer And Text "XT2" (4847mil,5689mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.428mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R36-2(4852.765mil,5701.4mil) on Bottom Layer And Track (4803.552mil,5683.684mil)(4868.513mil,5683.684mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R36-2(4852.765mil,5701.4mil) on Bottom Layer And Track (4803.552mil,5719.117mil)(4868.513mil,5719.117mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.317mil < 10mil) Between Pad R36-2(4852.765mil,5701.4mil) on Bottom Layer And Track (4836.452mil,5718.783mil)(4836.452mil,5754.217mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.317mil]
Silk To Solder Mask Clearance Constraint: (4.541mil < 10mil) Between Pad R36-2(4852.765mil,5701.4mil) on Bottom Layer And Track (4836.452mil,5718.783mil)(4901.413mil,5718.783mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.541mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R36-2(4852.765mil,5701.4mil) on Bottom Layer And Track (4868.513mil,5683.684mil)(4868.513mil,5719.117mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.541mil < 10mil) Between Pad R37-1(4852.2mil,5736.5mil) on Bottom Layer And Track (4803.552mil,5719.117mil)(4868.513mil,5719.117mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.541mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R37-1(4852.2mil,5736.5mil) on Bottom Layer And Track (4836.452mil,5718.783mil)(4836.452mil,5754.217mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R37-1(4852.2mil,5736.5mil) on Bottom Layer And Track (4836.452mil,5718.783mil)(4901.413mil,5718.783mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R37-1(4852.2mil,5736.5mil) on Bottom Layer And Track (4836.452mil,5754.217mil)(4901.413mil,5754.217mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.317mil < 10mil) Between Pad R37-1(4852.2mil,5736.5mil) on Bottom Layer And Track (4868.513mil,5683.684mil)(4868.513mil,5719.117mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.317mil]
Silk To Solder Mask Clearance Constraint: (8.956mil < 10mil) Between Pad R37-2(4885.664mil,5736.5mil) on Bottom Layer And Track (4803.552mil,5719.117mil)(4868.513mil,5719.117mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.956mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R37-2(4885.664mil,5736.5mil) on Bottom Layer And Track (4836.452mil,5718.783mil)(4901.413mil,5718.783mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R37-2(4885.664mil,5736.5mil) on Bottom Layer And Track (4836.452mil,5754.217mil)(4901.413mil,5754.217mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.956mil < 10mil) Between Pad R37-2(4885.664mil,5736.5mil) on Bottom Layer And Track (4868.513mil,5683.684mil)(4868.513mil,5719.117mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.956mil]
Silk To Solder Mask Clearance Constraint: (4.1mil < 10mil) Between Pad R37-2(4885.664mil,5736.5mil) on Bottom Layer And Track (4900.639mil,5718.687mil)(4900.639mil,5754.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.1mil]
Silk To Solder Mask Clearance Constraint: (7.675mil < 10mil) Between Pad R37-2(4885.664mil,5736.5mil) on Bottom Layer And Track (4900.639mil,5718.687mil)(4924.1mil,5718.687mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.675mil]
Silk To Solder Mask Clearance Constraint: (7.526mil < 10mil) Between Pad R37-2(4885.664mil,5736.5mil) on Bottom Layer And Track (4900.639mil,5754.113mil)(4900.645mil,5754.12mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.526mil]
Silk To Solder Mask Clearance Constraint: (7.526mil < 10mil) Between Pad R37-2(4885.664mil,5736.5mil) on Bottom Layer And Track (4900.639mil,5754.113mil)(4924.1mil,5754.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.526mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R37-2(4885.664mil,5736.5mil) on Bottom Layer And Track (4901.413mil,5718.783mil)(4901.413mil,5754.217mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R40-1(5142.513mil,5386.003mil) on Top Layer And Track (5093.301mil,5368.287mil)(5158.261mil,5368.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R40-1(5142.513mil,5386.003mil) on Top Layer And Track (5093.301mil,5403.72mil)(5158.261mil,5403.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (3.481mil < 10mil) Between Pad R40-1(5142.513mil,5386.003mil) on Top Layer And Track (5136.762mil,5369.68mil)(5160.224mil,5369.68mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.481mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R40-1(5142.513mil,5386.003mil) on Top Layer And Track (5158.261mil,5368.287mil)(5158.261mil,5403.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.779mil < 10mil) Between Pad R40-1(5142.513mil,5386.003mil) on Top Layer And Track (5160.224mil,5334.247mil)(5160.224mil,5369.68mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.779mil]
Silk To Solder Mask Clearance Constraint: (7.198mil < 10mil) Between Pad R40-2(5109.049mil,5386.003mil) on Top Layer And Track (5093.301mil,5334.253mil)(5093.301mil,5369.68mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.198mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R40-2(5109.049mil,5386.003mil) on Top Layer And Track (5093.301mil,5368.287mil)(5093.301mil,5403.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R40-2(5109.049mil,5386.003mil) on Top Layer And Track (5093.301mil,5368.287mil)(5158.261mil,5368.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (3.483mil < 10mil) Between Pad R40-2(5109.049mil,5386.003mil) on Top Layer And Track (5093.301mil,5369.68mil)(5116.762mil,5369.68mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.483mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R40-2(5109.049mil,5386.003mil) on Top Layer And Track (5093.301mil,5403.72mil)(5158.261mil,5403.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R4-1(4161.151mil,5473.903mil) on Top Layer And Track (4111.939mil,5456.187mil)(4176.899mil,5456.187mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R4-1(4161.151mil,5473.903mil) on Top Layer And Track (4111.939mil,5491.62mil)(4176.899mil,5491.62mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R4-1(4161.151mil,5473.903mil) on Top Layer And Track (4176.899mil,5456.187mil)(4176.899mil,5491.62mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R41-1(5142.513mil,5283.883mil) on Top Layer And Track (5093.301mil,5266.167mil)(5158.261mil,5266.167mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (3.481mil < 10mil) Between Pad R41-1(5142.513mil,5283.883mil) on Top Layer And Track (5093.301mil,5267.56mil)(5158.261mil,5267.56mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.481mil]
Silk To Solder Mask Clearance Constraint: (3.481mil < 10mil) Between Pad R41-1(5142.513mil,5283.883mil) on Top Layer And Track (5093.301mil,5300.207mil)(5158.261mil,5300.207mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.481mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R41-1(5142.513mil,5283.883mil) on Top Layer And Track (5093.301mil,5301.6mil)(5158.261mil,5301.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.198mil < 10mil) Between Pad R41-1(5142.513mil,5283.883mil) on Top Layer And Track (5158.261mil,5232.127mil)(5158.261mil,5267.56mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.198mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R41-1(5142.513mil,5283.883mil) on Top Layer And Track (5158.261mil,5266.167mil)(5158.261mil,5301.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.198mil < 10mil) Between Pad R41-1(5142.513mil,5283.883mil) on Top Layer And Track (5158.261mil,5300.207mil)(5158.261mil,5335.64mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.198mil]
Silk To Solder Mask Clearance Constraint: (8.312mil < 10mil) Between Pad R41-1(5142.513mil,5283.883mil) on Top Layer And Track (5160.239mil,5299.287mil)(5160.239mil,5334.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.312mil]
Silk To Solder Mask Clearance Constraint: (8.312mil < 10mil) Between Pad R41-1(5142.513mil,5283.883mil) on Top Layer And Track (5160.239mil,5299.287mil)(5160.245mil,5299.28mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.312mil]
Silk To Solder Mask Clearance Constraint: (8.312mil < 10mil) Between Pad R41-1(5142.513mil,5283.883mil) on Top Layer And Track (5160.239mil,5299.287mil)(5183.7mil,5299.287mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.312mil]
Silk To Solder Mask Clearance Constraint: (7.251mil < 10mil) Between Pad R41-1(5142.513mil,5283.883mil) on Top Layer And Track (5160.639mil,5264.087mil)(5160.639mil,5299.513mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.251mil]
Silk To Solder Mask Clearance Constraint: (8.772mil < 10mil) Between Pad R41-1(5142.513mil,5283.883mil) on Top Layer And Track (5160.639mil,5299.513mil)(5184.1mil,5299.513mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.772mil]
Silk To Solder Mask Clearance Constraint: (7.198mil < 10mil) Between Pad R41-2(5109.049mil,5283.883mil) on Top Layer And Track (5093.301mil,5232.127mil)(5093.301mil,5267.56mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.198mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R41-2(5109.049mil,5283.883mil) on Top Layer And Track (5093.301mil,5266.167mil)(5093.301mil,5301.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R41-2(5109.049mil,5283.883mil) on Top Layer And Track (5093.301mil,5266.167mil)(5158.261mil,5266.167mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (3.481mil < 10mil) Between Pad R41-2(5109.049mil,5283.883mil) on Top Layer And Track (5093.301mil,5267.56mil)(5158.261mil,5267.56mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.481mil]
Silk To Solder Mask Clearance Constraint: (7.198mil < 10mil) Between Pad R41-2(5109.049mil,5283.883mil) on Top Layer And Track (5093.301mil,5300.207mil)(5093.301mil,5335.64mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.198mil]
Silk To Solder Mask Clearance Constraint: (3.481mil < 10mil) Between Pad R41-2(5109.049mil,5283.883mil) on Top Layer And Track (5093.301mil,5300.207mil)(5158.261mil,5300.207mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.481mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R41-2(5109.049mil,5283.883mil) on Top Layer And Track (5093.301mil,5301.6mil)(5158.261mil,5301.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R4-2(4127.687mil,5473.903mil) on Top Layer And Track (4111.939mil,5456.187mil)(4111.939mil,5491.62mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R4-2(4127.687mil,5473.903mil) on Top Layer And Track (4111.939mil,5456.187mil)(4176.899mil,5456.187mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R4-2(4127.687mil,5473.903mil) on Top Layer And Track (4111.939mil,5491.62mil)(4176.899mil,5491.62mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.198mil < 10mil) Between Pad R42-1(5109.049mil,5249.843mil) on Top Layer And Track (5093.301mil,5198.087mil)(5093.301mil,5233.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.198mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R42-1(5109.049mil,5249.843mil) on Top Layer And Track (5093.301mil,5232.127mil)(5093.301mil,5267.56mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R42-1(5109.049mil,5249.843mil) on Top Layer And Track (5093.301mil,5232.127mil)(5158.261mil,5232.127mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (3.481mil < 10mil) Between Pad R42-1(5109.049mil,5249.843mil) on Top Layer And Track (5093.301mil,5233.52mil)(5158.261mil,5233.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.481mil]
Silk To Solder Mask Clearance Constraint: (7.198mil < 10mil) Between Pad R42-1(5109.049mil,5249.843mil) on Top Layer And Track (5093.301mil,5266.167mil)(5093.301mil,5301.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.198mil]
Silk To Solder Mask Clearance Constraint: (3.481mil < 10mil) Between Pad R42-1(5109.049mil,5249.843mil) on Top Layer And Track (5093.301mil,5266.167mil)(5158.261mil,5266.167mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.481mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R42-1(5109.049mil,5249.843mil) on Top Layer And Track (5093.301mil,5267.56mil)(5158.261mil,5267.56mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R42-2(5142.513mil,5249.843mil) on Top Layer And Track (5093.301mil,5232.127mil)(5158.261mil,5232.127mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (3.481mil < 10mil) Between Pad R42-2(5142.513mil,5249.843mil) on Top Layer And Track (5093.301mil,5233.52mil)(5158.261mil,5233.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.481mil]
Silk To Solder Mask Clearance Constraint: (3.481mil < 10mil) Between Pad R42-2(5142.513mil,5249.843mil) on Top Layer And Track (5093.301mil,5266.167mil)(5158.261mil,5266.167mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.481mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R42-2(5142.513mil,5249.843mil) on Top Layer And Track (5093.301mil,5267.56mil)(5158.261mil,5267.56mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.198mil < 10mil) Between Pad R42-2(5142.513mil,5249.843mil) on Top Layer And Track (5158.261mil,5198.087mil)(5158.261mil,5233.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.198mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R42-2(5142.513mil,5249.843mil) on Top Layer And Track (5158.261mil,5232.127mil)(5158.261mil,5267.56mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.198mil < 10mil) Between Pad R42-2(5142.513mil,5249.843mil) on Top Layer And Track (5158.261mil,5266.167mil)(5158.261mil,5301.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.198mil]
Silk To Solder Mask Clearance Constraint: (8.156mil < 10mil) Between Pad R42-2(5142.513mil,5249.843mil) on Top Layer And Track (5160.639mil,5264.087mil)(5160.639mil,5299.513mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.156mil]
Silk To Solder Mask Clearance Constraint: (8.156mil < 10mil) Between Pad R42-2(5142.513mil,5249.843mil) on Top Layer And Track (5160.639mil,5264.087mil)(5160.645mil,5264.08mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.156mil]
Silk To Solder Mask Clearance Constraint: (8.156mil < 10mil) Between Pad R42-2(5142.513mil,5249.843mil) on Top Layer And Track (5160.639mil,5264.087mil)(5184.1mil,5264.087mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.156mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R43-1(4956.503mil,5000.051mil) on Bottom Layer And Track (4938.787mil,4950.839mil)(4938.787mil,5015.799mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R43-1(4956.503mil,5000.051mil) on Bottom Layer And Track (4938.787mil,5015.799mil)(4974.22mil,5015.799mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R43-1(4956.503mil,5000.051mil) on Bottom Layer And Track (4974.22mil,4950.839mil)(4974.22mil,5015.799mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R43-2(4956.503mil,4966.587mil) on Bottom Layer And Track (4938.787mil,4950.839mil)(4938.787mil,5015.799mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R43-2(4956.503mil,4966.587mil) on Bottom Layer And Track (4938.787mil,4950.839mil)(4974.22mil,4950.839mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R43-2(4956.503mil,4966.587mil) on Bottom Layer And Track (4974.22mil,4950.839mil)(4974.22mil,5015.799mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R44-1(4797.249mil,4998.203mil) on Bottom Layer And Track (4781.501mil,4980.487mil)(4781.501mil,5015.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R44-1(4797.249mil,4998.203mil) on Bottom Layer And Track (4781.501mil,4980.487mil)(4846.461mil,4980.487mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R44-1(4797.249mil,4998.203mil) on Bottom Layer And Track (4781.501mil,5015.92mil)(4846.461mil,5015.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.349mil < 10mil) Between Pad R44-1(4797.249mil,4998.203mil) on Bottom Layer And Track (4781.519mil,5018.395mil)(4846.479mil,5018.395mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.349mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R44-2(4830.713mil,4998.203mil) on Bottom Layer And Track (4781.501mil,4980.487mil)(4846.461mil,4980.487mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R44-2(4830.713mil,4998.203mil) on Bottom Layer And Track (4781.501mil,5015.92mil)(4846.461mil,5015.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.349mil < 10mil) Between Pad R44-2(4830.713mil,4998.203mil) on Bottom Layer And Track (4781.519mil,5018.395mil)(4846.479mil,5018.395mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.349mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R44-2(4830.713mil,4998.203mil) on Bottom Layer And Track (4846.461mil,4980.487mil)(4846.461mil,5015.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R45-1(4658.035mil,4943.7mil) on Bottom Layer And Track (4642.287mil,4925.984mil)(4642.287mil,4961.417mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R45-1(4658.035mil,4943.7mil) on Bottom Layer And Track (4642.287mil,4925.984mil)(4707.248mil,4925.984mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R45-1(4658.035mil,4943.7mil) on Bottom Layer And Track (4642.287mil,4961.417mil)(4707.248mil,4961.417mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R45-2(4691.5mil,4943.7mil) on Bottom Layer And Track (4642.287mil,4925.984mil)(4707.248mil,4925.984mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R45-2(4691.5mil,4943.7mil) on Bottom Layer And Track (4642.287mil,4961.417mil)(4707.248mil,4961.417mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R45-2(4691.5mil,4943.7mil) on Bottom Layer And Track (4707.248mil,4925.984mil)(4707.248mil,4961.417mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R46-1(5142.513mil,5215.803mil) on Top Layer And Track (5093.301mil,5198.087mil)(5158.261mil,5198.087mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (3.481mil < 10mil) Between Pad R46-1(5142.513mil,5215.803mil) on Top Layer And Track (5093.301mil,5232.127mil)(5158.261mil,5232.127mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.481mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R46-1(5142.513mil,5215.803mil) on Top Layer And Track (5093.301mil,5233.52mil)(5158.261mil,5233.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.247mil < 10mil) Between Pad R46-1(5142.513mil,5215.803mil) on Top Layer And Track (5094.501mil,5196.713mil)(5159.461mil,5196.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.247mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R46-1(5142.513mil,5215.803mil) on Top Layer And Track (5158.261mil,5198.087mil)(5158.261mil,5233.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.198mil < 10mil) Between Pad R46-1(5142.513mil,5215.803mil) on Top Layer And Track (5158.261mil,5232.127mil)(5158.261mil,5267.56mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.198mil]
Silk To Solder Mask Clearance Constraint: (9.956mil < 10mil) Between Pad R46-1(5142.513mil,5215.803mil) on Top Layer And Track (5159.461mil,5161.28mil)(5159.461mil,5196.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.956mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R46-2(5109.049mil,5215.803mil) on Top Layer And Track (5093.301mil,5198.087mil)(5093.301mil,5233.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R46-2(5109.049mil,5215.803mil) on Top Layer And Track (5093.301mil,5198.087mil)(5158.261mil,5198.087mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.198mil < 10mil) Between Pad R46-2(5109.049mil,5215.803mil) on Top Layer And Track (5093.301mil,5232.127mil)(5093.301mil,5267.56mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.198mil]
Silk To Solder Mask Clearance Constraint: (3.481mil < 10mil) Between Pad R46-2(5109.049mil,5215.803mil) on Top Layer And Track (5093.301mil,5232.127mil)(5158.261mil,5232.127mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.481mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R46-2(5109.049mil,5215.803mil) on Top Layer And Track (5093.301mil,5233.52mil)(5158.261mil,5233.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.404mil < 10mil) Between Pad R46-2(5109.049mil,5215.803mil) on Top Layer And Track (5094.501mil,5161.28mil)(5094.501mil,5196.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.404mil]
Silk To Solder Mask Clearance Constraint: (6.247mil < 10mil) Between Pad R46-2(5109.049mil,5215.803mil) on Top Layer And Track (5094.501mil,5196.713mil)(5159.461mil,5196.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.247mil]
Silk To Solder Mask Clearance Constraint: (9.956mil < 10mil) Between Pad R47-1(5110.249mil,5178.997mil) on Top Layer And Track (5093.301mil,5198.087mil)(5093.301mil,5233.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.956mil]
Silk To Solder Mask Clearance Constraint: (6.247mil < 10mil) Between Pad R47-1(5110.249mil,5178.997mil) on Top Layer And Track (5093.301mil,5198.087mil)(5158.261mil,5198.087mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.247mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R47-1(5110.249mil,5178.997mil) on Top Layer And Track (5094.501mil,5161.28mil)(5094.501mil,5196.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R47-1(5110.249mil,5178.997mil) on Top Layer And Track (5094.501mil,5161.28mil)(5159.461mil,5161.28mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R47-1(5110.249mil,5178.997mil) on Top Layer And Track (5094.501mil,5196.713mil)(5159.461mil,5196.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.247mil < 10mil) Between Pad R47-2(5143.713mil,5178.997mil) on Top Layer And Track (5093.301mil,5198.087mil)(5158.261mil,5198.087mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.247mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R47-2(5143.713mil,5178.997mil) on Top Layer And Track (5094.501mil,5161.28mil)(5159.461mil,5161.28mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R47-2(5143.713mil,5178.997mil) on Top Layer And Track (5094.501mil,5196.713mil)(5159.461mil,5196.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.404mil < 10mil) Between Pad R47-2(5143.713mil,5178.997mil) on Top Layer And Track (5158.261mil,5198.087mil)(5158.261mil,5233.52mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.404mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R47-2(5143.713mil,5178.997mil) on Top Layer And Track (5159.461mil,5161.28mil)(5159.461mil,5196.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.951mil < 10mil) Between Pad R48-1(4585.097mil,4995.651mil) on Top Layer And Track (4543.639mil,5013.587mil)(4567.1mil,5013.587mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.951mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R48-1(4585.097mil,4995.651mil) on Top Layer And Track (4567.38mil,4946.439mil)(4567.38mil,5011.399mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R48-1(4585.097mil,4995.651mil) on Top Layer And Track (4567.38mil,5011.399mil)(4602.813mil,5011.399mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.061mil < 10mil) Between Pad R48-1(4585.097mil,4995.651mil) on Top Layer And Track (4587.1mil,5013.587mil)(4610.561mil,5013.587mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.061mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R48-1(4585.097mil,4995.651mil) on Top Layer And Track (4602.813mil,4946.439mil)(4602.813mil,5011.399mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R48-2(4585.097mil,4962.187mil) on Top Layer And Track (4567.38mil,4946.439mil)(4567.38mil,5011.399mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R48-2(4585.097mil,4962.187mil) on Top Layer And Track (4567.38mil,4946.439mil)(4602.813mil,4946.439mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R48-2(4585.097mil,4962.187mil) on Top Layer And Track (4602.813mil,4946.439mil)(4602.813mil,5011.399mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.366mil < 10mil) Between Pad R49-1(4595.397mil,5491.451mil) on Top Layer And Track (4540.587mil,5507.199mil)(4576.02mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.366mil]
Silk To Solder Mask Clearance Constraint: (6.535mil < 10mil) Between Pad R49-1(4595.397mil,5491.451mil) on Top Layer And Track (4576.02mil,5442.239mil)(4576.02mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.535mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R49-1(4595.397mil,5491.451mil) on Top Layer And Track (4577.68mil,5442.239mil)(4577.68mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R49-1(4595.397mil,5491.451mil) on Top Layer And Track (4577.68mil,5507.199mil)(4613.113mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R49-1(4595.397mil,5491.451mil) on Top Layer And Track (4613.113mil,5442.239mil)(4613.113mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.366mil < 10mil) Between Pad R49-2(4595.397mil,5457.987mil) on Top Layer And Track (4540.587mil,5442.239mil)(4576.02mil,5442.239mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.366mil]
Silk To Solder Mask Clearance Constraint: (6.535mil < 10mil) Between Pad R49-2(4595.397mil,5457.987mil) on Top Layer And Track (4576.02mil,5442.239mil)(4576.02mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.535mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R49-2(4595.397mil,5457.987mil) on Top Layer And Track (4577.68mil,5442.239mil)(4577.68mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R49-2(4595.397mil,5457.987mil) on Top Layer And Track (4577.68mil,5442.239mil)(4613.113mil,5442.239mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R49-2(4595.397mil,5457.987mil) on Top Layer And Track (4613.113mil,5442.239mil)(4613.113mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R50-1(4997.703mil,4996.051mil) on Bottom Layer And Track (4979.987mil,4946.839mil)(4979.987mil,5011.799mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R50-1(4997.703mil,4996.051mil) on Bottom Layer And Track (4979.987mil,5011.799mil)(5015.42mil,5011.799mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R50-1(4997.703mil,4996.051mil) on Bottom Layer And Track (5015.42mil,4946.839mil)(5015.42mil,5011.799mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R50-2(4997.703mil,4962.587mil) on Bottom Layer And Track (4979.987mil,4946.839mil)(4979.987mil,5011.799mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R50-2(4997.703mil,4962.587mil) on Bottom Layer And Track (4979.987mil,4946.839mil)(5015.42mil,4946.839mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R50-2(4997.703mil,4962.587mil) on Bottom Layer And Track (5015.42mil,4946.839mil)(5015.42mil,5011.799mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R5-1(4161.451mil,5524.103mil) on Top Layer And Track (4112.239mil,5506.387mil)(4177.199mil,5506.387mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R5-1(4161.451mil,5524.103mil) on Top Layer And Track (4112.239mil,5541.82mil)(4177.199mil,5541.82mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R5-1(4161.451mil,5524.103mil) on Top Layer And Track (4177.199mil,5506.387mil)(4177.199mil,5541.82mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.349mil < 10mil) Between Pad R51-1(4797.267mil,5036.111mil) on Bottom Layer And Track (4781.501mil,5015.92mil)(4846.461mil,5015.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.349mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R51-1(4797.267mil,5036.111mil) on Bottom Layer And Track (4781.519mil,5018.395mil)(4781.519mil,5053.828mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R51-1(4797.267mil,5036.111mil) on Bottom Layer And Track (4781.519mil,5018.395mil)(4846.479mil,5018.395mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R51-1(4797.267mil,5036.111mil) on Bottom Layer And Track (4781.519mil,5053.828mil)(4846.479mil,5053.828mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.349mil < 10mil) Between Pad R51-2(4830.731mil,5036.111mil) on Bottom Layer And Track (4781.501mil,5015.92mil)(4846.461mil,5015.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.349mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R51-2(4830.731mil,5036.111mil) on Bottom Layer And Track (4781.519mil,5018.395mil)(4846.479mil,5018.395mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R51-2(4830.731mil,5036.111mil) on Bottom Layer And Track (4781.519mil,5053.828mil)(4846.479mil,5053.828mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R51-2(4830.731mil,5036.111mil) on Bottom Layer And Track (4846.479mil,5018.395mil)(4846.479mil,5053.828mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R5-2(4127.987mil,5524.103mil) on Top Layer And Track (4112.239mil,5506.387mil)(4112.239mil,5541.82mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R5-2(4127.987mil,5524.103mil) on Top Layer And Track (4112.239mil,5506.387mil)(4177.199mil,5506.387mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R5-2(4127.987mil,5524.103mil) on Top Layer And Track (4112.239mil,5541.82mil)(4177.199mil,5541.82mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R52-1(4659.368mil,5004mil) on Bottom Layer And Track (4643.62mil,4986.283mil)(4643.62mil,5021.717mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R52-1(4659.368mil,5004mil) on Bottom Layer And Track (4643.62mil,4986.283mil)(4708.58mil,4986.283mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R52-1(4659.368mil,5004mil) on Bottom Layer And Track (4643.62mil,5021.717mil)(4708.58mil,5021.717mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R52-2(4692.832mil,5004mil) on Bottom Layer And Track (4643.62mil,4986.283mil)(4708.58mil,4986.283mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R52-2(4692.832mil,5004mil) on Bottom Layer And Track (4643.62mil,5021.717mil)(4708.58mil,5021.717mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R52-2(4692.832mil,5004mil) on Bottom Layer And Track (4708.58mil,4986.283mil)(4708.58mil,5021.717mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R53-1(4558.303mil,5491.451mil) on Top Layer And Track (4540.587mil,5442.239mil)(4540.587mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R53-1(4558.303mil,5491.451mil) on Top Layer And Track (4540.587mil,5507.199mil)(4576.02mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R53-1(4558.303mil,5491.451mil) on Top Layer And Track (4576.02mil,5442.239mil)(4576.02mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.535mil < 10mil) Between Pad R53-1(4558.303mil,5491.451mil) on Top Layer And Track (4577.68mil,5442.239mil)(4577.68mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.535mil]
Silk To Solder Mask Clearance Constraint: (9.366mil < 10mil) Between Pad R53-1(4558.303mil,5491.451mil) on Top Layer And Track (4577.68mil,5507.199mil)(4613.113mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.366mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R53-2(4558.303mil,5457.987mil) on Top Layer And Track (4540.587mil,5442.239mil)(4540.587mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R53-2(4558.303mil,5457.987mil) on Top Layer And Track (4540.587mil,5442.239mil)(4576.02mil,5442.239mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R53-2(4558.303mil,5457.987mil) on Top Layer And Track (4576.02mil,5442.239mil)(4576.02mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (6.535mil < 10mil) Between Pad R53-2(4558.303mil,5457.987mil) on Top Layer And Track (4577.68mil,5442.239mil)(4577.68mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.535mil]
Silk To Solder Mask Clearance Constraint: (9.366mil < 10mil) Between Pad R53-2(4558.303mil,5457.987mil) on Top Layer And Track (4577.68mil,5442.239mil)(4613.113mil,5442.239mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.366mil]
Silk To Solder Mask Clearance Constraint: (9.928mil < 10mil) Between Pad R54-1(4520.897mil,4993.551mil) on Top Layer And Track (4482.939mil,5013.487mil)(4506.4mil,5013.487mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.928mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R54-1(4520.897mil,4993.551mil) on Top Layer And Track (4503.18mil,4944.339mil)(4503.18mil,5009.299mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R54-1(4520.897mil,4993.551mil) on Top Layer And Track (4503.18mil,5009.299mil)(4538.613mil,5009.299mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.062mil < 10mil) Between Pad R54-1(4520.897mil,4993.551mil) on Top Layer And Track (4526.4mil,5013.487mil)(4549.861mil,5013.487mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.062mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R54-1(4520.897mil,4993.551mil) on Top Layer And Track (4538.613mil,4944.339mil)(4538.613mil,5009.299mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R54-2(4520.897mil,4960.087mil) on Top Layer And Track (4503.18mil,4944.339mil)(4503.18mil,5009.299mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R54-2(4520.897mil,4960.087mil) on Top Layer And Track (4503.18mil,4944.339mil)(4538.613mil,4944.339mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R54-2(4520.897mil,4960.087mil) on Top Layer And Track (4538.613mil,4944.339mil)(4538.613mil,5009.299mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (7.795mil < 10mil) Between Pad R55-1(5359.25mil,4784.652mil) on Bottom Layer And Track (5280.51mil,4829.927mil)(5437.99mil,4829.927mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.795mil]
Silk To Solder Mask Clearance Constraint: (9.764mil < 10mil) Between Pad R55-2(5359.25mil,4550.4mil) on Bottom Layer And Track (5280.51mil,4503.156mil)(5437.99mil,4503.156mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.764mil]
Silk To Solder Mask Clearance Constraint: (6.481mil < 10mil) Between Pad R6-1(5560.097mil,5646.849mil) on Bottom Layer And Track (5506.78mil,5649.701mil)(5542.213mil,5649.701mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [6.481mil]
Silk To Solder Mask Clearance Constraint: (5.041mil < 10mil) Between Pad R6-1(5560.097mil,5646.849mil) on Bottom Layer And Track (5542.213mil,5649.701mil)(5542.213mil,5714.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.041mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R6-1(5560.097mil,5646.849mil) on Bottom Layer And Track (5542.38mil,5631.101mil)(5542.38mil,5696.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R6-1(5560.097mil,5646.849mil) on Bottom Layer And Track (5542.38mil,5631.101mil)(5577.813mil,5631.101mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R6-1(5560.097mil,5646.849mil) on Bottom Layer And Track (5577.813mil,5631.101mil)(5577.813mil,5696.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (5.041mil < 10mil) Between Pad R6-2(5560.097mil,5680.313mil) on Bottom Layer And Track (5542.213mil,5649.701mil)(5542.213mil,5714.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.041mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R6-2(5560.097mil,5680.313mil) on Bottom Layer And Track (5542.38mil,5631.101mil)(5542.38mil,5696.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R6-2(5560.097mil,5680.313mil) on Bottom Layer And Track (5542.38mil,5696.061mil)(5577.813mil,5696.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R6-2(5560.097mil,5680.313mil) on Bottom Layer And Track (5577.813mil,5631.101mil)(5577.813mil,5696.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R7-1(5524.497mil,5665.449mil) on Bottom Layer And Track (5506.78mil,5649.701mil)(5506.78mil,5714.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R7-1(5524.497mil,5665.449mil) on Bottom Layer And Track (5506.78mil,5649.701mil)(5542.213mil,5649.701mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R7-1(5524.497mil,5665.449mil) on Bottom Layer And Track (5542.213mil,5649.701mil)(5542.213mil,5714.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (5.041mil < 10mil) Between Pad R7-1(5524.497mil,5665.449mil) on Bottom Layer And Track (5542.38mil,5631.101mil)(5542.38mil,5696.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.041mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R7-2(5524.497mil,5698.913mil) on Bottom Layer And Track (5506.78mil,5649.701mil)(5506.78mil,5714.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R7-2(5524.497mil,5698.913mil) on Bottom Layer And Track (5506.78mil,5714.661mil)(5542.213mil,5714.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R7-2(5524.497mil,5698.913mil) on Bottom Layer And Track (5542.213mil,5649.701mil)(5542.213mil,5714.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (5.041mil < 10mil) Between Pad R7-2(5524.497mil,5698.913mil) on Bottom Layer And Track (5542.38mil,5631.101mil)(5542.38mil,5696.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.041mil]
Silk To Solder Mask Clearance Constraint: (5.041mil < 10mil) Between Pad R7-2(5524.497mil,5698.913mil) on Bottom Layer And Track (5542.38mil,5696.061mil)(5577.813mil,5696.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.041mil]
Silk To Solder Mask Clearance Constraint: (9.058mil < 10mil) Between Pad R8-1(5561.851mil,5598.997mil) on Bottom Layer And Text "C5" (5574mil,5581mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.058mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R8-1(5561.851mil,5598.997mil) on Bottom Layer And Track (5512.639mil,5581.28mil)(5577.599mil,5581.28mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R8-1(5561.851mil,5598.997mil) on Bottom Layer And Track (5512.639mil,5616.713mil)(5577.599mil,5616.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R8-1(5561.851mil,5598.997mil) on Bottom Layer And Track (5577.599mil,5581.28mil)(5577.599mil,5616.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.041mil < 10mil) Between Pad R8-2(5528.387mil,5598.997mil) on Bottom Layer And Track (5503.6mil,5578.113mil)(5527.061mil,5578.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.041mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R8-2(5528.387mil,5598.997mil) on Bottom Layer And Track (5512.639mil,5581.28mil)(5512.639mil,5616.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R8-2(5528.387mil,5598.997mil) on Bottom Layer And Track (5512.639mil,5581.28mil)(5577.599mil,5581.28mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R8-2(5528.387mil,5598.997mil) on Bottom Layer And Track (5512.639mil,5616.713mil)(5577.599mil,5616.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (8.041mil < 10mil) Between Pad R8-2(5528.387mil,5598.997mil) on Bottom Layer And Track (5527.061mil,5542.687mil)(5527.061mil,5578.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.041mil]
Silk To Solder Mask Clearance Constraint: (5.541mil < 10mil) Between Pad R9-1(5524.349mil,5742.303mil) on Bottom Layer And Track (5508.039mil,5760.687mil)(5531.5mil,5760.687mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.541mil]
Silk To Solder Mask Clearance Constraint: (9mil < 10mil) Between Pad R9-1(5524.349mil,5742.303mil) on Bottom Layer And Track (5508.039mil,5760.68mil)(5508.039mil,5796.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R9-1(5524.349mil,5742.303mil) on Bottom Layer And Track (5508.601mil,5724.587mil)(5508.601mil,5760.02mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R9-1(5524.349mil,5742.303mil) on Bottom Layer And Track (5508.601mil,5724.587mil)(5573.561mil,5724.587mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R9-1(5524.349mil,5742.303mil) on Bottom Layer And Track (5508.601mil,5760.02mil)(5573.561mil,5760.02mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.999mil < 10mil) Between Pad R9-2(5557.813mil,5742.303mil) on Bottom Layer And Text "R7" (5545mil,5738mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.999mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R9-2(5557.813mil,5742.303mil) on Bottom Layer And Track (5508.601mil,5724.587mil)(5573.561mil,5724.587mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R9-2(5557.813mil,5742.303mil) on Bottom Layer And Track (5508.601mil,5760.02mil)(5573.561mil,5760.02mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (5.541mil < 10mil) Between Pad R9-2(5557.813mil,5742.303mil) on Bottom Layer And Track (5551.5mil,5760.687mil)(5574.961mil,5760.687mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.541mil]
Silk To Solder Mask Clearance Constraint: (4.874mil < 10mil) Between Pad R9-2(5557.813mil,5742.303mil) on Bottom Layer And Track (5573.561mil,5724.587mil)(5573.561mil,5760.02mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.874mil]
Silk To Solder Mask Clearance Constraint: (9.599mil < 10mil) Between Pad R9-2(5557.813mil,5742.303mil) on Bottom Layer And Track (5574.955mil,5760.68mil)(5574.961mil,5760.687mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.599mil]
Silk To Solder Mask Clearance Constraint: (9.608mil < 10mil) Between Pad R9-2(5557.813mil,5742.303mil) on Bottom Layer And Track (5574.961mil,5760.687mil)(5574.961mil,5796.113mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.608mil]
Silk To Solder Mask Clearance Constraint: (5.848mil < 10mil) Between Pad S1-1(4826.548mil,5845.2mil) on Bottom Layer And Track (4838.36mil,5788.113mil)(4838.36mil,5796.73mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.848mil]
Silk To Solder Mask Clearance Constraint: (4.1mil < 10mil) Between Pad S1-1(4826.548mil,5845.2mil) on Bottom Layer And Track (4838.36mil,5893.67mil)(4838.36mil,5902.287mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.1mil]
Silk To Solder Mask Clearance Constraint: (4.1mil < 10mil) Between Pad S1-2(5007.652mil,5845.2mil) on Bottom Layer And Track (4995.84mil,5788.113mil)(4995.84mil,5796.73mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.1mil]
Silk To Solder Mask Clearance Constraint: (4.1mil < 10mil) Between Pad S1-2(5007.652mil,5845.2mil) on Bottom Layer And Track (4995.84mil,5893.67mil)(4995.84mil,5902.287mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.1mil]
Silk To Solder Mask Clearance Constraint: (5.848mil < 10mil) Between Pad S2-1(5063.948mil,5845.7mil) on Bottom Layer And Track (5075.76mil,5788.613mil)(5075.76mil,5797.23mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.848mil]
Silk To Solder Mask Clearance Constraint: (4.1mil < 10mil) Between Pad S2-1(5063.948mil,5845.7mil) on Bottom Layer And Track (5075.76mil,5894.17mil)(5075.76mil,5902.787mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.1mil]
Silk To Solder Mask Clearance Constraint: (4.1mil < 10mil) Between Pad S2-2(5245.052mil,5845.7mil) on Bottom Layer And Track (5233.24mil,5788.613mil)(5233.24mil,5797.23mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.1mil]
Silk To Solder Mask Clearance Constraint: (4.1mil < 10mil) Between Pad S2-2(5245.052mil,5845.7mil) on Bottom Layer And Track (5233.24mil,5894.17mil)(5233.24mil,5902.787mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.1mil]
Silk To Solder Mask Clearance Constraint: (5.848mil < 10mil) Between Pad S3-1(5297.148mil,5844.7mil) on Bottom Layer And Track (5308.96mil,5787.613mil)(5308.96mil,5796.23mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.848mil]
Silk To Solder Mask Clearance Constraint: (4.1mil < 10mil) Between Pad S3-1(5297.148mil,5844.7mil) on Bottom Layer And Track (5308.96mil,5893.17mil)(5308.96mil,5901.787mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.1mil]
Silk To Solder Mask Clearance Constraint: (4.1mil < 10mil) Between Pad S3-2(5478.252mil,5844.7mil) on Bottom Layer And Track (5466.44mil,5787.613mil)(5466.44mil,5796.23mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.1mil]
Silk To Solder Mask Clearance Constraint: (4.1mil < 10mil) Between Pad S3-2(5478.252mil,5844.7mil) on Bottom Layer And Track (5466.44mil,5893.17mil)(5466.44mil,5901.787mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.1mil]
Silk To Solder Mask Clearance Constraint: (8.218mil < 10mil) Between Pad S3-2(5478.252mil,5844.7mil) on Bottom Layer And Track (5507.187mil,5806.439mil)(5507.187mil,5829.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.218mil]
Silk To Solder Mask Clearance Constraint: (8.218mil < 10mil) Between Pad S3-2(5478.252mil,5844.7mil) on Bottom Layer And Track (5507.187mil,5806.439mil)(5542.613mil,5806.439mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.218mil]
Silk To Solder Mask Clearance Constraint: (8.218mil < 10mil) Between Pad S3-2(5478.252mil,5844.7mil) on Bottom Layer And Track (5507.187mil,5849.9mil)(5507.187mil,5873.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.218mil]
Silk To Solder Mask Clearance Constraint: (8.212mil < 10mil) Between Pad S3-2(5478.252mil,5844.7mil) on Bottom Layer And Track (5507.18mil,5806.445mil)(5507.187mil,5806.439mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.212mil]
Silk To Solder Mask Clearance Constraint: (8.212mil < 10mil) Between Pad S3-2(5478.252mil,5844.7mil) on Bottom Layer And Track (5507.18mil,5873.361mil)(5542.613mil,5873.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.212mil]
Silk To Solder Mask Clearance Constraint: (0.795mil < 10mil) Between Pad U10-1(4038.743mil,5627.2mil) on Top Layer And Track (3999.2mil,5632.2mil)(4019.2mil,5632.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.795mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad U10-1(4038.743mil,5627.2mil) on Top Layer And Track (4056.2mil,5627.2mil)(4066.2mil,5617.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.709mil < 10mil) Between Pad U10-1(4038.743mil,5627.2mil) on Top Layer And Track (4066.2mil,5494.2mil)(4066.2mil,5617.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.709mil]
Silk To Solder Mask Clearance Constraint: (8.709mil < 10mil) Between Pad U10-2(3981.657mil,5627.2mil) on Top Layer And Track (3954.2mil,5494.2mil)(3954.2mil,5632.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.709mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad U10-2(3981.657mil,5627.2mil) on Top Layer And Track (3954.2mil,5632.2mil)(3964.2mil,5632.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad U10-2(3981.657mil,5627.2mil) on Top Layer And Track (3999.2mil,5632.2mil)(4019.2mil,5632.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.709mil < 10mil) Between Pad U10-3(3981.657mil,5494.2mil) on Top Layer And Track (3954.2mil,5494.2mil)(3954.2mil,5632.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.709mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad U10-3(3981.657mil,5494.2mil) on Top Layer And Track (3954.2mil,5494.2mil)(3966.2mil,5494.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (0.795mil < 10mil) Between Pad U10-3(3981.657mil,5494.2mil) on Top Layer And Track (4001.2mil,5494.2mil)(4021.2mil,5494.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.795mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad U10-4(4038.743mil,5494.2mil) on Top Layer And Track (4001.2mil,5494.2mil)(4021.2mil,5494.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad U10-4(4038.743mil,5494.2mil) on Top Layer And Track (4056.2mil,5494.2mil)(4066.2mil,5494.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (8.709mil < 10mil) Between Pad U10-4(4038.743mil,5494.2mil) on Top Layer And Track (4066.2mil,5494.2mil)(4066.2mil,5617.2mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.709mil]
Silk To Solder Mask Clearance Constraint: (0.117mil < 10mil) Between Pad U1-10(4971.996mil,5535.828mil) on Bottom Layer And Track (4935.513mil,5508.639mil)(4935.513mil,5532.1mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0.117mil]
Silk To Solder Mask Clearance Constraint: (9.184mil < 10mil) Between Pad U1-10(4971.996mil,5535.828mil) on Bottom Layer And Track (4935.513mil,5552.1mil)(4935.513mil,5575.561mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.184mil]
Silk To Solder Mask Clearance Constraint: (0.117mil < 10mil) Between Pad U1-11(4971.996mil,5555.512mil) on Bottom Layer And Track (4935.513mil,5552.1mil)(4935.513mil,5575.561mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0.117mil]
Silk To Solder Mask Clearance Constraint: (7.243mil < 10mil) Between Pad U11-1(5627.953mil,5488.193mil) on Bottom Layer And Track (5627.898mil,5449.06mil)(5627.898mil,5469.06mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.243mil]
Silk To Solder Mask Clearance Constraint: (7.733mil < 10mil) Between Pad U11-10(5627.953mil,5718.503mil) on Bottom Layer And Text "R6" (5581mil,5719mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.733mil]
Silk To Solder Mask Clearance Constraint: (5.5mil < 10mil) Between Pad U11-13(5627.953mil,5795.283mil) on Bottom Layer And Track (5545.487mil,5805.839mil)(5580.913mil,5805.839mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.5mil]
Silk To Solder Mask Clearance Constraint: (5.5mil < 10mil) Between Pad U11-13(5627.953mil,5795.283mil) on Bottom Layer And Track (5580.913mil,5805.839mil)(5580.913mil,5829.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.5mil]
Silk To Solder Mask Clearance Constraint: (8.188mil < 10mil) Between Pad U11-14(5627.953mil,5820.873mil) on Bottom Layer And Track (5545.487mil,5805.839mil)(5580.913mil,5805.839mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.187mil]
Silk To Solder Mask Clearance Constraint: (4.67mil < 10mil) Between Pad U11-14(5627.953mil,5820.873mil) on Bottom Layer And Track (5580.913mil,5805.839mil)(5580.913mil,5829.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.67mil]
Silk To Solder Mask Clearance Constraint: (9.82mil < 10mil) Between Pad U11-15(5627.953mil,5846.463mil) on Bottom Layer And Track (5580.913mil,5805.839mil)(5580.913mil,5829.3mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.82mil]
Silk To Solder Mask Clearance Constraint: (4.67mil < 10mil) Between Pad U11-15(5627.953mil,5846.463mil) on Bottom Layer And Track (5580.913mil,5849.3mil)(5580.913mil,5872.761mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.67mil]
Silk To Solder Mask Clearance Constraint: (0.117mil < 10mil) Between Pad U1-12(4971.996mil,5575.198mil) on Bottom Layer And Track (4900.08mil,5575.561mil)(4935.513mil,5575.561mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0.117mil]
Silk To Solder Mask Clearance Constraint: (3.469mil < 10mil) Between Pad U1-12(4971.996mil,5575.198mil) on Bottom Layer And Track (4908.7mil,5573.487mil)(4932.161mil,5573.487mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [3.469mil]
Silk To Solder Mask Clearance Constraint: (3.469mil < 10mil) Between Pad U1-12(4971.996mil,5575.198mil) on Bottom Layer And Track (4932.161mil,5573.487mil)(4932.161mil,5608.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [3.469mil]
Silk To Solder Mask Clearance Constraint: (0.117mil < 10mil) Between Pad U1-12(4971.996mil,5575.198mil) on Bottom Layer And Track (4935.513mil,5552.1mil)(4935.513mil,5575.561mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0.117mil]
Silk To Solder Mask Clearance Constraint: (8.524mil < 10mil) Between Pad U1-13(4971.996mil,5594.883mil) on Bottom Layer And Track (4908.7mil,5608.913mil)(4932.161mil,5608.913mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.524mil]
Silk To Solder Mask Clearance Constraint: (3.469mil < 10mil) Between Pad U1-13(4971.996mil,5594.883mil) on Bottom Layer And Track (4932.161mil,5573.487mil)(4932.161mil,5608.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [3.469mil]
Silk To Solder Mask Clearance Constraint: (3.572mil < 10mil) Between Pad U1-14(4971.996mil,5614.568mil) on Bottom Layer And Track (4908.7mil,5608.913mil)(4932.161mil,5608.913mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [3.572mil]
Silk To Solder Mask Clearance Constraint: (3.571mil < 10mil) Between Pad U1-14(4971.996mil,5614.568mil) on Bottom Layer And Track (4932.161mil,5573.487mil)(4932.161mil,5608.92mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [3.571mil]
Silk To Solder Mask Clearance Constraint: (8.239mil < 10mil) Between Pad U11-5(5627.953mil,5590.553mil) on Bottom Layer And Track (5512.639mil,5581.28mil)(5577.599mil,5581.28mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.239mil]
Silk To Solder Mask Clearance Constraint: (7.984mil < 10mil) Between Pad U11-5(5627.953mil,5590.553mil) on Bottom Layer And Track (5577.599mil,5581.28mil)(5577.599mil,5616.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.984mil]
Silk To Solder Mask Clearance Constraint: (9.663mil < 10mil) Between Pad U11-6(5627.943mil,5616.143mil) on Bottom Layer And Track (5512.639mil,5616.713mil)(5577.599mil,5616.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.663mil]
Silk To Solder Mask Clearance Constraint: (9.663mil < 10mil) Between Pad U11-6(5627.943mil,5616.143mil) on Bottom Layer And Track (5577.599mil,5581.28mil)(5577.599mil,5616.713mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.663mil]
Silk To Solder Mask Clearance Constraint: (7.643mil < 10mil) Between Pad U11-7(5627.953mil,5641.733mil) on Bottom Layer And Text "R8" (5581mil,5640mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.643mil]
Silk To Solder Mask Clearance Constraint: (8.401mil < 10mil) Between Pad U11-7(5627.953mil,5641.733mil) on Bottom Layer And Track (5542.38mil,5631.101mil)(5577.813mil,5631.101mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.401mil]
Silk To Solder Mask Clearance Constraint: (7.769mil < 10mil) Between Pad U11-7(5627.953mil,5641.733mil) on Bottom Layer And Track (5577.813mil,5631.101mil)(5577.813mil,5696.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.769mil]
Silk To Solder Mask Clearance Constraint: (7.769mil < 10mil) Between Pad U11-8(5627.953mil,5667.323mil) on Bottom Layer And Track (5577.813mil,5631.101mil)(5577.813mil,5696.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.769mil]
Silk To Solder Mask Clearance Constraint: (8.401mil < 10mil) Between Pad U11-9(5627.953mil,5692.913mil) on Bottom Layer And Track (5542.38mil,5696.061mil)(5577.813mil,5696.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.401mil]
Silk To Solder Mask Clearance Constraint: (8.401mil < 10mil) Between Pad U11-9(5627.953mil,5692.913mil) on Bottom Layer And Track (5577.813mil,5631.101mil)(5577.813mil,5696.061mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.401mil]
Silk To Solder Mask Clearance Constraint: (9.363mil < 10mil) Between Pad U1-32(5338.138mil,5724.804mil) on Bottom Layer And Track (5354.339mil,5737.787mil)(5377.8mil,5737.787mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.363mil]
Silk To Solder Mask Clearance Constraint: (9.363mil < 10mil) Between Pad U1-32(5338.138mil,5724.804mil) on Bottom Layer And Track (5354.339mil,5737.78mil)(5354.339mil,5773.213mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.363mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad U1-48(5409.004mil,5358.662mil) on Bottom Layer And Text "C17" (5392mil,5359mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (9.924mil < 10mil) Between Pad U1-59(5141.287mil,5287.796mil) on Bottom Layer And Track (5100.48mil,5240.361mil)(5135.913mil,5240.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.924mil]
Silk To Solder Mask Clearance Constraint: (9.924mil < 10mil) Between Pad U1-59(5141.287mil,5287.796mil) on Bottom Layer And Track (5135.913mil,5175.401mil)(5135.913mil,5240.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.924mil]
Silk To Solder Mask Clearance Constraint: (9.868mil < 10mil) Between Pad U1-60(5121.602mil,5287.796mil) on Bottom Layer And Track (5100.48mil,5240.361mil)(5135.913mil,5240.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.868mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad U1-61(5101.917mil,5287.796mil) on Bottom Layer And Text "R14" (5098mil,5263mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (9.973mil < 10mil) Between Pad U1-61(5101.917mil,5287.796mil) on Bottom Layer And Track (5100.48mil,5175.401mil)(5100.48mil,5240.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.973mil]
Silk To Solder Mask Clearance Constraint: (9.973mil < 10mil) Between Pad U1-61(5101.917mil,5287.796mil) on Bottom Layer And Track (5100.48mil,5240.361mil)(5135.913mil,5240.361mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.973mil]
Silk To Solder Mask Clearance Constraint: (9.566mil < 10mil) Between Pad U1-62(5082.232mil,5287.796mil) on Bottom Layer And Text "R14" (5098mil,5263mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.566mil]
Silk To Solder Mask Clearance Constraint: (8.113mil < 10mil) Between Pad U1-63(5062.547mil,5287.796mil) on Bottom Layer And Track (5033.98mil,5242.661mil)(5069.413mil,5242.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.113mil]
Silk To Solder Mask Clearance Constraint: (9.495mil < 10mil) Between Pad U1-63(5062.547mil,5287.796mil) on Bottom Layer And Track (5069.413mil,5219.2mil)(5069.413mil,5242.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.496mil]
Silk To Solder Mask Clearance Constraint: (7.763mil < 10mil) Between Pad U1-64(5042.862mil,5287.796mil) on Bottom Layer And Text "C30" (5031mil,5266mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.763mil]
Silk To Solder Mask Clearance Constraint: (9.201mil < 10mil) Between Pad U1-64(5042.862mil,5287.796mil) on Bottom Layer And Track (5033.987mil,5219.2mil)(5033.987mil,5242.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.201mil]
Silk To Solder Mask Clearance Constraint: (8.113mil < 10mil) Between Pad U1-64(5042.862mil,5287.796mil) on Bottom Layer And Track (5033.98mil,5242.661mil)(5069.413mil,5242.661mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.113mil]
Silk To Solder Mask Clearance Constraint: (5.295mil < 10mil) Between Pad U1-8(4971.996mil,5496.457mil) on Bottom Layer And Track (4900.087mil,5508.639mil)(4935.513mil,5508.639mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.295mil]
Silk To Solder Mask Clearance Constraint: (5.295mil < 10mil) Between Pad U1-8(4971.996mil,5496.457mil) on Bottom Layer And Track (4935.513mil,5508.639mil)(4935.513mil,5532.1mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.295mil]
Silk To Solder Mask Clearance Constraint: (1.333mil < 10mil) Between Pad U1-9(4971.996mil,5516.142mil) on Bottom Layer And Track (4900.087mil,5508.639mil)(4935.513mil,5508.639mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [1.333mil]
Silk To Solder Mask Clearance Constraint: (0.117mil < 10mil) Between Pad U1-9(4971.996mil,5516.142mil) on Bottom Layer And Track (4935.513mil,5508.639mil)(4935.513mil,5532.1mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0.117mil]
Silk To Solder Mask Clearance Constraint: (1.352mil < 10mil) Between Pad U2-1(4364.399mil,5439.042mil) on Bottom Layer And Track (4322.364mil,5437.012mil)(4337.364mil,5422.012mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [1.351mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad U2-1(4364.399mil,5439.042mil) on Bottom Layer And Track (4322.364mil,5437.012mil)(4337.364mil,5452.012mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (Collision < 10mil) Between Pad U2-1(4364.399mil,5439.042mil) on Bottom Layer And Track (4337.364mil,5422.012mil)(4337.364mil,5452.012mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0mil]
Silk To Solder Mask Clearance Constraint: (7.856mil < 10mil) Between Pad U2-11(4651.801mil,5669.358mil) on Bottom Layer And Track (4688.2mil,5535.9mil)(4688.2mil,5665.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.856mil]
Silk To Solder Mask Clearance Constraint: (8.392mil < 10mil) Between Pad U2-11(4651.801mil,5669.358mil) on Bottom Layer And Track (4688.2mil,5665.9mil)(4838.2mil,5665.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [8.392mil]
Silk To Solder Mask Clearance Constraint: (7.856mil < 10mil) Between Pad U2-12(4651.801mil,5643.767mil) on Bottom Layer And Track (4688.2mil,5535.9mil)(4688.2mil,5665.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.856mil]
Silk To Solder Mask Clearance Constraint: (7.856mil < 10mil) Between Pad U2-13(4651.801mil,5618.176mil) on Bottom Layer And Track (4688.2mil,5535.9mil)(4688.2mil,5665.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.856mil]
Silk To Solder Mask Clearance Constraint: (7.856mil < 10mil) Between Pad U2-14(4651.801mil,5592.586mil) on Bottom Layer And Track (4688.2mil,5535.9mil)(4688.2mil,5665.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.856mil]
Silk To Solder Mask Clearance Constraint: (7.856mil < 10mil) Between Pad U2-15(4651.801mil,5566.995mil) on Bottom Layer And Track (4688.2mil,5535.9mil)(4688.2mil,5665.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.856mil]
Silk To Solder Mask Clearance Constraint: (7.946mil < 10mil) Between Pad U2-16(4651.801mil,5541.405mil) on Bottom Layer And Track (4688.2mil,5535.9mil)(4688.2mil,5665.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.946mil]
Silk To Solder Mask Clearance Constraint: (7.946mil < 10mil) Between Pad U2-16(4651.801mil,5541.405mil) on Bottom Layer And Track (4688.2mil,5535.9mil)(4838.2mil,5535.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.946mil]
Silk To Solder Mask Clearance Constraint: (4.969mil < 10mil) Between Pad U2-2(4364.399mil,5464.633mil) on Bottom Layer And Track (4322.364mil,5437.012mil)(4337.364mil,5452.012mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.969mil]
Silk To Solder Mask Clearance Constraint: (4.969mil < 10mil) Between Pad U2-2(4364.399mil,5464.633mil) on Bottom Layer And Track (4337.364mil,5422.012mil)(4337.364mil,5452.012mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.969mil]
Silk To Solder Mask Clearance Constraint: (5.698mil < 10mil) Between Pad U3-4(4515.621mil,5584.8mil) on Top Layer And Track (4540.587mil,5442.239mil)(4540.587mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.698mil]
Silk To Solder Mask Clearance Constraint: (5.698mil < 10mil) Between Pad U3-4(4515.621mil,5584.8mil) on Top Layer And Track (4540.587mil,5507.199mil)(4576.02mil,5507.199mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [5.698mil]
Silk To Solder Mask Clearance Constraint: (9.93mil < 10mil) Between Pad U3-4(4515.621mil,5584.8mil) on Top Layer And Track (4562.987mil,5630.139mil)(4562.987mil,5653.6mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.93mil]
Silk To Solder Mask Clearance Constraint: (9.93mil < 10mil) Between Pad U3-4(4515.621mil,5584.8mil) on Top Layer And Track (4562.987mil,5630.139mil)(4598.413mil,5630.139mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.93mil]
Silk To Solder Mask Clearance Constraint: (9.858mil < 10mil) Between Pad U4-1(5129.119mil,5022.302mil) on Top Layer And Track (5160.3mil,4931.868mil)(5160.3mil,5038.167mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.858mil]
Silk To Solder Mask Clearance Constraint: (9.971mil < 10mil) Between Pad U4-2(5129.119mil,4984.9mil) on Top Layer And Track (4994.209mil,4989.091mil)(5096.572mil,4989.091mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.971mil]
Silk To Solder Mask Clearance Constraint: (9.971mil < 10mil) Between Pad U4-2(5129.119mil,4984.9mil) on Top Layer And Track (5096.572mil,4937.909mil)(5096.572mil,4989.091mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.971mil]
Silk To Solder Mask Clearance Constraint: (9.858mil < 10mil) Between Pad U4-2(5129.119mil,4984.9mil) on Top Layer And Track (5160.3mil,4931.868mil)(5160.3mil,5038.167mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.858mil]
Silk To Solder Mask Clearance Constraint: (9.971mil < 10mil) Between Pad U4-3(5129.119mil,4947.498mil) on Top Layer And Track (4994.209mil,4937.909mil)(5096.572mil,4937.909mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.971mil]
Silk To Solder Mask Clearance Constraint: (9.971mil < 10mil) Between Pad U4-3(5129.119mil,4947.498mil) on Top Layer And Track (5096.572mil,4937.909mil)(5096.572mil,4989.091mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.971mil]
Silk To Solder Mask Clearance Constraint: (9.858mil < 10mil) Between Pad U4-3(5129.119mil,4947.498mil) on Top Layer And Track (5160.3mil,4931.868mil)(5160.3mil,5038.167mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.858mil]
Silk To Solder Mask Clearance Constraint: (9.858mil < 10mil) Between Pad U4-4(5231.481mil,4947.498mil) on Top Layer And Track (5200.3mil,5038.167mil)(5200.3mil,4931.868mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.858mil]
Silk To Solder Mask Clearance Constraint: (9.858mil < 10mil) Between Pad U4-5(5231.481mil,5022.302mil) on Top Layer And Track (5200.3mil,5038.167mil)(5200.3mil,4931.868mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.858mil]
Silk To Solder Mask Clearance Constraint: (9.642mil < 10mil) Between Pad U5-28(4535.052mil,5398.906mil) on Top Layer And Track (4404.5mil,5377.8mil)(4514.5mil,5377.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.642mil]
Silk To Solder Mask Clearance Constraint: (9.642mil < 10mil) Between Pad U5-28(4535.052mil,5398.906mil) on Top Layer And Track (4514.5mil,5237.8mil)(4514.5mil,5377.8mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.642mil]
Silk To Solder Mask Clearance Constraint: (9.28mil < 10mil) Between Pad U5-35(4653.162mil,5099.694mil) on Top Layer And Track (4660.039mil,5027.287mil)(4660.039mil,5062.72mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.28mil]
Silk To Solder Mask Clearance Constraint: (9.284mil < 10mil) Between Pad U5-35(4653.162mil,5099.694mil) on Top Layer And Track (4660.039mil,5062.713mil)(4683.5mil,5062.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.284mil]
Silk To Solder Mask Clearance Constraint: (7.833mil < 10mil) Between Pad U5-36(4672.847mil,5099.694mil) on Top Layer And Track (4660.039mil,5062.713mil)(4683.5mil,5062.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.833mil]
Silk To Solder Mask Clearance Constraint: (9.014mil < 10mil) Between Pad U5-37(4692.532mil,5099.694mil) on Top Layer And Track (4660.039mil,5062.713mil)(4683.5mil,5062.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.014mil]
Silk To Solder Mask Clearance Constraint: (9.968mil < 10mil) Between Pad U5-37(4692.532mil,5099.694mil) on Top Layer And Track (4703.5mil,5062.713mil)(4726.961mil,5062.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.968mil]
Silk To Solder Mask Clearance Constraint: (7.833mil < 10mil) Between Pad U5-38(4712.217mil,5099.694mil) on Top Layer And Track (4703.5mil,5062.713mil)(4726.961mil,5062.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.833mil]
Silk To Solder Mask Clearance Constraint: (7.889mil < 10mil) Between Pad U5-39(4731.902mil,5099.694mil) on Top Layer And Track (4703.5mil,5062.713mil)(4726.961mil,5062.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.889mil]
Silk To Solder Mask Clearance Constraint: (7.883mil < 10mil) Between Pad U5-39(4731.902mil,5099.694mil) on Top Layer And Track (4726.955mil,5062.72mil)(4726.961mil,5062.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.883mil]
Silk To Solder Mask Clearance Constraint: (7.889mil < 10mil) Between Pad U5-39(4731.902mil,5099.694mil) on Top Layer And Track (4726.961mil,5027.287mil)(4726.961mil,5062.713mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [7.889mil]
Silk To Solder Mask Clearance Constraint: (9.186mil < 10mil) Between Pad U5-45(4850.013mil,5099.694mil) on Top Layer And Track (4861.039mil,5034.387mil)(4861.039mil,5069.82mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.186mil]
Silk To Solder Mask Clearance Constraint: (9.187mil < 10mil) Between Pad U5-45(4850.013mil,5099.694mil) on Top Layer And Track (4861.039mil,5069.813mil)(4884.5mil,5069.813mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.187mil]
Silk To Solder Mask Clearance Constraint: (3.034mil < 10mil) Between Pad U5-46(4869.698mil,5099.694mil) on Top Layer And Track (4861.039mil,5034.387mil)(4861.039mil,5069.82mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.033mil]
Silk To Solder Mask Clearance Constraint: (0.733mil < 10mil) Between Pad U5-46(4869.698mil,5099.694mil) on Top Layer And Track (4861.039mil,5069.813mil)(4884.5mil,5069.813mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.733mil]
Silk To Solder Mask Clearance Constraint: (0.876mil < 10mil) Between Pad U5-47(4889.383mil,5099.694mil) on Top Layer And Track (4861.039mil,5069.813mil)(4884.5mil,5069.813mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.876mil]
Silk To Solder Mask Clearance Constraint: (8.881mil < 10mil) Between Pad U5-47(4889.383mil,5099.694mil) on Top Layer And Track (4904.5mil,5069.813mil)(4927.961mil,5069.813mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [8.881mil]
Silk To Solder Mask Clearance Constraint: (0.733mil < 10mil) Between Pad U5-48(4909.068mil,5099.694mil) on Top Layer And Track (4904.5mil,5069.813mil)(4927.961mil,5069.813mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.733mil]
Silk To Solder Mask Clearance Constraint: (0.733mil < 10mil) Between Pad U5-49(4928.753mil,5099.694mil) on Top Layer And Track (4904.5mil,5069.813mil)(4927.961mil,5069.813mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0.733mil]
Silk To Solder Mask Clearance Constraint: (1.81mil < 10mil) Between Pad U5-49(4928.753mil,5099.694mil) on Top Layer And Track (4927.955mil,5069.82mil)(4927.961mil,5069.813mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [1.81mil]
Silk To Solder Mask Clearance Constraint: (1.818mil < 10mil) Between Pad U5-49(4928.753mil,5099.694mil) on Top Layer And Track (4927.961mil,5034.387mil)(4927.961mil,5069.813mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [1.818mil]
Silk To Solder Mask Clearance Constraint: (7.756mil < 10mil) Between Pad USB1-1(4267.364mil,5437.012mil) on Bottom Layer And Track (4322.364mil,5437.012mil)(4337.364mil,5422.012mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.756mil]
Silk To Solder Mask Clearance Constraint: (7.756mil < 10mil) Between Pad USB1-1(4267.364mil,5437.012mil) on Bottom Layer And Track (4322.364mil,5437.012mil)(4337.364mil,5452.012mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.756mil]
Silk To Solder Mask Clearance Constraint: (9.134mil < 10mil) Between Pad XT1-1(4590.561mil,5843.665mil) on Bottom Layer And Track (4551.9mil,5834.2mil)(4551.9mil,5878.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.134mil]
Silk To Solder Mask Clearance Constraint: (7.976mil < 10mil) Between Pad XT1-1(4590.561mil,5843.665mil) on Bottom Layer And Track (4551.9mil,5879.2mil)(4596.9mil,5879.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.976mil]
Silk To Solder Mask Clearance Constraint: (5.118mil < 10mil) Between Pad XT1-1(4590.561mil,5843.665mil) on Bottom Layer And Track (4556.9mil,5745.2mil)(4556.9mil,5875.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.118mil]
Silk To Solder Mask Clearance Constraint: (4.961mil < 10mil) Between Pad XT1-1(4590.561mil,5843.665mil) on Bottom Layer And Track (4556.9mil,5875.2mil)(4706.9mil,5875.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.961mil]
Silk To Solder Mask Clearance Constraint: (4.961mil < 10mil) Between Pad XT1-2(4673.239mil,5843.665mil) on Bottom Layer And Track (4556.9mil,5875.2mil)(4706.9mil,5875.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.961mil]
Silk To Solder Mask Clearance Constraint: (5.118mil < 10mil) Between Pad XT1-2(4673.239mil,5843.665mil) on Bottom Layer And Track (4706.9mil,5745.2mil)(4706.9mil,5875.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.118mil]
Silk To Solder Mask Clearance Constraint: (4.961mil < 10mil) Between Pad XT1-3(4673.239mil,5776.735mil) on Bottom Layer And Track (4556.9mil,5745.2mil)(4706.9mil,5745.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.961mil]
Silk To Solder Mask Clearance Constraint: (5.118mil < 10mil) Between Pad XT1-3(4673.239mil,5776.735mil) on Bottom Layer And Track (4706.9mil,5745.2mil)(4706.9mil,5875.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.118mil]
Silk To Solder Mask Clearance Constraint: (5.118mil < 10mil) Between Pad XT1-4(4590.561mil,5776.735mil) on Bottom Layer And Track (4556.9mil,5745.2mil)(4556.9mil,5875.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.118mil]
Silk To Solder Mask Clearance Constraint: (4.961mil < 10mil) Between Pad XT1-4(4590.561mil,5776.735mil) on Bottom Layer And Track (4556.9mil,5745.2mil)(4706.9mil,5745.2mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.961mil]
Silk To Solder Mask Clearance Constraint: (4.961mil < 10mil) Between Pad XT2-1(4804.539mil,5567.435mil) on Bottom Layer And Track (4688.2mil,5535.9mil)(4838.2mil,5535.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.961mil]
Silk To Solder Mask Clearance Constraint: (7.976mil < 10mil) Between Pad XT2-1(4804.539mil,5567.435mil) on Bottom Layer And Track (4798.2mil,5531.9mil)(4843.2mil,5531.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [7.976mil]
Silk To Solder Mask Clearance Constraint: (5.118mil < 10mil) Between Pad XT2-1(4804.539mil,5567.435mil) on Bottom Layer And Track (4838.2mil,5535.9mil)(4838.2mil,5665.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.118mil]
Silk To Solder Mask Clearance Constraint: (9.134mil < 10mil) Between Pad XT2-1(4804.539mil,5567.435mil) on Bottom Layer And Track (4843.2mil,5532.9mil)(4843.2mil,5576.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [9.134mil]
Silk To Solder Mask Clearance Constraint: (5.118mil < 10mil) Between Pad XT2-2(4721.861mil,5567.435mil) on Bottom Layer And Track (4688.2mil,5535.9mil)(4688.2mil,5665.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.118mil]
Silk To Solder Mask Clearance Constraint: (4.961mil < 10mil) Between Pad XT2-2(4721.861mil,5567.435mil) on Bottom Layer And Track (4688.2mil,5535.9mil)(4838.2mil,5535.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.961mil]
Silk To Solder Mask Clearance Constraint: (5.118mil < 10mil) Between Pad XT2-3(4721.861mil,5634.365mil) on Bottom Layer And Track (4688.2mil,5535.9mil)(4688.2mil,5665.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.118mil]
Silk To Solder Mask Clearance Constraint: (4.961mil < 10mil) Between Pad XT2-3(4721.861mil,5634.365mil) on Bottom Layer And Track (4688.2mil,5665.9mil)(4838.2mil,5665.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.961mil]
Silk To Solder Mask Clearance Constraint: (4.961mil < 10mil) Between Pad XT2-4(4804.539mil,5634.365mil) on Bottom Layer And Track (4688.2mil,5665.9mil)(4838.2mil,5665.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [4.961mil]
Silk To Solder Mask Clearance Constraint: (5.118mil < 10mil) Between Pad XT2-4(4804.539mil,5634.365mil) on Bottom Layer And Track (4838.2mil,5535.9mil)(4838.2mil,5665.9mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [5.118mil]

Silk to Silk (Clearance=10mil) (All),(All)
Silk To Silk Clearance Constraint: (2.002mil < 10mil) Between Arc (5684.4mil,5088.8mil) on Bottom Overlay And Text "ADC2" (5710.355mil,5059.4mil) on Bottom Overlay Silk Text to Silk Clearance [2.002mil]
Silk To Silk Clearance Constraint: (6.556mil < 10mil) Between Arc (5719.567mil,5316.898mil) on Bottom Overlay And Text "ADC1" (5697.739mil,5326.394mil) on Bottom Overlay Silk Text to Silk Clearance [6.556mil]
Silk To Silk Clearance Constraint: (8.103mil < 10mil) Between Text "ADC1" (5697.739mil,5326.394mil) on Bottom Overlay And Text "GND" (5691.075mil,5305.293mil) on Bottom Overlay Silk Text to Silk Clearance [8.103mil]
Silk To Silk Clearance Constraint: (9.096mil < 10mil) Between Text "ADC1" (5697.739mil,5326.394mil) on Bottom Overlay And Track (5666.9mil,5349.987mil)(5690.361mil,5349.987mil) on Bottom Overlay Silk Text to Silk Clearance [9.096mil]
Silk To Silk Clearance Constraint: (9.339mil < 10mil) Between Text "ADC1" (5697.739mil,5326.394mil) on Bottom Overlay And Track (5690.355mil,5349.98mil)(5690.361mil,5349.987mil) on Bottom Overlay Silk Text to Silk Clearance [9.339mil]
Silk To Silk Clearance Constraint: (9.346mil < 10mil) Between Text "ADC1" (5697.739mil,5326.394mil) on Bottom Overlay And Track (5690.361mil,5349.987mil)(5690.361mil,5385.413mil) on Bottom Overlay Silk Text to Silk Clearance [9.346mil]
Silk To Silk Clearance Constraint: (8.603mil < 10mil) Between Text "ADC2" (5710.355mil,5059.4mil) on Bottom Overlay And Text "GND" (5700.358mil,5037.8mil) on Bottom Overlay Silk Text to Silk Clearance [8.603mil]
Silk To Silk Clearance Constraint: (0.88mil < 10mil) Between Text "C10" (4766mil,5778mil) on Bottom Overlay And Track (4761.8mil,5768.6mil)(4761.8mil,5780.6mil) on Bottom Overlay Silk Text to Silk Clearance [0.88mil]
Silk To Silk Clearance Constraint: (0.233mil < 10mil) Between Text "C13" (5578mil,5819mil) on Bottom Overlay And Track (5580.913mil,5805.839mil)(5580.913mil,5829.3mil) on Bottom Overlay Silk Text to Silk Clearance [0.233mil]
Silk To Silk Clearance Constraint: (3.439mil < 10mil) Between Text "C14" (4802mil,5779mil) on Bottom Overlay And Track (4795.261mil,5756.887mil)(4795.261mil,5792.32mil) on Bottom Overlay Silk Text to Silk Clearance [3.439mil]
Silk To Silk Clearance Constraint: (0.295mil < 10mil) Between Text "C16" (5362.185mil,5615.702mil) on Bottom Overlay And Track (5357.823mil,5338.977mil)(5357.823mil,5673.623mil) on Bottom Overlay Silk Text to Silk Clearance [0.295mil]
Silk To Silk Clearance Constraint: (3.397mil < 10mil) Between Text "C18" (5422mil,5796mil) on Bottom Overlay And Track (5308.96mil,5787.613mil)(5466.44mil,5787.613mil) on Bottom Overlay Silk Text to Silk Clearance [3.397mil]
Silk To Silk Clearance Constraint: (0.562mil < 10mil) Between Text "C2" (5574mil,5517mil) on Bottom Overlay And Track (5571.313mil,5491.039mil)(5571.313mil,5514.5mil) on Bottom Overlay Silk Text to Silk Clearance [0.562mil]
Silk To Silk Clearance Constraint: (4.84mil < 10mil) Between Text "C26" (5621mil,5408mil) on Bottom Overlay And Track (5581.78mil,5415.061mil)(5617.213mil,5415.061mil) on Bottom Overlay Silk Text to Silk Clearance [4.84mil]
Silk To Silk Clearance Constraint: (0.467mil < 10mil) Between Text "C26" (5621mil,5408mil) on Bottom Overlay And Track (5617.213mil,5350.101mil)(5617.213mil,5415.061mil) on Bottom Overlay Silk Text to Silk Clearance [0.467mil]
Silk To Silk Clearance Constraint: (3.387mil < 10mil) Between Text "C27" (5352mil,5796mil) on Bottom Overlay And Track (5308.96mil,5787.613mil)(5466.44mil,5787.613mil) on Bottom Overlay Silk Text to Silk Clearance [3.387mil]
Silk To Silk Clearance Constraint: (6.053mil < 10mil) Between Text "C28" (4898mil,5777mil) on Bottom Overlay And Track (4838.36mil,5788.113mil)(4995.84mil,5788.113mil) on Bottom Overlay Silk Text to Silk Clearance [6.053mil]
Silk To Silk Clearance Constraint: (2.21mil < 10mil) Between Text "C29" (5468mil,5400mil) on Bottom Overlay And Track (5473.4mil,5394.8mil)(5473.4mil,5425.8mil) on Bottom Overlay Silk Text to Silk Clearance [2.21mil]
Silk To Silk Clearance Constraint: (4.223mil < 10mil) Between Text "C29" (5468mil,5400mil) on Bottom Overlay And Track (5473.4mil,5394.8mil)(5491.4mil,5376.8mil) on Bottom Overlay Silk Text to Silk Clearance [4.223mil]
Silk To Silk Clearance Constraint: (2.873mil < 10mil) Between Text "C3" (4572mil,5421mil) on Bottom Overlay And Track (4533.899mil,5414.2mil)(4589.399mil,5414.2mil) on Bottom Overlay Silk Text to Silk Clearance [2.873mil]
Silk To Silk Clearance Constraint: (3.823mil < 10mil) Between Text "C42" (5543mil,5438mil) on Bottom Overlay And Track (5535.887mil,5426.939mil)(5535.887mil,5450.4mil) on Bottom Overlay Silk Text to Silk Clearance [3.823mil]
Silk To Silk Clearance Constraint: (8.101mil < 10mil) Between Text "C42" (5543mil,5438mil) on Bottom Overlay And Track (5535.887mil,5426.939mil)(5571.32mil,5426.939mil) on Bottom Overlay Silk Text to Silk Clearance [8.101mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "C5" (5574mil,5581mil) on Bottom Overlay And Track (5512.639mil,5581.28mil)(5577.599mil,5581.28mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (0.809mil < 10mil) Between Text "C5" (5574mil,5581mil) on Bottom Overlay And Track (5577.599mil,5581.28mil)(5577.599mil,5616.713mil) on Bottom Overlay Silk Text to Silk Clearance [0.809mil]
Silk To Silk Clearance Constraint: (9.567mil < 10mil) Between Text "C50" (4523mil,4973mil) on Bottom Overlay And Track (4517.8mil,4985.587mil)(4541.261mil,4985.587mil) on Bottom Overlay Silk Text to Silk Clearance [9.567mil]
Silk To Silk Clearance Constraint: (9.722mil < 10mil) Between Text "C53" (4782.703mil,5035.941mil) on Top Overlay And Track (4795.305mil,5033.391mil)(4795.305mil,5056.853mil) on Top Overlay Silk Text to Silk Clearance [9.722mil]
Silk To Silk Clearance Constraint: (2.513mil < 10mil) Between Text "C56" (4613mil,5368mil) on Bottom Overlay And Track (4606.5mil,5362.487mil)(4629.961mil,5362.487mil) on Bottom Overlay Silk Text to Silk Clearance [2.513mil]
Silk To Silk Clearance Constraint: (7.306mil < 10mil) Between Text "C6" (4798mil,5815mil) on Bottom Overlay And Track (4728.101mil,5824.187mil)(4793.061mil,5824.187mil) on Bottom Overlay Silk Text to Silk Clearance [7.306mil]
Silk To Silk Clearance Constraint: (9.073mil < 10mil) Between Text "C6" (4798mil,5815mil) on Bottom Overlay And Track (4771.7mil,5826.813mil)(4795.161mil,5826.813mil) on Bottom Overlay Silk Text to Silk Clearance [9.073mil]
Silk To Silk Clearance Constraint: (7.306mil < 10mil) Between Text "C6" (4798mil,5815mil) on Bottom Overlay And Track (4793.061mil,5824.187mil)(4793.061mil,5859.62mil) on Bottom Overlay Silk Text to Silk Clearance [7.306mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "C6" (4798mil,5815mil) on Bottom Overlay And Track (4795.161mil,5791.387mil)(4795.161mil,5826.82mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (6.459mil < 10mil) Between Text "C61" (4856mil,5584mil) on Bottom Overlay And Track (4865.239mil,5573.487mil)(4865.239mil,5608.913mil) on Bottom Overlay Silk Text to Silk Clearance [6.459mil]
Silk To Silk Clearance Constraint: (9.72mil < 10mil) Between Text "C62" (4897mil,5599mil) on Bottom Overlay And Track (4865.239mil,5608.913mil)(4888.7mil,5608.913mil) on Bottom Overlay Silk Text to Silk Clearance [9.72mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "C62" (4897mil,5599mil) on Bottom Overlay And Track (4898.7mil,5585.2mil)(4898.7mil,5597.2mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "C7" (5758mil,5446mil) on Bottom Overlay And Track (5627.898mil,5449.06mil)(5922.898mil,5449.06mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (9.984mil < 10mil) Between Text "C8" (5757mil,5410mil) on Bottom Overlay And Track (5731.423mil,5422.913mil)(5754.884mil,5422.913mil) on Bottom Overlay Silk Text to Silk Clearance [9.984mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "C8" (5757mil,5410mil) on Bottom Overlay And Track (5754.884mil,5387.487mil)(5754.884mil,5422.92mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (3.204mil < 10mil) Between Text "C8" (5757mil,5410mil) on Bottom Overlay And Track (5755.567mil,5296.898mil)(5755.567mil,5401.898mil) on Bottom Overlay Silk Text to Silk Clearance [3.204mil]
Silk To Silk Clearance Constraint: (3.112mil < 10mil) Between Text "C8" (5757mil,5410mil) on Bottom Overlay And Track (5755.567mil,5401.898mil)(5769.567mil,5401.898mil) on Bottom Overlay Silk Text to Silk Clearance [3.112mil]
Silk To Silk Clearance Constraint: (7.674mil < 10mil) Between Text "C9" (4798mil,5850mil) on Bottom Overlay And Track (4728.101mil,5859.62mil)(4793.061mil,5859.62mil) on Bottom Overlay Silk Text to Silk Clearance [7.674mil]
Silk To Silk Clearance Constraint: (4.478mil < 10mil) Between Text "C9" (4798mil,5850mil) on Bottom Overlay And Track (4771.3mil,5856.887mil)(4794.761mil,5856.887mil) on Bottom Overlay Silk Text to Silk Clearance [4.478mil]
Silk To Silk Clearance Constraint: (1.719mil < 10mil) Between Text "C9" (4798mil,5850mil) on Bottom Overlay And Track (4793.061mil,5824.187mil)(4793.061mil,5859.62mil) on Bottom Overlay Silk Text to Silk Clearance [1.719mil]
Silk To Silk Clearance Constraint: (4.478mil < 10mil) Between Text "C9" (4798mil,5850mil) on Bottom Overlay And Track (4794.761mil,5856.887mil)(4794.761mil,5892.32mil) on Bottom Overlay Silk Text to Silk Clearance [4.478mil]
Silk To Silk Clearance Constraint: (2.278mil < 10mil) Between Text "DAC1" (5673.994mil,5041.3mil) on Top Overlay And Text "GND" (5673.994mil,5056.575mil) on Top Overlay Silk Text to Silk Clearance [2.278mil]
Silk To Silk Clearance Constraint: (2.278mil < 10mil) Between Text "DAC2" (5666.877mil,5315.106mil) on Top Overlay And Text "GND" (5666.877mil,5330.381mil) on Top Overlay Silk Text to Silk Clearance [2.278mil]
Silk To Silk Clearance Constraint: (7.83mil < 10mil) Between Text "GND" (4056.7mil,5792.082mil) on Top Overlay And Track (4031.375mil,5782.55mil)(4031.375mil,5817.984mil) on Top Overlay Silk Text to Silk Clearance [7.83mil]
Silk To Silk Clearance Constraint: (7.554mil < 10mil) Between Text "IC2" (5461mil,5259mil) on Bottom Overlay And Track (5465.975mil,5128.8mil)(5465.975mil,5248.8mil) on Bottom Overlay Silk Text to Silk Clearance [7.554mil]
Silk To Silk Clearance Constraint: (7.554mil < 10mil) Between Text "IC2" (5461mil,5259mil) on Bottom Overlay And Track (5465.975mil,5248.8mil)(5662.825mil,5248.8mil) on Bottom Overlay Silk Text to Silk Clearance [7.554mil]
Silk To Silk Clearance Constraint: (8.119mil < 10mil) Between Text "IO 1" (4538.344mil,5855.3mil) on Bottom Overlay And Track (4551.9mil,5834.2mil)(4551.9mil,5878.2mil) on Bottom Overlay Silk Text to Silk Clearance [8.119mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "JP3" (5932mil,4991mil) on Bottom Overlay And Track (5927.283mil,4991.11mil)(5927.283mil,5400.835mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (7.596mil < 10mil) Between Text "JP4" (5932mil,5440mil) on Bottom Overlay And Track (5627.898mil,5449.06mil)(5922.898mil,5449.06mil) on Bottom Overlay Silk Text to Silk Clearance [7.596mil]
Silk To Silk Clearance Constraint: (7.596mil < 10mil) Between Text "JP4" (5932mil,5440mil) on Bottom Overlay And Track (5922.898mil,5449.06mil)(5922.898mil,5899.06mil) on Bottom Overlay Silk Text to Silk Clearance [7.596mil]
Silk To Silk Clearance Constraint: (9.15mil < 10mil) Between Text "Q10" (5295mil,4617mil) on Bottom Overlay And Track (5280.51mil,4503.156mil)(5280.51mil,4829.927mil) on Bottom Overlay Silk Text to Silk Clearance [9.15mil]
Silk To Silk Clearance Constraint: (0.094mil < 10mil) Between Text "Q12" (4680mil,4501mil) on Bottom Overlay And Track (4583.96mil,4495.946mil)(4741.44mil,4495.946mil) on Bottom Overlay Silk Text to Silk Clearance [0.094mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "R13" (5126mil,5083mil) on Bottom Overlay And Track (5127.287mil,5066.239mil)(5127.287mil,5131.199mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (5.64mil < 10mil) Between Text "R18" (4135mil,4986mil) on Top Overlay And Track (4137.687mil,4994.301mil)(4137.687mil,5059.261mil) on Top Overlay Silk Text to Silk Clearance [5.64mil]
Silk To Silk Clearance Constraint: (5.64mil < 10mil) Between Text "R18" (4135mil,4986mil) on Top Overlay And Track (4137.687mil,4994.301mil)(4173.12mil,4994.301mil) on Top Overlay Silk Text to Silk Clearance [5.64mil]
Silk To Silk Clearance Constraint: (9.912mil < 10mil) Between Text "R26" (5301.575mil,5373.635mil) on Top Overlay And Track (5314.487mil,5340.601mil)(5314.487mil,5405.561mil) on Top Overlay Silk Text to Silk Clearance [9.912mil]
Silk To Silk Clearance Constraint: (4.407mil < 10mil) Between Text "R27" (5579mil,5438mil) on Bottom Overlay And Track (5571.313mil,5426.939mil)(5571.313mil,5450.4mil) on Bottom Overlay Silk Text to Silk Clearance [4.407mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "R3" (5653mil,4972mil) on Bottom Overlay And Track (5655.601mil,4952.987mil)(5655.601mil,4988.42mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (6.33mil < 10mil) Between Text "R33" (4796mil,5883mil) on Bottom Overlay And Track (4771.3mil,5892.313mil)(4794.761mil,5892.313mil) on Bottom Overlay Silk Text to Silk Clearance [6.33mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "R33" (4796mil,5883mil) on Bottom Overlay And Track (4794.761mil,5856.887mil)(4794.761mil,5892.32mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "R36" (4801mil,5742mil) on Bottom Overlay And Track (4798.513mil,5732.2mil)(4798.513mil,5755.661mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (7.015mil < 10mil) Between Text "R37" (4834mil,5777mil) on Bottom Overlay And Track (4838.36mil,5788.113mil)(4838.36mil,5796.73mil) on Bottom Overlay Silk Text to Silk Clearance [7.015mil]
Silk To Silk Clearance Constraint: (7.015mil < 10mil) Between Text "R37" (4834mil,5777mil) on Bottom Overlay And Track (4838.36mil,5788.113mil)(4995.84mil,5788.113mil) on Bottom Overlay Silk Text to Silk Clearance [7.015mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "R44" (4849mil,5039mil) on Bottom Overlay And Track (4846.479mil,5018.395mil)(4846.479mil,5053.828mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "R45" (4710mil,4984mil) on Bottom Overlay And Track (4643.62mil,4986.283mil)(4708.58mil,4986.283mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "R45" (4710mil,4984mil) on Bottom Overlay And Track (4708.58mil,4986.283mil)(4708.58mil,5021.717mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (9.368mil < 10mil) Between Text "R47" (5118.032mil,5148.822mil) on Top Overlay And Track (5094.501mil,5161.28mil)(5159.461mil,5161.28mil) on Top Overlay Silk Text to Silk Clearance [9.368mil]
Silk To Silk Clearance Constraint: (6.098mil < 10mil) Between Text "R6" (5581mil,5719mil) on Bottom Overlay And Track (5508.601mil,5724.587mil)(5573.561mil,5724.587mil) on Bottom Overlay Silk Text to Silk Clearance [6.097mil]
Silk To Silk Clearance Constraint: (6.098mil < 10mil) Between Text "R6" (5581mil,5719mil) on Bottom Overlay And Track (5573.561mil,5724.587mil)(5573.561mil,5760.02mil) on Bottom Overlay Silk Text to Silk Clearance [6.097mil]
Silk To Silk Clearance Constraint: (6.397mil < 10mil) Between Text "R8" (5581mil,5640mil) on Bottom Overlay And Track (5542.38mil,5631.101mil)(5577.813mil,5631.101mil) on Bottom Overlay Silk Text to Silk Clearance [6.397mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "R8" (5581mil,5640mil) on Bottom Overlay And Track (5577.813mil,5631.101mil)(5577.813mil,5696.061mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "R9" (5577mil,5783mil) on Bottom Overlay And Track (5574.961mil,5760.687mil)(5574.961mil,5796.113mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "U1" (5455mil,5791mil) on Bottom Overlay And Track (5308.96mil,5787.613mil)(5466.44mil,5787.613mil) on Bottom Overlay Silk Text to Silk Clearance [0mil]
Silk To Silk Clearance Constraint: (6.61mil < 10mil) Between Text "U1" (5455mil,5791mil) on Bottom Overlay And Track (5466.44mil,5787.613mil)(5466.44mil,5796.23mil) on Bottom Overlay Silk Text to Silk Clearance [6.61mil]
Silk To Silk Clearance Constraint: (2.357mil < 10mil) Between Text "XT2" (4847mil,5689mil) on Bottom Overlay And Track (4803.552mil,5683.684mil)(4868.513mil,5683.684mil) on Bottom Overlay Silk Text to Silk Clearance [2.357mil]